CN107227015B - Low dielectric material - Google Patents
Low dielectric material Download PDFInfo
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- CN107227015B CN107227015B CN201610167700.9A CN201610167700A CN107227015B CN 107227015 B CN107227015 B CN 107227015B CN 201610167700 A CN201610167700 A CN 201610167700A CN 107227015 B CN107227015 B CN 107227015B
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- 239000003989 dielectric material Substances 0.000 title claims abstract description 37
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 32
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 28
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 25
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 31
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 26
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000003431 cross linking reagent Substances 0.000 claims description 15
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 239000003063 flame retardant Substances 0.000 claims description 12
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 8
- -1 BMI Polymers 0.000 claims description 7
- 238000004132 cross linking Methods 0.000 claims description 7
- 150000002978 peroxides Chemical class 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 239000005062 Polybutadiene Substances 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 239000005350 fused silica glass Substances 0.000 claims description 5
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229920006395 saturated elastomer Polymers 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 claims description 4
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 claims description 3
- 229920005604 random copolymer Polymers 0.000 claims description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims 3
- 125000005724 cycloalkenylene group Chemical group 0.000 claims 2
- 125000002993 cycloalkylene group Chemical group 0.000 claims 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 claims 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims 1
- LUECERFWADIZPD-UHFFFAOYSA-N 1-tert-butyl-2-ethenylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1C=C LUECERFWADIZPD-UHFFFAOYSA-N 0.000 claims 1
- SMSKIVCCLIQXFD-UHFFFAOYSA-N 1-tert-butyl-3-ethenylbenzene Chemical compound CC(C)(C)C1=CC=CC(C=C)=C1 SMSKIVCCLIQXFD-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 125000000732 arylene group Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 229920001169 thermoplastic Polymers 0.000 description 8
- 239000004416 thermosoftening plastic Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 3
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- APOXBWCRUPJDAC-UHFFFAOYSA-N bis(2,6-dimethylphenyl) hydrogen phosphate Chemical compound CC1=CC=CC(C)=C1OP(O)(=O)OC1=C(C)C=CC=C1C APOXBWCRUPJDAC-UHFFFAOYSA-N 0.000 description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- HIBWGGKDGCBPTA-UHFFFAOYSA-N C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 HIBWGGKDGCBPTA-UHFFFAOYSA-N 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229920010448 Poly(2,6-dimethyl-1,4-phenylene oxide) PPO Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
本发明有关一种低介电材料，包含：(i)5‑50重量份的聚苯醚，数目平均分子量（Mn）=1000‑4000，重量平均分子量（Mw）=1000‑7000，及Mw/Mn=1.0‑1.8；及(ii)10‑90重量份的具有烯丙基的液晶高分子，Mn=1000‑4000，Mw=1000‑5000，Mw/Mn=1.0‑1.8，其中该低介电材料Dk值:3.4‑4.0，Df值:0.0025‑0.0050。该低介电材料可应用于半固化胶片或电路基板绝缘层，且具有高Tg、低热膨胀系数、低吸水率及优异介电性能例如介电常数(Dk)及介电损耗（Df）的特性。The present invention relates to a low dielectric material, comprising: (i) 5-50 parts by weight of polyphenylene ether, number average molecular weight (Mn)=1000-4000, weight average molecular weight (Mw)=1000-7000, and Mw/ Mn=1.0-1.8; and (ii) 10-90 parts by weight of a liquid crystal polymer having an allyl group, Mn=1000-4000, Mw=1000-5000, Mw/Mn=1.0-1.8, wherein the low dielectric Material Dk value: 3.4‑4.0, Df value: 0.0025‑0.0050. The low dielectric material can be applied to prepreg or circuit substrate insulating layer, and has the characteristics of high Tg, low thermal expansion coefficient, low water absorption and excellent dielectric properties such as dielectric constant (Dk) and dielectric loss (Df) .
Description
Technical Field
The present invention relates to a low dielectric material, and more particularly to a resin composition.
