JP4294451B2 - Semiconductor bonding equipment - Google Patents

Description

  The present invention relates to a semiconductor bonding apparatus, and more particularly to a semiconductor bonding apparatus that bonds a semiconductor chip (hereinafter simply referred to as a chip) and a substrate with a bonding material interposed therebetween.

  In recent years, by adding optical functions, such as lenses and mirrors, to chips or substrates mounted on optical products such as optical communication devices and microscopes, the number of parts used can be reduced, and the size and function of products can be reduced. Development with the goal of making it happen is actively underway. Many of these devices have to be bonded with a predetermined distance between the chip and the substrate in order to effectively exert their optical functions. The spacing accuracy is also required to be higher than the conventional bonding between the chip and the substrate.

  The main requirement for bonding the chip and the substrate is that the mechanical bonding strength is ensured and the electrical continuity is obtained, and the requirement for increasing the accuracy between the chip and the substrate is It was small. Therefore, regarding the bonding of these devices, there are not many bonding machines having a function of controlling the height position of the chip or the substrate, which is a factor determining the distance between the chip and the substrate, with high accuracy.

As a bonding apparatus that actively controls the height position of a chip, there is a semiconductor manufacturing apparatus disclosed in Japanese Unexamined Patent Publication No. 2000-353725. The prior art will be described below with reference to FIG. In this prior art, the height position of the chip 101 is obtained by detecting the height of the tool holder 117 having the tool 102 capable of holding the chip 101 by the height detecting means 123 installed in the holder holding means 115. . Further, by grounding the substrate 105 held by the substrate holding stage 104 and the chip 101 and raising the height of the tool holder 117 by a desired amount from the grounding point, the chip 101 and the substrate 105 have a desired distance. In this way, the height of the chip 101 is positioned. Since the positioning of the chip 101 in the height direction is performed by reflecting the height of the tool holder 117, it is possible to perform the positioning by eliminating the influence of the thermal expansion of the Z-axis feed mechanism. It becomes possible to carry out with the accuracy of μm.
JP 2000-353725 A

  In the above-mentioned Japanese Patent Application Laid-Open No. 2000-353725, the apparatus measures the distance between the holder holding means 115 where the height detecting means 123 is installed and the tool holder 117. As a result, the height of the chip 101 held by the tool provided in the tool holder 117 can be obtained, but the relative distance between the chip 101 and the substrate 105 is not directly obtained.

  Therefore, in Japanese Patent Laid-Open No. 2000-353725, in order to obtain the relative distance between the chip 101 and the substrate 105, the chip 101 and the substrate 105 are grounded before joining the chip 101 and the substrate 105, and a desired amount is obtained therefrom. The tool holder 117 is raised and the height of the chip 101 is positioned so that the chip 101 and the substrate 105 are at a desired distance. However, when the chip 101 is heated by the heater provided in the tool 102, heat is also transmitted to the substrate holding stage 104, so that the height of the substrate holding stage 104 changes due to thermal expansion.

  At the time of heating, the bump 101a interposed between the chip 101 and the substrate 105 is in a molten state and not solid, so that if the height of the substrate holding stage 104 changes, the distance between the chip 101 and the substrate 105 also changes. Problems arise. In addition, when the bump 101a is in a molten state, the change in the height of the substrate holding stage 104 is not transmitted to the tool holder 117. Therefore, the height detection unit 123 that detects the height of the tool holder 117 holds the substrate. A change in the height of the stage 104 cannot be detected. For this reason, it becomes difficult to accurately position the relative distance between the chip 101 and the substrate 105 and bond the chip 101 and the substrate 105 together.

  Further, as described in Japanese Patent Laid-Open No. 2000-353725, when the bump 101a is previously set on the chip 101, the height of the tool holder 117 is set to the height of the bump 101a when the chip 101 and the substrate 105 are grounded. It will be affected by the height. Therefore, in order to accurately control the distance between the chip 101 and the substrate 105, it is necessary to accurately form the height of the bump 101a. However, in order to keep the height of the bump 101a accurately, the bump 101a A leveling process for aligning the height of 101a is required separately.

  The present invention has been made paying attention to such problems, and an object of the present invention is to provide a semiconductor bonding apparatus capable of accurately controlling a distance between a chip and a substrate to a desired value. It is in.

  Another object of the present invention is to provide a semiconductor bonding apparatus that eliminates the need for a leveling step for keeping the height of the bonding material interposed between the chip and the substrate constant.

In order to achieve the above object, a semiconductor bonding apparatus according to a first aspect of the present invention is a semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate for holding the chip. A chip holding member, a substrate holding member for holding the substrate, and a chip holding surface of the chip holding member or a substrate holding surface of the substrate holding member. A sensor for measuring the distance between the surfaces, and a supply pallet for aligning and holding the chip and the substrate ,
The distance between the chip and the substrate is controlled based on the output of the sensor, and the chip and the substrate are set aside from the supply pallet using the chip holding member .

