CN107162398A - A kind of cutting glass by laser device absorbed based on multi-way - Google Patents
A kind of cutting glass by laser device absorbed based on multi-way Download PDFInfo
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- CN107162398A CN107162398A CN201710363679.4A CN201710363679A CN107162398A CN 107162398 A CN107162398 A CN 107162398A CN 201710363679 A CN201710363679 A CN 201710363679A CN 107162398 A CN107162398 A CN 107162398A
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- upper reflector
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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Abstract
The invention discloses a kind of cutting glass by laser device absorbed based on multi-way, including upper reflector group, lower speculum group, one upper focus lamp and a lower focus lamp, upper focus lamp is located between upper reflector group and glass to be cut, lower focus lamp is located between lower speculum group and glass to be cut, incident laser enters upper focus lamp after being reflected via upper reflector group, glass to be cut is acted on after being focused on via upper focus lamp, passed through after being absorbed via glass to be cut and lower speculum group is injected by lower focus lamp, enter lower focus lamp after being reflected via lower speculum group, acted on after being focused on via lower focus lamp on glass to be cut, passed through after being absorbed via glass to be cut and upper reflector group is injected by upper focus lamp, such iterative cycles, realize that laser is repeatedly absorbed by glass, improve laser absorption rate, reduce laser power.
Description
Technical field:
The present invention relates to Laser Processing manufacturing technology field, and in particular to a kind of cutting glass by laser absorbed based on multi-way
Device.
Technical background:
The cutting method of existing glass mainly has following several method:1st, with skive piece or hard alloy,
Glass surface marks trace line, and then glass is fractureed with the method for machinery again.This method is although relatively easy, but with machine
During tool method fractures glass, the edge of glass is unsmooth, and due to glass edge residual stress and fine crack
The intensity of glass can be reduced.So at the edge also needed to using the method glass-cutting after cutting cleaned, polishes and be hot
The subsequent handlings such as reason.2nd, the laser cutting technique of glass has many superiority compared with traditional cutting technique.Laser is cut
The glass edge that cuts out is smooth, without horizontal fine fisssure, without fragment.Avoid and occur scratching on sheet material and by glass breaking
Possibility is minimized by.The method of cutting glass by laser can be divided into two kinds from principle:One kind is melt-cut method,
Another is crack―control.
Just at present, crack―control is broadly divided into based on CO2The cutting of laser and the cutting based on YAG laser, this
Both are different for the mechanism of absorption of laser.Glass is to CO2The absorption of laser is Surface absorption, and wavelength is 10.6 μm
CO2Laser is easily all absorbed in glass surface.Therefore, CO is utilized2During laser glass-cutting, crackle extends since surface,
Kerf quality is poor, the finite thickness of glass-cutting, and can not cut compound glass, and the bad control of crackle, is mainly used to during cutting
Cutting straight line type glass material.And wavelength is 1 μm or so of YAG laser-light transparent glass, absorption of the glass to laser energy is
Body absorpting form, the cracking of glass is uniform penetrating, and the YAG laser glass-cutting method absorbed based on body not only can obtain
More preferable cut quality, but also cleavable compound glass, laminated glass and glass tube, its greatest drawback is inefficiency, by
In glass to the absorption of YAG laser less than 10%, so the power that needs is relative just than larger during cutting, and cutting speed
It is very slow.
The content of the invention:
For drawbacks described above, it is an object of the invention to provide a kind of cutting glass by laser device absorbed based on multi-way,
Aim to solve the problem that technology high to laser power requirement when prior art uses wavelength for 0.5 μm~1 μm of cutting glass by laser is asked
Topic.
To achieve the above object, the present invention provides a kind of cutting glass by laser device absorbed based on multi-way, glass to be cut
Glass is provided with first surface and second surface, including:
Upper reflector group, the first reflection laser or change are exported by laser for changing after the light path of the first parallel laser
Generation unit exports the first reflection laser after projecting laser optical path;
Upper focus lamp, between upper reflector group and glass first surface to be cut, for entering to the first reflection laser
Output second focuses on laser after line focusing processing, and the first absorption laser is converted into the output of the first parallel laser;
Lower focus lamp, below the glass second surface to be cut, its focus is overlapped with upper focusing mirror foci, its optical axis and
Upper focus lamp optical axis coincidence, for the second absorption laser to be converted into the output of the second parallel laser, and enters to the second reflection laser
Output first focuses on laser after line focusing processing;
Lower speculum group, below lower focus lamp, the reflection of light path output second for changing the second parallel laser swashs
Light;
Glass to be cut absorbs second and focused on after laser by glass second surface to be cut output the second absorption laser;It is to be cut
Cut after glass absorbs the first focusing laser and laser is absorbed by glass first surface to be cut output first.
