CN107195459B - The manufacturing method of laminated ceramic capacitor - Google Patents
The manufacturing method of laminated ceramic capacitor Download PDFInfo
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- CN107195459B CN107195459B CN201611059442.9A CN201611059442A CN107195459B CN 107195459 B CN107195459 B CN 107195459B CN 201611059442 A CN201611059442 A CN 201611059442A CN 107195459 B CN107195459 B CN 107195459B
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 66
- 239000005416 organic matter Substances 0.000 claims abstract description 49
- 239000000919 ceramic Substances 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000012986 modification Methods 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 4
- 150000002222 fluorine compounds Chemical class 0.000 claims description 3
- 150000003377 silicon compounds Chemical class 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010304 firing Methods 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention relates to a kind of manufacturing methods of laminated ceramic capacitor, wherein before the process for forming the conductive paste film that should become external electrode (12,13), implement to be heat-treated the article body (2) not being burnt into the non-firing stage of article body (2) and the process that removes of the organic matter on the surface that will be exposed to the article body (2) not being burnt into.
Description
Technical field
The present invention relates to the manufacturing methods of laminated ceramic capacitor, more particularly in the process of manufacture laminated ceramic capacitor
The manufacturer for the laminated ceramic capacitor that the middle external electrode formed using conductive paste and article body are burnt into simultaneously
Method.
Background technique
Common laminated ceramic capacitor has: article body, and it includes multiple dielectric ceramics layers being stacked and edges
The specific interface of dielectric ceramics interlayer and the internal electrode that is formed；And external electrode, it is formed on the end of article body
In portion, so as to be electrically connected to internal electrode specific internal electrode ora terminalis.
An example of manufacturing method as this laminated ceramic capacitor, it is special in JP Tetsukai 2001-15376 bulletin and JP
Opening in 2006-86400 bulletin has following methods: in the stage of article body not being burnt into, will should become leading for external electrode
Electrical paste film is formed on the surface of article body, then burns the article body not being burnt into and conductive paste film simultaneously
At.
When wanting to realize the miniaturization or slimming of laminated ceramic capacitor, for external electrode, by its thickness
The way of skiving is also effective.But in order to by external electrode skiving, if the conductive paste film that will should become external electrode
Be formed thin, then it is being burnt into simultaneously with the article body not being burnt into as a result, external electrode especially on the crest line of article body or
It is easy thinning on angle, can be broken in extreme situations.This phenomenon can incur the decline of the reliability of laminated ceramic capacitor.
Summary of the invention
It is a primary object of the present invention to provide a kind of laminated ceramic capacitors of thickness that can steadily maintain external electrode
The manufacturing method of device.
Manufacturing method of the present invention towards laminated ceramic capacitor, has: production comprising ceramic raw material and organic matter not
The process of the article body of firing；The conductive paste that should become external electrode is formed on the surface for the article body not being burnt into
The process of film；With to the article body and conductive paste film be not burnt into while the process being burnt into, it is above-mentioned in order to solve
Technical project, which is characterized in that be also equipped with: the component not being burnt into will be exposed to before the process for forming conductive paste film
The process that the organic matter on the surface of main body removes.
Although above-mentioned organic matter is mainly adhesive, the organic matter on the surface for the article body not being burnt into will be exposed to
Remove as a result, the surface of article body generates fine bumps or pit, the surface of article body can be made in permeable
State.
In addition, in the process for removing organic matter, organic matter only its at least part to be removed, without all
It is removed.
It is formed in the process for the conductive paste film that should become external electrode in above-mentioned, is especially crossing over article body
When forming conductive paste film in the state of the crest line that at least two face intersects, the present invention is advantageously applicable in.The reason is that, outer
Portion's electrode has the tendency that thinning on the crest line of article body or angle or is easy to be broken.
In the present invention, the stacking of the ceramic layer not being burnt into comprising ceramic raw material and organic matter has preferably been laminated after production
The process of block and the process that block cutting is laminated is made into the component not being burnt into order to obtain multiple article bodies not being burnt into
Main body.In this case, can also implement be exposed in the state that block is laminated not burning before the process that block cutting will be laminated
At article body surface organic matter remove process.According to this constitution, can be effectively performed organic matter removing
Process.
