CN107167685B - The electrical testing method and system of face-down bonding - Google Patents
The electrical testing method and system of face-down bonding Download PDFInfo
- Publication number
- CN107167685B CN107167685B CN201710504024.4A CN201710504024A CN107167685B CN 107167685 B CN107167685 B CN 107167685B CN 201710504024 A CN201710504024 A CN 201710504024A CN 107167685 B CN107167685 B CN 107167685B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- test circuit
- test
- soldered ball
- metallic pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of electrical testing method of face-down bonding and systems.The test method includes: to provide the first test circuit board, the first metallic pattern of a plurality of electric isolations each other is provided on the first test circuit board, second test circuit board is provided, the second metallic pattern of a plurality of electric isolations each other is provided on the second test circuit board, multiple metal soldered balls along setting route interval distribution are set, are provided mainly by a probe, test power supply, electric current and/or voltage test device and the test module of another probe formation in sequential series；Then conducting shape and short-circuit test are carried out respectively.Test method provided by the invention is simple to operation, at low cost, easy to use, and chip is enough normally to be connected to, and can effectively find existing short circuit problem after can testing Flip Chip Bond Technique, can targetedly improve technique and improve the quality of flip chip bonding.
Description
Technical field
The present invention is more particularly directed to a kind of electrical testing method of face-down bonding and systems, belong to semiconductors manufacture and measurement skill
Art field.
Background technique
Upside-down mounting interconnection technique is widely used in semiconductor fabrication process.This technology can be realized between two kinds of chips
Hybrid connections, solder joint density is high, and good reliability is widely used in focus planar detector array (FPA), LED light source array,
The connection of the corresponding reading circuit of the photoelectric chips such as spatial light modulator array or driving circuit.But photoelectric chip is past
Past expensive, the Diameter of Solder Ball in Flip Chip Bond Technique is generally at 20 μm or so, and directly test is not only with high costs, but also tests
Difficulty is also very high.
Summary of the invention
The main purpose of the present invention is to provide a kind of electrical testing method of face-down bonding and systems, to overcome existing skill
The deficiency of art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes:
The embodiment of the invention provides a kind of electrical testing methods of face-down bonding, comprising:
First test circuit board is provided, is provided with the first of a plurality of electric isolations each other on the first test circuit board
Metallic pattern,
Second test circuit board is provided, is provided with the second of a plurality of electric isolations each other on the second test circuit board
Metallic pattern,
N number of metal soldered ball along setting route interval distribution is set, N is positive integer,
It provides mainly by a probe, test power supply, electric current and/or voltage test device and the formation in sequential series of another probe
Test module；
And N number of metal soldered ball is alternately electrically connected through a plurality of first metallic patterns, a plurality of second metallic patterns
Connect, so that N number of metal soldered ball be connected to form a series circuit, and by two probes respectively with the series circuit
Both ends be electrically connected to form a test circuit, then observe test circuit whether normally；
Alternatively, by N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and make any one gold
Belonging to soldered ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, then two probes are divided
Be not electrically connected to form a test circuit with the 1st metal soldered ball, n-th metal soldered ball, then observe test circuit it is whether short-circuit.
The embodiment of the invention also provides a kind of electrical testing systems of face-down bonding, comprising:
First test circuit board, the first metallic pattern with a plurality of electric isolations each other,
Second test circuit board, the second metallic pattern with a plurality of electric isolations each other,
Along N number of metal soldered ball of setting route interval distribution, N is positive integer,
Mainly by a probe, test power supply, electric current and/or voltage test device and the survey of another probe formation in sequential series
Die trial block；
When carrying out conduction test, which is alternately electrically connected through the first metallic pattern, the second metallic pattern
And a series circuit is formed, and two probes are electrically connected to form one with the initial and end Duan Duan of the series circuit respectively
Test circuit；
When carrying out short-circuit test, N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and
Any one metal soldered ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, and described two
Probe is electrically connected to form a test circuit with the 1st metal soldered ball, n-th metal soldered ball respectively.
