CN113121981B - Resin composition, prepreg and insulating plate using same - Google Patents

Resin composition, prepreg and insulating plate using same Download PDF

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Publication number
CN113121981B
CN113121981B CN201911413241.8A CN201911413241A CN113121981B CN 113121981 B CN113121981 B CN 113121981B CN 201911413241 A CN201911413241 A CN 201911413241A CN 113121981 B CN113121981 B CN 113121981B
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resin composition
compound
composition according
resin
combination
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CN113121981A (en
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孟运东
罗成
许永静
方克洪
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Priority to CN201911413241.8A priority Critical patent/CN113121981B/en
Priority to PCT/CN2020/086538 priority patent/WO2021134993A1/en
Priority to TW109114941A priority patent/TWI742643B/en
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    • C—CHEMISTRY; METALLURGY
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    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
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Abstract

The present invention relates to a resin composition including a combination of a modified maleimide compound and an olefin group-containing polymer, and a prepreg and an insulating plate using the same; the modified maleimide compound is prepared from a compound (A) or an aminosilane-containing organometallic salt, and a compound (B) containing at least two maleimide groups. The resin composition provided by the invention has higher bonding strength, can be used for preparing laminated boards with high peeling strength, low dielectric, high heat resistance and high flame retardance, and has good compatibility between the modified maleimide compound and resin, and is not easy to crystallize in the processing process.

Description

Resin composition, prepreg and insulating plate using same
Technical Field
The invention relates to the technical field of printed circuits, in particular to a resin composition, and a prepreg and an insulating plate using the same.
Background
Along with the progress of the electronic and electric industry and the rapid development of terminal electronics, the development direction of the electronic circuit substrate is light, thin, high-performance, high-reliability, environment-friendly and the like. The maleimide resin is used as a thermosetting polyimide resin and has excellent performances in mechanical property, electric property, heat resistance and solvent resistance. Among electronic circuit boards, bismaleimide resins or polymaleimide resins have been used in a large number of applications in the field of package boards. However, one of the problems that has been found at present is that maleimide resins have been insufficient in terms of adhesion, and therefore, they are generally used in combination with epoxy resins, phenolic resins and cyanate resins having good adhesion, but the adhesion performance is still poor when bismaleimides are combined with resins having low polarity.
CN107109055a discloses a thermosetting resin composition containing a polyimide compound having a structural unit derived from a maleimide compound having at least 2N-substituted maleimide groups and a structural unit derived from a diamine compound, a modified polybutadiene, and an inorganic filler. The thermosetting resin composition obtained by the invention has excellent heat resistance, small dielectric loss tangent and smooth surface. However, the composition has poor adhesive property, and the copper-clad plate prepared by using the composition has low peel strength.
CN102115569B discloses a dielectric composition comprising (a) 1 to 90 parts by weight of polybutadiene having maleic anhydride in its branched chain, carboxyl, hydroxyl, or epoxy groups in its terminal end, and having a weight average molecular weight of 1200 to 15000; (b) 5 to 90 parts by weight of a chain-broken rearranged polyphenylene ether having a weight average molecular weight of between 2000 and 8000; (c) 1 to 30 parts by weight of bismaleimide; and (d) 1 to 30 parts by weight of an epoxy resin. The polybutadiene with excellent electrical characteristics can modify polyphenyl ether, and improve resin crosslinking density by utilizing bismaleimide, so that heat resistance and Tg are greatly improved, in addition, a semi-interpenetrating structure can be formed by Polybutene (PB)/polyphenyl ether (PPE)/Bismaleimide (BMI) with different proportions, and a dielectric material with higher Tg, low dielectric constant, low loss factor and excellent solvent resistance and heat resistance can be obtained. However, the dielectric material has poor adhesion to materials such as copper foil and glass fiber cloth, and it is difficult to obtain a laminate having high peel strength.
