CN107210253A - 基板移载系统 - Google Patents
基板移载系统 Download PDFInfo
- Publication number
- CN107210253A CN107210253A CN201580058301.2A CN201580058301A CN107210253A CN 107210253 A CN107210253 A CN 107210253A CN 201580058301 A CN201580058301 A CN 201580058301A CN 107210253 A CN107210253 A CN 107210253A
- Authority
- CN
- China
- Prior art keywords
- substrate
- absorption layer
- transfer system
- substrate transfer
- jut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/051712 WO2016117095A1 (ja) | 2015-01-22 | 2015-01-22 | 基板移載システム |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107210253A true CN107210253A (zh) | 2017-09-26 |
Family
ID=56416660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580058301.2A Pending CN107210253A (zh) | 2015-01-22 | 2015-01-22 | 基板移载系统 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6327367B2 (ja) |
CN (1) | CN107210253A (ja) |
WO (1) | WO2016117095A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110954633A (zh) * | 2018-09-26 | 2020-04-03 | 株式会社岛津制作所 | 试样搬送装置 |
CN113396485A (zh) * | 2019-02-12 | 2021-09-14 | 信越化学工业株式会社 | 微小构造体移载装置、模板头单元、微小构造体移载用模板部件及微小构造体集成部件的移载方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202342252A (zh) * | 2022-01-12 | 2023-11-01 | 日商東京威力科創股份有限公司 | 搬送臂及基板搬送裝置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08236597A (ja) * | 1995-02-27 | 1996-09-13 | Hitachi Ltd | 移載装置 |
US20050062465A1 (en) * | 2003-08-20 | 2005-03-24 | De Ridder Christianus Gerardus Maria | Method and system for loading substrate supports into a substrate holder |
US20050110292A1 (en) * | 2002-11-26 | 2005-05-26 | Axcelis Technologies, Inc. | Ceramic end effector for micro circuit manufacturing |
JP2006027795A (ja) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | 吸着装置、ならびに板状部材の搬送方法、液晶表示装置の製造方法 |
CN103715125A (zh) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | 板状体保持机构、基板贴合装置以及基板贴合方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2837332B2 (ja) * | 1993-02-26 | 1998-12-16 | 東京エレクトロン株式会社 | 搬送アーム |
JP2008130800A (ja) * | 2006-11-21 | 2008-06-05 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2015
- 2015-01-22 WO PCT/JP2015/051712 patent/WO2016117095A1/ja active Application Filing
- 2015-01-22 CN CN201580058301.2A patent/CN107210253A/zh active Pending
- 2015-01-22 JP JP2016570432A patent/JP6327367B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08236597A (ja) * | 1995-02-27 | 1996-09-13 | Hitachi Ltd | 移載装置 |
US20050110292A1 (en) * | 2002-11-26 | 2005-05-26 | Axcelis Technologies, Inc. | Ceramic end effector for micro circuit manufacturing |
US20050062465A1 (en) * | 2003-08-20 | 2005-03-24 | De Ridder Christianus Gerardus Maria | Method and system for loading substrate supports into a substrate holder |
JP2006027795A (ja) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | 吸着装置、ならびに板状部材の搬送方法、液晶表示装置の製造方法 |
CN103715125A (zh) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | 板状体保持机构、基板贴合装置以及基板贴合方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110954633A (zh) * | 2018-09-26 | 2020-04-03 | 株式会社岛津制作所 | 试样搬送装置 |
CN113396485A (zh) * | 2019-02-12 | 2021-09-14 | 信越化学工业株式会社 | 微小构造体移载装置、模板头单元、微小构造体移载用模板部件及微小构造体集成部件的移载方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2016117095A1 (ja) | 2016-07-28 |
JPWO2016117095A1 (ja) | 2017-06-15 |
JP6327367B2 (ja) | 2018-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170926 |