The semiconductor bonding apparatus according to the second aspect of the present invention is a semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate, the chip holding member for holding the chip, and the substrate A substrate holding member for holding the substrate, a length measuring member disposed adjacent to the chip holding member, and the length measuring member or the substrate holding surface of the substrate holding member. A sensor for measuring the distance between the member and the substrate holding surface of the substrate holding member, and a supply pallet for aligning and holding the chip and the substrate, and the distance between the chip and the substrate based on the output of the sensor And the chip and the substrate are set aside from the supply pallet using the chip holding member .

The semiconductor bonding apparatus according to the third aspect of the present invention is a semiconductor bonding apparatus for bonding with a bonding material interposed between the chip and the substrate, the chip holding member for holding the chip, and the substrate A substrate holding member for holding the substrate, an inclined member disposed on the substrate holding member and capable of inclining in a predetermined direction, each disposed on a substrate holding surface of the inclined member, and holding the chip of the chip holding member A plurality of sensors for measuring the distance to the surface, and a supply pallet for aligning and holding the chip and the substrate, and adjusting an inclination angle of the inclined member based on outputs from the plurality of sensors. While controlling the space | interval between the said chip | tip and the said board | substrate, the said chip | tip and the said board | substrate are reserved from the said supply pallet using the said chip | tip holding member .

Further, the semiconductor junction device according to the fourth aspect of the present invention is a semiconductor junction device according to the first to third in any one embodiment, the chip holding surface of the supply pallet, a bonding material said chip comprises A recess corresponding to is provided.

Further, the semiconductor junction device according to a fifth aspect of the present invention is a semiconductor junction device for joining by interposing a bonding material between the chip and the substrate, and the chip holding member for holding the chip, a substrate holding member for holding said substrate, said chip or set of movable sensor and the displacement reference member to be adjusted to move in the thickness direction and becomes the chip and the substrate and the same thickness of the position of the substrate And the movable sensor and the displacement reference member are disposed on the chip holding member and the substrate holding member so as to face each other , and based on the distance between the movable sensor and the displacement reference member, controlling the distance between the between the chip substrate

  ADVANTAGE OF THE INVENTION According to this invention, the semiconductor bonding apparatus which can control the space | interval of a chip | tip and a board | substrate correctly to a desired value is provided.

  Further, there is provided a semiconductor bonding apparatus that eliminates the need for a leveling process for making the height of the bonding material interposed between the chip and the substrate constant.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 is an overall configuration diagram of a semiconductor bonding apparatus according to a first embodiment of the present invention as viewed from the side. FIG. 2 is an overall configuration diagram of the semiconductor bonding apparatus according to the first embodiment of the present invention as viewed from the front.

  In the drawing, an scale 2 is installed on a base 1, and a Z stage 3 movable in the Z direction (vertical direction) is installed on the scale 2. The Z stage 3 includes a guide 4, a ball screw 5, and a motor 6. The rotational motion of the motor 6 is converted into a linear motion by the ball screw 5, and further, the guide 4 can linearly move in the Z direction. ing. Further, a controller 7 is electrically connected to the motor 6 so that the Z stage 3 can be driven to an arbitrary position at an arbitrary speed. On the Z stage 3, a tool 8 capable of holding the chip 11 is supported by a tool guide 9 so as to be slidable in the Z direction, and a pressing mechanism 10 capable of generating an arbitrary thrust in any direction. Can be pressed. A lock mechanism 19 for fixing the tool 8 is provided on the Z stage 3.

  The base 1 is provided with a stage 13 electrically connected to the controller 7, and can be positioned at an arbitrary position in an XY direction at an arbitrary position by the controller 7.

Further, on the stage 13, the substrate 14 can be held by, for example, suction so as to face the chip 11, and is electrically connected to the controller 7 and can be positioned by arbitrary θ rotation. Is provided. Further, a sensor 16a is installed on the substrate holding surface of the substrate holding stage 15, so that the distance to the chip holding surface of the tool 8 can be measured, and the sensor 16a and the controller 7 are electrically connected. The output of the sensor 16a can be taken into the controller 7. On the stage 13, as shown in FIG. 2, there are a substrate supply pallet 17 capable of aligning and holding a desired number of substrates 14 and a chip supply pallet 18 capable of aligning and holding the chips 11. is set up. Similar to the substrate holding stage 15, a sensor 16 b is installed on the chip holding surface of the chip supply pallet 18 so that the distance to the chip holding surface of the tool 8 can be measured.