CN104177809B discloses a halogen-free resin composition comprising: (A) 100 parts by weight of a polyphenylene ether resin; (B) 10 to 50 parts by weight of a maleimide resin; (C) 5 to 100 parts by weight of a polybutadiene copolymer; (D) 5 to 30 parts by weight of a cyanate resin; and (E) 15 to 150 parts by weight of a phosphazene compound. The invention can achieve the characteristics of high glass transition temperature, low thermal expansion coefficient, low dielectric property, heat resistance, flame retardance, no halogen and other circuit substrate by comprising specific components and proportions; can be made into semi-cured film or resin film, thereby achieving the purpose of being applied to metal laminated plates and printed circuit boards. However, the adhesive properties of the composition are poor, and the peel strength of the prepared laminated board is low.
Accordingly, there is a need in the art to develop a resin composition having high adhesive properties, and thus to produce a laminate having high peel strength, low dielectric loss, high heat resistance and high flame retardancy.
Disclosure of Invention
It is an object of the present invention to provide a resin composition having high adhesive properties, which can produce a laminate having high peel strength, low dielectric, high heat resistance and high flame retardance.
To achieve the purpose, the invention adopts the following technical scheme:
the present invention provides a resin composition comprising a combination of a modified maleimide compound and an olefin-group-containing polymer;
the modified maleimide compound is prepared from a compound (A) or an organosilane-containing organometallic salt, and a compound (B) containing at least two maleimide groups, the molecular structure of the compound (A) being as follows:
Figure BDA0002350517700000031
the R is 1 、R 2 And R is 3 Each independently selected from C1-C6 (e.g., C1, C2, C3, C4, C5, or C6) alkyl;
the structure of the Y is-Y 1 —Y 2 -or
Figure BDA0002350517700000032
The Y is 1 And Y 2 Each independently selected from-CH 2 -、-C 2 H 4 -、-C 3 H 6 -、-C 4 H 8 -、-C 5 H 10 -、-C 3 H 6 -N-、-C 2 H 4 -N-、
Figure BDA0002350517700000033
Figure BDA0002350517700000034
Figure BDA0002350517700000035
Any one of them;
the Y is 3 Selected from-H, -CH 3 、-C 2 H 5 、-C 3 H 7 、-C 4 H 9 、-C 5 H 11 、-C 8 H 17 、-C 15 H 31 、
Figure BDA0002350517700000036
Figure BDA0002350517700000037
Any one of them;
and m is 0 or 1.
The present invention provides a silane-containing modified maleimide compound obtained by heating a compound (B) containing at least two maleimide groups with an amino-containing silane compound (A) or an aminosilane-containing organometal salt. When used in a resin composition of a composite material, the resin composition has better compatibility with low-polarity resin, avoids volatilization of a silane coupling agent in the drying process of a prepreg, can reduce the reactivity between bismaleimide and other resins, reduces the curing stress of the resin composition, increases the adhesive force of the resin composition to a reinforcing material or a conductive layer, and maintains low dielectric loss and high heat resistance. And the modified maleimide compound has good compatibility with resin, and is not easy to crystallize in the processing process.
In the present invention, the N atom of the compound (A) or the organometallic salt of an aminosilane is ortho-linked to the carbonyl group in the compound (B), and a modified maleimide compound of the following structure can be exemplified:
Figure BDA0002350517700000041
the above-mentioned structure is merely for the purpose of describing the connection manner after the reaction of the organic metal salt of the compound (a) or the aminosilane and the compound (B), and is not limited to the above-mentioned structure, and the structure of the obtained modified maleimide compound may vary depending on the structure of the raw material.
Preferably, the compound (a) has any one of the structures shown in the following formulas I to III:
Figure BDA0002350517700000042
Figure BDA0002350517700000051
the R is 1 、R 2 、R 3 、Y 1 、Y 2 And Y 3 All have the same selection range as before.
Preferably, said R 1 、R 2 And R is 3 Each independently selected from CH 3 、C 2 H 5 Or C 3 H 7 Any one of the following.
Preferably, said Y 1 And Y 2 Each independently selected from
Figure BDA0002350517700000052
/>
Figure BDA0002350517700000053
Figure BDA0002350517700000054
Any one of the following.
The preferred compound (A) of the present invention contains the above-mentioned linking groups, which can lengthen the chain length, avoid the influence of the crosslinked structure after curing of the resin on the siloxane, further improve the adhesive property of the resin, and in addition, the main chain of these structures has higher rigidity, which is advantageous for high heat resistance.