Compared with prior art, the invention has the advantages that test method provided by the invention is simple to operation, cost
Low, easy to use, chip is enough normally to be connected to, and can effectively find that existing short circuit is asked after can testing Flip Chip Bond Technique
Topic can targetedly improve technique and improve the quality of flip chip bonding.
Detailed description of the invention
Fig. 1 is the graphic structure schematic diagram that conduction test designs in the embodiment of the present invention 1；
Fig. 2 is the partial enlargement structural representation that conduction test designs in the embodiment of the present invention 1；
Fig. 3 is the detailed structure schematic diagram of conduction test design configuration in the embodiment of the present invention 1；
Fig. 4 is the graphic structure schematic diagram that short-circuit test designs in the embodiment of the present invention 2；
Fig. 5 is that the conduction and short circuit of the first test circuit board and/or the second test circuit version in the embodiment of the present invention are surveyed
Attempt shape distribution schematic diagram.
Specific embodiment
In view of deficiency in the prior art, inventor is studied for a long period of time and is largely practiced, and is able to propose of the invention
Technical solution.The technical solution, its implementation process and principle etc. will be further explained as follows.
On the one hand the embodiment of the present invention provides a kind of electrical testing method of face-down bonding, comprising:
First test circuit board is provided, is provided with the first of a plurality of electric isolations each other on the first test circuit board
Metallic pattern,
Second test circuit board is provided, is provided with the second of a plurality of electric isolations each other on the second test circuit board
Metallic pattern,
N number of metal soldered ball along setting route interval distribution is set, N is positive integer,
It provides mainly by a probe, test power supply, electric current and/or voltage test device and the formation in sequential series of another probe
Test module；
And N number of metal soldered ball is alternately electrically connected through a plurality of first metallic patterns, a plurality of second metallic patterns
Connect, so that N number of metal soldered ball be connected to form a series circuit, and by two probes respectively with the series circuit
Both ends be electrically connected to form a test circuit, then observe test circuit whether normally；
Alternatively, by N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and make any one gold
Belonging to soldered ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, then two probes are divided
Be not electrically connected to form a test circuit with the 1st metal soldered ball, n-th metal soldered ball, then observe test circuit it is whether short-circuit.
Further, which comprises
A probe therein and one first pad is in electrical contact, first pad and only with the 1st metal soldered ball electricity
Second metallic pattern of connection electrically combines；And
Another probe and one second pad is in electrical contact, it second pad and is only electrically connected with n-th metal soldered ball
The second metallic pattern electrically combine；
First pad and the second pad are arranged on the second test circuit board.
Further, any one in N number of metal soldered ball in addition to the 1st metal soldered ball and n-th metal soldered ball
Metal soldered ball is in electrical contact with the different loci on surface and one first metallic pattern, one second metallic pattern simultaneously.
Further, the method specifically includes:
In depositing the first metallic pattern of a plurality of electric isolations each other on the first test circuit board,
In depositing the second metallic pattern of a plurality of electric isolations each other on the second test circuit board,
Circuit board metallization medium layer is tested in the first test circuit board and/or second,
Correspond at solder joint and pad on the first test circuit board and/or the second test circuit board and process window,
The deposited metal welding column at bond pad locations,
Flip chip bonding is carried out using upside-down mounting welding machine, to form the welded ball array for including N number of metal soldered ball.
In some more specific embodiments, which comprises at least through photoetching, removing and electron beam evaporation side
Formula tests on circuit board in the first test circuit board, second and deposits the first metallic pattern, the second metallic pattern.
In some more specific embodiments, which comprises at least through photoetching and reactive ion etching mode
Correspond at solder joint and pad on the first test circuit board and/or the second test circuit board and processes window；
In some more specific embodiments, which comprises at least through photoetching and thermal evaporation methods in correspondence
The deposition of metal welding column is carried out at solder joint, the metal welding column includes In column.