Background
With the rapid development of wireless transmission products and the leap forward of high frequency transmission technology, the materials of the existing epoxy resin and phenolic resin systems have been unable to meet the requirements of advanced applications, especially high frequency printed circuit boards.
The substrate material of the printed circuit board with low dielectric loss is fluorine-based resin, but the resin has high cost and is difficult to process, and the application is limited to military and aerospace applications. In addition, polyphenylene ether (PPE) resin is a preferred resin material for substrates of high frequency printed circuit boards because of its good mechanical properties and excellent dielectric properties, such as dielectric constant (Dk) and dielectric loss (Df).
However, polyphenylene ether is a thermoplastic resin, and its direct use in a copper foil substrate has the following disadvantages: the melt viscosity is high, and the processing and the forming are difficult; the solvent resistance is poor, and the lead is easy to be attached or fall off in the environment of solvent cleaning in the manufacturing process of the printed circuit board; and a melting point close to the glass transition temperature (Tg), which makes it difficult to withstand soldering operations above 250 ℃ in printed circuit board processes. Therefore, PPE is thermoset modified to meet the requirements of printed circuit board applications.
Thermosetting modification of PPE is generally done in two ways: introducing crosslinkable active groups into the molecular structure of PPE to make it become thermosetting resin. Alternatively, other thermosetting resins are introduced by blending modification or interpenetrating network (IPN) techniques to form blended thermosetting composites. However, due to the difference in polarity of the chemical structure, the PPE is often incompatible with the reactive groups or thermosetting resin, and is not easily processed or loses the original excellent properties of PPE, which is limited.
Therefore, how to develop a material with excellent dielectric properties and meeting the requirements of other characteristics of printed circuit boards, such as high Tg, low thermal expansion coefficient and low water absorption, and apply it to the manufacture of high frequency printed circuit boards is a problem that printed circuit board material suppliers are demanding to solve at present.
Disclosure of Invention
Accordingly, the present invention is directed to a low dielectric material having excellent dielectric properties, a low thermal expansion coefficient and low water absorption.
In order to achieve the above object, the present invention provides a low dielectric material, comprising: (i)5 to 50 parts by weight of polyphenylene ether, having a number average molecular weight (Mn) of 1000-4000, a weight average molecular weight (Mw) of 1000-7000 and Mw/Mn of 1.0 to 1.8; and (ii)10 to 90 parts by weight of a liquid crystal polymer having an allyl group, Mn 1000-4000, Mw 1000-5000, and Mw/Mn 1.0 to 1.8. The Dk value of the low dielectric material is 3.4-4.0, and the Df value is 0.0025-0.0050. In the low dielectric material of the present invention, the low dielectric material further comprises 0.01 to 15 parts by weight of Bismaleimide (BMI) resin. In the low dielectric material of the present invention, the low dielectric material further comprises 0.01 to 10 parts by weight of a polymer additive.
In the low dielectric material of the present invention, the structural formula of polyphenylene ether is as follows:
it is composed of
In the low dielectric material of the present invention, the bismaleimide is selected from at least one of the following groups:
phenyl methane maleimide (phenyl methane maleimide)
Wherein n ≧ 1;
bisphenol A diphenyl ether bismaleimide (Bisphenol A diphenyl ether bismalimide)
3,3 '-dimethyl-5, 5' -diethyl-4,4 '-diphenylethane bismaleimide (3, 3' -dimethyl-5,5 '-diethyl-4, 4' -diphenylethane bismaleimide)
1,6-bismaleimide- (2,2,4-trimethyl) hexane (1,6-bismaleimide- (2,2, 4-trimethy) hexane)
In the dielectric material, the polymer additive may be at least one selected from the following group:
butadiene homopolymer (homo polymers of Butadiene)
Wherein y is 70%, x + z is 30%;
butadiene and styrene Random copolymers (Random copolymers of butadiene and styrene)
Wherein y is 30%, x + z is 70%, w is ≧ 1, and styrene content is 25 wt%;
maleated Polybutadiene (Maleinized polybutadienee)
Wherein y is 28%, x + z is 72%, Maleic Anhydride (MA) content is 8 wt%;
copolymers of butadiene, styrene and divinylbenzene; and
Styrene-Maleic Anhydride copolymer (Styrene Maleic Anhydride copolymer)
Wherein X is 1-8, and n is ≧ 1.
