CN107179177B

CN107179177B - Optical detection device of light-emitting diode

Info

Publication number: CN107179177B
Application number: CN201610136208.5A
Authority: CN
Inventors: 赵堂钟; 尤家鸿; 曾培翔; 陈达享
Original assignee: Epistar Corp
Current assignee: Epistar Corp
Priority date: 2016-03-10
Filing date: 2016-03-10
Publication date: 2022-04-01
Anticipated expiration: 2036-03-10
Also published as: CN107179177A

Abstract

The invention provides an optical detection device of a light emitting diode, which is used for detecting the light emitting diode and comprises: a carrier, comprising: the bearing table is used for bearing the light emitting diode to be detected and is provided with a first surface and a second surface opposite to the first surface; a supporting body connected to the bearing platform and having a convex part protruding on the first surface of the bearing platform, so that the supporting body and the bearing platform are jointly surrounded to form a recess; a first vacuum hole disposed on the support body and communicated with the recess; a light receiver, which is arranged towards the bearing platform; and a wavelength conversion component arranged on the bearing platform or the light receiver.

Description

Optical detection device of light-emitting diode

Technical Field

The present invention relates to an optical detection device for a light emitting diode, and more particularly to a detection device for detecting the light emitting intensity of a light emitting diode.

Background

The structure of the light emitting diode includes three types, i.e., horizontal type, vertical type and flip chip type. In the horizontal light emitting diode, two electrodes are disposed on the light emitting layer, so that the light emitting layer is shielded by the electrodes to reduce the area of the light emitting source, thereby reducing the light emitting efficiency. Similarly, one of the electrodes of the vertical light emitting diode is covered on the light emitting layer, which also reduces the light emitting efficiency. In contrast, the two electrodes and the light-emitting layer of the flip-chip light-emitting diode are disposed on two opposite surfaces of the substrate, i.e., the light-emitting layer is not affected by the electrodes, so that the flip-chip light-emitting diode has the best light-emitting efficiency among the three structures. Meanwhile, the flip chip type light emitting diode has smaller heat fading and is quite suitable for the light emitting diode lighting assembly.

Generally, a light emitting diode die is practically applied after passing a test, in a test process of the light emitting diode, a wafer carrying the light emitting diode is spread and then loaded on a carrier of a detection device, then a probe is contacted with an electrode and current is supplied to make the light emitting diode emit light, then a light receiver (such as an integrating sphere or a solar cell) is used for detecting light emitting characteristics, and the probe is used for detecting the electrical property of the light emitting diode.

Referring to fig. 1A, an optical inspection apparatus 100 of a conventional led is shown. The conventional led inspection apparatus 100 includes a carrier 110, a light receiver 120 and a light detector 130. The carrier 110 includes a carrier (chuck)140 and a support (holder)150 supporting the carrier 140, wherein the support 150 has a vacuum hole 155 on its surface. An expanding film 180 (e.g., blue film or white film) is used to attach the plurality of leds 170 to be tested on the surface thereof, and the plurality of leds 170 to be tested on the surface of the expanding film 180 can be separated from each other by a predetermined distance through the die-expanding step, and a clamping inner ring 160A and a clamping outer ring 160B clamp the expanding film 180 and are fixed outside the supporting body 150. An air-extracting device (not shown) is connected to the vacuum holes 155 to extract air between the carrier and the expansion film 180, so that the expansion film 180 is attached to the surface of the susceptor 140. During testing, the two point detectors 190 are respectively connected to the positive electrode 175A and the negative electrode 175B on the surface of the light emitting diode 170 and light the light emitting diode 170, so that the light emitted by the light emitting diode 170 under test is emitted from the light receiving end 125 of the light receiver 120, and then the light collected by the light receiver 120 is transmitted to the light detector 130 connected to the light receiver 120 for optical detection.

Referring to fig. 1B, when the conventional optical inspection apparatus 100 for led is used to draw air from the vacuum holes 155, the expansion film 180 on the vacuum holes 155 is quickly attached to the vacuum holes 155 due to being close to the vacuum holes 155, and directly blocks the vacuum holes 155, so that the air between the carrier 140 and the expansion film 180 cannot be smoothly discharged, and the expansion film 180 cannot be smoothly attached to the surface of the carrier 140, and therefore, when the spot detector 190 inspects each led 170, the distance between the upper and lower needles must be extended to reduce the probability of the led 170 being scratched by the spot detector 190 when the carrier 110 moves, and the inspection speed is reduced. In addition, the failure of the expansion film 180 to be smoothly attached to the surface of the carrier 140 may cause the point detector 190 to slide during the needle insertion, or the led 170 may be easily displaced or rotated to cause unstable electrical characteristics during the measurement.

Accordingly, the present invention discloses an optical inspection apparatus for light emitting diodes, so as to improve the above-mentioned disadvantages of the conventional optical inspection apparatus for light emitting diodes.

Disclosure of Invention

One feature of the present invention is to provide an optical inspection apparatus for inspecting a light emitting diode, comprising: a carrier, comprising: the bearing table is used for bearing the light emitting diode to be detected and is provided with a first surface and a second surface opposite to the first surface; a supporting body connected to the bearing platform and having a convex part protruding on the first surface of the bearing platform, so that the supporting body and the bearing platform are jointly surrounded to form a recess; a first vacuum hole disposed on the support body and communicated with the recess; a light receiver, which is arranged towards the bearing platform; and the wavelength conversion assembly is arranged on the bearing platform or the light receiver.

According to an embodiment of the present invention, the first vacuum hole is disposed on the convex portion of the support body.

According to an embodiment of the present invention, the protrusion is provided with a side surface surrounding the recess, and the first vacuum hole is provided in the side surface.

According to an embodiment of the present invention, the protrusion is provided with an upper surface protruding from the carrier and away from the first surface, wherein the protrusion further comprises a second vacuum hole disposed on the upper surface of the protrusion.