In order to remove organic matter, such as it is applicable in heating.In this case, preferably than fitting in the process being burnt into
The low temperature of maximum temperature heats the article body not being burnt into.It is right if being applicable in heating in order to remove organic matter
In multiple article bodies or for the stacking block of large area, organic matter removing can be carried out at one stroke.Further more, if with
The temperature lower than the maximum temperature being applicable in the process be burnt into is implemented to heat, then the burning of ceramics can be prevented
Knot.
More preferable above-mentioned heating is implemented under 100 DEG C or more and 900 DEG C of temperature below.Here, 100 DEG C of lower limit are to have
Machine object starts the temperature burnt, and 900 DEG C of the upper limit are the temperature that ceramics are not sintered excessively.
In order to remove organic matter, above-mentioned heating can also be replaced, the article body not being burnt into is chemically lost
Quarter or physical etching.This chemically etching or physical etching are especially to can take out multiple article bodies not being burnt into
It can be advantageously applicable in for aforementioned stacking block.To find out its cause, if to stacking block implement heating process, if block is laminated can be undesirably
The reason of warpage.
Conductive paste film due to that should become external electrode can be burnt into simultaneously with the article body not being burnt into, therefore it is preferred that
Include Ni powder and ceramic powders.
The manufacturing method of laminated ceramic capacitor of the present invention is preferably also equipped with modification process, by organic matter
It after the process of removing and is formed before the process of conductive paste film, is adsorbed in silicon compound or fluorine compounds and is not burnt into
The surface of article body.By the modification, can make to lead in the process for the formation conductive paste film next implemented
The shape of electrical paste film is more stable.
According to the present invention, the organic matter that will be exposed to the surface for the article body not being burnt into removes, as a result in article body
Surface generate fine bumps or pit so that the surface of article body becomes permeable state, this external enwergy is formed should be at
For the conductive paste film of external electrode.For this purpose, can be realized function and effect below.
By the fixed effect in the surface of permeable article body, crest line and angle of the conductive paste in article body
Part it is also easy to attach, become difficult to flow after attachment, become easy and be held in herein.Further more, passing through permeable portion
Capillarity in the surface of part main body, the solvent in conductive paste are absorbed by article body side, accordingly, conductive paste
Viscosity rise, nonetheless, conductive paste also becomes difficult to flow, and becomes easy and is held in herein.
As a result, conductive paste film be locally difficult to it is thinning, such as even in the portion at the crest line of article body and angle
On point, the thickness of conductive paste film can be also maintained in the same manner as in other parts.
Above-mentioned and other purposes, feature, aspect and advantage of the invention, according to the present invention intelligible after being associated with attached drawing
The next detailed description being related to, it is more clear.
Detailed description of the invention
Fig. 1 is the laminated ceramic capacitor 1 as first case for indicating the manufacturing method being related to through the invention and obtaining
The perspective view of appearance.
Fig. 2 is the cross-sectional view along the line A-A of Fig. 1.
Fig. 3 is to carry out shooting by surface of the field emission type scanning electron microscope to the article body not being burnt into
The alternative photo of the attached drawing arrived, (A) indicate that the state before removing organic matter, (B) indicate the state after removing organic matter.
Fig. 4 is the laminated ceramic capacitor 21 as second case for indicating the manufacturing method being related to through the invention and obtaining
The perspective view of appearance.
Fig. 5 is the laminated ceramic capacitor 31 as third example for indicating the manufacturing method being related to through the invention and obtaining
The top view of appearance.
Specific embodiment
The laminated ceramic capacitor 1 that the manufacturing method being related to through the invention obtains is illustrated referring to FIG. 1 and FIG. 2.
Laminated ceramic capacitor 1 has article body 2.Article body 2 is the substantially rectangular parallelepiped with 6 faces, is had
In height direction H first and second opposite interarea 3 and 4, first and second side 5 opposite on width direction W and 6, with
And opposite first and second end face 7 and 8 in the length directionl.Here, height direction H, width direction W and length direction L phase
It is mutually orthogonal with other directions.Angle of the approximately cuboid shape of article body 2 comprising cuboid or crest line are by the shape of rounding, also
Concave-convex shape slightly is formed with comprising surface.