Preferably, upper reflector group includes 2M+1 upper reflector, and lower speculum group includes 2M+1 lower speculums;Its
In, 2M+1 upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2M+1 upper reflector;2M+1
Lower speculum be designated as the 1st lower speculum, the 2nd lower speculum ..., 2M+1 lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite;Each lower speculum is equal with the optical axis distance of lower focus lamp, and 2t-1 lower speculums and 2t are individual lower anti-
Penetrate mirror positioned opposite;And 2M+1 lower mirror reflection surfaces are vertical with injecting 2M+1 lower reflector lasers;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and u-th of upper reflector is upper
Projection projects the focus pair on upper focus lamp with v-th of lower speculum on upper focus lamp focal plane on focus lamp focal plane
Claim, and w-th of upper reflector reflecting surface and x-th of lower mirror reflection surface are parallel;Wherein, u numerical value and v numerical value are equal, w
Numerical value it is equal with x numerical value, 1≤s≤M, 1≤t≤M, 2≤u≤2M+1,2≤v≤2M+1,2≤w≤2M, 2≤x≤2M, M
≥1。
Preferably, upper reflector group includes 2N upper reflector, and the lower speculum group includes 2N lower speculums;
2N upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2N upper reflector, 2N
Lower speculum be designated as the 1st lower speculum, the 2nd lower speculum ..., 2N lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2i upper reflector and 2i+1 upper reflections
Mirror is positioned opposite;And the 2N upper reflector reflecting surface is vertical with the reflecting surface for injecting the 2N upper reflector;Each lower reflection
Mirror is equal with the optical axis distance of lower focus lamp, and 2j-1 lower speculums and 2j lower speculums are positioned opposite;1≤i≤N-
1,1≤j≤N;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and k-th of upper reflector is upper
Projection projects the focus pair on upper focus lamp with l-th of lower speculum on upper focus lamp focal plane on focus lamp focal plane
Claim;M-th of upper reflector reflecting surface and n-th of lower mirror reflection surface are parallel;Wherein, k numerical value and l numerical value are equal, m's
Numerical value is equal with n numerical value, 2≤k≤2N, 2≤l≤2N, 2≤m≤2N-1,2≤n≤2N-1, N >=2.
Preferably, the upper reflector group includes 2M+1 upper reflector, and the lower speculum group includes 2M lower reflections
Mirror;
2M+1 upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2M+1 upper reflector,
The lower speculums of 2M be designated as the 1st lower speculum, the 2nd lower speculum ..., 2M lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite;Each lower speculum is equal with the optical axis distance of lower focus lamp, and 2t-1 lower speculums and 2t are individual lower anti-
Penetrate mirror positioned opposite;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and y-th of upper reflector is upper
Projection projects the focus pair on upper focus lamp with z-th of lower speculum on upper focus lamp focal plane on focus lamp focal plane
Claim, and the reflecting surface of the reflecting surface of w-th upper reflector and x-th of lower speculum is parallel;Wherein, the numerical value phase of y numerical value and z
Deng w numerical value is equal with x numerical value, 1≤s≤M, 1≤t≤M, 2≤y≤2M, 2≤z≤2M, 2≤w≤2M, 2≤x≤2M, M
≥1。
Preferably, the reflectivity all same of all speculums.
Above-mentioned technical proposal proposed by the present invention, compared with prior art, the invention has the advantages that:
Because the laser that glass is 1 μm or so to wavelength is that body absorbs, i.e., laser is via glass first surface to be cut
Inject after glass to be cut, can be projected after being absorbed by glass to be cut by glass second surface to be cut.In glass to be cut
Two lower faces are provided with lower focus lamp and lower speculum, and laser is exported after being absorbed by glass to be cut by second surface, under
After focus lamp and the reflection of lower speculum group and focusing, it is again introduced into glass to be cut and absorbs, and exported via first surface.Together
Reason, after glass to be cut is injected via glass second surface to be cut, by glass to be cut the after being absorbed by glass to be cut
Project on one surface.Upper focus lamp and upper focus lamp are provided with above glass first surface to be cut, glass to be cut the can be allowed
Laser is projected on one surface, into after upper focus lamp and the reflection of upper reflector group and focusing on, is again introduced into glass to be cut and is absorbed,
And projected via second surface.Therefore, the laser cutting device that the present invention is provided, it is possible to achieve laser is repeatedly by glass to be cut
Absorb, improve laser absorption rate, and then laser generating unit output laser power can be reduced.
