CN107193354A - A kind of liquid metal heat radiation device - Google Patents
A kind of liquid metal heat radiation device Download PDFInfo
- Publication number
- CN107193354A CN107193354A CN201710474768.6A CN201710474768A CN107193354A CN 107193354 A CN107193354 A CN 107193354A CN 201710474768 A CN201710474768 A CN 201710474768A CN 107193354 A CN107193354 A CN 107193354A
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- CN
- China
- Prior art keywords
- heat
- liquid metal
- radiator
- copper pipe
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The present invention provides a kind of liquid metal heat radiation device, including：Heat conducts module and radiating module, and the radiating module is made up of graphite；Wherein, the radiating module includes radiator body and many module radiator fins, and many module radiator fins are arranged at the radiator body outer surface；The radiator body inner hollow, and correspondence constitutes a radiator cavity, the radiator cavity is filled by the mixture of liquid metal and graphite, and the heat conduction module is connected into inside the radiator body.Liquid metal heat radiation device proposed by the present invention, by the way that the material of radiator is replaced with into graphite, extend the life-span of radiator using the corrosion resistance characteristic of graphite, and the capacity of heat transmission of graphite is 2 to 3 times of copper, therefore use the heat dispersion for the radiator that graphite material constitutes more preferably.
Description
Technical field
The present invention relates to radiator field, more particularly, to a kind of liquid metal heat radiation device.
Background technology
At present, continuing to develop with cpu chip integrated technology, the frequency of use and its heat dissipation capacity of cpu chip is also more next
Bigger, cpu chip temperature is too high to have had a strong impact on the operational performance of cpu chip, while also reducing the use longevity of cpu chip
Life.Traditional chip cooling technology mainly includes：Wind-cooling heat dissipating, water-cooling, semiconductor heat-dissipating, heat pipe heat radiation, compression mechanism
Cold liquid nitrogen radiating etc., but the integrated and light-weighted pursuit along with user to equipment, the defect of these traditional radiators
Start to show, its heat dispersion can not meet the radiating requirements of existing cpu chip.
In the prior art, the radiator of cpu chip typically uses liquid metal heat radiation device, and liquid metal is a kind of outstanding
Heat transfer medium, its heat conduction compared with specific heat capacity conventional thermal conductive medium will height, and the liquid metal of phase homogenous quantities can transmit
Heat is more.And liquid metal can further reduce as the radiator of working medium in volume, meet people to integrated
Change and light-weighted demand.The liquid metal heat radiation device of prior art uses copper structure, and using without any moving component
Electromagnetic pump drives, and drive efficiency is high and energy consumption is relatively low, can solve the problem that the radiating requirements that cpu chip is present.
But, existing liquid metal heat radiation device is due to using copper structure, and its heat spreader structures inevitably will be by
To the corrosion of liquid metal, the service life of radiator is caused to reduce, radiating effect is deteriorated.
The content of the invention
The present invention provides a kind of a kind of liquid metal for overcoming above mentioned problem or solving the above problems at least in part and dissipated
Hot device.
According to an aspect of the present invention there is provided a kind of liquid metal heat radiation device, including：
Heat conducts module and radiating module, and the radiating module is made up of graphite；Wherein,
The radiating module includes radiator body and many module radiator fins, and many module radiator fins are arranged at
The radiator body outer surface；The radiator body inner hollow, and correspondence constitutes a radiator cavity, the radiating
Device cavity is filled by liquid metal and graphite mixture, and the heat conduction module is connected into inside the radiator body.
Wherein, the radiator body and many module radiator fins are integrally prepared.
Wherein, each module radiator fin thickness is identical, and is evenly arranged in the radiator body outer surface.
Wherein, the heat conduction module includes：
Base, copper pipe connect hole, heat-conducting copper pipe and electromagnetic pump, wherein,
The copper pipe connects hole and is arranged at the susceptor surface, and the first end of the heat-conducting copper pipe meets Kong Lian by the copper pipe
Enter the chassis interior, the second end of the heat-conducting copper pipe is connected into inside the radiator body, and the electromagnetic pump is placed in institute
State on the outside of heat-conducting copper pipe and be close to the heat-conducting copper pipe.
Wherein, the copper pipe connects hole and integrally prepared with the heat-conducting copper pipe, and copper pipe connects hole number equal to the conduction copper
Pipe quantity.
Wherein, the electromagnetic pump includes：
The opposite electrode slice of a pair of electrodes and a pair of permanent magnetism pieces, wherein,
Two panels electrode slice is just to being placed in the heat-conducting copper pipe both sides, and the permanent magnetism piece and any one plate electrode piece are vertical.
Wherein, the chassis interior is hollow and is filled by liquid metal.