If necessary, the chip 11 or the substrate 14 may be preliminarily provided with a bonding material 12 such as a solder bump. In this case, as shown in FIG. 2, it is desirable that a recess 29 corresponding to the bonding material 12 provided in the chip 11 is provided in the chip supply pallet 18. Further, if the Z-axis is configured to be movable in the X direction, the stage 13 may be configured to be movable only in the Y-axis.

  Next, the operation of the above-described configuration will be described.

1. The stage 13 is driven in the X and Y directions to position a desired substrate 14 directly below the tool 8 among the plurality of substrates 14 arranged and held on the substrate supply pallet 17.

2. The pressing mechanism 10 is slightly smaller than the weight of the tool 8 and generates a thrust in the direction of pulling up the tool 8 to reduce the weight of the tool.

3. The motor 6 is driven to lower the Z stage 3 to a predetermined position where the tool 8 and the substrate 14 come into contact with each other.

4). After holding the substrate 14 using the tool 8, the motor 6 is driven to retract the Z stage 3 to a predetermined height.

5). The stage 13 is driven in the X and Y directions to position the center of the substrate holding stage 15 directly below the tool 8.

6). The motor 6 is driven to lower the Z stage 3 to a predetermined position where the substrate 14 and the substrate holding stage 15 come into contact. The distance to the tool 8 at this time is measured by the sensor 16 a, and the output value is stored by the controller 7 as the thickness value of the substrate 14. Note that the output of the sensor 16a is corrected in advance so that the substrate holding surface of the substrate holding stage 15 becomes a zero point. The zero point correction of the sensor 16 may be performed every time the substrate 14 is supplied to the substrate holding stage 15 as necessary.

7. After holding the substrate 14 by the substrate holding stage 15, the holding of the substrate 14 by the tool 8 is released.

8). The motor 6 is driven to retract the Z stage 3 to a predetermined height.

9. The stage 13 is driven in the X and Y directions, and the desired chip 11 in the chips 11 arranged and held on the chip supply pallet 18 is positioned directly below the tool 8.

10. The motor 6 is driven to lower the Z stage 3 to a predetermined position where the tool 8 and the chip 11 come into contact. The distance to the tool 8 at this time is measured by the sensor 16 b, and the output value is stored as the thickness value of the chip 11 by the controller 7. It is assumed that the output of the sensor 16b is corrected in advance so that the chip holding surface of the chip supply pallet 18 becomes the zero point.

11. After holding the chip 11 using the tool 8, the motor 6 is driven to position the Z stage 3 at a predetermined height.

12 The stage 13 is driven in the X and Y directions so that a desired relative position can be obtained with respect to the X and Y directions of the substrate 14 held on the substrate holding stage 15 and the chip 11 held on the tool 8. The stage 13 is positioned.

13. Generation of thrust by the pressing mechanism 10 is stopped, and the tool 8 is fixed by the lock mechanism 19.

14 The motor 6 is driven to refer to the thickness value of the chip 11 and the thickness value of the substrate 14 stored in the controller 7 so that the distance between the chip 11 and the substrate 14 becomes a desired value. Position the height.

15. The chip 11 and the substrate 14 are heated by a heater (not shown) provided on at least one of the tool 8 and the substrate holding stage 15. Since the substrate holding stage 15 expands due to the heater heating, the substrate holding surface may rise or tilt. However, since the sensor 16a also moves in the same manner as the substrate holding surface, the displacement due to the movement and inclination of the substrate holding surface is caused. The sensor 16a can measure the length accurately. Similarly, in the tool 8, the chip holding surface may move or tilt due to expansion due to the heating of the heater, but the displacement accompanying the movement and tilt of the chip holding surface can be accurately measured by the sensor 16 a. .

16. With reference to the output of the sensor 16a after heating by the heater, the motor 6 is driven again to position the height of the Z stage 3 so that the distance between the chip 11 and the substrate 14 becomes a desired value. In addition, the said process 14. Heating of the heater may be started before the Z is performed, and then the Z stage 3 may be positioned. In that case, positioning correction after heating is not necessary.

17. After a predetermined heating time has elapsed, heating by the heater is stopped, and the chip 11, the bonding material 12, and the substrate 14 are cooled. If necessary, forced cooling such as air blow may be performed.

18. The holding by the tool 8 and the substrate holding stage 15 is finished, and the motor 6 is driven to retract the Z stage 3 to a predetermined height.

  FIG. 3 shows a schematic configuration of a completed semiconductor device manufactured by the method according to the first embodiment, in which the chip 11 and the substrate 14 are bonded by the bonding material 12.