Preferably, the compound (B) has a structure represented by the following formula IV or formula V:
Figure BDA0002350517700000055
the X is selected from-CH 2 -、-C 2 H 4 -、-C 3 H 6 -、-C 4 H 8 -、-C 5 H 10 -、
Figure BDA0002350517700000056
Figure BDA0002350517700000061
Figure BDA0002350517700000062
Any one of them;
said R, R 4 ～R 11 Each independently selected from the group consisting of-H, C1 to C15 (e.g., C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, etc.) alkyl groups,
Figure BDA0002350517700000063
Figure BDA0002350517700000064
Any of them, preferably-H, -CH 3 、-C 2 H 5 、-C 3 H 7 、-C 4 H 9 、-C 5 H 11 、-C 8 H 17 、-C 15 H 31 、/>
Figure BDA0002350517700000065
Any one of them;
the n is an integer of 1 to 10, for example, 2, 3, 4, 5, 6, 7, 8, 9, etc.
Preferably, the preparation method comprises the following steps: and (2) carrying out heating reaction on the compound (A) or the organic metal salt containing aminosilane and the compound (B) containing at least two maleimide groups to obtain the modified maleimide compound.
Preferably, the temperature of the heating reaction is 100 to 200 ℃, preferably 110 ℃, 120 ℃, 130 ℃, 136 ℃, 141 ℃, 145 ℃, 151 ℃, 156 ℃, 160 ℃, 165 ℃ and 170 ℃.
Preferably, the heating reaction is carried out for a period of time of 1 to 30 hours, preferably 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 10 hours, 12 hours, 16 hours, 21 hours, 28 hours.
Preferably, the heating reaction is carried out under reflux condensation conditions.
Preferably, the heating reaction is carried out with stirring.
Preferably, the molar ratio of the compound (a) or aminosilane-containing organometallic salt to the compound (B) is from 10:90 to 80:20, such as 10:90, 15:85, 20:80, 24:76, 30:70, 40:60, 50:50, 60:40, 70:30, 80:20, etc. In order to allow the compound (a) and the compound (B) to sufficiently react, it is further preferable that the molar ratio is 30:70 to 50:50, for example, 30:70, 35:65, 38:62, 40:60, 45:55, 50:50, or the like.
Preferably, an accelerator is added to the heating reaction.
Preferably, the accelerator is used in an amount of 0.01 to 10% by mass of the compound (B), for example 0.1%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5% by mass, etc.
Preferably, the accelerator comprises any one or at least two of dicumyl peroxide, tert-butylcumyl peroxide, di-tert-butyl peroxide, tert-butyl peroxyisopropyl carbonate, 2, 5-dimethyl-2, 5-di-tert-butylcumyl peroxy hexyne-3, 2, 5-dimethyl-2, 5-di-tert-butylperoxy hexane, p-menthane peroxide, 1-bis (tert-amyl peroxy) cyclohexane, diisopropylbenzene hydroperoxide, benzoyl peroxide derivatives, metal salts of acetylacetone, metal salts of naphthenic acid, vanadium pentoxide, amine compounds, quaternary ammonium salts, imidazoles, triphenylphosphine or triphenylphosphine derivatives.
Preferably, a solvent is added to the heating reaction.
Preferably, the solvent is used in an amount of 10 to 500% by mass, for example 50%, 100%, 150%, 200%, 250%, 300%, 350%, 400%, 450%, 480% by mass, etc., preferably 50 to 400% by mass of the compound (B).
Preferably, the solvent comprises any one or a combination of at least two of toluene, xylene, cyclohexane, tetrahydrofuran, N-Dimethylformamide (DMF) or butanone.
Preferably, the olefin-based polymer includes any one or a combination of at least two of polybutadiene, polydivinylbenzene, a copolymer of butadiene and styrene, a copolymer of butadiene and divinylbenzene, a terpolymer of butadiene and styrene and divinylbenzene, a difunctional or at least three functional bismaleimide compound or a prepolymer thereof, a vinyl-based polyphenylene ether resin, or a acryl-based polyphenylene ether resin.
Preferably, an inorganic filler and/or a flame retardant is also included in the resin composition.
