CN107222180B - Quartz crystal resonator based on new device production research and development - Google Patents
Quartz crystal resonator based on new device production research and development Download PDFInfo
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- CN107222180B CN107222180B CN201710333094.8A CN201710333094A CN107222180B CN 107222180 B CN107222180 B CN 107222180B CN 201710333094 A CN201710333094 A CN 201710333094A CN 107222180 B CN107222180 B CN 107222180B
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- 239000013078 crystal Substances 0.000 title claims abstract description 104
- 239000010453 quartz Substances 0.000 title claims abstract description 86
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000012827 research and development Methods 0.000 title description 2
- 238000007789 sealing Methods 0.000 claims abstract description 64
- 239000003292 glue Substances 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000011160 research Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 85
- 238000007599 discharging Methods 0.000 claims description 52
- 230000007246 mechanism Effects 0.000 claims description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- 239000010703 silicon Substances 0.000 claims description 32
- 230000007306 turnover Effects 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 9
- 210000000078 claw Anatomy 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000012797 qualification Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 11
- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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Abstract
The invention discloses a quartz crystal resonator based on the production and research of a novel device, which comprises a quartz crystal resonator with a known structure, and is produced by three novel devices, namely a spiral high-speed chamfer wave-shaped cylinder, a three-dimensional dispenser and an automatic sealing, welding and mold changing machine. According to the invention, the wafer chamfering is more uniform through the waveform spiral cylinder, the damage to the surface of the wafer is reduced, the wafer chamfering machine has the characteristics of wide temperature range and stable electrical parameters, the positions and sizes of the wafer and glue points are more uniform, stable and consistent during glue dispensing operation through a three-dimensional glue dispensing process, the falling resistance and the impact resistance of a quartz crystal resonator are improved, the automatic die changing operation in the sealing welding process is realized through the automatic die changing device for sealing welding, and the precision and the stability of the quartz crystal resonator are improved.
Description
Technical Field
The invention relates to the field of quartz crystal production, in particular to a quartz crystal resonator based on the production and research of a novel device.
Background
The quartz crystal resonator is also called quartz crystal, commonly called crystal oscillator, and is a resonance element made by using piezoelectric effect of quartz crystal, and it has high stable physical and chemical properties, making it an important component for stabilizing frequency and selecting frequency. With the rapid increase of the application of intelligent terminal equipment, the requirement on quartz crystal is higher and higher; when the quartz crystal resonator is produced, the surface of the wafer is easy to damage due to the uneven chamfering of the wafer, the dispensing position is inaccurate or uneven, and the falling and impact resistance of the quartz crystal resonator are affected; the seal will affect the hermeticity of the quartz crystal resonator.
Disclosure of Invention
The invention aims to provide a quartz crystal resonator produced and researched based on a novel device, solves the problems that the electrical characteristics of the crystal resonator are easily influenced and the manufacturing benefit is low in the existing production mode, improves the production efficiency and ensures the production quality of the quartz crystal resonator.