According to an embodiment of the present invention, the supporting body includes a main body and an extending portion, the protruding portion is disposed on the main body, the extending portion connects the main body and the supporting stage, and the first vacuum hole is disposed on the extending portion.

According to an embodiment of the present invention, a gap is formed between the body and the susceptor, and the gap is in communication with the cavity.

According to an embodiment of the present invention, the support body surrounds the susceptor.

According to an embodiment of the invention, the first vacuum hole is arranged around the support body.

According to an embodiment of the present invention, the number of the first vacuum holes is several, and two adjacent first vacuum holes are separated by a partition wall.

According to an embodiment of the present invention, the carrier is transparent, and the light receiver is disposed toward the second surface of the carrier.

The present invention provides an optical inspection device for LED, which is used to inspect LED, and comprises a carrying platform for carrying LED, wherein the transmittance of partial or whole area of the carrying platform is adjustable; a point detector which is arranged towards the bearing table and is used for detecting the electrical property of the light-emitting diode; a light receiver facing the bearing table for collecting the light emitted by the light emitting diode; and the wavelength conversion component is used for converting the wavelength of the light emitted by the light emitting diode.

The invention is characterized in that the invention provides an optical detection method of a light-emitting diode, which comprises the steps of providing a bearing table; placing a plurality of light emitting diodes on the bearing table; positioning the plurality of light emitting diodes; changing the transmittance of the carrier to divide the carrier into a first region and a second region, wherein the first region covers at least one of the plurality of light emitting diodes, and the first region has a transmittance higher than that of the second region; providing a wavelength conversion component to convert the wavelength of the light emitted by the plurality of light emitting diodes; and measuring the light emission characteristics of at least one of the plurality of light emitting diodes disposed in the first region.

Drawings

Fig. 1A to 1B are schematic cross-sectional views illustrating an optical inspection apparatus for a conventional led.

Fig. 2A is a schematic diagram illustrating an led optical inspection device according to an embodiment of the invention.

Fig. 2B, 2D and 2E are schematic cross-sectional views of a carrier of an led optical inspection apparatus according to an embodiment of the invention.

Fig. 2C is a top view of a carrier of an led optical inspection apparatus according to an embodiment of the invention.

Fig. 3A-3B are schematic cross-sectional views of a carrier of an led optical inspection apparatus according to a second embodiment of the invention.

Fig. 4A to 4B are schematic cross-sectional views of a carrier of an led optical inspection apparatus according to a third embodiment of the invention.

Fig. 5A-5B are schematic diagrams illustrating a carrier stage of an led optical inspection apparatus according to a fourth embodiment of the invention.

Fig. 6A to 6B are schematic diagrams illustrating a carrier stage of an led optical inspection apparatus according to a fifth embodiment of the invention.

Fig. 7A to 7C are schematic diagrams illustrating a carrier stage of an led optical inspection apparatus according to a sixth embodiment of the invention.

Fig. 8A to 8C are schematic cross-sectional views illustrating seventh and eighth led optical inspection devices according to embodiments of the invention.

Fig. 9 is a schematic cross-sectional view illustrating an led optical inspection device according to a ninth embodiment of the invention.

[ notation ] to show

100 conventional LED optical detection device

200. 800, 800' LED optical detection device

110. 210, 310, 410 carrier

120. 220, 720, 820 light receiver

125. 225, 725, 825 light receiving end

130. 230, 730, 830 light detector

140. 240, 340, 440, 540, 640, 740 carrier table

150. 250, 350, 450 support

155 vacuum hole

160A clamping inner ring

160B grip outer ring

170. 270, 370, 470, 570, 670, 770 light emitting diodes

175A, 275A, 375A, 475A, 575A, 675A, 775A positive electrode

175B, 275B, 375B, 475B, 575B, 675B, 775B negative electrode

180. 280, 380, 480, 580, 680, 780 dilatation membrane

190. 290, 390, 490, 590, 690, 790 spot tester

240a, 340a, 440a, 540a, 640a, 740a first surface

240b, 340b, 440b, 540b, 640b, 740b second surface

250a, 350a, 450a side surface

350b, 450b upper surface

251. 351, 451 convex part

255. 355A first vacuum hole

256 partition walls

355B second vacuum hole

260. 360, 460 pockets

262A, 362A, 462A clamp the inner ring

262B, 362B, 462B clamp the outer ring

271 light emitting surface

452 body

453 extension part

454 gap

455C third vacuum hole

541. 641 and 741 first region

542. 642, 742 second region

671 first light emitting diode

672 second light emitting diode

673 third LED

781 reflecting cavity

783 reflecting layer

784 light guide assembly

784a light collecting end

826 light-emitting end

850 wavelength conversion assembly

850A first wavelength conversion element

850B second wavelength converter

850C third wavelength converter

850D fourth wavelength converter

850E fifth wavelength conversion element

850F sixth wavelength conversion member

d1 walkway

Detailed Description

The manner in which embodiments of the invention are made and used will now be described in detail. It should be noted, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific forms. Although specific embodiments of LED devices are discussed herein as examples, it should be understood that they are merely illustrative of specific ways to make and use the invention, and that the scope of the invention is not limited thereto, and that any semiconductor device with similar structure may be used.

The first embodiment is as follows:

the following describes an led optical inspection apparatus according to an embodiment of the invention with reference to the cross-sectional views shown in fig. 2A to 2E.

Referring to fig. 2A, an optical inspection apparatus 200 for led according to a first embodiment of the present invention is shown, in which the optical inspection apparatus 200 includes a carrier 210 and a light receiver 220, and preferably further includes a light detector 230 and a point detector 290. The carrier 210 includes a carrier 240 and a holder 250 for supporting the carrier 240, the carrier 240 is used for supporting the led 270 to be tested, the holder 250 is provided with a first vacuum hole 255, and the light detector 230 and the point detector 290 are disposed toward the carrier 240.

