CN107199401B - A kind of polishing method of laser polishing machine - Google Patents
A kind of polishing method of laser polishing machine Download PDFInfo
- Publication number
- CN107199401B CN107199401B CN201710269509.XA CN201710269509A CN107199401B CN 107199401 B CN107199401 B CN 107199401B CN 201710269509 A CN201710269509 A CN 201710269509A CN 107199401 B CN107199401 B CN 107199401B
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- Prior art keywords
- leg
- laser
- path trace
- leg path
- workpiece
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- 238000005498 polishing Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims description 23
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 238000010408 sweeping Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 16
- 239000002184 metal Substances 0.000 abstract description 16
- 239000000843 powder Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 9
- 239000000446 fuel Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021654 trace metal Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
Abstract
A kind of laser polishing machine involved in the present invention, including laser scanning system, high-speed vibrator and XY mobile platform.Because high-speed vibrator is mounted on XY mobile platform.Laser scanning system includes laser light source, scanning galvanometer, field lens.When use, back and forth move back and forth first with field lens, so that field lens is launched first leg laser and form multichannel first leg path trace in surface of workpiece, be then turned on high-speed vibrator, so that field lens is launched second leg laser and form multichannel second leg path trace in surface of workpiece；The width of second leg path trace is greater than the width of first leg path trace, and second leg path trace is covered in the first leg path clearance that first leg path trace and first leg path trace are formed, forms traceless metallic mirror surface.Surface of workpiece noresidue metal powder and surface of workpiece to be polished are not damaged.Technical solution of the present invention has the advantages that structure is simple, the processing is simple and easy to use.
Description
[technical field]
The present invention relates to a kind of polishing methods of laser machine for workpiece surface polishing aspect.
[background technique]
It is higher and higher along with the requirement to workpiece surface with society's continuous development and progress.Nowadays to workpiece surface
The metal polishing procedure of processing is divided into mechanical polishing method and contactless polishing method.Metal polishing procedure is mechanically to throw
Most common one kind of light method, using polishing wheel rotation and additional polishing powder and liquid effects in workpiece surface, such polishing side
Method be easy to cause metal powder to remain on workpiece surface, and is polished workpiece surface and is depleted.Electron beam metal polishing is non-connects
The most common one kind of touch polishing method, the structure of such polishing method is more complicated, and needs in the environment of high vacuum
Processing, is extremely restricted in terms of using field.
[summary of the invention]
It not only can be to avoid the metal work being polished in view of this, technical problem to be solved by the invention is to provide one kind
Part surface noresidue metal powder and surface of workpiece are not damaged, but also have the simple laser polishing machine of structure.
The technical problems to be solved by the invention also provide a kind of with the processing is simple, laser polishing machine easy to use
Polishing method.
Above-mentioned technical problem is solved thus, and the technical solution in the present invention uses a kind of laser polishing machine comprising swashs
Photo-scanning system, high-speed vibrator and XY mobile platform；The high-speed vibrator is mounted on XY mobile platform, described
XY mobile platform is provided with the switch for opening or closing high-speed vibrator；The laser scanning system includes laser light
Source is mounted on the scanning galvanometer of laser light source one end, is mounted on the field lens of scanning galvanometer upper end；It is back and forth moved back first with field lens
It is dynamic, so that field lens is launched first leg laser and form multichannel first leg path trace in surface of workpiece, is then turned on high speed
Vibrator makes field lens launch second leg laser and forms multichannel second leg path trace on surface of workpiece；Second
The width of bout path trace is greater than the width of first leg path trace, and second leg path trace is covered in first time
It is combined the first leg path clearance that diameter trace and first leg path trace are formed, forms traceless metallic mirror surface.
It is further limited according to technical characteristics, firstly, launching first leg laser from field lens, in scanning galvanometer control
Under system, the first leg laser projects the first leg path trace of a surface melting；The first leg laser is being swept
It under the control for retouching galvanometer, is moved back and forth in surface of workpiece, makes first leg path adjacent on surface of workpiece
First leg path clearance is formed between trace and first leg path trace；Then, high-speed vibrator is opened, is emitted from field lens
Second leg laser out makes second leg laser along the side perpendicular to first leg path clearance under scanning galvanometer control
To vibration movement, second leg laser is driven to form second leg path trace in work metal workpiece surface, this is second time
Combining diameter trace width is two times of first leg path trace width；Under scanning galvanometer and high-speed vibrator co- controlling,
The second leg laser moves back and forth, and second leg path trace on surface of workpiece is made to cover and smooth the
Bout path clearance forms traceless metallic mirror surface；The point energy of laser light source used in the first leg laser
Greater than 1.5mJ, frequency is greater than 100KHz, and scanning speed is greater than 100mm/sec, and melting heat energy is greater than 64KJ/Kg, and is less than
1577kJ/kg；High-speed vibrator vibration velocity back and forth/second greater than 1000, and vibrated in the range of 0.5mm, second leg is swashed
The hot spot of light is widened, and by the width of original 0.1mm to 0.3mm, is expanded to the width of 0.6mm to 1mm, the second leg laser
The point energy of used laser light source is greater than 1.5mJ, and frequency is greater than 100KHz, and scanning speed is greater than 1000mm/sec.
Technical solution of the present invention advantageous effects are as follows: described because the high-speed vibrator is mounted on XY mobile platform
XY mobile platform be provided with the switch for opening or closing high-speed vibrator；The laser scanning system includes laser light
Source is mounted on the scanning galvanometer of laser light source one end, is mounted on the field lens of scanning galvanometer upper end.First in use, past using field lens
Move back and forth again, first leg laser is made to form multichannel first leg path trace in surface of workpiece, is then turned on high speed and shakes
Dynamic device, makes field lens launch second leg laser and forms multichannel second leg path trace on surface of workpiece；Second time
The width for being combined diameter trace is greater than the width of first leg path trace, and second leg path trace is covered in first leg
The first leg path clearance that path trace and first leg path trace are formed, forms traceless metallic mirror surface.It is such to swash
Light polishing method directly can carry out laser scanning polishing treatment repeatedly to surface of workpiece, and surface of workpiece is formed without dirt
Dye, noresidue and loss-free surface, to make the surface of workpiece noresidue metal powder being polished and metal works table
Face is not damaged.Technical solution of the present invention is compared to each other with existing similar product, has the simple effect of structure.It is thrown in the present invention
In light method, it is only necessary to by generating laser in metal under field lens exclusive use or high-speed vibrator and field lens co- controlling
It is moved back and forth on workpiece surface, adjusts bout path trace width, the processing is simple, effect easy to use to reach
Fruit.
With reference to the accompanying drawings and examples, technical scheme of the present invention will be described in further detail.
[Detailed description of the invention]
Fig. 1 is the stereoscopic figure of laser scanning system in the present invention；
Fig. 2 is the perspective view of high speed vibrator of the present invention；
Fig. 3 is the structural schematic diagram of laser scanning system in the present invention；
Fig. 4 is the structural schematic diagram of high speed vibrator of the present invention；
Fig. 5 is that the first leg laser of single in the present invention forms the schematic diagram of first leg path trace；
Fig. 6 is the schematic diagram that a plurality of first leg path trace is formed in the present invention；
Fig. 7 is the schematic diagram that single second leg laser forms second leg path trace in the present invention；
Fig. 8 is the schematic diagram that a plurality of second leg path trace and first leg path trace are formed in the present invention；
Fig. 9 is the schematic diagram that first leg laser forms melting zone in the present invention；
Figure 10 is the schematic diagram that first leg laser forms liquidized layer in the present invention；
Figure 11 is the schematic diagram that second leg laser forms liquidized layer in the present invention.
[specific embodiment]
In order to be clearer and more clear technical problems, technical solutions and advantages to be solved, tie below
Drawings and examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
It please refers to shown in Fig. 1 to Figure 11, illustrates a kind of laser polishing machine below with reference to embodiment comprising laser scanning system
System 100, high-speed vibrator 200 and XY mobile platform 300；The high-speed vibrator 200 is mounted on XY mobile platform 300
Face, the XY mobile platform 300 are provided with the switch 400 for opening or closing high-speed vibrator 200.The laser
Scanning system 100 includes laser light source 101, is mounted on the scanning galvanometer 102 of 101 one end of laser light source, is mounted on scanning galvanometer
The field lens 103 of 102 upper ends；
A kind of polishing method of laser polishing machine are as follows: firstly, launching first leg laser 501 from field lens 103, scanning
Under galvanometer 102 controls, the first leg laser 501 projects the first leg path trace 502 of a surface melting；It is scanning
Under the control of galvanometer 102, the first leg laser 501 is moved back and forth, and is made adjacent first on surface of workpiece
First leg path clearance 505 is formed between bout path trace 502 and first leg path trace 502；Then, high speed is opened
Vibrator 200 launches second leg laser 506 from field lens 103, under the control of scanning galvanometer 102, makes second leg laser
506, along the direction vibration movement perpendicular to first leg path clearance 505, drive second leg laser 506 being processed gold
Metal work-pieces surface forms second leg path trace 504, which is first leg path trace
Two times of 502 width；Under 200 co- controlling of scanning galvanometer 102 and high-speed vibrator, the second leg laser 506 is back and forth
It moves back and forth, make to form the covering of second leg path trace 504 on surface of workpiece and smooths first leg path clearance
505, form traceless metallic mirror surface.
During first leg, the point energy for generating the laser light source 101 of first leg laser 501 is greater than
1.5mJ, frequency are greater than 100KHz, and scanning speed is greater than 100mm/sec, and melting heat energy is greater than 64KJ/Kg, and is less than 1577kJ/
Kg, i.e., width is greater than 0.005mm between adjacent scanning lines.Between first leg laser 501 and surface of workpiece, because of laser
Light source 101 generate first leg laser 501 energy it is larger, scanning speed is slow, be easy so that surface of workpiece melt, but
Speed cannot be too slow, and the density of scan path cannot be too close, to prevent surface gasification from generating pit-hole phenomenon, so that first
The energy of bout laser 501, which will control, can enable surface of workpiece generate melting zone 600 and fuel factor layer 601, reach fusing
Purpose.In the process, since 502 process times of two adjacent first leg paths trace are successive and metal works table
The reason of face is quickly cooled down, be easy so that two adjacent first leg paths trace 502 and first leg path trace 502 it
Between generate first leg path clearance 505.
In order to smooth the first leg path clearance 505, then, in the case where opening high-speed vibrator 200, increase
Add 506 sweep length of second leg laser, drives trace 504 width in generated second leg path to increase, by first leg
Formed first leg path clearance 505 smooths between path trace 502 and first leg path trace 502.
During second leg, the energy for the second leg laser 506 that the laser light source 101 generates makes metal work
Part surface generates melting zone and expands, meanwhile, the surface to be machined for saving prior scans path will not cool down, and reach large area
Liquidized layer；The point energy of the laser light source 101 is greater than 1.5mJ, and frequency is greater than 100KHz, and scanning speed is greater than 1000mm/
sec.When second leg laser 506 scans, high-speed vibrator 200 starts, and the hot spot of second leg laser 506 is widened, and enables every
The energy of quadrature reduces, the laser energy for enabling wider reception average；To make two adjacent first leg path traces
Mark 502 joins together, and melting zone 600 and fuel factor layer 601 can be evenly distributed bigger area；After cooling, formed without trace
Metal surface.When second leg laser 506 scans, the vibration velocity of the high-speed vibrator 200 back and forth/second greater than 1000,
And vibrated in the range of 0.5mm, refer to round-trip number back and forth；The hot spot of second leg laser 506 is widened, by original 0.1mm
To the width of 0.3mm, it is expanded to the width of 0.6mm to 1mm, average laser energy method range is received and expands.Swash in second leg
In 506 scanning process of light, energy is smaller, and scanning speed is fast, and scanning speed fast must cross 501 scanning speed of first leg laser fastly
The cooling speed of formed melting zone 600；It avoids that surface is enabled directly to evaporate and generate pit-hole.Produced by second leg laser 506
Wider melting zone 600 and fuel factor layer 601 liquefy with season previous melting zone 600；Due to second leg laser 506, energy
It measures smaller no decree melting zone 600 to deepen to thicken, this can influence the size and shape of script workpiece to avoid excess molten.
When work, back and forth move back and forth first with field lens 103, forms first leg laser 501 in surface of workpiece
Multichannel first leg path trace 502, is then turned on high-speed vibrator 200, and field lens 103 is made to launch second leg laser in metal
Multichannel second leg path trace 504 is formed on workpiece surface；The width of second leg path trace 504 is greater than first leg road
The width of diameter trace 502, second leg path trace 504 are covered in first leg path trace 502 and first leg road
The first leg path clearance 505 that diameter trace 502 is formed, forms traceless metallic mirror surface.Laser polishing machine passes through first and second
Bout laser 501,506 scans, and opens high-speed vibrator 200, and mutual cooperation mode, which is realized, carrys out surface of workpiece
Laser scanning polishing treatment repeatedly is returned, pollution-free, noresidue and loss-free workpiece surface are formed.
In conclusion because the high-speed vibrator 200 is mounted on XY mobile platform 300, the XY mobile platform 300
It is provided with the switch 400 for opening or closing high-speed vibrator；The laser scanning system 100 includes laser light source 101,
It is mounted on the scanning galvanometer 102 of 101 one end of laser light source, is mounted on the field lens 103 of 102 upper end of scanning galvanometer.In use, first sharp
Back and forth moved back and forth with field lens 103, first leg laser 501 is made to form multichannel first leg path trace on surface of workpiece
Mark 502 is then turned on high-speed vibrator 200, so that field lens is launched second leg laser and forms multichannel on surface of workpiece
Two bout path traces 504；The width of second leg path trace 504 is greater than the width of first leg path trace 502, described
Second leg path trace 504 is covered in first time that first leg path trace 502 and 502 trace of first leg path are formed
Path clearance 505 is closed, traceless metallic mirror surface is formed.Such laser polishing method can directly carry out surface of workpiece
Laser scanning polishing treatment repeatedly, surface of workpiece forms pollution-free, noresidue and loss-free surface, to make to be polished
Surface of workpiece noresidue metal powder and surface of workpiece be not damaged.Technical solution of the present invention and existing similar production
Product are compared to each other, and have the simple effect of structure.In polishing method of the present invention, it is only necessary to by being used alone in field lens 103
Or under high-speed vibrator 200 and field lens 103 control, generates laser and moved back and forth on surface of workpiece, adjust bout
Path trace width, to reach, the processing is simple, effect easy to use.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (1)
1. a kind of polishing method of laser polishing machine, it is characterised in that: firstly, launching first leg laser from field lens, sweeping
It retouches under galvanometer control, the first leg laser projects the first leg path trace of a surface melting；The first leg
Laser moves back and forth under the control of scanning galvanometer in surface of workpiece, make adjacent first leg path trace with
First leg path clearance is formed between the trace of first leg path；Then, high-speed vibrator is opened, launches second from field lens
Bout laser makes second leg laser along the direction vibration perpendicular to first leg path trace under scanning galvanometer control
It is mobile, drive second leg laser to form second leg path trace, the second leg path trace in processed tool surfaces
Width is two times of first leg path trace width；The second leg laser moves back and forth, and makes surface of workpiece
On second leg path trace covering and smooth first leg path clearance, form traceless metallic mirror surface；Described first
The point energy of laser light source used in bout laser is greater than 1.5mJ, and frequency is greater than 100KHz, and scanning speed is greater than 100mm/
Sec, melting heat energy is greater than 64KJ/Kg, and is less than 1577kJ/kg, and the density of scan line is greater than 0.005mm；High-speed vibrator vibration
Dynamic speed back and forth/second greater than 1000, and vibrated in the range of 0.5mm, the hot spot of second leg laser is widened, by original
The width of 0.1mm to 0.3mm is expanded to the width of 0.6mm to 1mm, laser light source used in the second leg laser
Point energy is greater than 1.5mJ, and frequency is greater than 100KHz, and scanning speed is greater than 1000mm/sec.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710269509.XA CN107199401B (en) | 2017-04-24 | 2017-04-24 | A kind of polishing method of laser polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710269509.XA CN107199401B (en) | 2017-04-24 | 2017-04-24 | A kind of polishing method of laser polishing machine |
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| Publication Number | Publication Date |
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| CN107199401A CN107199401A (en) | 2017-09-26 |
| CN107199401B true CN107199401B (en) | 2019-11-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108110067A (en) * | 2018-01-22 | 2018-06-01 | 南通苏民新能源科技有限公司 | A kind of solar cell assistant grid for increasing opto-electronic conversion benefit and preparation method thereof |
| CN111716005A (en) * | 2020-06-19 | 2020-09-29 | 西安交通大学 | Method for polishing ceramic matrix composite material by ultrasonic-assisted laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6286709A (en) * | 1985-10-11 | 1987-04-21 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| IL121890A (en) * | 1997-10-06 | 2000-11-21 | Dov Zahavi | Laser assisted polishing |
| US6492615B1 (en) * | 2000-10-12 | 2002-12-10 | Scimed Life Systems, Inc. | Laser polishing of medical devices |
| DE10228743B4 (en) * | 2002-06-27 | 2005-05-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for smoothing and polishing surfaces by machining with laser radiation |
| US20070202780A1 (en) * | 2006-02-24 | 2007-08-30 | Chung-Ching Feng | Polishing pad having a surface texture and method and apparatus for fabricating the same |
| CN100450695C (en) * | 2006-11-28 | 2009-01-14 | 倍腾国际股份有限公司 | Method for processing mould surface by using laser |
| JP2009066627A (en) * | 2007-09-13 | 2009-04-02 | Aisin Seiki Co Ltd | Polishing method using laser beam machining, polishing device, and polished cutting tool |
| KR101358332B1 (en) * | 2012-04-27 | 2014-02-06 | 한국기계연구원 | Method for polishing metal surface by using laser |
| CN103941406B (en) * | 2014-05-09 | 2017-01-25 | 西安炬光科技有限公司 | High-power semiconductor laser optical shaping method and device based on beam expanding |
| US9682441B2 (en) * | 2015-06-01 | 2017-06-20 | Caterpillar Inc. | Laser polishing system and method for metal face seal |
| CN205363518U (en) * | 2015-10-19 | 2016-07-06 | 富鼎电子科技(嘉善)有限公司 | Three -dimensional curved surface burnishing device |
| CN105583524B (en) * | 2015-12-18 | 2017-08-04 | 江苏大学 | A kind of accurate laser polishing devices and methods therefor |
| CN105772946B (en) * | 2016-03-10 | 2018-01-12 | 中国科学院上海光学精密机械研究所 | CO2Laser beam burnishing device |
| CN106001927B (en) * | 2016-07-05 | 2018-03-23 | 温州大学激光与光电智能制造研究院 | One kind measurement machining integrated laser planarizing polishing method |
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Effective date of registration: 20220914 Address after: No. 42, Longteng North Road, Longwen District, Zhangzhou City, Fujian Province Patentee after: ZHANGZHOU HEPIN INDUSTY AND TRADE Co.,Ltd. Address before: Room 8, 38/F, Block A, Tong Ming Court, Tong Ming Street, Tseung Kwan O Patentee before: ROYAL(HK)CO. Patentee before: Xie Yongling |
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Effective date of registration: 20231030 Address after: 363000 No.42 Longteng North Road, Longwen District, Zhangzhou City, Fujian Province Patentee after: WIN-TARGE INTELLIGENT TECHNOLOGY CO.,LTD. Address before: 363000 No.42 Longteng North Road, Longwen District, Zhangzhou City, Fujian Province Patentee before: ZHANGZHOU HEPIN INDUSTY AND TRADE Co.,Ltd. |