Brief description of the drawings:
The structure chart for the cutting glass by laser device 3rd embodiment absorbed based on multi-way that Fig. 1 provides for the present invention;Its
In, 11 it is the 1st upper reflector, 12 be the 2nd upper reflector, 13 be the 3rd upper reflector, 21 is the 1st lower speculum, 22
It is the 3rd lower speculum for the 2nd lower speculum, 23,31 is upper focus lamp, 32 is lower focus lamp;
Upper reflector group in the cutting glass by laser device 3rd embodiment absorbed based on multi-way that Fig. 2 provides for the present invention
The perspective view on upper focus lamp;
Lower speculum group in the cutting glass by laser device 3rd embodiment absorbed based on multi-way that Fig. 3 provides for the present invention
The perspective view on upper focus lamp;
Upper reflector group in the cutting glass by laser device fourth embodiment absorbed based on multi-way that Fig. 4 provides for the present invention
The perspective view on upper focus lamp;
Lower speculum group in the cutting glass by laser device fourth embodiment absorbed based on multi-way that Fig. 5 provides for the present invention
The perspective view on upper focus lamp;
Upper reflector group in the cutting glass by laser device sixth embodiment absorbed based on multi-way that Fig. 6 provides for the present invention
The perspective view on upper focus lamp;
Lower speculum group in the cutting glass by laser device sixth embodiment absorbed based on multi-way that Fig. 7 provides for the present invention
The perspective view on upper focus lamp;
Upper reflector group in the embodiment of cutting glass by laser device the 8th absorbed based on multi-way that Fig. 8 provides for the present invention
The perspective view on upper focus lamp;
Lower speculum group in the embodiment of cutting glass by laser device the 8th absorbed based on multi-way that Fig. 9 provides for the present invention
The perspective view on upper focus lamp.
Embodiment:
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The present invention provide based on multi-way absorb cutting glass by laser device first embodiment include upper reflector group, under
Speculum group, upper focus lamp and lower focus lamp.Upper focus lamp is located between upper reflector group and glass first surface to be cut,
Lower focus lamp is located between lower speculum group and glass second surface to be cut.
The laser exported by laser generation module injects upper reflector group, and upper reflector group changes defeated by laser generation module
The first reflection laser is exported after the laser optical path gone out, the first reflection laser injects upper focus lamp, and focus lamp is to the first reflection laser
It is focused output second after processing and focuses on laser, second focuses on laser action on glass to be cut, glass to be cut is to the
Two focus on by glass second surface to be cut output the second absorption laser after laser absorption, and second, which absorbs laser, injects lower focus lamp
On, the second absorption laser is converted into the second parallel laser and exported by lower focus lamp, and the second parallel laser injects lower speculum group, under
Speculum group exports the second reflection laser after reflecting the second parallel laser, the second reflection laser enters lower focus lamp, lower focusing
Output first focuses on laser output after mirror is focused to the second reflection laser, and first focuses on laser action in glass to be cut,
Glass to be cut projects first by glass first surface to be cut after absorbing and absorbs laser, and the first absorption laser, which is injected, to be focused on
First absorption laser is converted into injection upper reflector group after the first parallel laser by mirror, upper focus lamp, and upper reflector group is to first
The first reflection laser is exported after parallel laser reflection, the first reflection laser enters upper focus lamp, such iterative cycles.Laser by
Upper reflector group is passed through during upper focus lamp, glass to be cut, lower focus lamp to lower speculum group, and laser is by glass to be cut
Absorb once, laser by focus lamp under lower speculum group process, glass to be cut, on focus lamp to upper reflector group process
In, laser is absorbed once by glass to be cut, during such iterative cycles, realizes that laser repeatedly absorbs, and improves laser absorption
Rate, reduces the power requirement that laser is exported to laser generating unit.
In the cutting glass by laser device second embodiment absorbed based on multi-way that the present invention is provided, upper reflector group includes
2M+1 upper reflector, lower speculum group includes 2M+1 lower speculums;2M+1 upper reflector be designated as the 1st upper reflector,
2nd upper reflector ..., the 2M+1 upper reflector, 2M+1 lower speculums are designated as the 1st lower speculum, anti-under the 2nd
Penetrate mirror ..., the lower speculums of 2M+1.
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite, 1≤s≤M.After first, which absorbs laser, injects 2s upper reflector so that anti-by the 2s upper reflector
The 2s+1 upper reflector can be injected by penetrating rear laser, and export the first reflection laser after the 2s+1 upper reflector reflection,
First reflection laser can inject focus lamp.Each lower speculum is equal with the optical axis distance of lower focus lamp, and 2t-1 lower anti-
Penetrate mirror and 2t lower speculums are positioned opposite, 1≤t≤M.When the second absorption laser injects 2t-1 lower speculums so that
Laser can inject 2t lower speculums after 2t-1 lower speculum reflections, and via defeated after 2t lower speculum reflections
Go out the second reflection laser, the second reflection laser can inject lower focus lamp.2M+1 lower mirror reflection surfaces are with injecting 2M+1
The reflecting surface of individual lower speculum is vertical, and the second parallel laser is after 2M+1 lower speculums reflections are injected, and laser is along original optical path
Return, realize that laser absorption number of times is doubled.