Preferably, the inorganic filler comprises any one or a combination of at least two of silica, boron nitride or aluminum hydroxide.
Preferably, the particle size of the inorganic filler is < 50 μm, e.g. 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, etc., preferably < 20 μm.
Preferably, the flame retardant comprises any one or a combination of at least two of decabromodiphenyl ether, decabromodiphenyl ethane, ethylenebis-tetrabromophthalimide, melamine phosphate, melamine polyphosphate, dimelamine pyrophosphate, tris (tribromophenyl) isocyanurate, tris (2, 6-dimethylphenyl) phosphorus, 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphazene-10-oxide, 2, 6-bis (2, 6-dimethylphenyl) phosphazene, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphazene-10-oxide or phosphazene compound, preferably tris (2, 6-dimethylphenyl) phosphorus, 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphazene-oxide, 2, 6-di (2, 6-dimethylphenyl) phosphazene, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphazene-10-oxide, hexachlorophosphazene, a combination of at least two of the following compounds, preferably tri (2, 6-dimethylphenyl) phosphorus, 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-phosphazene-10-oxide, 2, 6-di (2, 6-dimethylphenyl) phosphazene, 10-phosphazene, a combination of at least one of the three of the following phosphorus-alkoxy-phosphazenes.
Preferably, the resin composition comprises the following components in parts by weight:
Figure BDA0002350517700000081
the content of the modified maleimide compound is 5 to 40 parts by weight, for example, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 38 parts by weight, etc.;
the content of the polymer containing an olefin group is 30 to 70 parts by weight, for example, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 68 parts by weight, or the like;
the inorganic filler content is 10 to 60 parts by weight, for example, 11 parts by weight, 12 parts by weight, 13 parts by weight, 14 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, or the like;
the flame retardant content is 10 to 35 parts by weight, for example, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, 20 parts by weight, 22 parts by weight, 24 parts by weight, 26 parts by weight, 28 parts by weight, 30 parts by weight, 32 parts by weight, 34 parts by weight, and the like.
Preferably, an initiator is also included in the resin composition.
Preferably, the initiator comprises a peroxide initiator, preferably any one or a combination of at least two of α, α ' -di (tert-butyl-m-isopropyl-peroxygen) benzene, 2, 5-dimethyl-2, 5-di (tert-butyl-peroxy) -3-hexyne, benzoyl peroxide, 3', 5' -tetramethyl-1, 4-diphenoxyquinone, chloranil, 2,4, 6-tri (tert-butylphenoxy) or tert-butyl-isopropyl-peroxymonocarbonate.
The second object of the present invention is to provide a resin glue solution containing the resin composition and the solvent according to one of the objects.
Preferably, the solvent comprises any one or at least two of toluene, xylene, cyclohexane, butanone or dimethylformamide.
A third object of the present invention is to provide a prepreg comprising a reinforcing material and the resin composition of one of the objects or the resin dope of the other object attached thereto after impregnation drying.
Preferably, the reinforcing material comprises a glass cloth.
It is a fourth object of the present invention to provide an insulating panel comprising at least one mesh of three said prepreg sheets.
The fifth object of the present invention is to provide a metal foil-clad laminate comprising at least one mesh of three prepreg sheets and metal foils coated on one or both sides of the laminated prepreg sheets.
A sixth object of the present invention is to provide a printed circuit board comprising at least one mesh of three prepreg sheets, at least one mesh of four insulating sheets, or at least one mesh of five metal foil-clad laminate sheets.