Preferably, a crosslinking agent (crosslinking linker) is optionally added to the low dielectric material of the invention to further increase the crosslinking density of the resin, wherein the crosslinking agent is selected from at least one of the following groups in an amount of 40 to 80 parts by weight:
triallyl isocyanate (TAIC)
Triallyl cyanate (TAC)
4-tert-butyl
The low dielectric material of the present invention may have added thereto a suitable amount of a peroxide having a 10-hour half-life and a temperature in the range of 116 ℃ to 128 ℃ as a catalyst (or crosslinking promoter) for effectively bonding the crosslinking agent to other resins, and suitable peroxides of the present invention, such as dicumyl peroxide, α' -bis (t-butylperoxy) diisopropylbenzene, and 2, 5-dimethyl-2, 5-bis (t-butylperoxy) hexyne-3.
The low dielectric material of the present invention may further contain inorganic filler (filler) to increase the thermal conductivity of the dielectric material and improve the thermal expansion and mechanical strength of the dielectric material. Suitable inorganic fillers of the present invention are, for example, fused silica, spherical silica, talc, aluminum silicate and soft silica, such as siliesof, wherein the soft silica can be used to reduce drill pin wear during PCB drilling. The soft silica has a particle size in the range of 0.5 μm to 10 μm.
In order to improve the flame retardancy of the low dielectric material of the invention, a halogen flame retardant or a non-halogen flame retardant can be added. The halogen-based flame retardant includes, for example, decabromodiphenylethane. The non-halogen flame retardant includes, for example, phosphorus-containing flame retardants and phosphoric acid esters available from Albemarle corporation. Phosphoric acid esters such as resorcinol bis [ bis (2,6-dimethylphenyl) phosphate ], HCA derivatives (I), HCA derivatives (II) and HCA derivatives (III). A compound wherein resorcinol bis [ bis (2,6 dimethylphenyl) phosphate ] has the formula:
〔OC6H3(CH3)2〕2P(O)OC6H4OP(O)〔OC6H3(CH3)2〕2
the HCA derivative (I) has a structure of p-diphenylphosphonyl dibenzyl
The HCA derivative (II) has the following structure:
when the B structure is-CH 2-or-CH (CH3) -, m ═ 1 and n ═ 1-3; when the structure of B is CHCH, m is 2 and n is 0.
The HCA derivative (III) has the following structure (XP-7866, Albemarle):
wherein A is a direct bond, C6-C12Aryl radical, C3-C12Cycloalkyl, or C3-C12Cycloalkenyl, wherein the cycloalkyl or cycloalkenyl can be substituted by C1-C6Alkyl is optionally substituted; each R1、R2、R3And R4Independently of one another is hydrogen, C1-C15Alkyl radical, C6-C12Aryl radical, C7-C15Aralkyl or C7-C15An alkaryl group; or R1And R2Or R3And R4Taken together, may form a saturated or unsaturated cyclic ring, wherein the saturated or unsaturated ring may be substituted with C1-C6Alkyl is optionally substituted; each m is independently 1, 2, 3 or 4; each R5And R6Independently is hydrogen or C1-C6An alkyl group; and each n is independently 0, 1, 2, 3, 4, or 5; provided that when a is aryl or a direct bond, n cannot be 0.
The low dielectric material has the advantages of excellent dielectric property, low thermal expansion coefficient and low water absorption.
Drawings
FIG. 1 shows an FTIR spectrum of a liquid crystal polymer according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the invention more comprehensible, several embodiments accompanied with figures are described in detail below:
examples 4-1 to 4-7 below are prepregs made in a continuous process using the thermosetting compositions of the present invention. Usually, a glass fiber cloth is used as a substrate. The fiberglass cloth in roll form is continuously passed through a series of rollers into a sizing trough which contains the thermosetting composition of the present invention. And fully soaking the glass fiber cloth in the gluing tank by resin, scraping redundant resin by a metering roller, baking the glass fiber cloth in a gluing furnace for a certain time to evaporate a solvent and solidify the resin to a certain degree, cooling and rolling to form a prepreg.