Further, which comprises if test short circuit, judging face-down bonding, there are quality problems.
The other side of the embodiment of the present invention additionally provides a kind of electrical testing system of face-down bonding, comprising:
First test circuit board, the first metallic pattern with a plurality of electric isolations each other,
Second test circuit board, the second metallic pattern with a plurality of electric isolations each other,
Along N number of metal soldered ball of setting route interval distribution, N is positive integer,
Mainly by a probe, test power supply, electric current and/or voltage test device and the survey of another probe formation in sequential series
Die trial block；
When carrying out conduction test, which is alternately electrically connected through the first metallic pattern, the second metallic pattern
And a series circuit is formed, and two probes are electrically connected to form one with the initial and end Duan Duan of the series circuit respectively
Test circuit；
When carrying out short-circuit test, N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and
Any one metal soldered ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, and described two
Probe is electrically connected to form a test circuit with the 1st metal soldered ball, n-th metal soldered ball respectively.
Further, the first metallic pattern or the second metallic pattern being only electrically connected with the 1st metal soldered ball also with setting
The first pad on the first test circuit board or the second test circuit board electrically combines, and is only electrically connected with n-th metal soldered ball
The first metallic pattern or the second metallic pattern also be arranged in first test circuit board or second test circuit board on second
Pad electrically combines, wherein a probe and the first pad are in electrical contact, another probe and the second pad are in electrical contact.
Further, first pad and the second pad are arranged on the second test circuit board, only with the 1st metal
Second metallic pattern of soldered ball electrical connection is electrically combined with the first pad, the second metal being only electrically connected with n-th metal soldered ball
Figure is electrically combined with the second pad.
Further, any one in N number of metal soldered ball in addition to the 1st metal soldered ball and n-th metal soldered ball
Metal soldered ball is in electrical contact with the different loci on surface and one first metallic pattern, one second metallic pattern simultaneously.
Test method provided by the invention is simple, at low cost, easy to use, and chip is after can testing Flip Chip Bond Technique
Enough normal connections, and can effectively find existing short circuit problem, can targetedly improve technique and improve the matter of flip chip bonding
Amount.
The technical solution, its implementation process and principle etc. will be further explained in conjunction with specific embodiments as follows
It is bright.
The present invention deposits corresponding metallic pattern on it and deposits soldered ball later by a pair of of test circuit board of production
Metal carries out flip chip bonding after passivation aperture, and completes to test.
1 conduction test of embodiment
The present embodiment is related to testing the conduction of selected one or two lines road on a circuit board.More
Body, as shown in fig.1, the present embodiment system surveys the conduction of A, B point of two selected routes on a circuit board
(wherein, the path of connecting test can be several row/column pixels, be also possible to a string of pixels in some corner, as needed for examination
Depending on), corresponding detection method is as follows:
It provides mainly by a probe, test power supply, electric current and/or voltage test device and the formation in sequential series of another probe
Test module；
A pair of of test circuit board (the first test circuit board and the second test circuit board) is provided, and according to side known to industry
Case, it is plural in being deposited on the first test circuit board, the second test circuit board by modes such as photoetching, removing and electron beam evaporations
First metallic pattern of a electric isolation each other, the second metallic pattern (the first metallic pattern is also referred to as upper layer metallic pattern,
Two metallic patterns are also referred to as lower metal figure, and upper layer metallic pattern and lower metal figure can be identical or not identical
, and can be designed according to actual demand).