Wherein, the material of the base is corrosion protected copper alloy.
Wherein, the outer surface of the base scribbles liquid metal for conducting heat cream, or liquid metal heat radiation piece is posted on surface.
Wherein, the base is provided with the thermal source interface being connected with external heat source.
Liquid metal heat radiation device proposed by the present invention, by the way that the material of radiator is replaced with into graphite, utilizes the resistance to of graphite
Etching characteristic extends the life-span of radiator, and the capacity of heat transmission of graphite is 2 to 3 times of copper, therefore is constituted using graphite material
Radiator heat dispersion more preferably.
Brief description of the drawings
Fig. 1 is a kind of liquid metal heat radiation device structural representation provided in an embodiment of the present invention；
Fig. 2 is liquid metal heat radiation device sectional view provided in an embodiment of the present invention.
Embodiment
With reference to the accompanying drawings and examples, the embodiment to the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
Fig. 1 is a kind of liquid metal heat radiation device structural representation provided in an embodiment of the present invention, and Fig. 2 is the embodiment of the present invention
The liquid metal heat radiation device sectional view of offer, as depicted in figs. 1 and 2, the liquid metal heat radiation device includes：
Heat conducts module and radiating module, and the radiating module is made up of graphite；Wherein,
The radiating module includes radiator body 1 and many module radiator fins 2, and many module radiator fins 2 are set
It is placed in the outer surface of radiator body 1；The inner hollow of radiator body 1, and correspondence constitutes a radiator cavity 3,
The radiator cavity 3 is filled by liquid metal and graphite mixture, and the heat conduction module is connected into the radiator body 1
It is internal.
It is understood that the heat conduction module is by the conduction of the heat transfer of external heat source to radiating module
Device, the external heat source is such as：Cpu chip, motor etc. can be as external heat sources, CPU cores provided in an embodiment of the present invention
Piece is only preferred scheme as external heat source, and the embodiment of the present invention is specifically limited not to this.
The radiating module is the heat energy that will be passed over from heat conduction module by way of volatilizing or absorbing
Radiator body 1 is made using graphite in the device for dissipating heat energy, the embodiment of the present invention, and by the inner hollow of radiator body 1,
Radiator cavity 3 is formed, in order to preferably play heat conductivility, the similar rib shape of cavity of the radiator cavity 3 so that chamber
The heat transfer area of body is increased as far as possible.
Wherein, filled in the radiator cavity 3 by liquid metal and graphite mixture, the liquid metal includes：Often
Gallium, gallium-indium alloy, gallium-indium-tin alloy, Na-K alloy, mercury for being in a liquid state under temperature etc., the embodiment of the present invention do specific limit not to this
It is fixed；The granular size of the graphite is 1 μm -50 μm, and graphite accounts for the ratio of the mixture for 1-25.
It is understood that graphite is made as heat exchange material with liquid metal mixture compared with existing with liquid metal
For heat exchange material, the heat exchange efficiency of radiator is significantly improved, can be obtained through experimental test, graphite is made with liquid metal mixture
It is to exchange heat material compared to liquid metal, its heat-transfer capability improves 60%.
It is understood that graphite-phase has stronger corrosion resistance compared with copper alloy, the radiator that is introduced as of graphite is carried
It is provided with more long life-span and stability, and graphite has a splendid heat conductivility, thermal conductivity factor 700-1300w/ (m-k), quite
In 2 to 3 times of copper, 3 to 5 times of aluminium, the material that native graphite is processed has thermal conductivity more more preferable than aluminum bronze material, changes
, stable physical property are high, and electric conductivity is excellent, is the radiator material of superior heat radiation performance.
Heat radiator main body 1 provided in an embodiment of the present invention and heat radiator fin 2 are by high purity graphite, isostatic pressed stone
The graphite raw material that ink, composite graphite etc. have good heat conductive and corrosion resistance is processed, and the embodiment of the present invention is not to graphite
The composition of raw material is limited.
The embodiment of the present invention is extended scattered by the way that the material of radiator is replaced with into graphite using the corrosion resistance characteristic of graphite
The life-span of hot device, and cause the better heat-radiation effect of radiator.
On the basis of above-described embodiment, the radiator body and many module radiator fins are integrally prepared.
Each module radiator fin thickness is identical, and is evenly arranged in the radiator body outer surface.
As shown in figure 1, many module radiator fins 2 are evenly arranged on the upper surface of the radiator body 1, and each piece
The thickness and size of radiator fin are suitable, and radiator fin 2 and radiator body 1 are integrally formed in the fabrication process.
It is preferred that, the thickness of each module radiator fin should be maintained in 1mm-4mm, and two adjacent module radiator fins
Between spacing be difficult it is too big.
On the basis of above-described embodiment, the heat conduction module includes：
Base 4, copper pipe connect hole 5, heat-conducting copper pipe 6 and electromagnetic pump 7, wherein,
The copper pipe connects hole 5 and is arranged at the upper surface of base 4, and first end and the copper pipe of the heat-conducting copper pipe 6 connect
Hole 5 is connected, and the second end of the heat-conducting copper pipe 6 is connected with radiator cavity 3, and the electromagnetic pump 7 is placed in the heat-conducting copper pipe 6
Simultaneously it is close to the heat-conducting copper pipe 6 in outside.
Wherein, the base 4 is used to fix external heat source and radiator is overall, and it is connection interface, root that the copper pipe, which connects hole 5,
Hole size is connect according to the diameter design copper pipe of heat-conducting copper pipe 6, and is welded so that whole heat conduction module seal is good
It is good.
The heat-conducting copper pipe 6 is made up of Albrac, due to heat-conducting copper pipe and liquid metal close contact, therefore this hair
The heat-conducting copper pipe that bright embodiment is provided does not use general copper pipeline.It is understood that the surface of radiator body 1
Hole is connect provided with copper pipe, the heat-conducting copper pipe 6 connects hole by the copper pipe and accessed in radiator cavity 3.
The electromagnetic pump 7 is the pump that the energization fluid being in magnetic field flows under electromagnetic force to certain orientation.Institute
The flow direction that electromagnetic pump is mainly used in controlling the liquid metal in heat-conducting copper pipe is stated, electric current in magnetic field and conductor fluid is utilized
Interaction, makes fluid be produced barometric gradient by electromagnetic force, controls the flowing of the liquid metal in the heat-conducting copper pipe 6
Direction.
It should be noted that the heat-conducting copper pipe is at least 1.
As shown in Figure 1, it is preferred that conduct leading for module as heat the embodiments of the invention provide two heat-conducting copper pipes 6
Heat pipe, but quantity of the present invention not to the heat conducting pipe is specifically limited.
The copper pipe connects hole and integrally prepared with the heat-conducting copper pipe, and copper pipe connects hole number equal to the heat-conducting copper pipe number
Amount.
It is understood that in the fabrication process, the quantity in hole 5 is connect according to the arrangement quantity of heat-conducting copper pipe 6 setting copper pipe,
And integration welding copper pipe connects hole 5 and heat-conducting copper pipe 6 during Mold Making so that copper pipe connects hole 5 and heat-conducting copper pipe
Contact site seal is intact.
It should be noted that the heat-conducting copper pipe 6 is made up of erosion-resisting copper alloy, because heat-conducting copper pipe 6 needs necessarily
Physical strength, therefore unusable graphite is as material, a diameter of D2-D4 of the every heat-conducting copper pipe 6, and length is 50mm-
500mm, and connected mode is not limited to straight line connection, and heat-conducting copper pipe 6 is connected into the company of the radiator cavity 3 by any one
Connect mode and be applied to the embodiment of the present invention.
On the basis of above-described embodiment, the electromagnetic pump 7 includes：
The opposite electrode slice of a pair of electrodes and a pair of permanent magnetism pieces, wherein,
Two panels electrode slice is just to being placed in the heat-conducting copper pipe both sides, and the permanent magnetism piece and any one plate electrode piece hang down
Directly.
It is understood that for any a electromagnetic pump 7, all with a piece of anode electrode piece and a piece of negative electricity
Pole piece and a pair of permanent magnetism pieces, using the interaction of electric current in magnetic field and conductor fluid, make fluid be produced by electromagnetic force
Raw barometric gradient, so as to promote fluid motion, permanent magnetism piece provided in an embodiment of the present invention is 0 to 3 tesla.
It is preferred that, the opposite electrode slice of a pair of electrodes provided in an embodiment of the present invention be copper, graphite or stainless steel,
Because electromagnetic pump 7 is close to heat-conducting copper pipe 6, therefore also has to the corrosion resistance of electromagnetic pump and there are certain requirements, it is preferred that using it is copper,
Graphite or stainless steel are used as electrode slice.
Electromagnetic pump provided in an embodiment of the present invention does not have any rotatable parts, solves mechanical pump wear problem, and liquid
State metal operational efficiency under the driving of electromagnetic pump is higher, so that the operating efficiency of radiator is higher.
On the basis of above-described embodiment, the inner hollow of base 4 is simultaneously filled by liquid metal.
As shown in Fig. 2 the inner hollow of base 4 provided in an embodiment of the present invention, and filled by liquid metal, the conduction copper
Pipe 6 connects hole 5 through the copper pipe and accessed inside the base 4, and is covered by liquid metal, under the active force of electromagnetic pump 7, the bottom of from
Twitch liquid metal circulation in heat-conducting copper pipe 6 in the inside of seat 4.
