CN107186349A - Laser scribing device - Google Patents
Laser scribing device Download PDFInfo
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- CN107186349A CN107186349A CN201710446715.3A CN201710446715A CN107186349A CN 107186349 A CN107186349 A CN 107186349A CN 201710446715 A CN201710446715 A CN 201710446715A CN 107186349 A CN107186349 A CN 107186349A
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- unit
- laser beam
- laser
- substrate
- cutting
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0007—Applications not otherwise provided for
Abstract
The invention provides it is a kind of can be used for cutting brittle material substrate in laser when easily vary laser focal length laser scribing device.The laser scribing device includes：Line head unit；And saddle, substrate is loaded on the saddle, wherein line head unit is moved relative to saddle, and head unit of ruling includes lens subassembly and distance measurement sensor component, the lens subassembly receives cutting laser beam to change the focus of cutting laser beam from laser generation device, the distance measurement sensor component includes distance measurement sensor and passes through unit with light beam, the distance measurement sensor includes the Optical Transmit Unit for producing measurement laser beam and the light receiving unit for receiving measurement laser beam, unit is passed through by the light beam with laser beam by the cutting of control focal length in lens subassembly.
Description
Technical field
The present invention relates to a kind of laser scribing device.More particularly it relates to a kind of laser scribing device, it is measured
With the distance of brittle substrate and actively adjusting the focal length of laser according to the distance with brittle substrate.
Background technology
There is the situation that laser is used for accurate cutting as the method for cutting object to be cut.Use cutting for laser
Cut and be applied not only to cut sheet metal, and for cutting the fragile material of such as glass.
For example, utilizing laser to cut the two-d display panel of such as liquid crystal display.It is of the prior art to be used to cut
The scoring equipment for cutting liquid crystal display is rotatably moved by boring while predetermined pressure is applied to substrate surface
The break bar that stone or hard alloy are made, to form groove on the surface of the substrate and by fracture process come cutting substrate.
In this respect, using the scoring equipment of laser by irradiating laser to substrate and utilizing the cooling substrate such as cooling gas
To produce thermal stress, to form crack in a substrate.Alternately, it is proposed that by sequentially irradiated to substrate different laser come
Cutting substrate.Simultaneously, in some cases it may utilize laser to two pieces of substrates of cutting bonding composition liquid crystal display
The black matrix" of sealant or formation in a substrate etc., and hereafter can be using break bar come cutting substrate.
However, when substrate to be cut is not usually or when needing control laser depth of shine, existing and being difficult to adjust immediately
Whole the problem of.
For example, Korean Patent Publication publication No.10-2005-0106156 (" is used for the manufacturing process in flat-type display
The device of middle glass-cutting substrate and for the method for the depth of cut for controlling glass substrate ", be published in November 9 in 2005
Day) a kind of structure is disclosed, it includes a kind of lifting device, and the lifting device is measured from a distance from substrate and to lift irradiation sharp
The height in the irradiation hole of light beam, to control the focal length of laser beam.
However, in the prior art, mechanically the height in the irradiation hole of control irradiation laser beam postpones in terms of response, ties
Fruit is to be difficult to improve substrate cut speed.In addition, in the prior art, measuring the range sensor with a distance from from substrate and irradiation
Horizontal range between the irradiation hole of laser beam is separated, and result is can not to irradiate laser beam with accurate depth.
The content of the invention
It is an object of the invention to provide a kind of laser scribing device, it is carried according to the measurement result with the distance of substrate
High laser depth of shine control accuracy.
The present invention also aims to provide a kind of laser scribing device, it passes through according to the measurement position with the distance of substrate
Put and minimize error to improve line precision for the difference between the laser irradiating position of cutting.
An exemplary embodiment of the present invention provides a kind of laser scribing device, and it includes：Line head unit；With
And saddle, substrate is loaded on the saddle, and line head unit is moved relative to saddle, and head unit of ruling includes lens group
Part and distance measurement sensor component, the lens subassembly receive cutting laser beam from laser generation device and used with changing cutting
The focus of laser beam, the distance measurement sensor component includes distance measurement sensor and passes through unit, institute with light beam
Stating distance measurement sensor includes the light-receiving list for the Optical Transmit Unit and reception measurement laser beam for producing measurement laser beam
Member, unit is passed through in lens subassembly with laser beam by the cutting of control focal length by the light beam.