In order to achieve the purpose, the invention provides the following technical scheme: the quartz crystal resonator produced and researched based on the novel device comprises a quartz crystal resonator which is of a known structure and is produced by adopting three novel devices, wherein the novel devices comprise a spiral high-speed chamfer wave-shaped cylinder, a three-dimensional dispenser and an automatic sealing, welding and mold changing machine; the spiral high-speed chamfering corrugated cylinder comprises a top arc cover, a cover ring, a cylinder body and a bottom arc cover, wherein the cover ring is arranged at the top of the cylinder body, a plurality of fixed point points which surround one circumference of the cover ring are arranged on the cover ring, the bottom arc cover is also arranged at the bottom of the cylinder body, the top arc cover is also arranged at the top of the cover ring, the structures of the bottom arc cover and the top arc cover are the same, spiral waveform wall grains or annular spiral wall grains are arranged on the inner wall of the cylinder body, a rotary path is formed between the spiral waveform wall grains or the annular spiral wall grains, and the radian of the bottom arc cover and the radian of the top arc cover are 160-180 degrees; mixing the wafer and the carborundum of the quartz crystal resonator, pouring the mixture from the inlet end of the arc-shaped cover at the top, sealing, putting the spiral high-speed chamfering waveform cylinder into a beveling machine, fixing, adjusting the rotating speed to be within the range of 0-250 RPM according to the actual wafer requirement, enabling the vibration energy of the wafer to be uniformly distributed, eliminating the marginal effect generated by the vibration of the wafer, carrying out circular motion on the quartz wafer along the spiral wall, and pouring the mixture from the outlet of the arc-shaped cover at the top after the circular motion is completed; the three-dimensional dispenser comprises a turntable, a workbench, a driving device, a shell feeding mechanical arm, a silicon chip feeding mechanical arm, a dispensing device and an unloading mechanical arm, wherein the turntable is horizontally arranged on the workbench, a vertical rotating shaft is arranged in the middle of the turntable, the turntable is arranged on the workbench through the rotating shaft, the driving device is connected with the turntable, at least one first shell mounting groove is formed in the periphery of the turntable, the shell feeding mechanical arm, the silicon chip feeding mechanical arm, the dispensing device and the unloading mechanical arm are respectively arranged in the periphery of the turntable, the shell feeding mechanical arm is used for feeding a shell in the first shell mounting groove located at a first feeding station, the silicon chip feeding mechanical arm is used for feeding silicon chips to a shell located at a second feeding station, the dispensing device is used for feeding the dispensing chips to the wafer components located at the dispensing station, the unloading mechanical arm is used for unloading the wafer components for dispensing, and the shell feeding mechanical arm comprises a vibration feeding, A first slide rail, a second slide rail and a material pushing part, wherein a discharging structure is arranged at an outlet of the vibrating feeding disc, a discharging channel extending towards the direction close to the rotating disc is arranged on the discharging structure, the first slide rail is positioned between a discharging port of the discharging channel and the rotating disc, a slide block capable of being installed in a sliding way is arranged on the first slide rail, a second shell installation groove is arranged on the slide block, the slide block is positioned in a first position state, the first end of the second shell mounting groove is communicated with the discharge hole of the discharge channel, the slide block is in a second position state, the second end of the second shell mounting groove is communicated with the first shell mounting groove positioned at the first feeding station, the second slide rail is positioned on one side of the discharging structure and is arranged in parallel to the extending direction of the discharging channel, the pushing piece is slidably mounted on the second slide rail, and the pushing piece is used for pushing the shell to be processed in the second shell mounting groove into the first shell mounting groove positioned at the first feeding station when the slide block is in the second position state; the automatic sealing and welding mold changing machine comprises a vacuum box body, a charging mechanism, a sealing and welding manipulator device and a turnover mechanism, wherein the charging mechanism is arranged at the front part in the vacuum box body, the sealing and welding manipulator device is arranged on the right rear side in the vacuum box body, a crystal turnover mechanism is arranged between the charging mechanism and the sealing and welding manipulator device, the charging mechanism is provided with a charging box with an opening facing the interior of the vacuum box body, the bottom of the charging box is provided with a driving cylinder for driving the charging box to lift, the top of the charging box extends out of the vacuum box body and is provided with a feeding hole, the feeding hole is provided with a sealing cover, a turnover box is arranged in the charging box, a plurality of turnover disks are arranged in the turnover box, a plurality of anti-skid blocks are arranged on the left box wall and the; the crystal turnover mechanism comprises a mechanical arm which is transversely arranged, a manipulator which moves left and right is arranged on the mechanical arm, and the manipulator is provided with two side claws which are matched with the two ends of the crystal and a pressing claw which is matched with the middle part of the crystal; the loading and unloading arm is transversely arranged below the mechanical arm, an electromagnetic adsorption device matched with the turnover disc is arranged on the loading and unloading arm, a sliding arm is longitudinally arranged on one side of the charging box, and the loading and unloading arm is arranged on the sliding arm.
Preferably, the wafer of the quartz crystal resonator is chamfered in a spiral high-speed chamfering waveform cylinder.
Preferably, the wafer of the quartz crystal resonator is bonded on the metal frame through a three-dimensional glue dispenser.
Preferably, the three-dimensional dispenser adopts optical fiber positioning and CCD camera shooting identification technology.