Article body 2 has: multiple ceramic layers 9 being stacked and being formed along the specific interface between multiple ceramic layers 9
Multiple internal electrodes 10 and 11.
Each of ceramic layer 9 is for example with 0.5 μm~4 μm of average thickness.Ceramic layer 9 is for example by with barium titanate
(BaTiO3), calcium titanate (CaTiO3), strontium titanates (SrTiO3) or calcium zirconate (CaZrO3) etc. be principal component dielectric ceramics
Composition.The accessory ingredient fewer than above-mentioned principal component as content, ceramic layer 9 can also include Mn, Mg, Si, Co, Ni or terres rares
Element etc..
It is showed although internal electrode 10 and 11 is formed its ora terminalis in any of end face of article body 27 and 8
Out, but in the first internal electrode 10 of the exposing of the first end face of article body 27 and the electricity inside second that second end face 8 is exposed
Pole 11 alternately configures in height direction H across ceramic layer 9, so that can get electrostatic electricity in the inside of article body 2
Hold.
Internal electrode 10 and 11 is substantially rectangular if overlooking in height direction H.Each of internal electrode 10 and 11
Such as with 0.2 μm~2 μm of average thickness.Internal electrode 10 and 11 is for example comprising Ni, Cu, Ag, Pd, Ag-Pd alloy or Au
Deng metal material.
In order to take out above-mentioned electrostatic capacitance, on first and second opposite end face 7 and 8 of article body 2, respectively
Be formed with the first external electrode 12 being electrically connected with the first internal electrode 10 and be electrically connected with the second internal electrode 11 second outside
Portion's electrode 13.External electrode 12 and 13 is for example formed by firing the conductive paste comprising Ni powder and ceramic powders, such as
It is described afterwards, it is formed and being burnt into simultaneously with article body 2.
In addition, first and second external electrode 12 and 13 is not made only in first and second end face 7 of article body 2 respectively
And on 8, until being also formed as extending to each a part of position of the interarea 3 and 4 of the adjoining of end face 7 and 8 and side 5 and 6.Change speech
It, external electrode 12 and 13 is formed in the state of across the crest line of article body 2.Further more, in the crest line across article body 2
In the state of the external electrode 12 that is formed and 13 natural become the state for covering the angle of article body 2.
On external electrode 12 and 13, plated film is formed as needed.Plated film is for example made of Cu plated film, or is plated by Cu
Layer, Ni coating thereon and Sn coating thereon are constituted.The laminated ceramic capacitor 1 is for example the case where being embedded into multilager base plate
Under, as plated film only with Cu plated film, in the case where the laminated ceramic capacitor is used as surface mounting assembly, it is applicable in Cu
Plated film composed by coating, Ni coating and Sn coating.
In addition, above-mentioned Cu plated film or Cu coating can also take 2 layers of construction.In this case, with by external electrode 12 and
The average grain diameter of the Cu particle of 13 the first Cu coating directly covered is compared, the 2nd Cu coating that the first Cu coating is directly covered
The average grain diameter of Cu particle want small.Be, the average thickness of each of first and second Cu coating be for example set as 1 μm~
15 μm of degree.
In the case where laminated ceramic capacitor 1 is miniaturized or is thinned, it is preferably able to satisfy size relationship below.
That is, being preferably able to satisfy when the size of the height direction H of article body 2 to be set as DH, the size of width direction W is set as DW
(1/5) DW≤DH≤(1/2) DW or DH < 0.3mm.
In addition, it is preferred that the size of the length direction L of each of external electrode 12 and 13 is long as far as possible.Pacified as a result, by surface
Even if the laminated ceramic capacitor 1 of dress be it is slim, can also increase the pull-out capacity with installation base plate, or be embedded into multilayer base
The via hole connection of the laminated ceramic capacitor 1 of plate can also become easy.
In order to manufacture this laminated ceramic capacitor 1, implement next process.
The ceramic slurry for being mixed with ceramic material powder and organic matter and solvent etc. is printed on carrier film, spray is passed through
Painting, demoulding coating etc. are shaped to flake, thus to obtain the ceramic green sheet that should become ceramic layer 9.Obtained ceramic green sheet packet
Contain ceramic material powder, organic matter and residual solvent.Above-mentioned organic matter is, for example, polyvinyl alcohol resin, phthalic acid
The substance of ester system resin etc. to work as adhesive.
Next, internal electrode 10 and 11 should be become in ceramic green sheet formation by silk-screen printing or photogravure etc.
Conductive film.
Next, the ceramic green sheet that conductive film will have been formed be laminated needed for number, and by the ceramics of not formed conductive film
Raw cook is lower on it to be laminated proper number, and these ceramic green sheets by rigid body compacting or are waited static pressure suppressions etc. in stacking direction
On suppressed, thus to obtain stacking block.
Next, block cutting will be laminated by the means such as truncation or cutting, multiple thus to obtain shaped like chips are not burnt into
Article body 2.
Next, implementing characteristic of the invention constitutes the process for removing organic matter.Specifically, the portion that will be burnt into
Part main body 2 heats, and burns the organic matter on the surface for being exposed to the article body 2.Heating temperature is set as than later implementing
The low temperature of the maximum temperature that firing process is applicable in.It is preferred that heating temperature is the temperature that organic matter starts to burn, preferably enough
Reach 900 DEG C or less of the temperature that by 100 DEG C or more of the temperature that organic matter removes and ceramics are not sintered excessively.
Fig. 3 is carried out by surface of the field emission type scanning electron microscope (FE-SEM) to the article body not being burnt into
The alternative photo of attached drawing obtained from shooting, after (A) indicates that the state before removing organic matter, (B) expression remove organic matter
State.When being compared to (A) and (B), it is known that: in (B) after removing organic matter, the organic matter (resin) on surface
It splashes, ceramic particle more clearly shows, and surface becomes coarse state.
Next, for example using the dipping or the methods of corona treatment to solution, preferred implementation make silicon compound or
Fluorine compounds physical absorption or chemisorption are in the modification process on the surface for the article body 2 not being burnt into.Pass through the modification
Processing can make electric conductivity in the process for forming the conductive paste film that should become external electrode 12 and 13 next implemented
The shape of paste film is more stable.
Next, external electrode 12 for example should be become by infusion process formation on the surface for the article body 2 not being burnt into
And 13 conductive paste film.As conductive paste used by herein, using being added to Ni powder in organic solvent
The conductive paste at end and ceramic powders.
Next, the article body 2 not being burnt into for having formd conductive paste film is burnt into.That is, the component not being burnt into
Main body 2 is burnt into simultaneously with conductive paste film.The article body 2 of external electrode 12 and 13 can have been formed as a result,.Firing
1000 DEG C or more and 1500 DEG C or less of the temperature that temperature is sufficiently sintered preferably as ceramics.
Then, as needed, Cu plated film or Cu coating, Ni coating are formed on external electrode 12 and 13 as described above
And plated film composed by Sn coating.
In this way, achievable laminated ceramic capacitor 1.
In order to confirm effect brought by the process above-mentioned for removing organic matter, the following experiment was carried out.
As sample, lengthwise dimension × width direction size × short transverse after having selected firing having a size of
1.0mm × 0.6mm × 0.25mm laminated ceramic capacitor.
It will be formed into after implementing heat treatment in 120 minutes at 150 DEG C in the stage for the article body not being burnt into
The conductive paste film of external electrode, the electricity of laminated ceramic obtained from being burnt into simultaneously to conductive paste film and article body
Container is set as embodiment.On the other hand, heat treatment will be not carried out in the stage for the article body not being burnt into, is formed into external electrical
The conductive paste film of pole, and laminated ceramic capacitor obtained from being burnt into simultaneously to conductive paste film and article body
It is set as comparative example.
The laminated ceramic capacitors that the laminated ceramic capacitor 20 and comparative example being related to for obtained embodiment are related to
Device 20, when the presence or absence of the fracture of the external electrode at the ridgeline portions for having checked article body, in embodiment in whole
The fracture of external electrode is not all seen in 20 samples, in contrast, can be seen in all 20 samples in a comparative example
The fracture of external electrode.
Hereinafter, being illustrated to other embodiments.