Compared with the prior art, the invention has the following beneficial effects:
the modified maleimide compound is added into the resin composition, and the compound (B) containing at least two maleimide groups and the silane compound (A) containing amino or the organic metal salt containing amino silane are prepolymerized to obtain the modified maleimide compound containing silane. When used in a resin composition of a composite material, the resin composition has better compatibility with a low-polarity resin, reduces volatilization of a silane coupling agent during drying of a prepreg, reduces reactivity between bismaleimide and other resins, reduces curing stress of the resin composition, increases adhesion of the resin composition to a reinforcing material or a conductive layer, and maintains low dielectric loss and high heat resistance. The obtained laminated board has high peel strength, low dielectric loss, high heat resistance and high flame retardance. And the modified maleimide compound has good compatibility with resin, and is not easy to crystallize in the processing process.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
The details of the compounds referred to below are as follows:
KBM-602: n-2- (beta-aminoethyl) -3-gamma-aminopropyl methyl dimethoxy silane, japanese letter, yue;
KBM-603: n-2- (aminoethyl) -3-aminopropyl trimethoxysilane, japan believed to be the more;
KBM-903: 3-aminopropyl trimethoxysilane, japanese letter, yue;
KBE-903: 3-aminopropyl triethoxysilane, japanese letter, the more;
1, 2-ethylenediamine, N' -dibenzyl-N- [3- (trimethoxysilane) propyl ] -hydrochloride, CAS:145151-33-3, reagents, commercially available;
KBM-403: 3-glycidoxypropyl methyltrimethoxysilane, japanese letter, the more;
DDM: diaminodiphenyl methane, indian Areca;
DDS: diamino diphenyl sulfone, indian Areca;
CAS:92-87-5,4,4' -diaminobiphenyl, a reagent, commercially available;
BMI-50P: a multifunctional maleimide resin, KI, japan;
BMI-70: bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, KI, japan;
BMI-80:2, 2-bis (4- (4-maleimidophenoxy) phenyl) propane, japanese KI.
Synthesis examples 1 to 6
Synthesis examples 1 to 6 provide modified maleimide compounds, which are prepared as follows:
the silane compound containing amino group (KBM-602, KBM-603, KBM-903, KBE-903), the compound containing at least two maleimide groups (BMI-70, BMI-80, BMI-50P), the accelerator and the solvent are added into a reaction vessel with condensation reflux, stirring and heating, the solvent in the reactant is distilled off after heating and stirring reflux, and the temperature is cooled to normal temperature, so as to obtain modified maleimide compounds P1-P6.
The raw material compositions, reaction times and reaction temperatures of synthesis examples 1 to 6 are shown in Table 1.
TABLE 1
Figure BDA0002350517700000111
Figure BDA0002350517700000121
In table 1, -represents no addition of the corresponding substances.
Synthesis examples 7 to 10
The synthesis example provides modified maleimide compounds P7 to P10, and the preparation method comprises the following steps:
KBM-403, diamine compound (DDM, DDS or 4,4' -diaminobiphenyl) and DMF are added into a reaction vessel with condensation reflux, stirring and heating, heating to 160 ℃ and stirring reflux for 2h, then compound (BMI-70 or BMI-50P) containing more than two maleimide groups is added, heating, stirring reflux is carried out, solvent in the reactant is distilled off, and cooling to normal temperature is carried out, thus obtaining modified maleimide compounds P7-10.
The raw material compositions, reaction times and reaction temperatures of synthesis examples 7 to 10 are shown in Table 2.
TABLE 2
Synthesis example 7 Synthesis example 8 Synthesis example 9 Synthesis example 10
P7 P8 P9 P10
KBM-403 6 50 45 50
DDM —— —— —— 30
DDS —— —— 35 ——
4,4' -diaminobiphenyl 4 30 —— ——
BMI-70 90 20 20
BMI-50P —— 20 —— ——
DMF 100 10 20
MEK —— 20 —— ——
Triphenylphosphine and process for preparing same —— —— 0.2 0.2
Reaction temperature 100℃ 150℃ 200℃ 160℃
Reaction time 30h 5h 1h 10h
In table 2, -represents no addition of the corresponding substances.
Comparative Synthesis example 1
The modified bismaleimide resin (D1) prepared according to example 1 of patent application CN101775139a was prepared as follows:
100 parts of bismaleimide, 50 parts of diallyl phenyl compound, 12 parts of gamma-aminopropyl triethoxysilane and 0.50-1.50 parts of water are mixed at room temperature to react for 60 minutes at the temperature of 40 ℃; and heating to 150 ℃ and carrying out prepolymerization reaction for 120 minutes to obtain the modified bismaleimide resin D1.