  In the first embodiment, even if the tool 8 and the substrate holding stage 15 expand or tilt due to the heating of the heater, the sensor 16a also moves together with the substrate holding stage 15. Therefore, the chip holding surface of the tool 8 and the substrate holding stage are accurately detected. The distance between the 15 substrate holding surfaces can be measured. Further, by measuring the thicknesses of the chip 11 and the substrate 14 using the sensor 16a, the “thickness of the chip 11” can be obtained from the “distance between the chip holding surface of the tool 8 and the substrate holding surface of the substrate holding stage 15”. The distance between the chip 11 and the substrate 14 can be accurately obtained by subtracting “the thickness of the substrate 14”. By driving the Z stage 3 with reference to the output values of these sensors 16a, the height of the tool 8 can be positioned so that the distance between the chip 11 and the substrate 14 becomes a desired value accurately. It is possible to manufacture a product in which the distance between the chip 11 and the substrate 14 is exactly a desired value.

  The sensor 16a may be installed on the tool 8. In this case, the sensor 16b provided in the chip supply pallet 18 is not necessary. It is not always necessary to measure the thicknesses of the chip 11 and the substrate 14 in this apparatus, and the controller 7 obtains the thicknesses of the chip 11 and the substrate 14 using another measuring device in advance and inputs them to the controller 7. The thickness of the substrate 14 may be referred to. The ball screw 5 may be another type of feed screw represented by a trapezoidal screw or the like, and is not limited to the ball screw 5. The guide 4 may be a rolling guide mechanism such as a cross roller or a ball guide, or a sliding mechanism using a dovetail groove.

  The motor 6 may be a pulse motor, a servo motor, an ultrasonic motor, or the like.

The Z stage 3 may be driven by a linear motor. In this case, the motor 6 and the ball screw 5 are not necessary.

  The holding method of the chip 11 may be any one of gripping, electrostatic adsorption, adhesion, surface tension, and laser trap, and is not limited to vacuum adsorption.

A heater (not shown) is not necessarily required if, for example, an anaerobic bonding material or an ultraviolet curable bonding material is used.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described in detail with reference to FIG. Here, only the configuration of the part different from the first embodiment will be described. As shown in FIG. 4, a substrate holding stage 15 a that is electrically connected to the controller 7 and can be positioned at an arbitrary θ rotation is installed on the stage 13. Further, on the substrate holding stage 15a, the substrate 14 can be held, for example, by suction so as to face the chip 11, and the α axis (axis with the X axis as the rotation center) and β axis (with the Y axis as the rotation center) can be held. A tilt stage 32 that can tilt on the axis is installed. A plurality of sensors 16 a (here, sensors 16 a 1 to 3) are installed on the substrate holding surface of the tilt stage 32, and the distance to the chip holding surface of the tool 8 can be measured.

  Next, the operation of the above configuration will be described.

1. The stage 13 is driven in the X and Y directions, and the inclined stage 32 is positioned immediately below the tool 8.

2. A desired thrust is applied to the tool 8 by the pressing mechanism 10.

3. The motor 6 is driven to lower the Z stage 3 to a predetermined position where the tool 8 and the tilt stage 32 come into contact.

4). The outputs of the sensors 16a1, 16a2, and 16a3 are taken into the controller 7 and the respective values are compared. When there is a difference in the outputs of the sensors 16a1, 16a2, and 16a3, the tilt stage 32 is driven so that the difference is eliminated.

5). The motor 6 is driven to retract the Z stage 3 to a predetermined height.

6). The following operations are the operations described in the first embodiment. -Action 13. It is the same.

7. The motor 6 is driven to refer to the thickness value of the chip 11 and the thickness value of the substrate 14 stored in the controller 7 so that the distance between the chip 11 and the substrate 14 becomes a desired value. Position the height. When the output values of the sensors 16a1 to 3 are different, the average value may be used for positioning, but the present invention is not limited to this, and the output of a specific sensor (for example, 16a1), the maximum value or the minimum value is used. May be positioned.

8). The chip 11 and the substrate 14 are heated by a heater (not shown) provided on at least one of the tool 8 and the inclined stage 32. Although the substrate holding surface of the tilt stage 32 may be deformed and tilted due to thermal expansion due to the heater heating, the sensors 16a1 to 16a1 to 3 move in the same manner as the substrate holding surface. The sensors 16a1 to 3 can accurately measure the length. Similarly, in the tool 8, the chip holding surface may be inclined due to expansion due to the heating of the heater, but the displacement accompanying the movement and inclination of the chip holding surface can be accurately measured by the sensors 16 a 1 to 3. .

9. When there is a difference with reference to the output of the sensors 16a1 to 3 after heating by the heater, the tilt stage 32 is driven so as to eliminate the output difference of the sensors 16a1 to 3 and the substrate holding surface is inclined, and at the same time, the chip 11 The motor 6 is driven to position the height of the Z stage 3 so that the distance between the substrate 14 and the substrate 14 becomes a desired value. The above process 8. Heating of the heater may be started before the Z is performed, and then the Z stage 3 may be positioned.

10. The following actions are the actions described in the first embodiment 17. It is the same as ~.

  In the second embodiment, even if the tool 8 and the tilting stage 32 are tilted due to the deformation due to heating by the heater, the sensors 16a1 to 16a1-3 move in the same manner. It becomes possible to measure the distance between the holding surfaces. By driving the tilt stage 32 and adjusting the tilt of the tilt stage 32 so that there is no output difference between the sensors 16a1 to 16, the chip holding surface of the tool 8 and the substrate holding surface of the tilt stage 32 can be made parallel. It becomes possible. Therefore, the chip 11 or the substrate 14 is not joined in a tilted state, and it is possible to provide a product in which the distance between the chip 11 and the substrate 14 is more accurate than in the first embodiment.

  In the second embodiment, the number of sensors 16a installed is three. However, the number of sensors 16a installed is not limited thereto, and may be a plurality.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described in detail with reference to FIG. Here, only the configuration of the part different from the first embodiment will be described.

  On the upper side of the tool 8, a length measuring plate 41 is provided integrally with the tool 8. The tool 8 is made of, for example, a ceramic heater, and the length measuring plate 41 is made of, for example, a magnetic metal such as mechanical structural steel, aluminum alloy, or stainless steel. Further, the sensor 16a is constituted by a length measuring sensor such as an eddy current method in which a non-measurement object is limited to a magnetic material.

  Next, the operation of the above configuration will be described.

1. The sensor 16 a measures the distance to the length measuring plate 41 and stores the output value as the thickness values of the substrate 14 and the chip 11 by the controller 7.

2. The motor 6 is driven to refer to the thickness value of the chip 11 and the thickness value of the substrate 14 stored in the controller 7 so that the distance between the chip 11 and the substrate 14 becomes a desired value. Position the height.

3. When the chip 11 and the substrate 14 are heated by a heater (not shown) provided on at least one of the tool 8 or the substrate holding stage 15, the substrate holding stage 15 is also overheated and expands, so that the substrate holding surface rises or tilts. However, since the sensor 16a moves in the same manner as the substrate holding surface, the displacement due to the movement and inclination of the substrate holding surface can be accurately measured by the sensor 16a.

In the third embodiment, using a non-magnetic material such as a ceramic heater in a heater (not shown) is provided to the tool 8, in yet sensor 16a, for example so that the measuring Jobutsu such eddy current sensors are limited to the magnetic Even when a length measuring sensor is used, the distance between the chip 11 and the substrate 14 can be accurately obtained. By using the ceramic heater, it becomes possible to heat the chip 11 at a higher temperature and more rapidly. Therefore, the kind of the bonding material 12 interposed between the chip 11 and the substrate 14 and the degree of freedom of the bonding method are increased. Compared with the embodiment, the present bonding method can be applied to a wider variety of chips 11 and substrates 14.

(Fourth embodiment)
Hereinafter, a fourth embodiment of the present invention will be described in detail with reference to FIGS. 6 (a) to 8 (b). Here, only the configuration of the part different from the first embodiment will be described. In FIG. 6A, the substrate holding stage 15b is provided with at least one displacement reference member 52 that can be moved and fixed at an arbitrary position in the vertical direction. Further, the tool 8 a is provided with a movable sensor 55 that can be moved and fixed at an arbitrary position in the vertical direction at a position facing the displacement reference member 52.

  Next, the operation of the above configuration will be described.

1. As shown in FIG. 6A, in the same manner as in the first embodiment, the tool 8a holds the substrate 14 aligned on the substrate supply pallet 17 (not shown) on the substrate holding stage 15b, for example, by suction. To a predetermined position.

2. The tool 8a is moved by driving the Z stage 3 (not shown) in the arrow direction (downward direction) shown in FIG. 6A, and the substrate 14 and the substrate holding stage 15b are grounded. If necessary, the pressing mechanism 10 (FIG. 1) may cancel the weight of the tool 8a so that no pressing force is applied to the substrate 14.

3. As shown in FIG. 6B, the displacement reference member 52 is moved in the arrow (upward) direction, and positioned and fixed so that the tip of the displacement reference member 52 abuts against the substrate holding surface of the tool 8a. If necessary, the displacement reference member 52 may be abutted and fixed while the tool 8 is fixed using the lock mechanism 19 (FIG. 1). FIG. 6C shows a state where the displacement reference member 52 has been fixed.

4). After the holding of the substrate 14 by the tool 8a is finished, as shown in FIG. 6D, the Z stage 3 (FIG. 1) is driven to retract the tool 8a in the arrow (upward) direction. As a result, the upper surfaces of the substrate 14 and the displacement reference member 52 are aligned.