Firstly, replacing above-mentioned heating to remove organic matter, the article body 2 not being burnt into can also be changed
The property learned etching or physical etching.Chemically it is etched with the solution or O for being utilized and dissolving organic matter2The plasma of free radical
Cleaning etc..Plasma clean (O2Free radical processing) in, the C and O on the surface for the article body 2 not being burnt into react, C quilt
It removes.It is applicable in physical etching (corona treatment) and for example sprays Ar ion in the surface for the article body 2 not being burnt into
The plasma clean (Ar etching process) being etched afterwards.
Further more, in manufacturing method above-mentioned, although stacking block cutting is obtained multiple article bodies 2 not being burnt into
Afterwards, implement the process for removing the organic matter for being exposed to the surface for the article body 2 not being burnt into, but can also be cut block will be laminated
Before disconnected process, implement to remove the organic matter for being exposed to the surface for the article body 2 not being burnt into the state that block is laminated
Process.If the process for removing organic matter can be effectively performed according to the process sequence.
In addition, according to above-mentioned process sequence, then the article body 2 be not burnt into obtained from block cutting will be laminated
In, organic matter is removed only for interarea 3 and 4, and do not removed for the end face 7 and 8 and side 5 and 6 for being equivalent to section
Machine object.According to the situation, if only removing organic matter in interarea 3 and 4, it is construed as fully expecting the present invention
Effect.
Chemically etching or physical etching above-mentioned, are applied particularly advantageously to that multiple components not being burnt into can be taken out
The stacking block of main body 2.To find out its cause, if stacking block is implemented heating process, if block is laminated the edge of warpage can undesirably occur
Therefore.
The laminated ceramic capacitor obtained using the present invention, be not limited to Fig. 1 and Fig. 2 shows laminated ceramic capacitor
The capacitor of 1 that design.For example, even for the laminated ceramic capacitor 21 shown in Fig. 4 or the laminated ceramic shown in Fig. 5
The present invention can also be applied for capacitor 31.In addition, being assigned in Fig. 4 and Fig. 5 to the comparable element of element shown in FIG. 1
Same reference marks is given, and the repetitive description thereof will be omitted.
Laminated ceramic capacitor 21 shown in Fig. 4, which is characterized in that be also equipped with the length direction L for being formed in article body 2
Middle position third external electrode 22 and 23, constitute 3 terminal types capacitor.Manufacturing this laminated ceramic capacitor
During 21, difference is also formed after the process that the organic matter that will be exposed to the surface for the article body 2 not being burnt into removes
The conductive paste film of external electrode 12,13,22 and 23 should be become, and simultaneously by these conductive paste films and article body 2
Firing.
Third external electrode 22 and 23 is respectively formed as extending to first and second master from first and second side 5 and 6
In each a part in face 3 and 4.That is, Ying Chengwei third external electrode 22 and 23 is led in the stage that article body 2 is not burnt into
Electrical paste film, across first and second side 5 and 6 each is with first and second interarea 3 and each of 4 is intersected
It is formed in the state of crest line.Moreover, by implementing the process above-mentioned for removing organic matter, hence for third external electrode 22
And for 23, the thickness of the conductive paste film on the above-mentioned crest line of article body 2 can be maintained more than given, thus can
It is difficult to produce fracture.
In addition, third external electrode 22 and 23 is as shown in double dot dash line in Fig. 4, even if being configured as surrounding article body
In the case where 2 side 5 and 6 and interarea 3 and 4, if implementing that the portion not being burnt into will be exposed in the midway of its manufacturing process
The process that the organic matter on the surface of part main body removes, then also can be realized same effect.
Laminated ceramic capacitor 31 shown in Fig. 5 be respectively formed on the first interarea 3 of article body 2 island first and
Second external electrode 32 and 33.That is, the conductive paste film that should become external electrode 32 and 33 herein is not handed over across 2 faces
It is formed in the state of the crest line of fork.It in this case, also can be by Ying Chengwei by implementing the process above-mentioned for removing organic matter
First and second external electrode 32 and 33 thickness of conductive paste film balancedly maintain more than given.For this purpose, can drop
The deviation of the shape of low external electrode 32 and 33 forms external electrode 32 and 33 with capable of having good reproducibility.
In addition, first and second above-mentioned external electrode 32 and 33 respectively with first and second internal electrode example (not shown)
Such as connected by via hole conductor.
Although embodiments of the present invention are illustrated, it will be understood that embodiment of disclosure is in all sides
Face is all to illustrate, and not restrictive.The scope of the present invention is shown by claims, it is intended to encompass with claim
The meaning of book equalization and whole changes in range.
Claims (7)
1. a kind of manufacturing method of laminated ceramic capacitor, has:
The process of the article body be not burnt into of the production comprising ceramic raw material and organic matter；
The process that should become the conductive paste film of external electrode is formed on the surface of the article body not being burnt into；With
To the article body not being burnt into and the conductive paste film while the process being burnt into,
Wherein, the manufacturing method of the laminated ceramic capacitor is also equipped with:
Before the process for forming the conductive paste film, it will be exposed to described in the surface of the article body not being burnt into
The process that organic matter removes,
The manufacturing method of the laminated ceramic capacitor is also equipped with modification process, after the process for removing the organic matter
And formed before the process of the conductive paste film, so that silicon compound or fluorine compounds is adsorbed in the component master not being burnt into
The surface of body.
2. the manufacturing method of laminated ceramic capacitor according to claim 1, wherein
The process for forming the conductive paste film, the crest line intersected included at least two face across the article body
The process of the conductive paste film is formed under state.
3. the manufacturing method of laminated ceramic capacitor according to claim 1 or 2, wherein
The process of the production article body not being burnt into has:
The process that the stacking block of the ceramic layer not being burnt into comprising ceramic raw material and organic matter has been laminated in production；With
The process for cutting off the stacking block to obtain multiple article bodies not being burnt into,
Include by the process that the organic matter removes: before by the process of the stacking block cutting, in the shape of the stacking block
The process for removing the organic matter for being exposed to the surface of the article body not being burnt under state.
4. the manufacturing method of laminated ceramic capacitor according to claim 1 or 2, wherein
Include by the process that the organic matter removes: with the temperature lower than the maximum temperature being applicable in the process being burnt into
Spend the process heated to the article body not being burnt into.
5. the manufacturing method of laminated ceramic capacitor according to claim 4, wherein
The process heated is included in the process that 100 DEG C or more and 900 DEG C of temperature below are heated.
6. the manufacturing method of laminated ceramic capacitor according to claim 1 or 2, wherein
It include chemically to be etched to the article body not being burnt into or physical erosion by process that the organic matter removes
The process at quarter.
7. the manufacturing method of laminated ceramic capacitor according to claim 1 or 2, wherein
The conductive paste film that external electrode should be become includes Ni powder and ceramic powders.
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| JP2016049358A JP6769055B2 (en) | 2016-03-14 | 2016-03-14 | Manufacturing method of multilayer ceramic capacitors |
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| CN107919232A (en) * | 2017-10-27 | 2018-04-17 | 广东风华高新科技股份有限公司 | A kind of small size electronic component and preparation method thereof |
| KR102436222B1 (en) * | 2017-11-10 | 2022-08-25 | 삼성전기주식회사 | Embedded multilayer ceramic electronic component, manufacturing method thereof and print circuit board having embedded multilayer ceramic electronic component |
| CN111755247B (en) | 2019-03-28 | 2022-01-07 | 株式会社村田制作所 | Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor |
| JP7196732B2 (en) | 2019-03-28 | 2022-12-27 | 株式会社村田製作所 | Multilayer ceramic capacitor and method for manufacturing the same |
| JP2020167236A (en) | 2019-03-28 | 2020-10-08 | 株式会社村田製作所 | Three-terminal type multilayer ceramic capacitor and method for manufacturing the same |
| CN115472431A (en) * | 2019-07-04 | 2022-12-13 | 三星电机株式会社 | Multilayer ceramic capacitor |
| KR102333086B1 (en) | 2019-08-19 | 2021-12-01 | 삼성전기주식회사 | Multi-layered ceramic capacitor |
| JP7363654B2 (en) | 2020-04-20 | 2023-10-18 | 株式会社村田製作所 | Multilayer ceramic electronic components |
| JP7273373B2 (en) * | 2020-04-20 | 2023-05-15 | 株式会社村田製作所 | multilayer ceramic electronic components |
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| JP2017168488A (en) | 2017-09-21 |
| KR101896286B1 (en) | 2018-09-07 |
| CN107195459A (en) | 2017-09-22 |
| JP6769055B2 (en) | 2020-10-14 |
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