Using mode known to industry in the first test circuit board and/or the second test circuit board metallization medium layer (such as oxygen
SiClx or silicon nitride etc.),
Solder joint and weldering are corresponded on the first test circuit board and/or the second test circuit board using mode known to industry
Pan Chu processes window,
According to scheme known to industry, the heavy of In column is carried out corresponding at solder joint by modes such as photoetching and thermal evaporations
Product；
According to scheme known to industry, flip chip bonding is carried out using upside-down mounting welding machine, to form the soldered ball battle array for including N number of In ball
Column, N is positive integer；
N number of In ball is alternately electrically connected (the first metal through a plurality of first metallic patterns, a plurality of second metallic patterns
The connection type of figure and the second metallic pattern and In ball is seen shown in Fig. 2), so that N number of In ball be connected to be formed a string
Join circuit (refering to shown in Fig. 3), in N number of In ball except the 1st In ball (corresponding to A point) and n-th In ball (corresponding to B point) it
Any one outer In ball is electrically connected with simultaneously with the different loci on surface and one first metallic pattern, one second metallic pattern
Two probes are electrically connected to form a test circuit, then observe test by touching with the both ends of the series circuit respectively
Circuit whether normally.
2 short-circuit test of embodiment
The present embodiment is related to testing the one or more selected route on a circuit board with the presence or absence of short circuit.
One of typical resolution chart is as shown in Figure 4.Corresponding test method is as follows:
It provides test module (same as Example 1)；
One test circuit board (can be the second test circuit board) is provided, can be made in the way of embodiment 1；
By N number of In ball and the second test circuit board cooperation, and make any one In ball only can be with corresponding one second metal
Figure is in electrical contact, the second metallic pattern electrical connection the first pad of setting being electrically connected with first In ball, with n-th In ball electricity
The second metallic pattern electrical connection of connection is provided with the second pad, and (the first pad and the second pad are arranged electric in the second test simultaneously
On the plate of road), then two probes are electrically connected to form a test circuit with the 1st In ball, n-th In ball respectively, then
Whether observation test circuit is short-circuit.
If test short circuit, judge that (such as soldered ball exists to be deformed etc. and lacks face-down bonding there are quality problems
It falls into).At this time technique can be improved with quick positioning question point in conjunction with means such as x-ray fluoroscopy, ultrasonic scannings.
It, can be only comprising to be led depending on the structure and form of aforementioned each test circuit board can be according to actual demands
The circuit structure of general character test, can also be only comprising the circuit structure to carry out short-circuit test, naturally it is also possible to include simultaneously
Both circuit structures, such as its form can be refering to shown in Fig. 5.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all
Equivalent change or modification made by Spirit Essence according to the present invention, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of electrical testing method of face-down bonding, characterized by comprising:
First test circuit board is provided, the first metal of a plurality of electric isolations each other is provided on the first test circuit board
Figure,
Second test circuit board is provided, the second metal of a plurality of electric isolations each other is provided on the second test circuit board
Figure,
N number of metal soldered ball along setting route interval distribution is set, N is positive integer,
Survey mainly by a probe, test power supply, electric current and/or voltage test device and the formation in sequential series of another probe is provided
Die trial block；
And be alternately electrically connected N number of metal soldered ball through a plurality of first metallic patterns, a plurality of second metallic patterns, from
And N number of metal soldered ball is connected to form a series circuit, and by two probes respectively with the series circuit two
End be electrically connected to form a test circuit, then observe test circuit whether normally；
Alternatively, by N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and make any one metal welding
Ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, then by a probe and the 1st metal welding
Ball electrical connection, another probe and n-th metal soldered ball are electrically connected to form a test circuit, then observe whether test circuit short
Road.
2. the electrical testing method of face-down bonding according to claim 1, characterized by comprising:
A probe therein and one first pad is in electrical contact, it first pad and is only electrically connected with the 1st metal soldered ball
The second metallic pattern electrically combine；And
Another probe and one second pad is in electrical contact, second pad and be only electrically connected with n-th metal soldered ball
Two metallic patterns electrically combine；
First pad and the second pad are arranged on the second test circuit board.
3. the electrical testing method of face-down bonding according to claim 1 or 2, it is characterised in that: in N number of metal soldered ball
Any one metal soldered ball in addition to the 1st metal soldered ball and n-th metal soldered ball simultaneously with the different loci on surface with
One first metallic pattern, one second metallic pattern are in electrical contact.