In the illustrative embodiments, lens subassembly can include the condenser lens for forming the focus of cutting laser beam
With the lens driving unit of the position of adjustment condenser lens.
Optical Transmit Unit can irradiate measurement laser beam with the angle of on-right angle to substrate, and light receiving unit can be with
The measurement laser beam of substrate is reached with the angular acceptance of on-right angle.
Light beam can be formed between Optical Transmit Unit and light receiving unit by unit.
The point for irradiating measurement laser beam to substrate can be before the irradiation position of cutting laser beam.
Laser scribing device can also include receiving distance sensing information from distance measurement sensor and control lens to drive
The main control unit of the driving of moving cell.
In the illustrative embodiments, main control unit can by consider will to distance measurement sensor sensing points
Irradiation cutting calculates the driving deadline of lens driving unit with the time of laser beam.
Main control unit can be by considering processing time of the processing time Ts of distance measurement sensor, main control unit
Tm and time Td calculates the driving deadline of lens driving unit, and time Td controlled until by being exported from main control unit
Signal processed and practically drive the time needed for lens driving unit.
Main control unit can by consider the sensing points of distance measurement sensor and cutting laser beam point of irradiation it
Between distance come limit line head unit and substrate between relative moving speed higher limit.
Main control unit can be measured come setpoint distance according to the relative moving speed between line head unit and substrate and passed
The sense period of sensor.
According to an illustrative embodiment of the invention, can be according to the range measurements with substrate rapidly and accurately
Control laser depth of shine.
According to an illustrative embodiment of the invention, it can be used to measure the range measurement with the distance of substrate by integrated
Sensor and make for the laser irradiation device of cutting substrate depend between range measurement position and laser irradiating position
The error of difference is minimized.
According to an illustrative embodiment of the invention, by synthetically considering the sense period of distance measurement sensor, drawing
Point of irradiation of the end of a thread unit relative to the relative moving speed of substrate, the sensing points of distance measurement sensor and cutting laser beam
The distance between difference etc. accurately control the focal length of laser beam.
As a result, according to an illustrative embodiment of the invention, by according to a distance from from the processed object of such as substrate
Change the focal length of cutting laser beam and the groove with uniform depth can be formed in processed object.
It is outlined above to be merely illustrative, and be not intended to be any limitation as in any way.Except illustrative above
Beyond aspect, embodiment and feature, by reference to accompanying drawing and described in detail below, further aspect, embodiment and spy
Levy and will become obvious.
Brief description of the drawings
Fig. 1 is the diagram for the configuration for showing laser scribing device according to an illustrative embodiment of the invention.
Fig. 2 is to show the range measurement in the laser scribing device being arranged on according to an illustrative embodiment of the invention
The diagram of the configuration of sensor cluster.
Fig. 3 is the block diagram for the control configuration for showing laser scribing device according to an illustrative embodiment of the invention.
Fig. 4 be show the distance measurement sensor of laser scribing device according to an illustrative embodiment of the invention with
The diagram of relation between laser irradiating position.
Fig. 5 is the control method for the laser scribing device for showing another illustrative embodiments according to the present invention
Flow chart.
It should be appreciated that accompanying drawing is not drawn necessarily to scale, so that the various of the general principle of the explanation present invention are presented
The somewhat simplified expression of feature.Specific design feature of the invention as disclosed herein (such as including specific dimensions, takes
To, location and shape) partly it will be determined by specific intended application and use environment.
In figure, the reference in multiple figures of whole accompanying drawings represents the same or equivalent part of the present invention.
Embodiment
The illustrative embodiments of the present invention are described in detail hereinafter with reference to accompanying drawing.First, when reference represents each
During the component of individual figure, it is noted that as attached by identical as possible although identical component is illustrated in various figures
Icon note represents identical component.In addition, in the following description, it is convenient to omit known relevant configuration and function are specifically
It is bright, to avoid unnecessarily covering subject of the present invention.In addition, illustrative embodiments of the invention explained below, but this
The technical spirit not limited to this of invention is limited by it, and those skilled in the art can change and implement in a variety of ways
Illustrative embodiments.
Fig. 1 is the diagram for the configuration for showing laser scribing device according to an illustrative embodiment of the invention, and Fig. 2
It is to show the distance measurement sensor component in the laser scribing device being arranged on according to an illustrative embodiment of the invention
Configuration diagram.
Laser scribing device according to an illustrative embodiment of the invention includes：Substrate 1 is loaded onto saddle 2 thereon
With the line head unit 10 for being disposed relative to the movement of saddle 2.Saddle 2 be fixed and line head unit 10 be it is moveable,
Line head unit 10 is fixed and saddle 2 is moveable, or saddle 2 and line head unit 10 both may move
's.Line head unit 10 can be arranged in stand (not shown), and stand is arranged to span over the upside of saddle 2.Laser scribing is set
Standby basic configuration can follow the Fig. 1 for the Korean Patent Publication publication No.10-2005-0106156 for being described as prior art
Shown in configuration.
In the ideal case, it is coplanar to be loaded into the substrate 1 at the top of saddle 2, but in practical situations both, substrate 1
There is small difference in height with horizontal plane.Cutting is adjusted according to the distance with substrate 1 according to the laser scribing device of the present invention to use
The depth of shine of the focal length of laser beam, i.e. cutting laser beam.Here, the depth of shine of cutting laser beam can be substrate
A point on surface or in substrate, and in some cases, the depth of shine of cutting laser beam can be used to connect
Close a point either position corresponding with black matrix" present in substrate of the sealant of substrate engagement.
Head unit 10 of ruling includes distance measurement sensor component 20 and lens subassembly 30, and lens subassembly 30 is arranged on distance
On the top of measurement sensor component 20.In addition, at least one speculum 12 can be included in line head unit 10, at least one
Speculum 12 is used to the cutting laser beam 42 produced from single laser generation device 40 being transferred to lens subassembly 30.
Distance measurement sensor component 20 can be arranged to be fixed on the carrier types of line head unit 10.In range measurement
Sensor cluster 20 can be positioned below distance measurement sensor 22, and distance measurement sensor 22 includes Optical Transmit Unit 24 and light
Receiving unit 26, Optical Transmit Unit 24 irradiates measurement laser beam 25 to substrate 1 at a predetermined angle, and light receiving unit 26 is from light
The measurement that transmitter unit 24 is produced receives the measurement laser beam 25 of reflection after being reflected on substrate 1 with laser beam 25.In light
The light beam penetrated right through is provided between transmitter unit 24 and light receiving unit 26 and passes through unit 28.
The cutting that focal length is adjusted in lens subassembly 30 passes through unit 28 with laser beam 42 by light beam.
Measurement laser beam 25 and cutting laser beam 42 can preferably have different-waveband.This is in order in light-receiving
Unit 26 receives measurement with preventing the interference of cutting laser beam 42 during laser beam 25.
The condenser lens 32 of the focal length of adjustment cutting laser beam 42 is provided with lens subassembly 30.Condenser lens 32 can
To be single lens or component by combining multiple lens and obtaining.In addition, being provided with adjustment aggregation in lens subassembly 30
The lens driving unit (not shown in fig. 1 and 2) of the position of lens 32.
Lens driving unit is arranged to voice coil-type or linear electric machine type, to adjust the position of condenser lens 32.Range measurement
Sensor 22 measures the distance with substrate 1, and lens driving unit adjusts the position of condenser lens 32 according to the distance of measure,
To adjust the focal length of the laser beam 42 irradiated to substrate 1.
Lens driving unit can be obtained by considering the relative moving speed V between line head unit 10 and substrate 1
To the position adjustment time of condenser lens 32.
In fig. 1 it is illustrated that, lens subassembly 30 is located on the top of distance measurement sensor component 20, and passes through saturating
The cutting of mirror assembly 30 passes through unit 28 with laser beam 42 by the light beam of the lower section positioned at lens subassembly 30, as a result, in substrate 1
Pre-position form focus.However, in an exemplary embodiment of the present invention embodiment, the cutting exported from lens subassembly 30
It is can be configured to laser beam 42 while the light path of cutting laser beam 42 is converted by single speculum (not shown)
Pass through unit 28 by light beam.
In the present invention, the measurement of distance measurement sensor 22 and the position on the horizontal plane of the distance of substrate 1 and illuminated
Cutting is spaced apart from each other with the position on the horizontal plane of laser beam 42.In the exemplary embodiment, distance measurement sensor 22
The position of the distance of measurement and substrate 1 is before irradiation position of the cutting with laser beam 42.That is, the position is set so that logical
Distance measurement sensor 22 is crossed to measure and the distance of substrate 1 and this backward irradiation cutting of substrate 1 laser beam 42.
Fig. 3 is the block diagram for the control configuration for showing laser scribing device according to an illustrative embodiment of the invention,
And Fig. 4 is to show that the distance measurement sensor of laser scribing device according to an illustrative embodiment of the invention shines with laser
The diagram for the relation penetrated between position.
Reference picture 3, includes main control unit 50 according to the laser scribing device of the present invention, and main control unit 50 is surveyed from distance
Quantity sensor 22 receives the range measurements with substrate 1, and controls the lens driving unit 34 of lens subassembly 30.
Distance measurement sensor 22 measure with the distance of substrate 1, and according to the control carried out by main control unit 50 or
The distance of measure is sent to main control unit 50 every predetermined period.
Main control unit 50 according to the measurement result of distance measurement sensor 22 by controlling the lens of lens subassembly 30 to drive
The driving of moving cell 34 adjusts the position of condenser lens 32.
Reference picture 4, the measurement produced from the Optical Transmit Unit 24 of distance measurement sensor 22 is with laser beam 25 in substrate
Irradiate and reflect on point P1, and be hereafter incident in light receiving unit 26.Distance measurement sensor 22 can be based on from light hair
Penetrate unit 24 generation measurement be incident on laser beam 25 in light receiving unit 26 before time it is vertical from substrate 1 to calculate
Distance.Furthermore, it is possible to be calculated by the arrangement of Optical Transmit Unit 24 and light receiving unit 26 and from the vertical range of substrate 1
Point P1.
Cutting forms focus F on substrate 1 with laser beam 42, and which has been formed on the surface of focus F substrate 1
Point is P2.On the installation direction of the laser scribing device according to the present invention, when the direction is shown in respect to the horizontal plane each other
When in orthogonal X and Y-axis, P1 and P2 can be located on the same straight line in X-direction or Y direction or positioned at diagonal side
Upwards.
P1 and P2 horizontal range is represented by Δ L.In the exemplary embodiment, Δ L can have several millimeters
Value.In addition, Δ L can be in the range of 0.5mm to 2mm.As Δ L is smaller, it can more quickly reflect and be passed according to range measurement
The sensing result of sensor 22 and to adjustment of the cutting with the focal length of laser beam 42.However, due to according to distance measurement sensor 22
Sensing result control lens driving unit 34 driving needed for time, it may be difficult to Δ L is set as too small.In the present invention
In, can be by considering the relative moving speed between Δ L, line head unit 10 and substrate 1, time needed for control etc. come real
Existing optics line control.
When the relative moving speed between head unit 10 and substrate 1 of ruling is V, it can be cut by Δ L/V
With laser beam 42 from point P2 to the time Δ T needed at point P1.
Main control unit 50 controls lens by calculating the driving time of lens driving unit 34 by means of consideration Δ T
The driving of driver element 34.
In the illustrative embodiments, main control unit 50 can be by considering in time Ts, main control unit 50
Processing time Tm and time Td come determine the driving deadline T2 of lens driving unit 34, time Ts be from range measurement sensing
The time that device 22 is irradiated to P1 needed for the inter-process of the time T1 distance measurement sensor 22 of measurement laser beam, time Td
It is the time needed for by practically driving lens driving unit 34 by means of the output control signal of main control unit 50.
Due to needing to drive lens driving unit 34 when the position of cutting laser beam 42 reaches P1, so now needing
Meet the relation according to formula 1.
[formula 1]
Δ T=T2-T1 >=Ts+Tm+Td
Main control unit 50 can set the higher limit of the relative moving speed V between line head unit 10 and substrate 1, with
Meet the condition of formula 1.
Main control unit 50 can set the control time delay of lens driving unit 34, to cause lens driving unit 34
Driving lens driving unit 34 driving deadline T2 complete, and except control time delay in addition to also adjust to lens
The time of the output control signal of driver element 34.
The sense period of distance measurement sensor 22 can be set as Δ T, to meet the condition of formula 1.
The sense period of distance measurement sensor 22 can be set as and be rule and be between head unit 10 and substrate 1 relative
Translational speed V sets up association.When relative moving speed V is high, the sense period of measurement sensor 22 can be reduced the distance, and is worked as
When relative moving speed V is low, the sense period of distance measurement sensor 22 can be extended.
Fig. 5 is the control method for the laser scribing device for showing another illustrative embodiments according to the present invention
Flow chart.
First, depth of shine of the setting cutting with laser beam 42 in substrate 1, i.e. focal length (S100).
Distance measurement sensor 22 occurs either periodically or continuously measure with the distance of substrate 1, and main control unit 50 from away from
Measurement result (S102) is received from measurement sensor 22.
Main control unit 50 receives measurement result from distance measurement sensor 22, and to be surveyed thereafter through consideration to distance
The sensing points P1 irradiation cuttings of quantity sensor 22 calculate laser depth of shine control time (S104) with the time of laser beam 42.
Here, the time before driving deadline T2 that laser depth of shine control time can be understood as lens driving unit 34.
Lens driving unit 34 (S106) is controlled according to the control of main control unit 50.
Step S102 to S106 is performed repeatedly while laser scoring operations are performed to substrate 1.It can be surveyed according to distance
The sense period of quantity sensor 22 performs step S102 to S106 repeatedly.
As described above, illustrative embodiments have had been described and illustrated in the accompanying drawings and the description.In order to illustrate the present invention
Some principles and its practical application and select and describe illustrative embodiments so that others skilled in the art's energy
Enough manufactures and the various illustrative embodiments and their various alternative solutions and modification using the present invention.Such as from
And therefore upper description is not it is readily apparent that certain aspects of the invention are limited by the detail of example depicted herein,
Other modifications and application or its equivalent way will be expected by contemplating those skilled in the art.However, consulting specification
After accompanying drawing, many changes, modifications, change and other purposes of the invention and application are to one skilled in the art
It will be apparent.Without departing substantially from all these changes, modifications, change and other purposes and application of the spirit and scope of the present invention
It is considered as being covered by the present invention, the present invention is only defined by the following claims.
Claims (10)
1. a kind of laser scribing device, including：
Line head unit；And
Saddle, substrate is loaded on saddle,
Wherein, line head unit is moved relative to saddle, and
Wherein, line head unit includes
Lens subassembly, it receives cutting laser beam from laser generation device, to change the focus of cutting laser beam, and
Distance measurement sensor component, it includes distance measurement sensor and with cutting laser beam light beam therethrough
By unit, distance measurement sensor includes the Optical Transmit Unit for producing measurement laser beam and the light for receiving measurement laser beam
Receiving unit, the focal length of cutting laser beam is controlled in lens subassembly.
2. laser scribing device according to claim 1, wherein, lens subassembly includes forming the focus of cutting laser beam
Condenser lens and adjustment condenser lens position lens driving unit.
3. laser scribing device according to claim 2, wherein, Optical Transmit Unit is irradiated with the angle of on-right angle to substrate
Measurement laser beam, and light receiving unit reaches the measurement laser beam of substrate with the angular acceptance of on-right angle.
4. laser scribing device according to claim 2, wherein, light beam is connect by unit formation in Optical Transmit Unit with light
Between receipts unit.
5. laser scribing device according to claim 4, wherein, the point for irradiating measurement laser beam to substrate is used in cutting
Before the irradiation position of laser beam.
6. laser scribing device according to claim 5, in addition to：
Main control unit, it receives distance sensing information from distance measurement sensor and controls the driving of lens driving unit.
7. laser scribing device according to claim 6, wherein, main control unit will be sensed by considering to range measurement
The sensing points irradiation cutting of device calculates the driving deadline of lens driving unit with the time of laser beam.
8. laser scribing device according to claim 6, wherein, main control unit is by considering distance measurement sensor
Processing time Ts, the processing time Tm of main control unit and time Td calculate the driving deadline of lens driving unit, when
Between Td be time needed for by practically driving lens driving unit from main control unit output control signal.
9. laser scribing device according to claim 7, wherein, main control unit is by considering distance measurement sensor
Sensing points and cutting limit the relative movement speed between line head unit and substrate with the distance between point of irradiation of laser beam
The higher limit of degree.
10. laser scribing device according to claim 6, wherein, main control unit according to line head unit and substrate it
Between relative moving speed carry out the sense period of setpoint distance measurement sensor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170041521A KR20180111089A (en) | 2017-03-31 | 2017-03-31 | Laser scribing appratus |
| KR10-2017-0041521 | 2017-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107186349A true CN107186349A (en) | 2017-09-22 |
Family
ID=59878976
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710446715.3A Pending CN107186349A (en) | 2017-03-31 | 2017-06-14 | Laser scribing device |
| CN201720947591.2U Expired - Fee Related CN207043571U (en) | 2017-03-31 | 2017-07-31 | Laser scribing device |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720947591.2U Expired - Fee Related CN207043571U (en) | 2017-03-31 | 2017-07-31 | Laser scribing device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20180111089A (en) |
| CN (2) | CN107186349A (en) |
| TW (2) | TWM556643U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113735429A (en) * | 2021-08-24 | 2021-12-03 | 芜湖东旭光电科技有限公司 | Glass scribing and cutting device and cutting method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180111089A (en) * | 2017-03-31 | 2018-10-11 | 주식회사 탑 엔지니어링 | Laser scribing appratus |
| CN109332913A (en) * | 2018-09-29 | 2019-02-15 | 无锡恒领科技有限公司 | A kind of laser scribing means and a kind of method for adjusting height applied to scribing machine |
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| JP2015186825A (en) * | 2014-03-14 | 2015-10-29 | 株式会社東京精密 | Laser dicing device and dicing method |
| CN207043571U (en) * | 2017-03-31 | 2018-02-27 | 塔工程有限公司 | Laser scribing device |
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| JP2011237348A (en) * | 2010-05-12 | 2011-11-24 | Disco Abrasive Syst Ltd | Height position measuring device for workpiece held by chuck table and laser processing apparatus |
| JP2012192415A (en) * | 2011-03-15 | 2012-10-11 | Disco Corp | Laser processing device |
| DE102015115803A1 (en) * | 2015-09-18 | 2017-03-23 | Precitec Gmbh & Co. Kg | Method for guiding a machining head along a track to be processed |
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- 2017-03-31 KR KR1020170041521A patent/KR20180111089A/en not_active Application Discontinuation
- 2017-06-14 CN CN201710446715.3A patent/CN107186349A/en active Pending
- 2017-07-31 CN CN201720947591.2U patent/CN207043571U/en not_active Expired - Fee Related
- 2017-08-03 TW TW106211441U patent/TWM556643U/en not_active IP Right Cessation
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| US5715375A (en) * | 1994-06-23 | 1998-02-03 | Fanuc Ltd. | Robot control system for executing multi-layer welding |
| US20020190230A1 (en) * | 1998-10-21 | 2002-12-19 | Canadian Space Agency | Distance tracking control system for single pass topographical mapping |
| CN1689750A (en) * | 2004-04-27 | 2005-11-02 | 株式会社迪斯科 | Laser beam processing machine |
| CN103459083A (en) * | 2011-04-08 | 2013-12-18 | 三菱电机株式会社 | Laser machining device |
| CN202317434U (en) * | 2011-10-10 | 2012-07-11 | 华中科技大学 | Laser processing automatic focusing adjustment device |
| US20150060421A1 (en) * | 2013-08-30 | 2015-03-05 | Hitachi Information & Telecommunication Engineering, Ltd. | Laser annealing apparatus and laser annealing method |
| JP2015186825A (en) * | 2014-03-14 | 2015-10-29 | 株式会社東京精密 | Laser dicing device and dicing method |
| CN207043571U (en) * | 2017-03-31 | 2018-02-27 | 塔工程有限公司 | Laser scribing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113735429A (en) * | 2021-08-24 | 2021-12-03 | 芜湖东旭光电科技有限公司 | Glass scribing and cutting device and cutting method thereof |
| CN113735429B (en) * | 2021-08-24 | 2023-09-08 | 芜湖东旭光电科技有限公司 | Glass scribing and cutting device and cutting method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180111089A (en) | 2018-10-11 |
| TWI695748B (en) | 2020-06-11 |
| CN207043571U (en) | 2018-02-27 |
| TWM556643U (en) | 2018-03-11 |
| TW201836751A (en) | 2018-10-16 |
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