Referring to fig. 2B and fig. 2C, fig. 2B is a cross-sectional view of the carrier 210 in the led optical inspection device of the present embodiment, and fig. 2C is a top view of the carrier 210 in the led optical inspection device of the present embodiment, wherein fig. 2B is a cross-sectional view taken along a section line B-B' of fig. 2C.

Referring to fig. 2B, the carrier 240 has a first surface 240a and a second surface 240B, the first surface 240a is opposite to the second surface 240B, and the first surface 240a is used for carrying the led 270 to be tested. The material of the carrier 240 may be transparent or opaque, and the carrier 240 in this embodiment is transparent, so that light can pass through the carrier 240, thereby detecting the light emitting characteristics of the flip chip led. The susceptor 240 of the present embodiment is made of transparent quartz, and in other embodiments of the present invention, the material of the susceptor 240 may also be transparent acryl or glass. The supporting body 250 surrounds the carrier 240 and has a protrusion 251, wherein the protrusion 251 protrudes from the first surface 240a of the carrier 240, such that the protrusion 251 of the supporting body 250 and the first surface 240a of the carrier 240 define a cavity 260. The protrusion 251 has a side surface 250a, the side surface 250a faces and surrounds the cavity 260, the first vacuum hole 255 is connected to the cavity 260, and the first vacuum hole 255 of the present embodiment is disposed on the side surface 250 a.

Referring to fig. 2C, the optical inspection apparatus of the light emitting diode of the present embodiment includes a plurality of first vacuum holes 255, and two adjacent first vacuum holes 255 are separated by a partition wall 256, the plurality of first vacuum holes 255 are arranged and annularly disposed on the supporting body 250, each first vacuum hole 255 may be a circle and have a hole diameter of, for example, about 2 mm; in other embodiments of the present invention, the first vacuum hole 255 comprises a rectangular air hole with a width of about 2mm, and the rectangular air hole is disposed around the supporting body 250.

Fig. 2D and 2E are schematic diagrams illustrating an led optical inspection apparatus according to an embodiment of the invention. The light emitting diodes 270 to be detected are attached to the expanding film 280, and the expanding film 280 is fixed to the support 250 by the clamping inner ring 262A and the clamping outer ring 262B. The material of the expanding film 280 used in this embodiment is a blue film, and in an embodiment according to the present invention, the material of the expanding film 280 may be a white film, a photoresist film (UV release tape), or polyethylene terephthalate (PET). In addition, in order to increase the light receiving angle of the light emitting diode 270 during measurement, the light emitting diodes 270 to be detected on the surface of the expanding film 280 may be separated from each other by a predetermined distance through a wafer expanding step, and then fixed between the inner clamping ring 262A and the outer clamping ring 262B, and then the inner clamping ring 262A and the outer clamping ring 262B are placed on the carrier 210. An air extractor (not shown) connected to the first vacuum holes 255 is used to extract air from the first vacuum holes 255 of the support 250, so that air between the carrier 240 and the expansion film 280 is extracted, and the expansion film 280 covering the plurality of leds 270 to be detected is flatly attached to the surface of the carrier 240 due to negative pressure, as shown in fig. 2E.

Referring to fig. 2A, when the optical inspection apparatus 200 is used to perform the optical inspection of the leds, the light receiver 220 is disposed facing the first surface 240a or the second surface 240B of the carrier 240, and the light detector 290 is used to sequentially apply current to the positive electrode 275A and the negative electrode 275B of the surface of each led 270, so as to sequentially light each led die 270, and make the light emitted by the led 270 under inspection enter the light receiver 220 through the light receiving end 225, and finally transmit the light collected by the light receiver 220 to the light detector 230 connected to the light receiver 220 for subsequent optical inspection, where the light detector 230 may be a spectrometer, and the light detector 290 may be two probes, and is respectively connected to the positive electrode 275A and the negative electrode 275B of the led 270 during inspection. When the led is a flip-chip led, the light receiving end 225 of the light receiver 230 is disposed toward the second surface 240a, and the carrier 240 is transparent, so that light emitted from the flip-chip led downwardly penetrates the carrier 240 to reach the light receiver 220 under the carrier 240 for detection, and when the led 270 is a horizontal or vertical led, the light receiver 220 can face the first surface 240a or the second surface 240b of the carrier 240 to receive light in a proper direction.

Example two:

a cross-sectional view of a carrier suitable for an led optical inspection apparatus according to a second embodiment of the invention will be described with reference to fig. 3A and 3B.

First, referring to fig. 3A, another carrier 310 suitable for an optical inspection apparatus of a light emitting diode according to a second embodiment of the invention is shown. The carrier 310 is substantially similar to the carrier 210 of the first embodiment, and includes a supporting platform 340 and a supporting body 350 for supporting the supporting platform 340. The carrier 340 has a first surface 340a and a second surface 340b, the first surface 340a is opposite to the second surface 340b, and the first surface 340a is used for carrying the led to be tested. The material of the susceptor 340 may be transparent or opaque, the material of the susceptor 340 in this embodiment is made of transparent quartz, and in other embodiments according to the present invention, the material of the susceptor 340 may also be transparent acryl or glass.

The supporting body 350 surrounds the susceptor 340 and has a protrusion 351, the protrusion 351 protrudes from the first surface 340a of the susceptor 340, such that the protrusion 351 of the supporting body 350 and the first surface 340a of the susceptor 340 define a cavity 360 together, the protrusion 351 has a lateral surface 350a, the lateral surface 350a faces and surrounds the cavity 360, and the first vacuum hole 255 is disposed on the lateral surface 350a and faces the cavity 360 and communicates with the cavity 360. The protrusion 351 of the embodiment further includes an upper surface 350B, the upper surface 350B is a surface protruding from the susceptor 340 and away from the first surface 340a, and the upper surface 350B is connected to the side surface 350a, the support 350 of the embodiment is further provided with a second vacuum hole 355B besides the first vacuum hole 355A disposed on the side surface 350a of the protrusion 351, and the second vacuum hole 355B is disposed on the upper surface 350B of the protrusion 351. In one embodiment, the support 350 is provided with a plurality of first vacuum holes 355A and/or a plurality of second vacuum holes 355B, and the first vacuum holes 355A and/or the second vacuum holes 355B have a hole size of about 2mm, while in other embodiments according to the present invention, two adjacent first vacuum holes 355A and/or two adjacent second vacuum holes 355B have a partition wall (not shown) therebetween, and the plurality of first vacuum holes 355A and/or second vacuum holes 355B surround the cavity 360.