4. the electrical testing method of face-down bonding according to claim 3, it is characterised in that specifically include:
In depositing the first metallic pattern of a plurality of electric isolations each other on the first test circuit board,
In depositing the second metallic pattern of a plurality of electric isolations each other on the second test circuit board,
Circuit board metallization medium layer is tested in the first test circuit board and/or second,
Correspond at solder joint and pad on the first test circuit board and/or the second test circuit board and process window,
The deposited metal welding column at bond pad locations,
Flip chip bonding is carried out using upside-down mounting welding machine, to form the welded ball array for including N number of metal soldered ball.
5. the electrical testing method of face-down bonding according to claim 4, characterized by comprising:
At least through photoetching, removing and electron-beam evaporation mode, circuit board is tested in first, deposits the on the second test circuit board
One metallic pattern, the second metallic pattern；
And/or at least through photoetching and reactive ion etching mode on the first test circuit board and/or the second test circuit board
Corresponding to processing window at solder joint and pad；
And/or corresponding at solder joint the deposition for carrying out metal welding column, the metal welding at least through photoetching and thermal evaporation methods
Column includes In column.
6. the electrical testing method of face-down bonding according to claim 4, characterized by comprising: if test circuit is short
Road then judges that there are quality problems for face-down bonding.
7. a kind of electrical testing system of face-down bonding, characterized by comprising:
First test circuit board, the first metallic pattern with a plurality of electric isolations each other,
Second test circuit board, the second metallic pattern with a plurality of electric isolations each other,
Along N number of metal soldered ball of setting route interval distribution, N is positive integer,
Mainly by a probe, test power supply, electric current and/or voltage test device and the test mould of another probe formation in sequential series
Block；
When carrying out conduction test, which is alternately electrically connected and shape through the first metallic pattern, the second metallic pattern
At a series circuit, and two probes are electrically connected to form a test with the initial and end Duan Duan of the series circuit respectively
Circuit；
When carrying out short-circuit test, N number of metal soldered ball and the first test circuit board or the second test circuit board cooperation, and it is any
A metal soldered ball only can be in electrical contact with corresponding one first metallic pattern or one second metallic pattern, and a probe and the 1st
Metal soldered ball electrical connection, another probe and n-th metal soldered ball are electrically connected to form a test circuit.
8. the electrical testing system of face-down bonding according to claim 7, it is characterised in that: only with the 1st metal soldered ball
The first metallic pattern or the second metallic pattern of electrical connection are also with setting on the first test circuit board or the second test circuit board
The first pad electrically combine, the first metallic pattern or the second metallic pattern being only electrically connected with n-th metal soldered ball also with set
The second pad set on the first test circuit board or the second test circuit board electrically combines, wherein a probe and the first pad electricity
Property contact, another probe and the second pad are in electrical contact.
9. the electrical testing system of face-down bonding according to claim 8, it is characterised in that: first pad and second
Pad is arranged on the second test circuit board, the second metallic pattern and the first pad being only electrically connected with the 1st metal soldered ball
It electrically combines, is only electrically combined with the second metallic pattern of n-th metal soldered ball electrical connection with the second pad.