5). As shown in FIG. 7A, the stage 13 (FIG. 1) is driven to move the chip supply pallet 20a directly below the tool 8a, and then the Z stage 3 (FIG. 1) is driven to drive the tool. Lower 8a.

6). The tool 8a is lowered to a predetermined position, and the tool 8a and the chip 11 are grounded. If necessary, the pressing mechanism 10 (FIG. 1) may cancel the weight of the tool 8a so that no pressing force is applied to the substrate 14.

7. As shown in FIG. 7B, the movable sensor 55 is moved in the direction of the arrow (downward), and positioned and fixed so that the tip of the movable sensor 55 abuts against the chip holding surface of the chip supply pallet 20a. If necessary, the movable sensor 55 may be abutted and fixed while the tool 8 is fixed using the lock mechanism 19 (FIG. 1). FIG. 7C shows a state in which the movable sensor 55 has been fixed.

8). After the holding of the chip 11 by the tool 8a is finished, as shown in FIG. 8A, the Z stage 3 (FIG. 1) is driven to retract the tool 8a upward. As a result, the tip of the chip 11 and the movable sensor 55 are aligned on the same plane.

9. By moving the stage 13 (FIG. 1), the chip 11 held by the substrate 14 and the tool 8a is positioned (FIG. 8B).

10. Similarly to the first embodiment, the tool 8a is positioned in the height direction by driving the Z stage 3 (FIG. 1) based on the output value of the movable sensor 55. In the present embodiment, the output of the movable sensor 55 is obtained by measuring the distance between the movable sensor 55 and the displacement reference member 52. Since the movable sensor 55 and the lower surface of the chip 11 are adjusted to be the same surface, and the displacement reference member 52 and the upper surface of the substrate 14 are adjusted to be the same surface, the output value of the movable sensor 55 is adjusted. Can be the distance between the chip 11 and the substrate 14 as it is. Therefore, by positioning the tool 8a based on the output value of the movable sensor 55, the distance between the chip 11 and the substrate 14 can be accurately positioned.

  In this embodiment, it is possible to accurately position the distance between the chip 11 and the substrate 14 without having to store and calculate the thickness data of the chip 11 and the substrate 14 by the controller 7 as compared with the first embodiment. become. Therefore, it is possible to provide a device that reduces the burden on the controller 7.

  It should be noted that the displacement reference member 52 and the movable sensor 55 only need to be configured as one set, and the tool 8a may be provided with the displacement reference member 52, and the substrate holding stage 15b may be provided with the movable sensor 55. Further, the number of installations is not limited to one set, and a plurality of installations may be installed.

  In addition, the sensor used in each of the above embodiments is preferably a non-contact type sensor such as an eddy current sensor, a capacitance type sensor, or a laser sensor sensor, but may be realized by a contact type sensor.

(Appendix)
Inventions having the following configurations can be extracted from the specific embodiments described above.

1. A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
A sensor that is disposed on either the chip holding surface of the chip holding member or the substrate holding surface of the substrate holding member, and that measures the distance between the chip holding surface and the substrate holding surface;
Comprising
A semiconductor bonding apparatus characterized in that an interval between the chip and the substrate is controlled based on an output of the sensor.

2. Comprising a supply pallet for aligning and holding the chip and the substrate;
2. The semiconductor bonding apparatus according to 1, wherein the chip and the substrate are left from the supply pallet using the chip holding member.

3. 3. The semiconductor bonding apparatus according to 2, wherein a recess corresponding to a bonding material included in the chip is provided on a chip holding surface of the supply pallet.

(Corresponding Embodiment of the Invention)
The embodiment relating to the present invention corresponds to at least the first embodiment.

The word “chip” in the above configuration corresponds to the chip 11. The “substrate” corresponds to the substrate 14. The “joining material” corresponds to the joining material 12. The “chip holding member” corresponds to the tool 8. The “substrate holding member” corresponds to the substrate holding stage 15. The “sensor” corresponds to the sensor 16a and the sensor 16b. The “supply pallet” corresponds to the substrate supply pallet 17 and the chip supply pallet 18. The “concave portion” corresponds to the concave portion 29 .

(Function and effect)
According to the above configurations 1 to 3, it is possible to obtain the distance between the chip holding surface of the chip holding member and the substrate holding surface of the substrate holding member by providing the sensor on the chip holding member or the substrate holding member. Further, by holding the chip or the substrate by the chip holding member, the thickness of the chip and the substrate can be obtained by the sensor. Based on these values, by driving the chip holding member in the height direction, it is possible to position the chip holding member so that the distance between the chip and the substrate becomes a desired value accurately. Even if the chip holding member or the substrate holding member is displaced due to thermal displacement or the like, the sensor moves together with the chip holding member or the substrate holding member. Therefore, the sensor holds the chip holding surface of the chip holding member and the substrate holding member accurately. It is possible to measure the distance between surfaces. Therefore, it is possible to provide a semiconductor bonding apparatus capable of bonding the chip and the substrate by accurately controlling the distance between the chip and the substrate to a desired value.

  In the configuration of 2, there is an effect that the substrate thickness can be measured particularly accurately. In addition, the configuration of 3 has an effect that interference can be particularly prevented.

4). A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
An inclined member disposed on the substrate holding member and capable of inclining in a predetermined direction;
A plurality of sensors each disposed on a substrate holding surface of the inclined member and measuring a distance to the chip holding surface of the chip holding member;
Comprising
A semiconductor bonding apparatus, wherein an interval between the chip and the substrate is controlled by adjusting an inclination angle of the inclined member based on outputs from the plurality of sensors.

(Corresponding Embodiment of the Invention)
The embodiment relating to the present invention corresponds to at least the second embodiment.

  The term “sensor” in the above configuration corresponds to the sensor 16a1, the sensor 16a2, and the sensor 16a3. The “substrate holding member” corresponds to the substrate holding stage 15a. The “tilting member” corresponds to the tilting stage 32.

(Function and effect)
According to the configuration of 4 above, by providing a plurality of sensors on the inclined member, the distance to the chip holding surface of the chip holding member is measured at a plurality of measurement points, and the output of each sensor is compared and calculated. It is possible to detect the inclination of the inclined member with respect to the chip holding surface of the holding member. Even if the tilting member is tilted due to the influence of thermal displacement, the chip holding surface of the chip holding member and the substrate holding surface of the tilting member are made parallel by calculating the output of each sensor and adjusting the tilt angle of the tilting member. It becomes possible to adjust. Therefore, the chip or the substrate is not joined in an inclined state, and it is possible to provide a semiconductor joining apparatus capable of joining the chip and the substrate more accurately as compared with the first embodiment.

5. A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
A length measuring member disposed adjacent to the chip holding member;
A sensor that is disposed on either one of the length measuring member or the substrate holding surface of the substrate holding member and measures the distance between the length measuring member and the substrate holding surface of the substrate holding member;
Comprising
A semiconductor bonding apparatus characterized in that an interval between the chip and the substrate is controlled based on an output of the sensor.

(Corresponding Embodiment of the Invention)
The embodiment relating to the present invention corresponds to at least the third embodiment.

  The word “chip” in the above configuration corresponds to the chip 11. The “substrate” corresponds to the substrate 14. The “joining material” corresponds to the joining material 12. The “tool” corresponds to the tool 8. The “substrate holding member” corresponds to the substrate holding stage 15a. The “length measuring member” corresponds to the length measuring plate 41. The “sensor” corresponds to the sensor 16a.

(Function and effect)
By providing the length measuring member adjacent to the chip holding member, the sensor measures the distance to the length measuring member, so that the distance between the chip holding surface of the chip holding member and the substrate holding surface of the substrate holding stage can be obtained. It becomes possible. It is also possible to determine the thickness of the chip and the substrate. By providing a length measuring member, even if a non-magnetic material is used for a heater (not shown) provided in the chip holding member and a length measuring sensor whose measured object is limited to a magnetic material is used for the sensor, It is possible to determine the distance of the substrate. Therefore, for example, a ceramic heater can be used as a heater (not shown), so that the chip can be heated to a higher temperature and more rapidly, and compared with the first embodiment, the chip is interposed between the chip and the substrate. It is possible to provide a semiconductor bonding apparatus having a high degree of freedom in the type of bonding material to be used and the bonding method.

6). A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip,
A substrate holding member for holding said substrate,
Anda movable sensor and deflection reference member set of which is adjusted to a position at which the tip or moves in the thickness direction of the substrate and the chip and the substrate and the same thickness of,
The movable sensor and the displacement reference member are disposed on the chip holding member and the substrate holding member so as to face each other, and based on the distance between the movable sensor and the displacement reference member, the chip and the substrate A semiconductor bonding apparatus characterized by controlling a distance.

(Corresponding Embodiment of the Invention)
The embodiment relating to the present invention corresponds to at least the fourth embodiment. The term “chip holding member” in the above configuration corresponds to the tool 8a. The “substrate holding member” corresponds to the substrate holding stage 15b. The “movable sensor” corresponds to the movable sensor 55. The “displacement reference member” corresponds to the displacement reference member 52.

(Function and effect)
The displacement reference member is applied and fixed to the chip holding surface of the chip holding member, and the movable sensor is applied to the substrate holding surface of the substrate holding member and fixed. Since the substrate and the tip of the displacement reference member and the tip of the chip and the movable sensor are arranged on the same plane, the output value of the movable sensor can be the distance between the chip and the substrate as it is. Therefore, by positioning the chip holding member based on the output value of the movable sensor, it is possible to position the distance between the chip and the substrate, and the thickness of the chip and the substrate as compared with the first embodiment. It is possible to provide a semiconductor bonding apparatus that reduces the burden on the controller without having to store and calculate data by the controller.

7). A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A member arranged on the side holding the chip;
A substrate holding member for holding the substrate;
A sensor that is disposed on either the member or the substrate holding surface of the substrate holding member and that measures the distance between the member and the substrate holding surface of the substrate holding member;
Comprising
A semiconductor bonding apparatus characterized in that an interval between the chip and the substrate is controlled based on an output of the sensor.

(Corresponding Embodiment of the Invention)
The embodiment relating to the present invention corresponds to at least one of the first to fourth embodiments.

  The word “chip” in the above configuration corresponds to the chip 11. The “substrate” corresponds to the substrate 14. The “joining material” corresponds to the joining material 12. The “member arranged on the side holding the chip” corresponds to the tool 8 or the length measuring plate 41. The “substrate holding member” corresponds to the substrate holding stage 15. The “sensor” corresponds to the sensor 16a and the sensor 16b.

(Function and effect)
When the tool 8 is used, the function 1 is the same, and when the length measuring plate 41 is used, the function 5 is the same.

It is the whole block diagram which looked at the semiconductor junction device concerning a 1st embodiment of the present invention from the side. It is the whole block diagram which looked at the semiconductor junction device concerning a 1st embodiment of the present invention from the front. 1 shows a schematic configuration of a semiconductor device in a completed state manufactured by a method according to a first embodiment. It is a figure for demonstrating 2nd Embodiment of this invention. It is a figure for demonstrating 3rd Embodiment of this invention. It is FIG. (1) for demonstrating 4th Embodiment of this invention. It is FIG. (2) for demonstrating 4th Embodiment of this invention. It is FIG. (3) for demonstrating 4th Embodiment of this invention. It is a figure for demonstrating a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Scale, 3 ... Z stage, 4 ... Guide, 5 ... Ball screw, 6 ... Motor, 7 ... Controller, 8 ... Tool, 9 ... Tool guide, 10 ... Pressing mechanism, 11 ... Tip, 12 ... Joining Material: 13 ... Stage, 14 ... Substrate, 15 ... Substrate holding stage, 16a, 16a1-3, 16b ... Sensor, 19 ... Lock mechanism.

Claims (5)

A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
A sensor that is disposed on either the chip holding surface of the chip holding member or the substrate holding surface of the substrate holding member, and that measures the distance between the chip holding surface and the substrate holding surface;
A supply pallet for aligning and holding the chip and the substrate ,
A semiconductor bonding apparatus , wherein the distance between the chip and the substrate is controlled based on the output of the sensor, and the chip and the substrate are set aside from the supply pallet using the chip holding member . A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
A length measuring member disposed adjacent to the chip holding member;
A sensor that is disposed on either one of the length measuring member or the substrate holding surface of the substrate holding member and measures the distance between the length measuring member and the substrate holding surface of the substrate holding member;
A supply pallet for aligning and holding the chip and the substrate ,
A semiconductor bonding apparatus , wherein the distance between the chip and the substrate is controlled based on the output of the sensor, and the chip and the substrate are set aside from the supply pallet using the chip holding member . A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip;
A substrate holding member for holding the substrate;
An inclined member disposed on the substrate holding member and capable of inclining in a predetermined direction;
A plurality of sensors each disposed on a substrate holding surface of the inclined member and measuring a distance to the chip holding surface of the chip holding member;
A supply pallet for aligning and holding the chip and the substrate ,
The gap between the chip and the substrate is controlled by adjusting the tilt angle of the tilt member based on the outputs from the plurality of sensors, and the chip and the substrate are supplied to the supply pallet using the chip holding member. A semiconductor bonding apparatus characterized by being left behind . Wherein the chip holding surface of the supply pallet, a semiconductor junction device according to any one of claims 1 to 3, characterized in that recesses corresponding to the bonding material in which the chip is provided is provided. A semiconductor bonding apparatus for bonding with a bonding material interposed between a chip and a substrate,
A chip holding member for holding the chip,
A substrate holding member for holding said substrate,
A set of movable sensors and a displacement reference member that move in the thickness direction of the chip or the substrate and are adjusted to a position corresponding to the same thickness as the chip and the substrate ;
The movable sensor and the displacement reference member are disposed on the chip holding member and the substrate holding member so as to face each other, and based on the distance between the movable sensor and the displacement reference member, the chip and the substrate A semiconductor bonding apparatus characterized by controlling a distance.

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