Examples 1 to 10 and comparative examples 1 to 2
Examples 1 to 10 and comparative examples 1 to 2 respectively provide a resin glue solution and a laminated board, and the specific preparation process is as follows:
(1) Preparation of resin glue solution:
firstly, dissolving a modified maleimide compound (one of P1 to P10 and D1) or an unmodified maleimide compound in DMF, and then uniformly mixing with other components in a formula to obtain resin glue solution; the specific formula is shown in Table 3;
(2) Preparation of the laminate:
uniformly soaking 2116 glass fiber cloth in the resin glue solution, baking at 155 deg.C for 5min in a blast oven to obtain prepreg, overlapping 6 prepregs, covering 35 μm inverted copper foil, and pressing in a vacuum hot press at 3MPa and 220 deg.C for 90min to obtain laminated board.
Performance test:
(1) Glass transition temperature Tg: dynamic thermo-mechanical analysis (DMA) testing was used, with reference to the DMA test method specified by IPC-TM-6502.4.24.
(2) Thermal decomposition temperature (Td): reference standard IPC-TM-6502.4.24.6 was used for thermogravimetric analysis (TGA) testing.
(3) Peel Strength (PS): refers to the pulling force required to peel each millimeter of copper foil from the copper-clad plate at room temperature.
(4) Dielectric constant (Dk) and dielectric loss factor (Df): the measurement was performed using the plate capacitance method, and reference was made to IPC-TM-650.2.4.24.
(5) Flame retardant: according to UL94"50W (20 mm) vertical burn test: v-0, V-1 and V-2' test methods, V-0 was considered flame retardant.
(6) Thermal expansion coefficient and thermal expansion ratio of 50-260 ℃): the test uses a static thermal analyzer (TMA) test, and the test reference standard IPC-TM-650.2.4.24.
(7) Thermal stress: the copper-bearing laminate was floated on the molten tin surface at 288 c with the time to delaminate or bubble as the test result.
The results of the above tests are detailed in Table 3.
TABLE 3 Table 3
Figure BDA0002350517700000141
/>
Figure BDA0002350517700000151
The detailed information of each component in table 3 is as follows:
OPE-2St: mitsubishi gas, double-ended olefin functionalized polyphenylene ether;
b-1000: japanese Caddy, polybutadiene resin;
ricon257: us g Lei Weile, butadiene-styrene-divinylbenzene branched terpolymer;
a1536: united states koteng, SEBS resin;
NQ1025J: inorganic filler NQ1025J spherical fused silica, d50=3.0 μm, new materials stock, inc. Of Jiangsu-associated;
Bt-93W: a fire retardant, such as ya bao, decabromodiphenyl ethylene;
OP935: clariant, usa, phosphorus-containing flame retardant;
DCP: dicumyl peroxide and an initiator.
-representing no addition of the corresponding substance.
As shown in Table 3, the modified maleimide compound provided by the invention has strong bonding performance after being combined with low-polarity resin, and the prepared laminated board has high peeling strength, good dielectric property and heat resistance, wherein the peeling strength is more than 0.8N/mm, the dielectric constant of 1GHz is less than 3.8, the dielectric loss factor of 1GHz is less than 0.002, the glass transition temperature is more than 190 ℃, the thermal decomposition temperature is more than 400 ℃, the thermal expansion ratio of 50-260 ℃ is less than 2%, and the thermal stress is more than 60min.
Comparative example 1 was not prepared by prepolymerizing an amino group-containing silane compound with maleimide, but was added to the resin dope separately, and the finally obtained laminate was higher in peel strength, lower in Tg and Td, higher in Dk and Df, larger in thermal expansion coefficient and expansion ratio, and significantly reduced in heat resistance. This is because, in the course of curing the dope, the silane compound containing an amino group is volatilized rapidly, and the curing reaction of bismaleimide and the olefin resin is faster, and the above properties are lowered.
The modified maleimide compound used in comparative example 2 further comprises a diallyl phenyl compound as a raw material, and has significantly reduced dielectric properties and significantly higher dielectric constants and dielectric losses as compared with examples, because the reaction of the diallyl phenyl compound with bismaleimide is relatively complicated, which adversely affects dielectric properties.
The present invention is described in detail by the above examples, but the present invention is not limited to the above detailed methods, i.e., it does not mean that the present invention must be practiced depending on the above detailed methods. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.

Claims (36)

1. A resin composition comprising a combination of a modified maleimide compound and an olefin-containing polymer;
the modified maleimide compound is prepared from a compound (A) and a compound (B) containing at least two maleimide groups, wherein the molecular structure of the compound (A) is as follows:
Figure FDA0004056077430000011
the R is 1 、R 2 And R is 3 Each independently selected from C1-C6 alkyl;
the structure of the Y is-Y 1 -Y 2 -or
Figure FDA0004056077430000012
The Y is 1 And Y 2 Each independently selected from-CH 2 -、-C 2 H 4 -、-C 3 H 6 -、-C 4 H 8 -、-C 5 H 10 -、
Figure FDA0004056077430000013
Any one of them;
the Y is 3 Selected from-H, -CH 3 、-C 2 H 5 、-C 3 H 7 、-C 4 H 9 、-C 5 H 11 、-C 8 H 17 、-C 15 H 31 、
Figure FDA0004056077430000014
Figure FDA0004056077430000015
Any one of them;
m is 0 or 1;
the preparation method of the modified maleimide compound comprises the following steps: carrying out heating reaction on the compound (A) and the compound (B) containing at least two maleimide groups to obtain the modified maleimide compound;
the resin composition comprises the following components in parts by weight:
Figure FDA0004056077430000016
Figure FDA0004056077430000021
2. the resin composition according to claim 1, wherein the compound (a) has any one of structures represented by the following formulas I to III:
Figure FDA0004056077430000022
the R is 1 、R 2 、R 3 、Y 1 、Y 2 And Y 3 All having the same limitations as claim 1.
3. According to claim 1 or 2The resin composition is characterized in that R 1 、R 2 And R is 3 Each independently selected from CH 3 、C 2 H 5 Or C 3 H 7 Any one of the following.
4. The resin composition according to claim 1 or 2, wherein Y 1 And Y 2 Each independently selected from
Figure FDA0004056077430000023
Any one of the following.
5. The resin composition according to claim 1, wherein the compound (B) has a structure represented by the following formula IV or formula V:
Figure FDA0004056077430000024
the X is selected from-CH 2 -、-C 2 H 4 -、-C 3 H 6 -、-C 4 H 8 -、-C 5 H 10 -、
Figure FDA0004056077430000031
Figure FDA0004056077430000032
/>
Any one of them;
said R, R 4 ～R 11 Each independently selected from the group consisting of-H, C C15 alkyl groups,
Figure FDA0004056077430000033
Figure FDA0004056077430000034
Any one of them;
and n is an integer of 1-10.
6. The resin composition according to claim 5, wherein R, R 4 ～R 11 Each independently selected from-H, -CH 3 、-C 2 H 5 、-C 3 H 7 、-C 4 H 9 、-C 5 H 11 、-C 8 H 17 、-C 15 H 31 、
Figure FDA0004056077430000035
Figure FDA0004056077430000036
Any one of the following.
7. The resin composition according to claim 1, wherein the temperature of the heating reaction is 100 to 200 ℃.
8. The resin composition according to claim 1, wherein the heating reaction time is 1 to 30 hours.
9. The resin composition according to claim 1, wherein the heating reaction is performed under condensing reflux conditions.
10. The resin composition according to claim 1, wherein the heating reaction is performed under stirring.
11. The resin composition according to claim 1, wherein the molar ratio of the compound (a) or the aminosilane-containing organometallic salt to the compound (B) is from 10:90 to 80:20.
12. The resin composition according to claim 1, wherein an accelerator is added to the heating reaction.
13. The resin composition according to claim 12, wherein the accelerator is used in an amount of 0.01 to 10% by mass of the compound (B).
14. The resin composition of claim 12, wherein the accelerator comprises any one or a combination of at least two of dicumyl peroxide, t-butyl cumyl peroxide, di-t-butyl peroxide, t-butyl peroxyisopropyl carbonate, 2, 5-dimethyl 2, 5-di-t-butyl hexane peroxide, p-menthane peroxide, 1-bis (t-amyl peroxy) cyclohexane, diisopropylbenzene hydroperoxide, benzoyl peroxide derivatives, metal salts of acetylacetone, metal salts of naphthenic acid, vanadium pentoxide, amine compounds, triphenylphosphine or triphenylphosphine derivatives.