Referring to fig. 3B, when the led optical inspection apparatus according to an embodiment of the invention is used for inspection, an expanding film 380 having a surface including a plurality of leds 370 to be inspected is provided and fixed between the inner clamping ring 362A and the outer clamping ring 362B, and then the inner clamping ring 362A and the outer clamping ring 362B are placed on the carrier 310, and the inner clamping ring 362A and the outer clamping ring 362B surround the support 350. The second vacuum holes 355B formed in the supporting member 350 can improve the absorption rate and uniformity of the expanded film 380 having a plurality of leds 370 to be tested absorbed onto the supporting stage 340 by negative pressure. In addition, in order to increase the light receiving angle of the led 370 during measurement, the led 370 for multiple detections on the surface of the expanding film 380 may be separated by a predetermined distance through the wafer expanding process, and then fixed between the inner clamping ring 362A and the outer clamping ring 362B, and then the inner clamping ring 362A and the outer clamping ring 362B are placed on the carrier 310 for subsequent optical measurement.

Next, an air extractor (not shown) connected to the support 350 is used to extract air from the first vacuum hole 355A and the second vacuum hole 355B of the support 350, so that the air between the carrier 340 and the expanded film 380 is extracted, and the expanded film 380 covering the leds 370 to be detected is uniformly adsorbed on the first surface 340a of the carrier 340 by negative pressure, and then the lighting device 390 is connected to the positive and

negative electrodes

375A and 375B on the surface of each led 370 one by one, so as to sequentially light each led 370, and allow the light emitted by the led 370 under detection to pass through the carrier 340 downward, and then enter the light receiver (not shown) located below the carrier 310 and the light detector (not shown) connected to the light receiver as in the first embodiment, so as to perform subsequent optical detection.

Example three:

a cross-sectional view of a carrier suitable for an led optical inspection apparatus according to a third embodiment of the present invention will be described with reference to fig. 4A to 4B.

Referring to fig. 4A, another carrier 410 suitable for use in an led optical inspection apparatus according to a third embodiment of the invention is shown. The carrier 410 is substantially similar to the carrier 210 of the first embodiment, and includes a carrier 440 and a supporting body 450 supporting the carrier 440, the carrier 440 has a first surface 440a and a second surface 440b, the first surface 440a is opposite to the second surface 440b, and the first surface 440a is used for carrying the led to be tested. The material of the susceptor 440 may be transparent or opaque, the material of the susceptor 440 in this embodiment is made of transparent quartz, and in other embodiments according to the present invention, the material of the susceptor 440 may also be transparent acryl or glass.

The supporting body 450 surrounds the susceptor 440 and has a protrusion 451, the protrusion 451 protrudes from the first surface 440a of the susceptor 440, such that the protrusion 451 of the supporting body 450 and the first surface 440a of the susceptor 440 define a cavity 460, and a third vacuum hole 455C is disposed on the supporting body 450. In detail, the supporting body 450 has a main body 452 and an extending portion 453, the protrusion 451 is disposed on the main body 452, the extending portion 453 is connected to the main body 452 and extends toward the carrying platform 440, the main body 452 is connected to the carrying platform 440 via the extending portion 453, the main body 452 and the carrying platform 440 are separated by a gap 454, the gap 454 is communicated with the cavity 460, wherein a third vacuum hole 455C is disposed on the extending portion 453 and is communicated with the cavity 460.

In addition, the carrier 410 of the present embodiment has a plurality of third vacuum holes 455C, a partition wall (not shown) is disposed between two adjacent third vacuum holes 455C, the plurality of third vacuum holes 455C are annularly disposed on the outer periphery of the carrier 440, and the diameter of the third vacuum holes 455C is about 2 mm; in other embodiments according to the present invention, the carrier 410 is provided with only one third vacuum hole 455C, and the third vacuum hole 455C is disposed around the outer periphery of the susceptor 440, and the third vacuum hole 355C is slit-shaped with a width of about 2 mm.

Referring to fig. 4B, when the led optical inspection apparatus according to an embodiment of the invention is used for inspection, an expansion film 480 having a plurality of leds 470 to be inspected is provided and fixed between the inner clamping ring 462A and the outer clamping ring 462B, the inner clamping ring 462A and the outer clamping ring 462B are placed on the carrier 410, and the inner clamping ring 462A and the outer clamping ring 462B surround the support (holder) 450. In addition, in order to increase the light receiving angle of the light emitting diode 470 during measurement, the light emitting diodes 470 to be detected on the surface of the expanding film 480 are fixed between the inner clamping ring 462A and the outer clamping ring 462B after being spaced apart from each other by a predetermined distance through the wafer expanding process, and then are placed on the carrier 410 for subsequent optical measurement.

Then, an air extractor (not shown) connected to the support 450 is used to extract air from the third vacuum hole 455C, so that the air between the carrier 440 and the expanding film 480 is extracted, and the expanding film 480 covering the plurality of leds 470 to be detected is uniformly adsorbed on the surface of the carrier 440 by negative pressure, and then the spot detector 490 is connected to the positive and

negative electrodes

475A and 475B on the surface of each led 470 one by one, so as to illuminate each led 470, and the light emitted by the led 470 passes through the carrier 440 downward, and then enters the light receiver (not shown) located below the carrier 410 and the light detector (not shown) connected to the light receiver as described in the first embodiment, so as to perform subsequent optical detection.