Preferably, the quartz crystal resonator is automatically changed during sealing by an automatic sealing and mould changing machine.
Compared with the prior art, the invention has the following beneficial effects:
1. the quartz crystal resonator of the invention improves the chamfering mode of the quartz crystal wafer by using the waveform spiral high-speed chamfering waveform cylinder, enables the quartz crystal wafer mixed with carborundum to carry out circular motion along a spiral wall through the spiral waveform wall veins or the annular spiral wall veins arranged on the inner wall of the cylinder body, and enables the vibration energy of the wafer to be uniformly distributed, eliminates the marginal effect generated by the vibration of the wafer without damaging the surface flatness of the wafer and realizes the requirements of wide temperature and good electrical property of the quartz crystal by researching the action track, the speed, the thickness and the quantity of the sand and the like of the motion of the crystal.
2. According to the quartz crystal resonator, the three-dimensional glue dispenser is used for dispensing glue from any space direction, the dispensing glue is sequentially switched among the shell feeding station, the silicon wafer feeding station, the dispensing station and the discharging station, the shell feeding mechanical arm feeds the shell into the first shell mounting groove, the silicon wafer feeding mechanical arm feeds the silicon wafer to the silicon wafer mounting position on the shell, the glue dispensing device performs dispensing, the discharging mechanical arm discharges the transistor assembly subjected to dispensing, continuous completion of wafer assembly dispensing is achieved, during feeding, the shells are fed one by one and accurate in feeding position through the moving and switching of the sliding block between the discharging channel of the discharging structure and the first shell mounting position of the rotating disc, compared with the traditional manual dispensing, the assembling and dispensing precision and speed of the transistor assembly are guaranteed.
3. According to the quartz crystal resonator, the automatic sealing and welding mold changing mode is used for improving the sealing and welding mode of the quartz crystal, the sealing and welding manipulator device is used, and the crystal turnover mechanism is arranged between the charging mechanism and the sealing and welding manipulator device.
4. The quartz crystal resonator adopts the wave-shaped spiral high-speed chamfering process technology, the wafers are more uniform and consistent in the chamfering process through the high-speed rotation of the wave-shaped spiral cylinder, the damage to the surfaces of the wafers is reduced, the quartz crystal resonator has the characteristics of wide temperature range and stable electrical parameters, the positions and the sizes of the wafers and glue spots are more uniform, stable and consistent in glue dispensing operation through the three-dimensional glue dispensing process by adopting the optical fiber positioning and CCD camera shooting identification technology, the falling resistance and the impact resistance of the quartz crystal resonator are improved, the automatic die changing operation in the sealing and welding process is realized through the sealing and welding automatic die changing device, the production efficiency is greatly improved, the influence of product difference caused by manual die changing is reduced, and the precision and the stability of the quartz crystal resonator are improved.
Drawings
FIG. 1 is a process diagram of the novel apparatus of the present invention;
FIG. 2 is a schematic view of the structure of the wave-shaped spiral high-speed chamfering wave-shaped cylinder of the present invention;
FIG. 3 is a schematic structural view of a three-dimensional dispenser according to the present invention;
FIG. 4 is a schematic structural view of an automatic sealing and welding mold changing machine according to the present invention;
in the figure: 1, a corrugated spiral high-speed chamfering corrugated cylinder, 2, a three-dimensional dispenser, 3, automatic sealing and welding mold changing machines, 101, a top arc cover, 102 cover rings, 103, 104, a bottom arc cover, 201, a turntable, 202, 203, a driving device, 204, a shell feeding manipulator, 205, a silicon chip feeding manipulator, 206, a dispensing device, 207, a blanking manipulator, 301, a 302 charging mechanism, 303, a sealing and welding manipulator device and 304 transferring mechanisms.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the quartz crystal resonator produced and developed based on the new device comprises a quartz crystal resonator which is a known structure and is produced by adopting three new devices, wherein the new devices comprise a spiral high-speed chamfer wave-shaped cylinder 1, a three-dimensional dispenser 2 and an automatic sealing and welding mold-changing machine 3; the spiral high-speed chamfering waveform cylinder 1 is used for chamfering operation of a quartz crystal resonator wafer and comprises a top arc-shaped cover 101, a cover ring 102, a cylinder body 103 and a bottom arc-shaped cover 104, wherein the top of the cylinder body 103 is provided with the cover ring 102, the cover ring 102 is provided with a plurality of fixed point points around one circumference of the cover ring 102, the bottom of the cylinder body 103 is also provided with the bottom arc-shaped cover 104, the top of the cover ring 102 is also provided with the top arc-shaped cover 101, the structures of the bottom arc-shaped cover 104 and the top arc-shaped cover 