15. The resin composition of claim 12, wherein the accelerator comprises a quaternary ammonium salt or an imidazole.
16. The resin composition according to claim 1, wherein a solvent is added to the heating reaction.
17. The resin composition according to claim 16, wherein the solvent is used in an amount of 10 to 500% by mass of the compound (B).
18. The resin composition according to claim 17, wherein the solvent is used in an amount of 50 to 400% by mass of the compound (B).
19. The resin composition of claim 16, wherein the solvent comprises any one or a combination of at least two of toluene, xylene, cyclohexane, tetrahydrofuran, N-dimethylformamide, or butanone.
20. The resin composition according to claim 1, wherein the polymer containing an olefin group comprises any one or a combination of at least two of polybutadiene, polydivinylbenzene, a copolymer of butadiene and styrene, a copolymer of butadiene and divinylbenzene, a terpolymer of butadiene and styrene and divinylbenzene, a polyphenylene ether resin containing a vinyl group, or a polyphenylene ether resin containing a acryl group.
21. The resin composition according to claim 1, further comprising an inorganic filler and/or a flame retardant.
22. The resin composition of claim 21, wherein the inorganic filler comprises any one or a combination of at least two of silica, boron nitride, or aluminum hydroxide.
23. The resin composition according to claim 21, wherein the inorganic filler has a particle size of < 50 μm.
24. The resin composition according to claim 23, wherein the inorganic filler has a particle size of < 20 μm.
25. The resin composition of claim 21, wherein the flame retardant comprises any one or a combination of at least two of decabromodiphenyl ether, decabromodiphenyl ethane, ethylene bis-tetrabromophthalimide, melamine phosphate, melamine polyphosphate, dimelamine pyrophosphate, tris (tribromophenyl) isocyanurate, tris (2, 6-dimethylphenyl) phosphorus, 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphafei-10-oxide, 2, 6-bis (2, 6-dimethylphenyl) phosphazene, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphafei-10-oxide, or phosphazene compounds.
26. The resin composition of claim 25, wherein the flame retardant comprises any one or a combination of at least two of tris (2, 6-dimethylphenyl) phosphorus, 10- (2, 5-dihydroxyphenyl) -9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2, 6-bis (2, 6-dimethylphenyl) phosphazene, 10-phenyl-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, hexachlorocyclotriphosphazene, alkoxycyclotriphosphazene, phenoxycyclotriphosphazene, hexaaminocyclotriphosphazene, polybrominated alkoxyphosphazene, or aryloxy-substituted polyphosphazene.
27. The resin composition of claim 1, further comprising an initiator.
28. The resin composition of claim 27, wherein the initiator comprises a peroxide initiator.
29. The resin composition of claim 28, wherein the peroxide initiator is selected from any one or a combination of at least two of α, α ' -di (t-butylperoxy m-isopropyl) benzene, 2, 5-dimethyl-2, 5-di (t-butylperoxy) -3-hexyne, benzoyl peroxide, 3', 5' -tetramethyl-1, 4-diphenoxyquinone, chloranil, 2,4, 6-tri (t-butylphenoxy) or t-butylperoxy isopropyl monocarbonate.
30. A resin dope comprising the resin composition according to any one of claims 1 to 29 and a solvent.
31. The resin glue of claim 30, wherein the solvent comprises any one or a combination of at least two of toluene, xylene, cyclohexane, butanone, or dimethylformamide.
32. A prepreg comprising a reinforcing material and the resin composition according to any one of claims 1 to 29 or the resin dope according to claim 30 or 31 attached thereto after impregnation drying.
33. A prepreg according to claim 32, wherein the reinforcing material comprises glass fibre cloth.
34. An insulation board comprising at least one prepreg sheet according to claim 32 or 33.
35. A metal foil-clad laminate comprising at least one prepreg according to claim 32 or 33 and a metal foil applied to one or both sides of the laminated prepreg.
36. A printed circuit board comprising at least one prepreg according to claim 32 or 33, or at least one insulating board according to claim 34, or at least one metal foil-clad laminate according to claim 35.
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WO2021134993A1 (en) 2021-07-08
TWI742643B (en) 2021-10-11
TW202126749A (en) 2021-07-16

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