Example four:

fig. 5A to 5B are schematic diagrams of a carrier of an led optical inspection apparatus according to a fourth embodiment of the present invention.

First, referring to fig. 5A, which is a top view of the carrier 540 according to the fourth embodiment of the present invention when the led 570 to be detected is measured, the carrier 540 may be applied to the

carriers

210, 310, 410 of the led optical detection apparatus according to the first to third embodiments, and replace the corresponding

carriers

240, 340, 440. The carrier 540 comprises a material capable of controlling light transmittance, so that the transmittance of a part or all of the carrier 540 can be adjusted, for example, when measuring the led 570 to be detected, the carrier 540 comprises a first region 541 and a second region 542 surrounding the first region 541. The transmittance of the first region 541 and/or the second region 542 is modulated by a physical quantity, and the carrier 540 of the embodiment has the second region 542 surrounding the first region 541. In detail, when measuring the leds 570 on the side to be tested, a plurality of leds 570 to be tested are correspondingly located in the first region 541 of the platform 540. The material of the supporting platform 540 may include liquid crystal, electrochromic material or liquid metal, the physical quantity for changing the transmittance of the supporting platform 540 may be electricity or heat, in this embodiment, the adjacent leds 570 to be detected are separated by a channel d1, and the material of the supporting platform 570 includes liquid crystal.

Referring to fig. 5B, it is a perspective view of the carrier 540 with an expansion film 580 including a plurality of leds 570 to be tested and spaced apart from each other attached to the surface of the carrier shown in fig. 5A. As described in the above embodiment, in order to increase the light receiving angle of the light emitting diodes 570 during measurement, the light emitting diodes 570 to be detected on the surface of the expanding film 580 are separated from each other by the path d1 through the crystal expanding process, and then the subsequent optical detection is performed.

The surface of the carrier 540 of this embodiment is attached with an expansion film 580 including a plurality of leds 570 to be detected arranged at intervals, and each of the leds 570 has a positive electrode 575A and a negative electrode 575B. After the expanding film 580 is attached to the first surface 540a of the carrier 540, the position of the led 570 to be detected is first located, so as to facilitate the subsequent division of the carrier 540 into the first region 541 and the second region 542; then, the transmittance of the carrier 540 is changed to make the first region 541 have a transmittance different from that of the second region 542, and the first region 541 covers a plurality of leds 570 and a channel d 1; and measuring the light emitting characteristics of the leds 570 disposed in the first region 541.

The optical inspection method of the led in this embodiment is to scan the image of the carrying platform 540 on which the led 570 is placed to position the led 570 to be inspected on the expansion film 580, and then to control the arrangement direction of the liquid crystal molecules in the carrying platform 540, so that the carrying platform 540 under the first region 541 covering the leds 570 to be inspected and the walkways d1 is converted into a light-transmitting region, and the arrangement direction of the remaining liquid crystal molecules in the second region 542 not covering the leds 570 is not changed, thereby forming the second region 542 with different light transmittance from the first region 541. In this embodiment, the light transmittance of the first region 541 is higher than that of the second region 542. Then, the point detector 590 disposed toward the carrying platform 540 sequentially contacts the positive electrode 575A and the negative electrode 575B of each led 570 for detection, and the light emitted by the led 570 to be detected penetrates the first region 541, and then enters the light receiver (not shown) disposed below the first region and the light detector (not shown) connected to the light receiver for subsequent optical detection, as described in the first embodiment. When detecting the led die 570 located at the periphery, the detection error caused by the reflection of the adjacent other leds 570 can be compensated by the reflected light of the second region 542 located at the periphery of the first region 541, so that each led 570 to be detected on the expanding film 580 has the same or close detection environment, thereby avoiding the measurement error caused by the different positions of the leds 570 when measuring the light emitting characteristics of the leds 570. In other embodiments according to the present invention, the material capable of controlling the light transmittance may also be electrochromic material or liquid metal.

Example five:

fig. 6A to 6B are schematic diagrams of a carrier of an led optical inspection apparatus according to a fifth embodiment of the present invention.

First, referring to fig. 6A, which is a top view of the fifth embodiment of the present invention when the carrier 640 is used to measure the led 670 to be tested, the carrier 640 can be applied to the

carriers

210, 310, 410 of the led optical inspection apparatus in the first to third embodiments, and replace the corresponding

carriers

240, 340, 440. The susceptor 640 of the present embodiment is similar to the susceptor 540 of the fourth embodiment, and the susceptor 640 includes a material capable of controlling light transmittance, so that the transmittance of a partial or whole area of the material can be adjusted, for example, when measuring the led 670 to be detected, the susceptor 640 includes a first area 641 and a second area 642, so that when measuring the led 670 to be detected, the transmittance of the first area 641 or/and the second area 642 can be adjusted by a physical quantity. The material of the carrier 640 may include liquid crystal, electrochromic material or liquid metal, wherein the physical quantity for changing the transmittance of the carrier 640 may be electricity or heat. However, the present embodiment is different from the fourth embodiment in that: during the detection, the first region 641 of the platform 640 only covers a single led 670 to be detected, i.e. only one led 670 to be detected is correspondingly located in the first region 641, such as the leftmost led 670 in fig. 6A.

Referring to fig. 6B, a perspective view of the carrier 640 shown in fig. 6A with an expansion film comprising a plurality of leds 670 to be tested and arranged at intervals attached to the surface thereof is shown. The method for performing optical measurement through the susceptor 640 according to the fifth embodiment includes: placing a plurality of light emitting diodes 670 on the carrier 640; positioning the led 670; changing the transmittance of the carrier 640 to divide the carrier 640 into a first region 641 and a second region 642, wherein the first region 641 only covers one led 670 to be detected, and the first region 641 is a transmissive region and has a transmittance higher than that of the second region 642; and measuring the light emitting characteristics of the led 670 disposed in the first region 641. The platform 640 of the fifth embodiment includes a liquid crystal material, and changes the transmittance of the first region 641 and/or the second region 642 by applying a voltage.