And (2) laminating and aligning prepregs prepared by soaking a certain number of electronic grade 2116 glass fiber cloth in the resin, arranging loz electrolytic copper foils on the upper and lower sides of the prepregs respectively, heating the prepregs to 200 ℃ from 80 ℃ within 30min under the pressure of 40-900psi in a vacuum press, then hot-pressing the prepregs for 120min at 200 ℃, and cooling the prepregs to room temperature within 30min to prepare the double-sided copper-clad plate with a certain thickness. Generally, 1.0mm thickness requires 4 2116 prepregs, 0.8mm requires 4 2116 prepregs, and 2.0mm requires 10 21160 prepregs.
The invention provides a thermosetting resin composition which forms stable homogeneous solution in a low boiling point solvent, a copper-clad plate manufactured by the thermosetting resin composition is subjected to glass transition temperature, thermal decomposition temperature, thermal layering time, soldering tin heat resistance (288 ℃), thermal expansion coefficient, water absorption, thermal conductivity, dielectric constant, dielectric loss factor and flame resistance index detection according to IPC-TM-650, and the detection result shows that: has the characteristics of high glass transition temperature (Tg), excellent dielectric property, low thermal expansion coefficient, low water absorption rate, high thermal shock resistance, high thermal conductivity and the like, and is suitable for being used as a substrate material for electronic components and Integrated Circuit (IC) packages.
(examples)
TABLE 1-1 influence of PPE resin content
Comparing Tg and the usage ratio of Dk, Df to PPE, too high or too low amount of PPE will result in too low Tg, while the amount of PPE will also affect Dk, Df, when the amount of PPE is high, Dk, Df are both high, and when the amount of PPE is low, Dk, Df are both low. Preferably, Dk and Df are both low. In addition, the thermal expansion coefficient is increased by adding PPE, so that the thermal expansion coefficient is decreased by adding BMI. In Table 1-1, PPE type SA9000 is available from Sabic corporation under the chemical name of poly-2, 6-dimethyl-1, 4-phenylene oxide (PPO) or PPE (polyphenylene ether), also known as polyphenylene oxide or polyphenylene ether.
TABLE 1-2 influence of LCP content
Liquid Crystal Polymers (LCP) generally exhibit good chemical, moisture and heat resistance, and good mechanical strength, and are capable of forming thin films with a high degree of structural integrity. However, the cost and/or dielectric constant of films made using LCP alone may be too high for some cushion applications.
The LCP's of the invention are selected from a liquid crystalline polymer (or a thermoplastic polymer capable of forming a selectively anisotropic dissolved phase) that can be processed in the melt. The chemical formula of the LCP is not particularly limited as long as it can dissolve the processed liquid crystalline polymer, and examples thereof may include a vinyl type thermoplastic liquid crystal polymer, an aramid thermoplastic liquid crystal polymer, or an aromatic polyester thermoplastic liquid crystal polymer, and it is preferable to introduce allyl group modification due to the terminal and/or side ends. The LCP of the invention can perform radical reaction by allyl to form interpenetrating polymer networks. Example C13 in tables 1-2 used low Dk glass fibers and example C8 and example C9 used E-glass fibers.
