CN203574006U

CN203574006U - LED light source

Info

Publication number: CN203574006U
Application number: CN201320775538.0U
Authority: CN
Inventors: 张荣民; 田景明
Original assignee: TIANJIN JINMA PHOTOELECTRIC CO Ltd
Current assignee: TIANJIN JINMA PHOTOELECTRIC CO Ltd
Priority date: 2013-11-28
Filing date: 2013-11-28
Publication date: 2014-04-30
Anticipated expiration: 2023-11-28

Abstract

The utility model discloses an LED light source which comprises a PCB board and a horizontal LED chip. The PCB board comprises a board body, a gold way which is arranged on the board body, and a solder mask coating which is covered on the gold way. A through hole which is corresponding to a PN electrode of the LED chip is arranged at a solid crystal position on the solder mask coating. The PN electrode of the LED chip is above the through hole and is fixedly connected with the gold way in the through hole through conductive silver glue. The utility model further discloses an LED light source manufacturing technology using the conventional horizontal LED chip. According to the utility model, the bottom of the LED chip is upward, is completely open and is not shielded; the sapphire bottom of the LED chip does not need reflecting layer plating processing; the light efficiency of PN light junction is high; a PN junction is close to the PCB surface; a heat conduction effect is great; transformation and upgrade of an epitaxial wafer of the LED chip are realized; an LED chip manufacturing procedure is relatively shortened; and the cost can be reduced.

Description

A kind of LED light source

Technical field

The utility model relates to LED preparing technical field, particularly relates to a kind of LED light source.

Background technology

LED chip Packaging Industry at present, it is a huge industry, economic development is grown up and had great contribution, a large amount of aluminium wire bonding wire encapsulation technologies of using in industry at present, operating personnel carry out the software programming program of LED chip die bond, by operating automatic die bond machine, use elargol LED chip to be fixed on to the surface of substrate, then by baking box by elargol baking-curing, import afterwards automatic aluminium silk bonding equipment by the PN electrode conduction of LED chip, by the program of programming, welded.The die bond technology of implementing at present, has adopted 30 years, and LED chip, all with bottom die bond down, contacts with elargol and fixes, and the PN utmost point of top is connected circuit by aluminium wire or spun gold YuPCBJin road.

Also has a kind of spun gold bonding wire encapsulation technology, spun gold bonding equipment has mainly increased electrion and has burnt ball, first do and plant gold goal, by ultrasonic wave, gold goal is done and is connected with substrate again, just completed the program of bonding wire, the just price comparison costliness of Herba Anoectochili roxburghii welding machine. same need to support the use with automatic die bond machine, complete the program of die bond to bonding wire, so comprehensive above performance, need exactly to carry out plural program, just can complete canned program, the input amount of money cost of traditional LED chip sealed in unit is very high.

Still there is at present a kind of high-end flip chip devices also in Packaging Industry is used, be called BGA(Ball Grid Aray) flip chip technology, be that CPU microprocessor is planted ball flip chip technology, the key feature that it is main, be exactly below CPU microprocessor, there are hundreds of terminals, density is quite high, and be expensive device, must be first by planting playing skill art, on each terminal, first implant a tin ball, and be to weld encapsulation by high-end visual-alignment software, cannot operate with human eye vision, so the equipment adopting is all suitable expensive machine, in addition, current flip LED chips specification is the several times price of conventional chip, key is exactly that the PN electrode of LED chip must be increased to double altitudes, and be to use highly purified AU proof gold material, mainly cause the rising of LED chip cost.

In industry, divide into two kinds of chip structures now, level and rectilinear, rectilinear chip is to do flip chip technology completely, only can selection level chip, what horizontal structure formula chip was the most conventional is the LED chip that the P utmost point and the high degree of N differ, as the LED chip of mentioning in Chinese patent 201020602414.9, such can not be suitable for this standard upside-down mounting, this is also that LED chip packaging industry is stagnated the reason that there is no progress for 30 years, LED encapsulation industry faces fierce price competition means, the encapsulation that how to improve conventional LED chip quantizes means, forcing down cost is a problem being badly in need of solution.

Utility model content

The purpose of this utility model is for the technological deficiency existing in prior art, and discloses a kind of LED light source.

For realizing the technical scheme that the purpose of this utility model adopts, be:

A kind of LED light source, comprise pcb board and horizontal LED chip, described pcb board comprises plate body, be arranged on plate body Shang Jin road, cover the anti-welding coat on golden road, described anti-welding coat is provided with the through hole of answering with described LED chip PN electrode pair in die bond position, the PN electrode of described LED chip and described through hole top is also fixedly connected with Jin road, through hole by conductive silver glue.

The height of the P utmost point of described horizontal LED chip is greater than the N utmost point.

The P utmost point of described horizontal LED chip and N utmost point double altitudes.

Compared with prior art, the beneficial effects of the utility model are:

The utility model has been realized the flip-chip packaged technology of conventional levels formula LED chip, can adopt the conventional levels formula LED chip of standard, only need the matching used chip size of design and substrate to be used in conjunction with, just can save the bonding wire program of aluminium wire or spun gold bonding equipment, significantly shortened the required time of canned program, accomplish a set of equipment one station canned program, the real yields that effectively improves, the management cost of reduction essence.

The invention also discloses a kind of LED light source manufacturing technology that adopts conventional levels formula LED chip simultaneously, be that the bottom-up completely open of LED chip do not covered, and the sapphire of LED chip bottom does not need to do reflector electroplating processes, the light efficiency that PN junction luminous energy is sent is higher, PN junction more approaches PCB surface, and heat-conducting effect is better, means the transformation and upgrade of LED chip epitaxial wafer simultaneously, relative shortening LED chip fabrication schedule, cost also can decline.

Accompanying drawing explanation

Figure 1 shows that pcb board structural representation of the present utility model;

Figure 2 shows that the front view of die bond;

Figure 3 shows that LED chip is placed on to elargol heap view afterwards;

Figure 4 shows that the structural representation after fixing.

Embodiment

Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

As Figure 1-4, the die-bonding method of a kind of LED chip of the present utility model comprises the following steps, 1) in the die bond position of pcb board 1, arrange and run through PCB insulating barrier 3, as the depression 4 of anti-welding coat, this step is called for short windows, the described paired setting of depression need and every pair of depression are extremely corresponding with the P utmost point and the N of LED chip respectively, , in the some glue position of PN electrode diameter and the location positioning elargol of die bond position cooperated with LED chip, then at this place, window to form the cavity of running through insulating barrier, ShiPCBJin road 2 just exposes and can conduct electricity, for different LED chips, can design arbitrarily the shape size of depression, only need to coordinate the PN electrode of chip, the flow range of standard elargol, just can not cause the PN electric pole short circuit of chip to lose efficacy, principle is to cause short circuit or electric leakage problem.

2) in described depression, inject conductive silver glue 5, by the liquid form of conductive silver glue, when conductive silver glue is splashed into surface, golden road by a plastic pin, due to capillary effect, can produce the shape that wire drawing also forms a silver heap, as individual small pyramid or cone post shapes, the height of elargol heap will be higher than the window thickness at place of insulating barrier, now also can, with reference to factors such as the current power of LED chip arrange, by the program parameters of die bond machine, be determined the size of silver heap area;

3) described LED chip 6PN electrode is placed on to corresponding die bond position down and makes the P utmost point and the N utmost point is separately positioned on corresponding conductive silver glue drips; When the PN of the LED chip utmost point covers elargol heap top, liquid elargol can be subject to the gravity of LED chip and decline, and the PN electrode of chip can touch conductive silver glue, when reaching the balance of chip PN utmost point both sides, just stop declining, oneself contacts elargol heap through the PN electrode YuPCBJin road that makes LED chip;

4) baking conductive silver glue makes it to solidify and completes chip die bond simultaneously, after elargol solidifies, just represent LED chip oneself through the conducting of YuPCBJin road, can switch on and test LED usefulness, wherein the temperature general control of elargol sintering is at 150-170 ℃, about sintering time 2 hours, specifically can adjust according to actual conditions are conventional.Preferably, this step can be taked the flat heat tunnel baking operation that adds, and can significantly shorten again the curing time of elargol, and actual measurement program only needs 15 minutes, can reach curing, and the test of can switching on.

Wherein, LED chip of the present utility model is conventional LED chip, the epitaxial wafer that is the conventional LED chip on sapphire basis splits the brilliant single-chip forming by laser, this conventional LED chip PN electrode is different height, be generally P high in extremely several microns of N, so be can not do to plant ball die bond program, can not be applicable to existing reverse installation process, and the utility model make two elargol heap at the place of windowing by the some plastic pin of automatic die bond machine, by the automatic adjustment of liquid elargol heap, realize the fixing and wire of LED chip, be that the PN electrode of LED chip is piled YuPCBJin road by conductive silver and done conducting, the LED chip that utilizes conventional levels formula structure is scalable applicable upside-down mounting program, reduced LED encapsulation process cost, only need to use conventional die bond board simultaneously, can do upside-down mounting programming automation, and reverse installation process relatively before, remove routing program from, significantly reduced the flow process of canned program, shorten processing procedure, reduce equipment investment cost, after LED chip die bond completes simultaneously, the test of can switching on, yields improves, accomplish that a station completes encapsulation, simultaneously after LED chip upside-down mounting, bottom-up opening completely is not covered, light-emitting area is 100%, there is no the problem of weld pad shading, it is higher that PN junction sends light efficiency, PN junction more approaches PCB surface simultaneously, and silver heat conduction parameter is greater than tin matter, realizing PN junction heat-conducting effect of the present utility model more wins and plants playing skill art.

The LED chip that the utility model adopts can be buying LED chip raw material, because it is to be attached to a blue membrane to pack to protect LED chip and fixing antistatic for the former factory of LED chip, the film that turns over that need to do once the blue film of LED chip when producing turns to, an i.e. blank tunica albuginea material of first-selected preparation, after making blue film heating uniform temperature by dilator, cover a tunica albuginea above LED chip, and exert pressure in top, make tunica albuginea and chip close adhesion, now the blue film of below is heat, top tunica albuginea is cold, make LED chip be easier to depart from blue film, PN electrode turns to tunica albuginea direction simultaneously, LED chip is passed on tunica albuginea, just can produce the transfer direction of PN electrode, every blue film need to do once inside out, certainly this overturning step also can turn to by pickout apparatus, it is the upset mode that the utility model does not limit LED chip, certainly also can adopt direct buying or customization PN utmost point LED chip product down, when fixing machine is worked, preferably to pass through dilator, chip is spaced out, be applicable to the suction nozzle operation of die bond machine.

Simultaneously, the invention also discloses a kind of LED light source, it comprises pcb board and LED chip, described pcb board comprises plate body, be arranged on plate body Shang Jin road, cover the insulating barrier on golden road, as anti-welding coat, described anti-welding coat is provided with the fenestration through hole of answering with described LED chip PN electrode pair in die bond position, the PN electrode of described LED chip and described through hole top is also fixedly connected with Jin road, fenestration through hole by conductive silver glue.Wherein, the P of described LED chip is high in the N utmost point.Wherein, LED light source of the present utility model is applicable to the light fixture of any form, as any forms such as strip source, bulb lamp, shot-lights.

Standard flip-chip is to adopt die bond to burn altogether program, be to plant a tin ball at the PN of LED chip electrode, by visual-alignment software programming, adhere on PCBJin road, what during die bond, use is insulating cement, again by high temperature by crystal-bonding adhesive and tin ball, burn altogether simultaneously and be solidificated in that on PCBJin road, to form contact fixing.

And upside-down mounting die bond technology of the present utility model, to use general conventional levels formula LED chip, in the crystal bonding area of PCB, being provided with the circle Bing Shijin road of windowing exposes, other parts all cover, and by the programming software of automatic die bond machine, two elargol being set at the place of windowing piles, when the PN of LED chip electrode alignment, corresponding electrode can drop on elargol heap, because elargol is still in liquid state, be subject to the gravity of LED chip, elargol can just stop to dropping to level, enter again baking box baking-curing, can complete die bond program, the utility model is taked first to window and is dripped afterwards the then program of upside-down mounting of glue, it is main core of the present utility model, with the past plant ball technical program in step, use equipment and cost have great essence different.

The above is only preferred implementation of the present utility model; it should be noted that; for those skilled in the art; do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims

1. a LED light source, it is characterized in that, comprise pcb board and horizontal LED chip, described pcb board comprises plate body, be arranged on plate body Shang Jin road, cover the anti-welding coat on golden road, described anti-welding coat is provided with the through hole of answering with described LED chip PN electrode pair in die bond position, and the PN electrode of described LED chip and described through hole top is also fixedly connected with Jin road, through hole by conductive silver glue.

2. LED light source as claimed in claim 1, is characterized in that, the height of the P utmost point of described horizontal LED chip is greater than the N utmost point.

3. LED light source as claimed in claim 1, is characterized in that, the P utmost point of described horizontal LED chip and N utmost point double altitudes.