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and u-th of upper reflector is upper
Projection projects the focus pair on upper focus lamp with v-th of lower speculum on upper focus lamp focal plane on focus lamp focal plane
Claim, and the reflecting surface of the reflecting surface of w-th upper reflector and x-th of lower speculum is parallel;Wherein, the numerical value phase of u numerical value and v
Deng, w numerical value is equal with x numerical value, 2≤u≤2M+1,2≤v≤2M+1,2≤w≤2M, 2≤x≤2M, M >=1, s, t, u, v,
W, x, M are integer.Upper reflector group is arranged with lower speculum group, it is possible to achieve enter upper poly- via upper reflector reflection laser
Focus lens act on glass to be cut after focusing on, and enter lower condenser lens after being absorbed via glass to be cut, are focused on thoroughly by lower
Mirror, which is converted into parallel laser, can enter with the upper reflector in upper focus lamp focal plane projection symmetrically lower speculum, or by lower anti-
Penetrate after mirror reflection laser is focused on into lower condenser lens and act on glass to be cut, enter upper poly- after being absorbed via glass to be cut
Focus lens, are converted into parallel laser by upper condenser lens and enter with the upper reflector in the projection of upper focus lamp focal plane to deserving to be called
Speculum.
The light path of laser is in the cutting glass by laser device that the present invention is provided:
The light path of laser from the 1st upper reflector to the 1st lower speculum is:
Laser generating unit projects laser and injects the 1st upper reflector, gathers via being injected after the 1st upper reflector reflection
Jiao Jing, glass to be cut is acted on after being focused on via upper focus lamp, by glass second to be cut after being absorbed via glass to be cut
Surface is projected and injects lower focus lamp, and being converted into parallel laser via lower focus lamp injects the 1st lower speculum;
Via the lower speculum of pth+1 is injected after p-th of lower speculum reflection, after+1 lower speculum reflection of pth
Lower focus lamp is injected, glass to be cut is acted on after being focused via lower focus lamp, by treating after being absorbed via glass to be cut
Glass-cutting first surface projects and injects focus lamp, and being converted into parallel laser via upper focus lamp injects q+1 above instead
Mirror is penetrated, via the q+2 upper reflector is injected after the q+1 upper reflector reflection, acts on and treats after being focused on via upper focus lamp
Glass-cutting, injects lower focus lamp after being absorbed via glass to be cut, being converted into parallel laser via lower focus lamp injects q+2
Individual lower speculum.Wherein, p is successively from 1,3,5 ..., and 2M-1 values, p numerical value is equal with q numerical value, realizes laser by 2M times
Absorb.
After laser injects 2M+1 lower speculums and reflects, laser is realized and swashed along backtracking to the 1st upper reflector
2M+1 absorption of light.
The operation principle for the cutting glass by laser device that the present invention is provided is:
Total light intensity after multi-way absorbs is:
Wherein, θ is the incident laser angle of divergence, P1For the power of incident laser, f is the focal length of upper focus lamp, and α is glass pair
In the absorptivity of optical maser wavelength, N is absorption number of times.
The required critical light intensity of glass-cutting is Ilaser, add up to light intensity to need foot I>Ilaser, i.e., incident intensity need meet:
The I for the glass of cutting is can be seen that from above-mentioned formulalasserIt is a definite value, glass is for incident laser ripple
Long absorptivity α is also constant, if the size of mirror is selected, θ is also a definite value, then between incident power and absorption number of times
Inverse correlation, i.e. increase absorb times N and reduce required incident power P1, and absorb bigger, the required incident work(of times N
Rate is lower.
The structure chart for the cutting glass by laser device 3rd embodiment absorbed based on multi-way that Fig. 1 provides for the present invention, Fig. 2
For upper reflector group in 3rd embodiment on upper focus lamp perspective view, Fig. 3 is that lower speculum group exists in 3rd embodiment
Perspective view on upper focus lamp.The cutting glass by laser device include the 1st upper anti-mirror 11, the 2nd upper anti-mirror 12, the 3rd
Upper anti-mirror 13, anti-mirror 21 under the 1st, anti-mirror 22 under the 2nd, anti-mirror 23, upper focus lamp 31 and lower focus lamp 32 under the 3rd.
The reflectivity all same of the length of all speculums and the wide spot diameter and all speculums for being all at least greater than incidence.Focusing on
In the selection of mirror, focus lamp is thin mirror, and transmissivity approximate 99.9%, and its thickness is ignored.1st upper anti-mirror 11 gathers with upper
Distance, the 2nd upper distance between anti-mirror 12 and upper focus lamp 31 and the 3rd upper anti-mirror 13 and upper focus lamp 31 between burnt mirror 31
Between distance it is equal.Distance between anti-mirror 21 and lower focus lamp 32 under 1st, under the 2nd anti-mirror 22 and lower focus lamp 32 it
Between distance is equal between anti-mirror 23 and lower focus lamp 32 under distance and the 3rd.2nd upper reflector 12 and the 3rd are upper anti-
Penetrate mirror 13 positioned opposite, the 1st lower speculum 21 and the 2nd lower speculum 22 are positioned opposite.
1st upper reflector 11 is symmetrical on the focal plane of upper focus lamp 31 with the 1st lower speculum.2nd upper reflection
Mirror 12 is projected on upper focus lamp in the projection of the upper focal plane of focus lamp 31 and the 2nd lower speculum 22 in the upper focal plane of focus lamp 31
31 focuses are symmetrical, and the reflecting surface of the 2nd upper reflector 12 is parallel with the reflecting surface of the 2nd lower speculum 22.3rd upper reflector
13 project on upper focus lamp 31 in the projection of the upper focal plane of focus lamp 31 and the 3rd lower speculum 23 in the upper focal plane of focus lamp 31
Focus is symmetrical, the 3rd lower reflecting surface of speculum 13 and the laser vertical for injecting the 3rd lower speculum 23.
Laser generating unit projects laser and injects the 1st upper reflector 11, is injected after being reflected via the 1st upper reflector 11
Upper focus lamp 31, glass to be cut is acted on after being focused on via upper focus lamp 31, by be cut after being absorbed via glass to be cut
Glass second surface projects and injects lower focus lamp 32, is converted into parallel laser via lower focus lamp 32 and injects under the 1st and reflects
Mirror 21, realizes the 1st absorption.
The 2nd lower speculum 22 is injected after being reflected via the 1st lower speculum 21, is reflected via the 2nd lower speculum 22
Lower focus lamp 32 is injected afterwards, and glass to be cut is acted on after being focused via lower focus lamp 32, is absorbed via glass to be cut
Projected afterwards by glass first surface to be cut and inject upper focus lamp 31, being converted into parallel laser via upper focus lamp 31 injects the
2 upper reflectors 12, inject the 3rd upper reflector 13 after being reflected via the 2nd upper reflector 12, realize 2 absorptions.
Upper focus lamp 31 is injected after being reflected via the 3rd upper reflector 13, acts on and treats after being focused on via upper focus lamp 31
Glass-cutting, is projected by glass second surface to be cut after being absorbed via glass to be cut and injects lower focus lamp 32, under
Focus lamp 32 is converted into parallel laser and injects the 3rd lower speculum 23, realizes the 3rd absorption.
Laser by the 3rd lower speculum 23 reflect after along backtracking to the 1st upper reflector 11, realize the 4th to the 6th
It is secondary to absorb.
In the third embodiment, in order to can be poly- by focus lamp after ensureing all light after speculum reflects
Jiao, then the diameter of upper focus lamp and the diameter of upper focus lamp need to meet d>3 Φ+Δ × 2, wherein, Δ is same group of speculum
Interval in group between speculum and speculum, Φ is the spot diameter of incident laser.
Fig. 4 be fourth embodiment in upper reflector group perspective view on upper focus lamp, Fig. 5 be fourth embodiment under
Speculum group perspective view on upper focus lamp.Upper reflector group includes 9 speculums, lower speculum group in fourth embodiment
Including 9 speculums.Each upper reflector is equal with the optical axis distance of upper focus lamp, each lower speculum and lower focus lamp
Optical axis distance is equal.1st upper reflector 11 is symmetrical on the focal plane of upper focus lamp 31 with the 1st lower speculum.2nd
Upper reflector 12 is projected on upper focus lamp focal plane and projected with the 2nd lower speculum 22 on upper focus lamp focal plane on upper
The focus of focus lamp is symmetrical, and the reflecting surface of the 2nd upper reflector 12 and the reflecting surface of the 2nd lower speculum 22 are parallel;……;
9th upper reflector 19 is projected on upper focus lamp focal plane to be projected with the 9th lower speculum 29 on upper focus lamp focal plane
Focus on upper focus lamp is symmetrical, and the 9th upper reflector 19 is projected and the 9th lower speculum 29 on upper focus lamp focal plane
Projected on upper focus lamp focal plane symmetrical on the focus of upper focus lamp.The diameter d of upper focus lamp diameter and lower focus lamp is needed
Meet d>5Φ+Δ×4.
In the embodiment of cutting glass by laser device the 5th absorbed based on multi-way that the present invention is provided, upper reflector group includes
2N upper reflector, lower speculum group includes 2N lower speculums;2N upper reflector is designated as the 1st upper reflector, on the 2nd
Speculum ..., the 2N upper reflector, the lower speculums of 2N be designated as the 1st lower speculum, the 2nd lower speculum ...,
2N lower speculums.
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2i upper reflector and 2i+1 upper reflections
Mirror is positioned opposite;And the 2N upper reflector reflecting surface is with injecting the 2N upper reflector laser vertical;Each lower speculum with
The optical axis distance of lower focus lamp is equal, and 2j-1 lower speculums and 2j lower speculums are positioned opposite;1≤i≤N-1,1≤
j≤N;
1st upper reflector 11 is symmetrical on the focal plane of upper focus lamp 31 with the 1st lower speculum.Reflected on k-th
Mirror projects Jiao projected with speculum under l-th on upper focus lamp focal plane on upper focus lamp on upper focus lamp focal plane
Point symmetry;The reflecting surface of m-th upper reflector and n-th of lower mirror reflection surface are parallel;Wherein, the numerical value phase of k numerical value and l
Deng, m numerical value is equal with n numerical value, 2≤k≤2N, 2≤l≤2N, 2≤m≤2N-1,2≤n≤2N-1, N >=2, i, j, k, l,
M, n, N are integer.
Fig. 6 be sixth embodiment in upper reflector group perspective view on upper focus lamp, Fig. 7 be sixth embodiment under
Speculum group perspective view on upper focus lamp.In sixth embodiment, upper reflector group includes 4 upper reflectors, lower reflection
Microscope group includes 4 lower speculums.4 upper reflectors be designated as the 1st upper reflector 11, the 2nd upper reflector 12 ..., the 4th
14,4 lower speculums of upper reflector be designated as the 1st lower speculum 21, the 2nd lower speculum 22 ..., the 4th lower speculum
24。
K-th of upper reflector is projected with speculum under l-th on upper focus lamp focal plane on upper focus lamp focal plane
Project symmetrical on the focus of upper focus lamp, k is from 2 to 4 values, and k numerical value and l numerical value are equal successively.Reflected on m-th
The lower mirror reflection surface of the reflecting surface of mirror and n-th is parallel, and m is from 2 to 3 values successively, and m numerical value is equal with n numerical value.
Distance is equal between the supreme focus lamp optical axis of 4 upper reflectors, and 4 lower speculums are between lower focus lamp optical axis
Distance is equal.1st lower speculum 21 and the 2nd lower speculum 22 are positioned opposite, on the 2nd upper reflector 12 and the 3rd
Speculum 13 is positioned opposite, and the 3rd lower speculum 23 and the 4th lower speculum 24 are positioned opposite, and the 4th upper reflector 14 reflects
Face and the laser vertical for injecting the 4th upper reflector.
During the 6th of the cutting glass by laser device that the present invention is provided implements, laser light incident to the 1st table of upper reflector 11
Face, the laser reflected through the 1st upper reflector 11 directly incides glass by upper focus lamp vertical 31, because glass is for wavelength
1 μm or so of laser is that body absorbs, and laser light glass is projected from the second surface of glass, and the laser transmitted through glass is passed through again
Cross down focus lamp and be irradiated to the 1st lower speculum, the laser reflected by the 1st lower speculum 21, which is irradiated under the 2nd, to be reflected
The laser reflection of reflection is incident to lower focus lamp by mirror 22, the 2nd lower speculum 22, and after lower focus lamp, glass is for this
Laser beam carries out second and absorbed, and the laser transmitted through glass again passes by the 2nd upper reflector 12 and the 3rd upper reflector 13, passes through
Cross and glass is again introduced into after the laser after two secondary reflections is focused on by upper focus lamp again, glass carries out third time suction for laser
Receive, laser light glass passes through lower focus lamp again, then again after the reflection of the 3 times speculums 23 and the 4 times speculums 23,
After laser after reflection is focused on by focus lamp again, again by glass, glass carries out the 4th absorption for laser.Transmitted through
The laser of glass again passes by the 4th upper reflector 14, via the 4th upper reflector 14 along backtracking, realizes the 5th of laser extremely
8th absorption, glass can realize the multiple absorption for laser, so as to improve the utilization rate of laser, improve efficiency.
In the embodiment of cutting glass by laser device the 7th absorbed based on multi-way that the present invention is provided, upper reflector group includes
2M+1 upper reflector, lower speculum group includes 2M lower speculums.
2M+1 upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2M+1 upper reflector,
The lower speculums of 2M be designated as the 1st lower speculum, the 2nd lower speculum ..., 2M lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite;Each lower speculum is equal with the optical axis distance of lower focus lamp, and 2t-1 lower speculums and 2t are individual lower anti-
Penetrate mirror positioned opposite;1≤s≤M, 1≤t≤M.
1st upper reflector and the 1st lower speculum are symmetrical on the focal plane of upper focus lamp.Y-th of upper reflector exists
Projection projects the focus pair on upper focus lamp with z-th of lower speculum on upper focus lamp focal plane on upper focus lamp focal plane
Claim, and w-th of upper reflector reflecting surface and x-th of lower mirror reflection surface are parallel;Wherein, y numerical value and z numerical value are equal, w
Numerical value it is equal with x numerical value, 2≤y≤2M, 2≤z≤2M, 2≤w≤2M, 2≤x≤2M, M >=1, y, z be integer.
Fig. 8 be the 8th embodiment in upper reflector group perspective view on upper focus lamp, Fig. 9 be the 8th embodiment under
Speculum group perspective view on upper focus lamp.The cutting glass by laser device the 8th absorbed based on multi-way that the present invention is provided
In embodiment, upper reflector group includes 5 upper reflectors, and lower speculum group includes 4 lower speculums.
5 upper reflectors be designated as the 1st upper reflector 11, the 2nd upper reflector 12 ..., the 5th upper reflector 15,4
Individual lower speculum be designated as the 1st lower speculum 21, the 2nd lower speculum 22 ..., the 4th lower speculum 24.
Each upper reflector is equal with the optical axis distance of upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite;S takes 1 and 2.Each lower speculum is equal with the optical axis distance of lower focus lamp, 2t-1 speculums and the down
2t lower speculums are positioned opposite;T takes 1 and 2.
1st upper reflector and the 1st lower speculum are symmetrical on the focal plane of upper focus lamp.Y-th of upper reflector exists
Projection projects the focus pair on upper focus lamp with z-th of lower speculum on upper focus lamp focal plane on upper focus lamp focal plane
Claim, y takes 2 to 4, y numerical value equal with z numerical value, and w-th of upper reflector reflecting surface and x-th of lower mirror reflection surface are put down
OK, w takes 2 to 4, w numerical value equal with x numerical value.
In the embodiment that the present invention is provided, after laser reflects via the 1st upper reflector, via to be cut after upper focus lamp
Glass absorption is cut, lower focus lamp is entered after absorption, via lower focus lamp is returned again to by two speculums after lower focus lamp, is passed through
Absorbed after lower focus lamp by glass, upper focus lamp is entered after absorption, via being again returned to after upper focus lamp by two speculums
Supreme focus lamp, until entering the 4th upper reflector, enters the 5th speculum, via the 5th after the 4th upper reflector reflection
Enter upper focus lamp after individual upper reflector reflection, via being absorbed after upper focus lamp by glass, realize 5 absorptions.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not used to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the invention etc., it all should include
Within protection scope of the present invention.
Claims (5)
1. a kind of cutting glass by laser device absorbed based on multi-way, glass to be cut is provided with first surface and second surface, its
It is characterised by, including:
Upper reflector group, is produced for changing to export the first reflection laser after the light path of the first parallel laser or change by laser
Unit exports the first reflection laser after projecting laser optical path;
Upper focus lamp, between the upper reflector group and the glass first surface to be cut, for anti-to described first
Penetrate laser and be focused the focusing of output second laser after processing, and the first absorption laser is converted into the output of the first parallel laser;
Lower focus lamp, below the glass second surface to be cut, its focus is overlapped with the upper focusing mirror foci, its light
Axle and the upper focus lamp optical axis coincidence, for the second absorption laser to be converted into the output of the second parallel laser, and it is anti-to second
Penetrate laser and be focused the focusing of output first laser after processing;
Lower speculum group, below lower focus lamp, the light path output described second for changing second parallel laser is anti-
Penetrate laser;
Glass to be cut absorbs described second and focused on after laser by glass second surface to be cut output the second absorption laser;
Glass to be cut absorbs described first and focused on after laser by glass first surface to be cut output the first absorption laser.
2. cutting glass by laser device as claimed in claim 1, it is characterised in that the upper reflector group is included on 2M+1
Speculum, the lower speculum group includes 2M+1 lower speculums;Wherein, 2M+1 upper reflector be designated as the 1st upper reflector,
2nd upper reflector ..., the 2M+1 upper reflector;The lower speculums of 2M+1 are designated as the 1st lower speculum, anti-under the 2nd
Penetrate mirror ..., the lower speculums of 2M+1;
Each upper reflector is equal with the optical axis distance of the upper focus lamp, 2s upper reflector and 2s+1 upper reflections
Mirror is positioned opposite;Each lower speculum is equal with the optical axis distance of the lower focus lamp, and 2t-1 lower speculums and 2t are individual
Lower speculum is positioned opposite;And the 2M+1 lower mirror reflection surfaces are hung down with injecting described 2M+1 lower reflector laser
Directly;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and u-th of upper reflector is focused on upper
On mirror focal plane projection projected with v-th of lower speculum on upper focus lamp focal plane it is symmetrical on the focus of upper focus lamp, and
W-th of upper reflector reflecting surface and x-th of lower mirror reflection surface are parallel;Wherein, u numerical value and v numerical value are equal, w number
It is worth, 1≤s≤M, 1≤t≤M, 2≤u≤2M+1,2≤v≤2M+1,2≤w≤2M, 2≤x≤2M, M >=1 equal with x numerical value.
3. cutting glass by laser device as claimed in claim 1, it is characterised in that the upper reflector group includes 2N above instead
Mirror is penetrated, the lower speculum group includes 2N lower speculums;
2N upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2N upper reflector, 2N are lower anti-
Penetrate mirror be designated as the 1st lower speculum, the 2nd lower speculum ..., 2N lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, the 2i upper reflector and the 2i+1 upper reflector phase
To arrangement;And the 2N upper reflector reflecting surface is vertical with the reflecting surface for injecting the 2N upper reflector;Each lower speculum with
The optical axis distance of lower focus lamp is equal, and 2j-1 lower speculums and 2j lower speculums are positioned opposite;1≤i≤N-1,1≤
j≤N;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and k-th of upper reflector is focused on upper
Projection projects symmetrical on the focus of upper focus lamp with l-th of lower speculum on upper focus lamp focal plane on mirror focal plane;M
Individual upper reflector reflecting surface and n-th of lower mirror reflection surface are parallel;Wherein, k numerical value and l numerical value are equal, m numerical value with
N numerical value is equal, 2≤k≤2N, 2≤l≤2N, 2≤m≤2N-1,2≤n≤2N-1, N >=2.
4. cutting glass by laser device as claimed in claim 1, it is characterised in that the upper reflector group is included on 2M+1
Speculum, the lower speculum group includes 2M lower speculums;
2M+1 upper reflector be designated as the 1st upper reflector, the 2nd upper reflector ..., the 2M+1 upper reflector;2M
Lower speculum be designated as the 1st lower speculum, the 2nd lower speculum ..., 2M lower speculums;
Each upper reflector is equal with the optical axis distance of upper focus lamp, the 2s upper reflector and the 2s+1 upper reflector phase
To arrangement;Each lower speculum is equal with the optical axis distance of lower focus lamp, 2t-1 lower speculums and 2t lower speculums
It is positioned opposite;
1st upper reflector and the 1st lower speculum are symmetrical on upper focus lamp focal plane, and y-th of upper reflector is focused on upper
On mirror focal plane projection projected with z-th of lower speculum on upper focus lamp focal plane it is symmetrical on the focus of upper focus lamp, and
The reflecting surface of the reflecting surface of w-th upper reflector and x-th of lower speculum is parallel;Wherein, y numerical value and z numerical value are equal, w
Numerical value it is equal with x numerical value, 1≤s≤M, 1≤t≤M, 2≤y≤2M, 2≤z≤2M, 2≤w≤2M, 2≤x≤2M, M >=1.
5. the cutting glass by laser device as described in any one of Claims 1-4, it is characterised in that the reflection of all speculums
Rate all same.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110066104A (en) * | 2019-04-26 | 2019-07-30 | 中国人民武装警察部队工程大学 | A kind of device and processing method of laser double-surface processing glass |
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CN1343542A (en) * | 2000-09-20 | 2002-04-10 | 精工爱普生株式会社 | Laser cutting off method, laser cutting off appts. method for mfg. liquid crystal device and appts. for mfg. same |
CN202934236U (en) * | 2012-11-27 | 2013-05-15 | 宁波金凤焊割机械制造有限公司 | Laser cutting light path device with light path compensation mechanism |
CN203409429U (en) * | 2013-07-02 | 2014-01-29 | 浙江工业职业技术学院 | Laser cutting system of polycrystalline diamond compact |
KR20150056399A (en) * | 2013-11-15 | 2015-05-26 | 주식회사 에스에프에이 | Device for glass cutting |
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CN1343542A (en) * | 2000-09-20 | 2002-04-10 | 精工爱普生株式会社 | Laser cutting off method, laser cutting off appts. method for mfg. liquid crystal device and appts. for mfg. same |
CN202934236U (en) * | 2012-11-27 | 2013-05-15 | 宁波金凤焊割机械制造有限公司 | Laser cutting light path device with light path compensation mechanism |
CN203409429U (en) * | 2013-07-02 | 2014-01-29 | 浙江工业职业技术学院 | Laser cutting system of polycrystalline diamond compact |
KR20150056399A (en) * | 2013-11-15 | 2015-05-26 | 주식회사 에스에프에이 | Device for glass cutting |
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CN110066104A (en) * | 2019-04-26 | 2019-07-30 | 中国人民武装警察部队工程大学 | A kind of device and processing method of laser double-surface processing glass |
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