In the optical detection method of the light emitting diode of the present embodiment, after the images of the carrying stage 640 on which the light emitting diodes 670 are placed are scanned to position the light emitting diodes 670 to be detected on the expansion film 680, the carrying stage 640 under the region covering one light emitting diode 670 to be detected is converted into the light-transmitting region by controlling the arrangement direction of the liquid crystal molecules in the carrying stage 640, and the arrangement direction of the liquid crystal molecules in the remaining regions not covering the light emitting diodes 670 is not changed, so that the second region 642 with different light transmittance from the first region 641 is formed. In this embodiment, the light transmittance of the first region 641 is higher than that of the second region 642. When the point detector 690 contacts the anode and

cathode

675A and 675B of each led 670 for detection, the light emitted from the led 670 to be detected penetrates the first region 641, and then enters the light receiver (not shown) and the photodetector (not shown) connected thereto for subsequent optical detection, as described in the embodiment. When detecting the led die 670 located at the periphery, the detection error caused by the light reflection of the adjacent other led dies 670 can be compensated by the reflected light of the second region 642 located at the periphery of the first region 641, so that each led die 670 located on the expanding film 680 to be detected has the same or close detection environment, thereby avoiding the measurement error caused by the different positions of the led dies 670 when measuring the light emitting characteristics of the led dies 670.

The method of measuring the optical characteristics of the led 670 by using the carrier 640 of this embodiment is similar to that of the fourth embodiment, and the main difference is that the position of the first area 641 of the carrier 640 of this embodiment is changed according to the positions of the leds 670 of different measurement targets. In detail, the carrier 640 has a plurality of leds 670, such as a first led 671, a second led 672, and a third led 673 shown in fig. 6A, the method for measuring the optical characteristics of the leds of the present embodiment measures the first, second, and

third leds

671, 672, 673 respectively, for example, when measuring the optical characteristics of the first led 671, the position of the first region 641 of the carrier 640 is adjusted to make the first region 641 corresponding to the first led 671 and the second region 642 corresponding to the remaining leds, so that the carrier 641 under the first led 671 to be detected is a transparent region to avoid the unexpected influence of the reflection of the adjacent other leds 670 (such as 672, 673) on the measurement of the optical characteristics of the first led 671, thereby further improving the measurement accuracy. Similarly, when the second led 672 and the third led 673 are to be measured, the position of the first region 641 of the carrying stage 640 is adjusted to make the first region 641 correspondingly located on the second led 672 or the third led 673, and the second region 642 correspondingly located on the remaining leds 670, so that the measured surroundings of the leds 670 have the same or close detection environment.

Example six:

fig. 7A to 7C are schematic diagrams of a carrier of an led optical inspection apparatus according to a sixth embodiment of the present invention.

First, referring to fig. 7A, which is a top view of a carrier 740 according to a sixth embodiment of the present invention when measuring a led 770 to be detected, the carrier 740 can be applied to the

carriers

240, 340, 440. The carrier 740 of this embodiment is similar to the

carrier

540 or 640 of the fourth or fifth embodiment, the carrier 740 includes a material capable of controlling light transmittance, so that the transmittance of a partial or whole region thereof can be adjusted, when measuring the led 770 to be detected, the transmittance of the first region 741 or/and the second region 742 can be adjusted by a physical quantity, the material of the carrier 740 can include liquid crystal, electrochromic material or liquid metal, and the physical quantity for changing the transmittance of the carrier 740 can be electricity or heat.

Referring to fig. 7B, it is a perspective side view of the carrier 740 shown in fig. 7A having an expanding film 780 comprising a plurality of leds 770 to be detected and spaced apart from each other. Referring to fig. 7C, the carrier 740 of the present embodiment is similar to the fourth or fifth embodiments, but the carrier 740 of the present embodiment further includes a reflective layer 783, and collects light emitted by the leds 770 through a light guide assembly 784 and sends the collected light to the light receiver 720. In detail, the carrier 740 includes a first surface 740a and a second surface 740b opposite to the first surface 740a, the first surface 740a is used for carrying the leds 770 to be detected, the reflective layer 783 is disposed on the second surface 740b, a reflective cavity 781 is disposed between the reflective layer 783 and the second surface 740b, the light guide 784 has a light collecting end 784a, and the light collecting end 784a is combined with the reflective cavity 781 of the carrier tray 740. The reflective layer 783 is made of a material having a high reflectance, and the material having a high reflectance selected in this embodiment is barium sulfate. In addition, the reflective layer 783 may also be made of silver, aluminum, or the like, or may have a bragg reflector (DBR) structure, or the like, in other embodiments according to the present invention. The method for performing optical measurement through the carrier 740 of the sixth embodiment includes: placing a plurality of LEDs 770 on the carrier 740; positioning the position of the light emitting diode 770; changing the transmittance of the carrier 740 to divide the carrier 740 into a first region 741 and a second region 742, wherein the first region 741 covers one or more leds 770, and the first region 741 is a transmittance region and has a transmittance higher than that of the second region 742; and measuring the light emitting characteristics of the leds 770 disposed in the first region 741. The platform 740 of the embodiment includes a liquid crystal material, and changes the transmittance of the first region 741 and/or the second region 742 by applying a voltage.

In the optical detection method of the led of the present embodiment, after the positions of the leds 770 to be detected on the expansion film 780 are determined by scanning the image of the carrier 740 on which the leds 770 are placed, the carrier 740 covering one or more areas of the leds 770 to be detected is converted into a first light-transmitting area 741 by controlling the arrangement direction of the liquid crystal molecules in the carrier 740, and the remaining liquid crystal molecules not covering the leds 770 do not change the arrangement direction, so as to form the second light-transmitting area 742 having a different light transmittance from the first light-transmitting area 741. In this embodiment, the transmittance of the first region 741 is higher than that of the second region 742. Referring to fig. 7C, when the spot detector 790 sequentially contacts the positive and

negative electrodes

775A, 775B of each led 770 for detection, the light emitted by the led 770 to be detected passes through the first region 741 and enters the reflective cavity 781, and the light is effectively reflected by the reflective cavity 781 and the reflective layer 783, so that the light is guided to the light collecting end 784a of the light guide assembly 784 to be collected and sent to the light receiver 720, and then the light detector 730 is used for subsequent optical detection. When detecting the led dies 770 located at the edge, the environmental difference caused by the reflection of the adjacent other led dies 770 can be compensated by the reflection of the second region 742 located around the first region 741, so that each led die 770 located on the expanding film 780 to be detected has the same or close detection environment, thereby avoiding the measurement error caused by the different positions of the led dies 770 when measuring the light emitting characteristics of the led dies 770.

Examples seven, eight:

fig. 8A to 8C are schematic diagrams illustrating an led optical inspection apparatus according to seventh and eighth embodiments of the present invention.

Fig. 8A shows an led optical inspection apparatus 800 according to a seventh embodiment of the present invention, which includes a carrier 210, a light receiver 820 and a light detector 830. The carrier 210 includes a carrier 240, the carrier 240 has a first surface 240a and a second surface 240b opposite to the first surface 240a, and the first surface 240a is used for carrying a light emitting surface 271 of the led 270 to be detected; the light receiver 820 has a light receiving end 825 and a light emitting end 826, and the light receiving end 825 is disposed toward the second surface 240b of the carrier 240 to collect light emitted from the led 270, and transmit the light to the light detector 830 through the light emitting end 826; the light detector 830 is coupled to the light receiver 820 to detect the light collected by the light receiver 820. The led optical inspection apparatus 800 further includes a wavelength converter 850, wherein the wavelength converter 850 is disposed between the light emitting surface 271 of the led 270 to be inspected and the light emitting end 826 of the light receiver 820. The wavelength conversion device 850 of the present embodiment is disposed between the light receiving end 825 of the light receiver 820 and the second surface 840b of the supporting platform 840, and preferably, the wavelength conversion device 850 is detachably connected to the light receiving end 825 of the light receiver 820.

Referring to fig. 8B, which is a schematic view of an led optical inspection apparatus according to an eighth embodiment of the present invention, an led optical inspection apparatus 800' according to the eighth embodiment of the present invention is substantially the same as the led optical inspection apparatus 800 according to the seventh embodiment of the present invention, and includes a carrier 210, a light receiver 820, a light detector 830 and a wavelength converter 850, with the difference that the wavelength converter 850 according to the eighth embodiment of the present invention is disposed at a light emitting end 826 of the light receiver 820, and preferably, the wavelength converter 850 is detachably coupled to the light emitting end 826 of the light receiver 820.

The wavelength converter 850 converts the light emitted from the light emitting diode 270 with a first wavelength (e.g., blue light) into light with a second wavelength (e.g., yellow, red, or green light) by passing through the wavelength converter 850, and the light with the first and second wavelengths is mixed to form white light. The optical detection devices 800, 800' of the light emitting diode with the wavelength conversion assembly 850 can simulate the light emitting characteristics of the light emitting diode package body formed by adding fluorescent powder and colloid to the light emitting diode 270, and measure and evaluate whether the light emitting characteristics meet the specification after packaging in advance before packaging so as to achieve the effects of improving the customer satisfaction degree, reducing the customer complaint rate and the like.

In the seventh and eighth embodiments, the wavelength conversion assembly 850 includes a phosphor film, and the wavelength conversion assembly 850 may be designed into a detachable form of a sheet or a plate as required, so that the light of the first wavelength emitted by the light emitting diode 270 can obtain the light of the second wavelength after passing through the different wavelength conversion assemblies 850. In addition, in one embodiment, the wavelength conversion assembly 850 includes a first wavelength conversion element 850A having a first emission wavelength and a second wavelength conversion element 850B having a second emission wavelength, the first wavelength conversion element 850A and the second wavelength conversion element 850B can be excited by the light emitted from the light emitting diode 270, and the first emission wavelength is different from the second emission wavelength. Specifically, the wavelength conversion element 850 may also be a turntable structure as shown in fig. 8C, the wavelength conversion element 850 includes a plurality of first, second, third, fourth, fifth and sixth

wavelength conversion elements

850A, 850B, 850C, 850D, 850E and 850F having different emission wavelengths, and the wavelength conversion element 850 is rotatably and selectively aligned with the light receiving end 825 or the light emitting end 826 of the light receiver 820, so that the wavelength conversion element 850 can be excited by the light emitted by the light emitting diode 270 to generate the light having the second wavelength.

The led 270 of the present embodiment is unpackaged, such as an led chip or a die, and the light-emitting characteristics of the led 270 after being packed are simulated in advance by passing through the wavelength conversion device 850. The wavelength conversion assembly 850 shown in fig. 8C includes a plurality of first wavelength converters 850A, second wavelength converters 850B, third wavelength converters 850C, etc. with different emission wavelengths, and when the light emitting diode 270 is to be simulated to have the light emitting characteristics of the package conditions of different wavelength converters, it is only necessary to align the

corresponding wavelength converters

850A, 850B, 850C, etc. at the light emitting end 825 or the light receiving end 826, and it is not necessary to disassemble and replace the wavelength converters, so as to improve the testing efficiency.

In addition, although the carrier 210 shown in the first embodiment is exemplified in the seventh and eighth embodiments, the carrier 210 may be replaced by the carriers disclosed in the second to sixth embodiments of the present invention, and details thereof are not described herein again.

Example nine:

a schematic diagram of an led optical inspection apparatus according to a ninth embodiment of the invention will be described with reference to fig. 9.