10. the electrical testing system of the face-down bonding according to any one of claim 7-9, it is characterised in that: N number of gold
Any one metal soldered ball in category soldered ball in addition to the 1st metal soldered ball and n-th metal soldered ball is while with surface not
It is in electrical contact with site and one first metallic pattern, one second metallic pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710504024.4A CN107167685B (en) | 2017-06-27 | 2017-06-27 | The electrical testing method and system of face-down bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710504024.4A CN107167685B (en) | 2017-06-27 | 2017-06-27 | The electrical testing method and system of face-down bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107167685A CN107167685A (en) | 2017-09-15 |
| CN107167685B true CN107167685B (en) | 2019-09-06 |
Family
ID=59826742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710504024.4A Active CN107167685B (en) | 2017-06-27 | 2017-06-27 | The electrical testing method and system of face-down bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107167685B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110488134A (en) * | 2019-07-10 | 2019-11-22 | 中国科学院上海技术物理研究所 | A kind of fast verification assessment chip and method for focal plane device inverse bonding technique |
| CN111725152B (en) * | 2020-06-12 | 2021-12-28 | 北京时代民芯科技有限公司 | Plastic package daisy chain circuit structure based on flip chip bonding and test method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1823277A (en) * | 2003-08-05 | 2006-08-23 | 飞思卡尔半导体公司 | Integrated circuit with test pad structure and method of testing |
| CN203275467U (en) * | 2013-04-17 | 2013-11-06 | 竞陆电子(昆山)有限公司 | Low-resistance and open-short synchronous test system of PCB board |
| CN104515874A (en) * | 2013-09-26 | 2015-04-15 | 北大方正集团有限公司 | Adapter plate used for circuit board testing and test method and test device |
| CN205374651U (en) * | 2015-12-25 | 2016-07-06 | 南通富士通微电子股份有限公司 | Short -circuit test carrier is opened to base plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8993432B2 (en) * | 2011-11-16 | 2015-03-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test structure and method of testing electrical characteristics of through vias |
-
2017
- 2017-06-27 CN CN201710504024.4A patent/CN107167685B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1823277A (en) * | 2003-08-05 | 2006-08-23 | 飞思卡尔半导体公司 | Integrated circuit with test pad structure and method of testing |
| CN203275467U (en) * | 2013-04-17 | 2013-11-06 | 竞陆电子(昆山)有限公司 | Low-resistance and open-short synchronous test system of PCB board |
| CN104515874A (en) * | 2013-09-26 | 2015-04-15 | 北大方正集团有限公司 | Adapter plate used for circuit board testing and test method and test device |
| CN205374651U (en) * | 2015-12-25 | 2016-07-06 | 南通富士通微电子股份有限公司 | Short -circuit test carrier is opened to base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107167685A (en) | 2017-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6895346B2 (en) | Method for test conditions | |
| CN102937695B (en) | Silicon through-hole ultrathin wafer testing structure and testing method | |
| TWI329902B (en) | Bump test units and apparatus, and methods for testing bumps | |
| TW528874B (en) | Non-destructive inspection method | |
| CN107167685B (en) | The electrical testing method and system of face-down bonding | |
| US4881029A (en) | Semiconductor integrated circuit devices and methods for testing same | |
| CN100358122C (en) | Apparatus and method for testing conductive bumps | |
| KR20130083824A (en) | Semiconductor integrated circuit device inspection method and semiconductor integrated circuit device | |
| CN109669113A (en) | The method for testing the device and method and manufacturing semiconductor devices of interconnection circuit | |
| US9754847B2 (en) | Circuit probing structures and methods for probing the same | |
| CN103630824A (en) | Chip concurrent test system | |
| CN206282851U (en) | Semi-conductor test structure | |
| KR20130083825A (en) | Detection method for semiconductor integrated circuit device, and semiconductor integrated circuit device | |
| CN101017182A (en) | Wafer-level burn-in and test | |
| US8378701B2 (en) | Non-contact determination of joint integrity between a TSV die and a package substrate | |
| CN106771405B (en) | A kind of spherical grid array integrated circuit interface adapter | |
| US20060066327A1 (en) | Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process | |
| CN109698138B (en) | Semiconductor failure positioning test unit and failure positioning method thereof | |
| CN111653497A (en) | Test structure and test method | |
| CN105990169B (en) | The detection method of chip through-hole connection defect | |
| KR101320934B1 (en) | Semiconductor device and manufacturing method thereof | |
| Yang et al. | Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures | |
| JP2002203882A (en) | Method for manufacturing semiconductor device | |
| TWI397691B (en) | Probe station device | |
| US11081469B2 (en) | Three-dimensional integrated circuit test and improved thermal dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |