CN107195761A - A kind of LED and its production method of heating power separation - Google Patents
A kind of LED and its production method of heating power separation Download PDFInfo
- Publication number
- CN107195761A CN107195761A CN201710368981.9A CN201710368981A CN107195761A CN 107195761 A CN107195761 A CN 107195761A CN 201710368981 A CN201710368981 A CN 201710368981A CN 107195761 A CN107195761 A CN 107195761A
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- CN
- China
- Prior art keywords
- support
- led
- heating power
- baking
- power separation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses the LED and its production method of a kind of heating power separation, the LED of the heating power separation includes light penetrating object, LED light module, support, support positive pole, support negative pole, connection medium；The LED light module of the LED of the heating power separation of the present invention is connected with support by tin cream or elargol baking；Beneficial effects of the present invention are：LED light module is to be connected by pure tin or elargol with support, and the connection between the light emitting module and support positive pole, support negative pole that are connected by tin cream is very firm, and connection dynamics improves more than 4 times than traditional handicraft；The increase of connection dynamics; allow the contacts such as anti-pull in the machining in the client later stage, extruding of the LED of such a technique external force effect under play complete protection to 2 points of pure tin or elargol; and the connected LED product of existing one is solved in the machining in client later stage and welding, the problem of LED light module occurs disconnecting bad with support tie point.
Description
Technical field
The present invention relates to lighting device, the more particularly to a kind of LED and its production method of heating power separation.
Background technology
Existing LED, including a LED wafer and LED wafer is integrally connected with support with gold thread and elargol, and
LED wafer is covered with light penetrating object, the both positive and negative polarity conductive segment of LED wafer extends from light penetrating object, combined for client and connect and lead
It is logical to use.
With present consumer products lighting, miniaturization, so demand LED product is minimized accordingly, and minimize
LED product diminution spatially, cause the connected LED product of one in the machining in client later stage and welding
The tie point appearance disconnection being connected in the connected LED of one is bad, and this can not be avoided bad.
The content of the invention
Instant invention overcomes the deficiencies in the prior art there is provided the LED and its production method that a kind of heating power is separated, solve
The connected LED product of existing one is in the machining in client later stage and welding, LED light module and support tie point
The problem of occurring disconnecting bad.
To solve above-mentioned technical problem, the present invention uses following technical scheme：
A kind of LED of heating power separation, it includes light penetrating object, LED light module and support, the LED light module position
Inside light penetrating object, one end of the support is located inside light penetrating object and connects LED light module, and the other end of the support is worn
Cross light penetrating object connection power supply；The support includes the support positive pole and support negative pole being provided separately, and the support positive pole, support are born
Connection medium is respectively connected with extremely, the support positive pole, support negative pole connect LED light module by connecting medium；It is described
Connection medium is made up of one kind in tin cream or elargol.
A kind of production method of the LED of heating power separation, LED light module is being fixed on support just by it with connection medium
On pole and support negative pole, and first time baking is carried out, after medium to be connected is fully cured, with the luminous mould of light penetrating object encapsulation parcel
Block, then cooled down after second of baking, baking molding, that is, the LED of heating power separation is made.
It is preferred that, described first time toasts to be completed in reflow machine, and second of baking is middle in an oven to be completed.
It is preferred that, described first time baking temperature is 180-260 DEG C, and baking time is 4-6min.
It is preferred that, second described of baking is divided into just roasting and long roasting；Just roasting is 130 DEG C only, and just the roasting time is 1.5h,
It is just roasting terminate after, heighten temperature and to 135 DEG C grow roasting, the long roasting time is 6h.
Compared with prior art, the beneficial effects of the invention are as follows：
The LED of the heating power separation of the production of the present invention, the LED light module is by pure tin or elargol and support
Connection, the connection between the light emitting module and support positive pole, support negative pole that are connected by tin cream or elargol is very firm, connection
Dynamics improves more than 4 times than traditional handicraft.The increase of connection dynamics, allow such a technique LED in the machinery in client later stage
Under the external force effect of the contacts such as anti-pull in processing, extruding complete protection is played to 2 points of pure tin or elargol.In addition,
Because the LED product after machining also need to be assembled into it is other it is inter-agency in, the contact assembling of any spare and accessory parts
In can all produce interfering edge each other, such a interfering edge under wave soldering, reflow soldering conditions (270 ° of maximum temperature ±
5 °, 10 seconds duration) in can be released, the interfering edge of such a release can allow support and LED wafer one in traditional handicraft
The tie point of formula connection disconnects and occurs that feature is bad, but in the technique that heating power is separated, has just completely evaded such a
The release of interfering edge, because pure in (270 ° ± 5 ° of maximum temperature, 10 seconds duration) under wave soldering, reflow soldering conditions
Tin can melt, and allow formation liquid between LED light module and support positive pole, support negative pole to be connected, in liquid is connected, interfering edge
LED light module will not be transmitted to up completely, after after natural cooling, pure tin can solidify with support positive pole, support positive pole just again
Often it is connected；So as to solve the connected LED product of existing one in the machining in client later stage and welding, LED hairs
The problem of optical module occurs disconnecting bad with support tie point.
Brief description of the drawings
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is schematic structural view of the invention.
In figure marked as：1st, light penetrating object；2nd, LED light module；3rd, support；31st, support positive pole；32nd, support negative pole；4、
Connect medium.
Embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings.Embodiments of the present invention include but is not limited to following reality
Apply example.
[embodiment 1]
A kind of LED of heating power separation as shown in Figure 1, it includes light penetrating object 1, LED light module 2 and support 3, described
LED light module 2 is located inside light penetrating object 1, and one end of the support 3 is located at the inside of light penetrating object 1 and connects LED light module 2,
The other end of the support 3 connects power supply through light penetrating object 1；The support 3 includes the support positive pole 31 and support being provided separately
Connection medium 4, the support positive pole 31, support negative pole 32 are respectively connected with negative pole 32, the support positive pole 31, support negative pole 32
LED light module 2 is connected by connecting medium 4.
Connect medium 4 in the present embodiment to be made up of tin cream, the production method of the LED of the heating power separation in the present embodiment
For：By LED light module 2, it is fixed on support positive pole 31 and support negative pole 32, and is carried out for the first time in reflow machine with tin cream
Baking, baking curve temperature is 180 DEG C -260 DEG C, and baking time is 4min；After treating that tin cream or elargol are fully cured, with saturating
The encapsulation parcel light emitting module 2 of body of light 1, then carry out toasting for the second time in an oven, second of baking, which is divided into, just bakes and long roasting, just roasting
Temperature is 130 DEG C, and baking time is 1.5h, just bakes and temperature is raised after end to 135 DEG C, and roasting, long to bake the time for 6h, baking is grown in progress
It is roasted into after type and cools down, that is, the LED of heating power separation is made.
[embodiment 2]
A kind of LED of heating power separation as shown in Figure 1, it includes light penetrating object 1, LED light module 2 and support 3, described
LED light module 2 is located inside light penetrating object 1, and one end of the support 3 is located at the inside of light penetrating object 1 and connects LED light module 2,
The other end of the support 3 connects power supply through light penetrating object 1；The support 3 includes the support positive pole 31 and support being provided separately
Connection medium 4, the support positive pole 31, support negative pole 32 are respectively connected with negative pole 32, the support positive pole 31, support negative pole 32
LED light module 2 is connected by connecting medium 4.
In the present embodiment, connection medium 4 is made up of elargol, the production method of the LED of the heating power separation in the present embodiment
For：By LED light module 2, it is fixed on support positive pole 31 and support negative pole 32, and is carried out for the first time in reflow machine with tin cream
Baking, baking curve temperature is 180 DEG C -260 DEG C, and baking time is 5min；After treating that elargol is fully cured, with the envelope of light penetrating object 1
Dress parcel light emitting module 2, then carry out toasting for the second time in an oven, second of baking, which is divided into, just bakes and long roasting, and just roasting temperature is
130 DEG C, baking time is 1.5h, just bakes rise temperature after end and, to 135 DEG C, carries out growing roasting, long to bake the time for 6h, baking molding
After cool down, that is, be made heating power separation LED.
[embodiment 3]
A kind of LED of heating power separation as shown in Figure 1, it includes light penetrating object 1, LED light module 2 and support 3, described
LED light module 2 is located inside light penetrating object 1, and one end of the support 3 is located at the inside of light penetrating object 1 and connects LED light module 2,
The other end of the support 3 connects power supply through light penetrating object 1；The support 3 includes the support positive pole 31 and support being provided separately
Connection medium 4, the support positive pole 31, support negative pole 32 are respectively connected with negative pole 32, the support positive pole 31, support negative pole 32
LED light module 2 is connected by connecting medium 4.
The production method of LED for the heating power separation that the present embodiment connection medium 4 is made up in middle the present embodiment of tin cream is：
By LED light module 2, it is fixed on tin cream on support positive pole 31 and support negative pole 32, and first time baking is carried out in reflow machine
Roasting, baking curve temperature is 180 DEG C -260 DEG C, and baking time is 6min；After treating that tin cream is fully cured, encapsulated with light penetrating object 1
Light emitting module 2 is wrapped up, then carries out second of baking in an oven, baking for the second time is divided into just roasting and length and baked, and just roasting temperature is 130
DEG C, baking time is 1.5h, it is just roasting terminate after rise temperature to 135 DEG C, progress grow it is roasting, after the long roasting time is 6h, baking molding
Cooling, that is, be made the LED of heating power separation.
It is embodiments of the invention as described above.The present invention is not limited to the above-described embodiments, anyone should learn that
The structure change made under the enlightenment of the present invention, the technical schemes that are same or similar to the present invention each fall within this
Within the protection domain of invention.
Claims (5)
1. a kind of LED of heating power separation, it includes light penetrating object (1), LED light module (2) and support (3), and the LED lights
Module (2) is located at light penetrating object (1) inside, and one end of the support (3) is located at light penetrating object (1) inside and connects LED light module
(2), the other end of the support (3) connects power supply through light penetrating object (1)；It is characterized in that：The support (3) includes separately setting
Connection matchmaker is respectively connected with the support positive pole (31) and support negative pole (32) put, the support positive pole (31), support negative pole (32)
It is situated between (4), the support positive pole (31), support negative pole (32) connect LED light module (2) by connecting medium (4)；The company
Medium (4) is connect to be made up of one kind in tin cream or elargol.
2. a kind of production method of the LED of heating power separation as claimed in claim 1, it is characterised in that：It by LED light mould
Block (2), is fixed on support positive pole (31) and support negative pole (32), and carry out first time baking, matchmaker to be connected with connection medium
After Jie is fully cured, light emitting module (2) is wrapped up with light penetrating object (1) encapsulation, then carry out cold after second of baking, baking molding
But, that is, the LED of heating power separation is made.
3. a kind of production method of the LED of heating power separation according to claim 2, it is characterised in that：Described first
Secondary baking is completed in reflow machine, what second of baking was completed in an oven.
4. a kind of LED of heating power separation according to claim 3, it is characterised in that：Described first time baking temperature
For 180-260 DEG C, baking time is 4-6min.
5. a kind of LED of heating power separation according to claim 3, it is characterised in that：Second described of baking is divided into
It is just roasting and long roasting；Just roasting is 130 DEG C only, and just the roasting time is 1.5h, it is just roasting terminate after, heighten temperature to 135 DEG C grow it is roasting,
The long roasting time is 6h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710368981.9A CN107195761A (en) | 2017-05-23 | 2017-05-23 | A kind of LED and its production method of heating power separation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710368981.9A CN107195761A (en) | 2017-05-23 | 2017-05-23 | A kind of LED and its production method of heating power separation |
Publications (1)
| Publication Number | Publication Date |
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| CN107195761A true CN107195761A (en) | 2017-09-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710368981.9A Pending CN107195761A (en) | 2017-05-23 | 2017-05-23 | A kind of LED and its production method of heating power separation |
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| Country | Link |
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| CN (1) | CN107195761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321289A (en) * | 2018-04-10 | 2018-07-24 | 东莞市虹鼎光电科技有限公司 | A kind of plug-in unit LED matrix |
Citations (6)
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|---|---|---|---|---|
| CN102299248A (en) * | 2010-06-25 | 2011-12-28 | 惟昌企业股份有限公司 | Manufacturing method for improving LED (light emitting diode) packaging support and packaging structure manufactured by using method |
| CN102593326A (en) * | 2012-03-12 | 2012-07-18 | 江门昊坤光电科技有限公司 | Light-emitting diode (LED) packaging structure and process based on fluorescent powder dispersive excitation technology |
| CN202523756U (en) * | 2012-04-18 | 2012-11-07 | 浙江金仕朗光电科技有限公司 | Bracket of light-emitting diode (LED) |
| CN103824906A (en) * | 2014-03-04 | 2014-05-28 | 深圳市智讯达光电科技有限公司 | LED (light-emitting diode) encapsulating method and LED device |
| CN104752597A (en) * | 2013-12-30 | 2015-07-01 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and packaging method thereof |
| CN205282504U (en) * | 2016-01-05 | 2016-06-01 | 厦门光莆电子股份有限公司 | SMD white light LED packaging body |
-
2017
- 2017-05-23 CN CN201710368981.9A patent/CN107195761A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299248A (en) * | 2010-06-25 | 2011-12-28 | 惟昌企业股份有限公司 | Manufacturing method for improving LED (light emitting diode) packaging support and packaging structure manufactured by using method |
| CN102593326A (en) * | 2012-03-12 | 2012-07-18 | 江门昊坤光电科技有限公司 | Light-emitting diode (LED) packaging structure and process based on fluorescent powder dispersive excitation technology |
| CN202523756U (en) * | 2012-04-18 | 2012-11-07 | 浙江金仕朗光电科技有限公司 | Bracket of light-emitting diode (LED) |
| CN104752597A (en) * | 2013-12-30 | 2015-07-01 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and packaging method thereof |
| CN103824906A (en) * | 2014-03-04 | 2014-05-28 | 深圳市智讯达光电科技有限公司 | LED (light-emitting diode) encapsulating method and LED device |
| CN205282504U (en) * | 2016-01-05 | 2016-06-01 | 厦门光莆电子股份有限公司 | SMD white light LED packaging body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321289A (en) * | 2018-04-10 | 2018-07-24 | 东莞市虹鼎光电科技有限公司 | A kind of plug-in unit LED matrix |
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Application publication date: 20170922 |