101 are the same, the inner wall of the cylinder body 103 is provided with spiral waveform wall grains or annular spiral wall grains, a rotation path is formed between the spiral waveform wall grains or the annular spiral wall grains, and the radians of the bottom arc-shaped cover and the top arc; mixing the wafer and the carborundum of the quartz crystal resonator, pouring the mixture from the inlet end of the top arc-shaped cover 101, sealing, putting the spiral high-speed chamfering waveform cylinder 1 into a beveling machine, fixing, adjusting the rotating speed to be within the range of 0-250 RPM according to the actual wafer requirement, enabling the vibration energy of the wafer to be uniformly distributed, eliminating the marginal effect generated by the vibration of the wafer, carrying out circular motion on the quartz wafer along the spiral wall, and pouring the mixture from the outlet of the top arc-shaped cover 101 after the circular motion is completed; the three-dimensional dispenser 2 is used for bonding wafers of a quartz crystal resonator on a metal frame and comprises a turntable 201, a workbench 202, a driving device 203, a shell feeding manipulator 204, a silicon chip feeding manipulator 205, a glue dispensing device 206 and a discharging manipulator 207, wherein the turntable 201 is horizontally arranged on the workbench 202, a vertical rotating shaft is arranged in the middle of the turntable 201, the turntable 201 is arranged on the workbench 202 through the rotating shaft, the driving device 203 is connected with the turntable 201, at least one first shell mounting groove is formed in the periphery of the turntable 201, the shell feeding manipulator 204, the silicon chip feeding manipulator 205, the glue dispensing device 206 and the discharging manipulator 207 are respectively arranged in the periphery of the turntable 201, the shell feeding manipulator 204 is used for feeding the shell into the first shell mounting groove in the first feeding station, the silicon chip feeding manipulator 205 is used for feeding silicon chips into the shell in the second feeding station, the glue dispensing device 206 is used for dispensing the chips on the chip assembly in the glue dispensing station, the blanking manipulator 207 is used for blanking the wafer assembly subjected to dispensing, the shell feeding manipulator 204 comprises a vibrating feeding disc, a first slide rail, a second slide rail and a material pushing part, a discharging structure is arranged at the outlet of the vibrating feeding disc, a discharging channel extending towards the direction close to the turntable 201 is arranged on the discharging structure, the first slide rail is positioned between the discharging port of the discharging channel and the turntable 201, a sliding block which can be installed in a sliding manner is arranged on the first slide rail, a second shell mounting groove is arranged on the sliding block, the sliding block is positioned in a first position state, the first end of the second shell mounting groove is communicated with the discharging port of the discharging channel, the sliding block is positioned in a second position state, the second end of the second shell mounting groove is communicated with the first shell mounting groove positioned at the first feeding station, the second slide rail is positioned on one side of the discharging structure and is arranged in parallel to the extending, the pushing piece is slidably arranged on the second sliding rail and used for pushing the shell to be processed in the second shell mounting groove into the first shell mounting groove in the first feeding station when the sliding block is at the second position; the automatic sealing and welding mold changing machine 3 is used for automatically changing molds during sealing and welding of quartz crystal resonators and comprises a vacuum box body 301, a charging mechanism 302, a sealing and welding manipulator device 303 and a turnover mechanism 304, wherein the charging mechanism 302 is arranged at the front part in the vacuum box body 301, a sealing manipulator device 303 is arranged on the right rear side in the vacuum box body 301, a crystal turnover mechanism 304 is arranged between the charging mechanism 302 and the sealing manipulator device 303, the charging mechanism 302 is provided with a charging box with an opening facing the vacuum box body 301, the bottom of the charging box is provided with a driving cylinder for driving the charging box to lift, the top of the charging box extends out of the vacuum box body 301 and is provided with a feeding hole, the feeding hole is provided with a sealing cover, a turnover box is arranged in the charging box, a plurality of turnover disks are arranged in the turnover box, the left and right box walls outside the turnover box are provided with a plurality of anti-skid blocks, and the left and right inner walls of the charging box are provided with stop blocks matched with the anti-skid blocks; the crystal turnover mechanism 304 comprises a mechanical arm which is transversely arranged, a manipulator which moves left and right is arranged on the mechanical arm, and the manipulator is provided with two side claws which are matched with the two ends of the crystal and a pressing claw which is matched with the middle part of the crystal; the loading and unloading arm is transversely arranged below the mechanical arm, an electromagnetic adsorption device matched with the turnover disc is arranged on the loading and unloading arm, a sliding arm is longitudinally arranged on one side of the charging box, and the loading and unloading arm is arranged on the sliding arm.
When the chamfering machine is used, when chamfering is carried out, wafers of a quartz crystal resonator are mixed with carborundum, the mixture is poured into the chamfering machine from the inlet end of the arc-shaped cover 101 at the top of the spiral high-speed chamfering waveform cylinder 1, sealing treatment is carried out, the spiral high-speed chamfering waveform cylinder 1 is placed into the chamfering machine and is fixed, the rotating speed is adjusted to be within the range of 0-250 RPM according to the actual wafer requirement, the vibration energy of the wafers can be uniformly distributed, the marginal effect generated by the vibration of the wafers is eliminated, the quartz wafers carry out circular motion along the spiral wall, and the mixture is poured out from the outlet of the arc-shaped cover; when a wafer of the quartz crystal resonator is to be bonded on a metal frame, glue can be dispensed from any spatial direction by using the three-dimensional glue dispenser 2, and the glue dispensing is sequentially switched among a shell feeding station, a silicon wafer feeding station, a glue dispensing station and a discharging station; when the quartz crystal resonator is sealed, the automatic sealing and die changing machine 3 is used, and the continuous and efficient sealing and welding of the wafer is completed through the reciprocating feeding and discharging of the sealing and welding manipulator device 303 between the loading mechanism 302 and the crystal turnover mechanism 304.
In summary, the following steps: according to the quartz crystal resonator produced and researched based on the new device, the chamfering mode of a quartz crystal wafer is improved by using the waveform spiral high-speed chamfering waveform cylinder 1, the quartz crystal wafer mixed with carborundum is enabled to carry out circular motion along a spiral wall through spiral waveform wall grains or annular spiral wall grains arranged on the inner wall of the cylinder body 104, and through researches on the aspects of action track, speed, thickness and quantity of the carborundum and the like of crystal motion, the vibration energy of the wafer can be uniformly distributed, the marginal effect generated by wafer vibration is eliminated, the surface flatness of the wafer is not damaged, and the requirements of wide temperature and good electrical characteristics of the quartz crystal are met; the quartz crystal resonator can be subjected to dispensing from any spatial direction by using a three-dimensional dispenser 2, the dispensing is sequentially switched among a shell feeding station, a silicon wafer feeding station, a dispensing station and a discharging station, a shell feeding manipulator 204 feeds the shell into a first shell mounting groove, a silicon wafer feeding manipulator 205 feeds the silicon wafer to the silicon wafer mounting position on the shell, a dispensing device 206 performs dispensing, a discharging manipulator 207 discharges the dispensed transistor assembly, continuous completion of wafer assembly dispensing is realized, and during feeding, the shells are fed one by one and the feeding position is accurate through the moving switching of a sliding block between a discharging channel of a discharging structure and the first shell mounting position of a turntable 201 compared with the traditional manual dispensing, so that the assembly dispensing accuracy and speed of the transistor assembly are ensured; the quartz crystal resonator uses the automatic sealing and welding mold changing machine 3 to improve the sealing and welding mode of the quartz crystal, and the sealing and welding manipulator device 303 is provided with the crystal turnover mechanism 304 between the charging mechanism 302 and the sealing and welding manipulator device 303, so that compared with the traditional manual mold changing machine, the continuous and efficient sealing and welding of the quartz crystal can be completed, the sealing and welding qualification rate is high, and the sealing performance and the consistency are good; the quartz crystal resonator adopts the wave-shaped spiral high-speed chamfering process technology, the wafers are more uniform and consistent in the chamfering process through the high-speed rotation of the wave-shaped spiral cylinder, the damage to the surfaces of the wafers is reduced, the quartz crystal resonator has the characteristics of wide temperature range and stable electrical parameters, the optical fiber positioning and CCD camera shooting identification technology is adopted, the positions and sizes of the wafers and glue points are more uniform, stable and consistent in the glue dispensing operation through the three-dimensional glue dispensing process, the falling resistance and the impact resistance of the quartz crystal resonator are improved, the automatic die changing operation in the sealing and welding process is realized through the sealing and welding automatic die changing device, the production efficiency is greatly improved, the influence of product difference caused by manual die changing is reduced, and the precision and the stability of the quartz crystal resonator are improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A quartz crystal resonator developed based on new device production, comprising a quartz crystal resonator, characterized in that: the quartz crystal resonator is of a known structure and is produced by adopting three novel devices, wherein the novel devices comprise a spiral high-speed chamfer wave-shaped cylinder (1), a three-dimensional glue dispenser (2) and an automatic sealing welding mold changing machine (3);
the spiral high-speed chamfering corrugated cylinder (1) comprises a top arc cover (101), a cover ring (102), a cylinder body (103) and a bottom arc cover (104), wherein the cover ring (102) is arranged at the top of the cylinder body (103), the bottom arc cover (104) is also arranged at the bottom of the cylinder body (103), the top arc cover (101) is also arranged at the top of the cover ring (102), the structures of the bottom arc cover (104) and the top arc cover (101) are the same, spiral waveform wall grains or annular spiral wall grains are arranged on the inner wall of the cylinder body (103), a rotary path is formed between the spiral waveform wall grains or the annular spiral wall grains, and the radian of the bottom arc cover and the radian of the top arc cover are 160-180 degrees; mixing the wafer of the quartz crystal resonator with carborundum, pouring the mixture from the inlet end of the top arc-shaped cover (101), sealing, putting the spiral high-speed chamfering waveform cylinder (1) into a beveling machine, fixing, adjusting the rotating speed to be within the range of 0-250 RPM according to the actual wafer requirement, enabling the vibration energy of the wafer to be uniformly distributed, eliminating the marginal effect generated by the vibration of the wafer, carrying out circular motion on the quartz wafer along the spiral wall, and pouring the mixture out from the outlet of the top arc-shaped cover (101) after the circular motion is completed;
the three-dimensional dispenser (2) comprises a turntable (201), a workbench (202), a driving device (203), a shell feeding manipulator (204), a silicon chip feeding manipulator (205), a glue dispensing device (206) and a discharging manipulator (207), wherein the turntable (201) is horizontally arranged on the workbench (202), a vertical rotating shaft is arranged in the middle of the turntable (201), the turntable (201) is installed on the workbench (202) through the rotating shaft, the driving device (203) is connected with the turntable (201), at least one first shell installation groove is formed in the periphery of the turntable (201), the shell feeding manipulator (204), the silicon chip feeding manipulator (205), the glue dispensing device (206) and the discharging manipulator (207) are respectively arranged in the periphery of the turntable (201), the shell feeding manipulator (204) is used for feeding a shell to a first shell installation groove located at a first feeding station, and the silicon chip feeding manipulator (205) is used for feeding a silicon chip to a shell located at a second feeding station, the glue dispensing device (206) is used for dispensing glue on the wafer component positioned at the glue dispensing station, the blanking manipulator (207) is used for blanking the wafer component completing the glue dispensing, the shell feeding manipulator (204) comprises a vibrating feeding disk, a first slide rail, a second slide rail and a pushing part, a discharging structure is arranged at the outlet of the vibrating feeding disk, a discharging channel extending towards the direction close to the turntable (201) is arranged on the discharging structure, the first slide rail is positioned between the discharging port of the discharging channel and the turntable (201), a sliding block capable of being installed in a sliding manner is arranged on the first slide rail, a second shell mounting groove is arranged on the sliding block, the sliding block is positioned in a first position state, the first end of the second shell mounting groove is communicated with the discharging port of the discharging channel, the sliding block is positioned in a second position state, the second end of the second shell mounting groove is communicated with the first shell positioned at the first feeding station, the second sliding rail is positioned on one side of the discharging structure and is arranged in parallel to the extending direction of the discharging channel, the pushing piece is slidably arranged on the second sliding rail, and the pushing piece is used for pushing the shell to be processed in the second shell mounting groove into the first shell mounting groove positioned in the first feeding station when the sliding block is positioned at the second position; the three-dimensional glue dispenser (2) dispenses glue from any space direction of a quartz crystal resonator wafer, the glue dispensing is sequentially switched among a shell feeding station, a silicon chip feeding station, a glue dispensing station and a discharging station, a shell feeding manipulator (204) feeds a shell into a first shell mounting groove, a silicon chip feeding device (205) feeds the silicon chip to a silicon chip mounting position on the shell, the glue dispensing device (206) dispenses the glue, a discharging manipulator (207) discharges wafer components subjected to glue dispensing, and during feeding, the wafer components are moved and switched between a discharging channel of a discharging structure and the first shell mounting position of a turntable (201) through a sliding block;
the automatic sealing and welding mold changing machine (3) comprises a vacuum box body (301), a charging mechanism (302), a sealing and welding manipulator device (303) and a turnover mechanism (304), wherein the charging mechanism (302) is arranged at the front part in the vacuum box body (301), the sealing and welding manipulator device (303) is arranged at the right rear side in the vacuum box body (301), a crystal turnover mechanism (304) is arranged between the charging mechanism (302) and the sealing and welding manipulator device (303), the charging mechanism (302) is provided with a charging box with an opening facing the interior of the vacuum box body (301), the bottom of the charging box is provided with a driving cylinder for driving the charging box to lift, the top of the charging box extends out of the vacuum box body (301) and is provided with a feeding hole, a sealing cover is arranged at the feeding hole, a turnover box is internally provided with a plurality of turnover boxes, a plurality of turnover boxes are arranged in the turnover, the inner walls of the left side and the right side of the charging box are provided with stop blocks matched with the anti-skid blocks; the crystal turnover mechanism (304) comprises a mechanical arm which is transversely arranged, a manipulator which moves left and right is arranged on the mechanical arm, and the manipulator is provided with two side claws which are matched with the two ends of the crystal and a pressing claw which is matched with the middle part of the crystal; a loading and unloading arm is transversely arranged below the mechanical arm, an electromagnetic adsorption device matched with the turnover disc is arranged on the loading and unloading arm, a sliding arm is longitudinally arranged on one side of the charging box, and the loading and unloading arm is arranged on the sliding arm; and the sealing manipulator device 303 carries out reciprocating feeding and discharging between the loading mechanism 302 and the crystal turnover mechanism 304 to complete continuous and efficient sealing of the wafers.
2. The quartz crystal resonator developed based on the new device production according to claim 1, characterized in that: the wafer of the quartz crystal resonator is chamfered in a spiral high-speed chamfering waveform cylinder (1).
3. The quartz crystal resonator developed based on the new device production according to claim 1, characterized in that: the wafer of the quartz crystal resonator is bonded on the metal frame through a three-dimensional dispenser (2).
4. The quartz crystal resonator developed on the basis of new device production according to claim 3, characterized in that: the three-dimensional dispenser (2) adopts optical fiber positioning and CCD camera shooting identification technology.
5. The quartz crystal resonator developed based on the new device production according to claim 1, characterized in that: the quartz crystal resonator is automatically changed during sealing through an automatic sealing and welding mold changing machine (3).
6. The method of using a quartz crystal resonator developed for new device production according to claim 1, characterized in that: when the chamfering machine is used, when chamfering is carried out, wafers of a quartz crystal resonator are mixed with carborundum, the mixture is poured into the chamfering machine from the inlet end of the top arc-shaped cover (101) of the spiral high-speed chamfering waveform cylinder (1), sealing treatment is carried out, the spiral high-speed chamfering waveform cylinder (1) is placed into the chamfering machine and fixed, the rotating speed is adjusted to be within the range of 0-250 RPM according to the actual wafer requirement, the vibration energy of the wafers can be uniformly distributed, the marginal effect generated by vibration of the wafers is eliminated, the quartz wafers carry out circular motion along the spiral wall, and the mixture is poured out from the outlet of the top arc-shaped cover (101) after the chamfering; when a wafer of the quartz crystal resonator is to be bonded on a metal frame, glue can be dispensed from any space direction by using a three-dimensional glue dispenser (2), the glue dispensing is sequentially switched among a shell feeding station, a silicon wafer feeding station, a glue dispensing station and a discharging station, when the quartz crystal resonator works, a shell feeding manipulator (204) firstly feeds a shell into a first shell mounting groove, then a silicon wafer feeding device (205) feeds a silicon wafer to a silicon wafer mounting position on the shell, and finally the glue dispensing device (206) performs glue dispensing, the discharging manipulator (207) discharges a transistor assembly subjected to glue dispensing to realize the continuous completion of the assembly glue dispensing of the transistor, and during the feeding, the slide block is moved and switched between a discharging channel of a discharging structure and the first shell mounting position of a turntable (201); when the quartz crystal resonator is sealed, the automatic sealing and mould changing machine 3 is used, and the continuous and efficient sealing and welding of the wafer is completed through the reciprocating feeding and discharging between the loading mechanism (302) and the crystal turnover mechanism (304) through the sealing and welding manipulator device (303).
7. A glue dispensing method for a quartz crystal resonator based on new device production and research is characterized in that: the quartz crystal resonator can be dispensed from any spatial direction by using a three-dimensional dispenser (2): according to the quartz crystal resonator produced and researched based on the new device, the chamfering mode of a quartz crystal wafer is improved by using the waveform spiral high-speed chamfering waveform cylinder 1, the quartz crystal wafer mixed with carborundum is enabled to carry out circular motion along a spiral wall through spiral waveform wall grains or annular spiral wall grains arranged on the inner wall of a cylinder body (104), and through researches on the aspects of motion tracks, speed, thickness and quantity of the carborundum and the like of the crystal motion, the vibration energy of the wafer can be uniformly distributed, the marginal effect generated by the vibration of the wafer is eliminated, and the surface flatness of the wafer is not damaged; the quartz crystal resonator can be subjected to dispensing from any spatial direction by using a three-dimensional dispenser (2), the dispensing is sequentially switched among a shell feeding station, a silicon chip feeding station, a dispensing station and a discharging station, a shell feeding manipulator (204) feeds the shell into a first shell mounting groove, a silicon chip feeding manipulator (205) feeds the silicon chip to a silicon chip mounting position on the shell, a dispensing device (206) performs dispensing, the discharging manipulator (207) discharges the transistor assembly subjected to dispensing, continuous completion of wafer assembly dispensing is realized, and during feeding, the shells are fed one by one and the feeding position is accurate through moving switching of a sliding block between a discharging channel of a discharging structure and the first shell mounting position of a turntable (201) compared with the traditional manual dispensing, so that the assembly dispensing accuracy and speed of the transistor assembly are ensured; the quartz crystal resonator improves the quartz crystal wafer sealing mode by using an automatic sealing and welding mold changing machine (3), and a crystal turnover mechanism (304) is arranged between a charging mechanism (302) and the sealing and welding manipulator device (303) through a sealing and welding manipulator device (303), so that compared with the traditional manual mold changing machine, the quartz crystal resonator completes continuous and efficient sealing and welding of wafers, and has high sealing and welding qualification rate and good sealing performance and consistency.
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| CN111112018A (en) * | 2019-12-10 | 2020-05-08 | 廊坊中电熊猫晶体科技有限公司 | Direct-insertion type quartz crystal resonator dispensing device and using method thereof |
| CN111769813B (en) * | 2020-06-29 | 2023-10-27 | 安徽晶赛科技股份有限公司 | Full-automatic sealing welding machine for quartz crystal resonator and sealing welding method |
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