On the basis of above-described embodiment, the material of the base is copper alloy.
It is understood that the inner hollow of base 4, and inside is filled by liquid metal, therefore to the corrosion resistance of base
Also tool there are certain requirements, although the base corrosion resistance of common graphite material is stronger, but the physical strength of its structure is not high, no
It is adapted to the similar this immobilising device of base of making.
It is preferred that, the embodiment of the present invention provides the base that copper alloy is made.
On the basis of above-described embodiment, the outer surface of the base scribbles liquid metal for conducting heat cream, or liquid is posted on surface
State metal fin.
It is understood that described dissipate in the outer surface coating liquid metal heat-conducting cream of base 4 and in surface patch liquid metal
The purpose of backing is：So that being liquid metal on the contact surface of base 4 and external heat source, liquid metal is given full play to as Jie
The excellent heat conductivity performance of matter.
On the basis of above-described embodiment, the base is provided with the thermal source interface being connected with external heat source.
As shown in figure 1, thermal source interface 8 is as shown in the figure, it is preferred that thermal source interface provided in an embodiment of the present invention is to be arranged on
4 connecting holes of 4 four jiaos of base, external heat source is fixed by bolt through 4 connecting holes with base, and tight with base outer surface
Patch.
It should be noted that the connection between the base 4 and external heat source is not limited to the connection of bolt penetration hole formula, such as
Metal glue bond or buckle-type connection, the embodiment of the present invention are specifically limited not to this.
Finally, the present processes are only preferably embodiment, are not intended to limit the scope of the present invention.It is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements made etc. should be included in the protection of the present invention
Within the scope of.
Claims (10)
1. a kind of liquid metal heat radiation device, it is characterised in that including：
Heat conducts module and radiating module, and the radiating module is made up of graphite；Wherein,
The radiating module includes radiator body and many module radiator fins, and many module radiator fins are arranged at described
Radiator body outer surface；The radiator body inner hollow, and correspondence constitutes a radiator cavity, the radiator is empty
Chamber is filled by the mixture of liquid metal and graphite, and the heat conduction module is connected into inside the radiator body.
2. liquid metal heat radiation device according to claim 1, it is characterised in that the radiator body and the polylith dissipate
Hot device fin is integrally prepared.
3. liquid metal heat radiation device according to claim 2, it is characterised in that each module radiator fin thickness is identical,
And it is evenly arranged in the radiator body outer surface.
4. liquid metal heat radiation device according to claim 1, it is characterised in that the heat conduction module includes：
Base, copper pipe connect hole, heat-conducting copper pipe and electromagnetic pump, wherein,
The copper pipe connects hole and is arranged at the susceptor surface, and the first end of the heat-conducting copper pipe connects hole by the copper pipe and is connected into institute
Chassis interior is stated, the second end of the heat-conducting copper pipe is connected into inside the radiator body, the electromagnetic pump is placed in described lead
It is close on the outside of hot copper pipe and with the heat-conducting copper pipe.
5. liquid metal heat radiation device according to claim 4, it is characterised in that the copper pipe connects hole and the heat-conducting copper pipe
Prepared by one, and copper pipe connects hole number equal to the heat-conducting copper pipe quantity.
6. liquid metal heat radiation device according to claim 3, it is characterised in that the electromagnetic pump includes：
The opposite electrode slice of a pair of electrodes and a pair of permanent magnetism pieces, wherein,
Two panels electrode slice is just to being placed in the heat-conducting copper pipe both sides, and the permanent magnetism piece and any one plate electrode piece are vertical.
7. liquid metal heat radiation device according to claim 3, it is characterised in that the chassis interior is hollow and by liquid gold
Category filling.
8. liquid metal heat radiation device according to claim 7, it is characterised in that the material of the base is closed for corrosion protected copper
Gold.
9. liquid metal heat radiation device according to claim 8, it is characterised in that the outer surface of the base scribbles liquid gold
Belong to heat-conducting cream, or liquid metal heat radiation piece is posted on surface.
10. liquid metal heat radiation device according to claim 9, it is characterised in that the base is provided with and external heat source
The thermal source interface of connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710474768.6A CN107193354A (en) | 2017-06-21 | 2017-06-21 | A kind of liquid metal heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710474768.6A CN107193354A (en) | 2017-06-21 | 2017-06-21 | A kind of liquid metal heat radiation device |
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| CN107193354A true CN107193354A (en) | 2017-09-22 |
Family
ID=59879699
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| CN201710474768.6A Pending CN107193354A (en) | 2017-06-21 | 2017-06-21 | A kind of liquid metal heat radiation device |
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Application publication date: 20170922 |