The structure of the led optical detection apparatus 800 ″ of the ninth embodiment is substantially the same as that of the led optical detection apparatuses 800, 800' of the seventh and eighth embodiments, and the main difference is that the wavelength conversion element 850 of the led optical detection apparatus 800 ″ of the present embodiment is disposed on the carrier 240, and the wavelength conversion element 850 can be combined with the first surface 240a or the second surface 240b of the carrier 240, for example, when the wavelength conversion element 850 is combined with the first surface 240a, the light (e.g., blue light) with the first wavelength emitted from the light emitting surface 271 of the led 270 is partially converted into light (e.g., yellow light, red light, or green light) with the second wavelength by the wavelength conversion element 850, and then the light receiver 820 can collect light (e.g., white light) mixed with the light with the first and second wavelengths after passing through the carrier 240, and then further analyzed by photodetector 830. The susceptor 240 of the present embodiment has high transmittance for the light with the first wavelength and the light with the second wavelength.

The wavelength conversion device 850 includes a phosphor film as described in the seventh and eighth embodiments, and the wavelength conversion device 850 may also optionally include a plurality of wavelength converters (850A to 850F) as shown in fig. 8C; the carrier 210 may be replaced by the carriers disclosed in the second to sixth embodiments of the present invention, and will not be described herein.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims

1. An optical inspection apparatus for inspecting a light emitting diode, comprising:

a carrier, comprising:

a carrier having a first surface, a second surface opposite to the first surface, and a first side surface, wherein the transmittance of a part or all of the carrier is adjustable;

the supporting body is connected with the bearing table and provided with a body, a convex part and an extending part, wherein the body covers the first side surface, the convex part extends from the body and protrudes out of the first surface of the bearing table, and the extending part extends from the body and covers part of the second surface; and

a first vacuum hole provided in the support body;

the light receiver is arranged towards the bearing table and comprises a light receiving end and a light emitting end; and

the wavelength conversion component is arranged between the light emitting surface of the light emitting diode and the light emitting end of the light receiver.

2. The optical inspection device of claim 1, wherein the first vacuum hole is disposed on the convex portion of the support.

3. The optical inspection device of claim 1, wherein the protrusion has a second side surface facing the first side surface, and the first vacuum hole is disposed on the second side surface.

4. The optical inspection device of claim 3, wherein the protrusion further comprises an upper surface away from the first surface, and the carrier further comprises a second vacuum hole; wherein, the second vacuum hole is arranged on the upper surface of the convex part.

5. The optical inspection device of claim 1, wherein the first vacuum hole is disposed in the extension portion.

6. The optical inspection device of claim 1, wherein a gap is formed between the main body and the supporting platform.

7. The optical inspection device of claim 1, wherein the wavelength conversion assembly is disposed on the first surface or the second surface of the carrier.

8. The optical inspection device of claim 1, wherein the light receiver further comprises a light receiving end and a light emitting end, and the wavelength conversion device is disposed at the light receiving end or the light emitting end.

9. The apparatus according to claim 1, wherein the wavelength conversion element is configured to convert a portion of the light emitted by the light emitting diode with a first wavelength into a second wavelength, and the first wavelength is different from the second wavelength.

10. The apparatus for optical inspection according to claim 9, wherein the wavelength conversion assembly has a rotating disk structure and comprises a first wavelength conversion member and a second wavelength conversion member, wherein the first wavelength conversion member converts the first wavelength into a third wavelength, the second wavelength conversion member converts the first wavelength into a fourth wavelength, and the third wavelength is different from the fourth wavelength.

11. An optical inspection apparatus for inspecting a light emitting diode, comprising:

a carrying platform for carrying the LED, wherein the transmittance of a part or the whole area of the carrying platform is adjustable;

the point detector is arranged towards the bearing table;

the light receiver is arranged towards the bearing table to collect light rays emitted by the light emitting diode and comprises a light receiving end and a light emitting end; and

the wavelength conversion component is arranged between the light emitting surface of the light emitting diode and the light emitting end of the light receiver and used for converting the wavelength of light emitted by the light emitting diode.

12. The apparatus of claim 11, wherein the stage comprises a first region and a second region, and the transmittance of the first region and/or the second region is modulated by physical quantity.

13. The optical inspection device of claim 12, wherein the first region has a higher transmittance than the second region, and the second region surrounds the first region.

14. The apparatus of claim 11, wherein the light emitting diode emits light having a first wavelength, the wavelength conversion element converts a portion of the first wavelength to a second wavelength, and the first wavelength is different from the second wavelength.

15. The optical inspection device of claim 11, wherein the light emitted from the light emitting diode is converted and mixed into white light.

16. The apparatus of claim 11, wherein the platform has a first surface, a second surface opposite to the first surface, and a reflective layer, the first surface is used for supporting the led, the reflective layer is disposed on the second surface, and a reflective cavity is disposed between the reflective layer and the second surface of the platform.

17. The optical inspection device of claim 11, wherein the wavelength conversion member comprises a phosphor film.

18. An optical inspection method for a light emitting diode, based on the optical inspection apparatus for a light emitting diode according to any one of claims 1 to 17, the method comprising:

providing a carrying table, wherein the carrying table comprises a material which can be controlled to modulate the light transmittance;

placing a plurality of light emitting diodes on the bearing table;

positioning the plurality of light emitting diodes;

changing the transmittance of the carrier to divide the carrier into a first region and a second region, wherein the first region covers at least one of the plurality of light emitting diodes, and the transmittance of the first region is higher than that of the second region;

providing a wavelength conversion component to convert the wavelength of the light emitted by the plurality of light emitting diodes; and

measuring the light emission characteristics of at least one of the plurality of light emitting diodes disposed in the first region.

19. The method of claim 18, wherein the positioning of the plurality of LEDs is performed by scanning an image of the stage on which the plurality of LEDs are placed.

20. The method of claim 18, wherein the wavelength conversion assembly comprises a plurality of wavelength conversion elements and a rotating disk structure, the method further comprising rotating the rotating disk structure to select the desired wavelength conversion element.