The vinyl type thermoplastic liquid crystal polymer has the following structure:
the aramid thermoplastic liquid crystalline polymer has the following structure:
FIG. 1 shows an FTIR spectrum of a liquid crystal polymer according to an embodiment of the present invention. The absorption peaks of FTIR are illustrated belowPeak at 3472cm-1With regard to-OH or-NH stretching. Peak 3097cm-1With respect to the asymmetric stretching of the vinyl group or-CH 2. Peak 2950cm-1、2919cm-1、2874cm-1And 2842cm-1Related to-C ≡ C-H, -C ≡ CH2, -C-CH3 or
Peak 1730cm-1And 1715cm-1Aromatic esters, C ═ O stretching, saturated C ═ O stretching, or aromatic C ═ O. Wave crest 1640cm-1And 1605cm-1Related to-C ═ C or cyclic C ═ C. Wave crest 1640cm-1、1570cm-1And 1482cm-1concerning-NH bending or asymmetry
And (5) stretching. Peak 1459cm-1And 1377cm-1To a
And (4) symmetrically stretching. Peak 1299cm-1、1244cm-1、1188cm-1、1153cm-1、1043cm-1And 1023cm-1With respect to-C-O-, -C-O-C-or-C-. Peak 1377cm-1To 1023cm-1Regarding amide, imide, -CN stretching. Peak 827cm-1to 691cm-1With respect to-C ═ C-phenyl substituted on the phenyl ring, at the para or meta position, or-NH out of the plane or singly. From the FTIR spectrum of FIG. 1, the absorption peak signals of the structures of the vinyl type thermoplastic liquid crystal polymer and the aramid thermoplastic liquid crystal polymer can be found.
TABLE 2 influence of the differences in the structure and ratio of BMI resins
TABLE 2-continuation
Comparing the use ratio of the coefficient of thermal expansion to the BMI, the higher the ratio of the BMI, the lower the reduction in the coefficient of thermal expansion. In this example, BMI comparisons were divided into three parts, A1-A5 for BMI resins of the same type at different ratios, A6-A8 for BMI resins of the same type but different types, and A9-A15 for comparison of mixed BMI resins. BMI models 2300, 4000, 5100, TMH are produced by Daiwakasei Industry CO., LTD, and the chemical names are in the following comparison table.
From A1 to A5, different ratios of BMI of the same species were effective in reducing the coefficient of thermal expansion, but also in improving the water absorption rate. From A6-A8, different BMI's are effective at reducing the coefficient of thermal expansion, but also have an effect on water absorption. From A9-A15, different combinations of BMI were also effective in reducing the coefficient of thermal expansion and at the same time achieving water absorption. The purpose of adding BMI in the invention is to reduce the thermal expansion coefficient, but the water absorption rate is also increased according to the use ratio and combination of BMI, so that the water absorption rate is reduced by adding a polymer additive.
TABLE 3 Effect of Polymer additive Structure and ratio Difference
TABLE 3-run
Comparing the ratio of water absorption to the use of polymer additives, the use of Polybutadiene (polybutadienes) and styrene-maleic anhydride copolymer (SMA) results in lower water absorption but higher thermal expansion coefficient when the same Polybutadiene is used. When different kinds of polybutadiene are used and SMA is matched for use, the SMA is more effective in reducing the water absorption rate and can also reduce the thermal expansion coefficient, but the performance of the SMA in the Df part is poor, and the defect of the SMA in the Df part can be overcome by using the polybutadiene. Butadiene models Ricon100, Ricon130MA8, Ricon150, Ricon257 from Sartomer are listed in the Table, with chemical names as follows.
In the table, SMA is listed as S: M ═ 3:1, which represents the ratio of Styrene (Styrene) to Maleic Anhydride (Maleic Anhydride), and the ratio is generally in the range of 1:1 to 12: 1.
TABLE 4 influence of the differences in the type of crosslinking agent
The low dielectric material of the present invention further comprises 40 to 80 parts by weight of at least one crosslinking agent selected from the following group: triallyl cyanate, triallyl isocyanate, 4-t-butyl styrene and trimethallyl allyl isocyanate (TMAIC). Compared with the influence of different crosslinking agents (crosslinking agents) on the physical properties of the invention, the Tg and the thermal expansion coefficient of the triallyl cyanate (TAC) are poor, and the Dk, the Df and the water absorption are common. Physical properties are more average when triallyl isocyanate (TAIC) is used. However, one disadvantage of using TAIC is that it is volatile during hot pressing. The use of TMAIC is effective in improving the high volatility of TAIC because TMAIC has a high melting point and is not easily evaporated, while maintaining its properties at a normal level. The use of 4-t-butylstyrene (TBS) is preferred in view of thermal expansion coefficient, water absorption and Df, but the Dk value is low.
TABLE 5 influence of differences in flame retardant types
The flame retardant can be matched with different flame retardants according to physical requirements. The halogen-containing flame retardant part may be added with 7 to 15phr (calculated by the sum of PPE, LCP, BMI, polymer additive and crosslinking agent) of decabromodiphenylethane (decabromodiphenylethane), and the halogen-free flame retardant part may be added with 12 to 14phr (calculated by the sum of PPE, LCP, BMI, polymer additive and crosslinking agent) of at least one selected from the following groups: phosphorus-containing flame retardants and phosphoric acid esters from ALBEMARLE corporation. Phosphoric acid esters such as resorcinol bis [ bis (2,6-dimethylphenyl) phosphate ] (Tetrakis (2,6-dimethylphenyl)1,3-phenylene bisphophate), HCA derivative (I), HCA derivative (II) and HCA derivative (III), wherein HCA derivative (III) having a product name XP7866 comprises an organic filler, 10-15% phosphorus. XP7866 has a particle size in the range of 0.5 μm to 60 μm.
TABLE 6 influence of the differences in the type and proportion of the inorganic fillers
TABLE 6-run
As for the inorganic filler, depending on physical requirements, 8 to 50phr (calculated by the sum of PPE, LCP, BMI, polymer additive and cross-linking agent) of different inorganic fillers may be added, such as fused silica, spherical silica and soft silica, such as Siliesof, wherein the soft silica may be used to reduce drill point abrasion during PCB drilling, compare examples F1-F3 with F8-F9. The soft silica has a particle size in the range of 0.5 μm to 10 μm. In the case of the same proportion of fused silica and spherical silica, the spherical silica is used, and both Dk and Df are lower than those of the fused silica.
TABLE 7 influence of the type and ratio differences of the crosslinking promoters
TABLE 7-run
The low dielectric material of the present invention further comprises 2 to 8phr (calculated as the sum of PPE, LCP, BMI, polymer additive and crosslinking agent) of peroxide having a 10-hour half-life temperature range of 116 ℃ to 128 ℃. The crosslinking accelerators (catalysts) may be used in combination with different crosslinking accelerators depending on the physical requirements. The invention can use peroxide with 10-hour half-life and temperature range of 116-128 ℃, preferably uses peroxide with 10-hour half-life and temperature of 119 ℃.
The low dielectric material of the invention uses PPE but does not add epoxy resin, because the addition of epoxy resin can cause Dk/Df to not reach the expected value, because the epoxy resin can generate too many OH groups after ring opening, and further causes Dk and Df value to not be reduced.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (10)
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| CN110876230B (en) * | 2018-09-03 | 2020-09-15 | 昆山雅森电子材料科技有限公司 | Composite laminated LCP substrate and preparation method thereof |
| CN109777123B (en) * | 2018-12-25 | 2021-07-30 | 广东生益科技股份有限公司 | Resin composition, prepreg for printed circuit, and metal-clad laminate |
| CN109971175B (en) * | 2019-03-18 | 2021-09-21 | 苏州生益科技有限公司 | Modified maleimide resin composition, prepreg and laminated board prepared from same |
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| JP2005057000A (en) * | 2003-08-01 | 2005-03-03 | Asahi Kasei Chemicals Corp | Film for flexible printed circuit boards |
| CN102876002A (en) * | 2011-07-11 | 2013-01-16 | 苍南县慧丰塑料有限公司 | Rapid molding high heat-resistant polyamide-polyphenyl ether alloy and preparation method thereof |
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| JP2005057000A (en) * | 2003-08-01 | 2005-03-03 | Asahi Kasei Chemicals Corp | Film for flexible printed circuit boards |
| CN102876002A (en) * | 2011-07-11 | 2013-01-16 | 苍南县慧丰塑料有限公司 | Rapid molding high heat-resistant polyamide-polyphenyl ether alloy and preparation method thereof |
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