CN107155258B - A kind of asymmetry via hole printed circuit board - Google Patents
A kind of asymmetry via hole printed circuit board Download PDFInfo
- Publication number
- CN107155258B CN107155258B CN201710276471.9A CN201710276471A CN107155258B CN 107155258 B CN107155258 B CN 107155258B CN 201710276471 A CN201710276471 A CN 201710276471A CN 107155258 B CN107155258 B CN 107155258B
- Authority
- CN
- China
- Prior art keywords
- signal
- via hole
- circuit board
- printed circuit
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A kind of asymmetry via hole printed circuit board, including basal layer, differential signal line is provided on the basal layer, anti-pad, ground via, there are three signal vias for setting in the anti-pad, transmitting signal wire is provided in three signal vias, the end of the transmitting signal wire is provided with connection pad, the reception signal wire that the bifurcated at one end of the differential signal line opposes at three, the end for receiving signal wire is provided with the connection pad, the ground via is provided between the adjacent transmitting signal wire, only two signal vias pass through the welding connection for connecting pad to the differential signal line.The present invention has the advantages that impedance continuity is good, reduces interference, realizes scene adjustment signal via hole connection type according to demand.
Description
Technical field
The present invention relates to PCB construction fields, and in particular to a kind of asymmetry via hole printed circuit board.
Background technique
In high-speed PCB, seeming simple via hole will also tend to bring very big negative effect to the design of circuit.
In order to reduce the ghost effect bring adverse effect of via hole, existing Via Design is mainly the following mode: first, from
From the aspect of cost and signal quality two, the via hole size of reasonable size is selected, at present under technical conditions, is difficult to use smaller ruler
Very little via hole can be considered using larger size the via hole of power supply or ground wire, then to reduce impedance；Second, using compared with
Thin pcb board is conducive to reduce two kinds of parasitic parameters of via hole；Third, the signal lead on pcb board do not change layer as far as possible, that is,
It says and tries not using unnecessary via hole；4th, power supply and ground pin will nearby punched, drawing between via hole and pin
The shorter line the better, because they will lead to the increase of inductance, while the lead on power supply and ground is as thick as possible, to reduce impedance；
5th, it is placed around the via hole of some ground connection in the via hole that signal changes layer, to provide nearest circuit for signal, it might even be possible to
Some extra ground vias are largely placed on pcb board.But existing mode work when design for designer
Work amount is huge, in actual production, i.e., enabled to accomplish theoretical qualification, and the stability after commercialization still has and asks greatly very much
Topic.So needing to design a kind of PCB universal architecture to simplify the design efforts would of designer, while eliminating via hole in High-Speed PCB
Ill effect.
Summary of the invention
The object of the present invention is to provide a kind of asymmetric via hole printed circuit board, this invention simplifies PCB design workload,
The ill effect of via hole in High-Speed PCB is eliminated simultaneously.
Above-mentioned technical purpose of the invention has the technical scheme that a kind of asymmetric via hole printing electricity
It is provided with differential signal line, anti-pad, ground via on road plate, including basal layer, the basal layer, is arranged in the anti-pad
There are three signal via, transmitting signal wire, the end of the transmitting signal wire are provided in three signal vias
It is provided with connection pad, the reception signal wire that the bifurcated at one end of the differential signal line opposes at three, the reception signal
The end of line is provided with the connection pad, is provided with the ground via between the adjacent transmitting signal wire, only two institutes
It states signal via and passes through the welding connection for connecting pad to the differential signal line.
As a preference of the present invention, the signal via includes the narrow diameter section being linked in sequence and wide diameter part.
As a preference of the present invention, the narrow diameter section of the adjacent signal via and the order of connection of wide diameter part are reversed.
As a preference of the present invention, be located in the middle the signal via only with one in the signal via of two sides
The signal via passes through the welding connection for connecting pad to the differential signal line.
As a preference of the present invention, the signal via is single-ended signal hole.
As a preference of the present invention, the narrow diameter section and the diameter difference of the wide diameter part are at least 0.02mm.
As a preference of the present invention, the spacing of the adjacent signal via is equal to the adjacent signal via and ground connection
Spacing between via hole.
In conclusion the invention has the following beneficial effects:
The present invention has good impedance continuity, reduction interference, realizes scene adjustment signal via hole connection type according to demand
The advantages of.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of signal via of the embodiment of the present invention；
In figure:
1- basal layer；2- differential signal line；3- anti-pad；4- ground via；5- signal via；6- transmits signal wire；7-
Receive signal wire；8- connection pad；5-1- narrow diameter section；5-2- wide diameter part.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
As shown in Figure 1 and Figure 2, the embodiment of the present invention includes differential signal line 2, anti-weldering are provided on basal layer 1, basal layer 1
Disk 3, ground via 4, setting is provided with transmitting signal wire in three signal vias 5 there are three signal via 5 in anti-pad 3
6, the end of transmitting signal wire 6 is provided with connection pad 8, the reception signal that the bifurcated at one end of differential signal line 2 opposes at three
Line 7, the end for receiving signal wire 7 are provided with connection pad 8, are provided with ground via 4 between adjacent transmitting signal wire 6, and only two
A signal via 5 is by the welding connection of connection pad 8 to differential signal line 2.The spacing of adjacent signals via hole 5 is equal to adjacent
Spacing between signal via 5 and ground via 4.
Signal via 5 includes the narrow diameter section 5-1 and wide diameter part 5-2 being linked in sequence.The narrow diameter section 5-1 of adjacent signals via hole 5
It is reversed with the order of connection of wide diameter part 5-2.Be located in the middle signal via 5 only with a signal in the signal via 5 of two sides
Via hole 5 is by the welding connection of connection pad 8 to differential signal line 2.Signal via 5 is single-ended signal hole.Narrow diameter section 5-1 and width
The diameter difference of diameter portion 5-2 is at least 0.02mm.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Claims (7)
1. a kind of asymmetry via hole printed circuit board, it is characterised in that: be provided on (1) including basal layer (1), the basal layer
Differential signal line (2), anti-pad (3), ground via (4), there are three signal via (5) for setting on the anti-pad (3), described
Three signal vias (5) on be provided with transmitting signal wire (6), the end of the transmitting signal wire (6) is provided with connection
Pad (8), the reception signal wire (7) that the bifurcated at one end of the differential signal line (2) opposes at three, the reception signal wire
(7) end is provided with the connection pad (8), is provided with the ground via between the adjacent transmitting signal wire (6)
(4), only two signal vias (5) pass through the welding connection for connecting pad (8) to the differential signal line (2).
2. a kind of asymmetric via hole printed circuit board according to claim 1, it is characterised in that: the signal via
It (5) include the narrow diameter section (5-1) being linked in sequence and wide diameter part (5-2).
3. a kind of asymmetric via hole printed circuit board according to claim 2, it is characterised in that: the adjacent signal mistake
The narrow diameter section (5-1) in hole (5) and the order of connection of wide diameter part (5-2) are reversed.
4. a kind of asymmetric via hole printed circuit board according to claim 1 or 3, it is characterised in that: be located in the middle institute
It states signal via (5) and only passes through the connection pad with a signal via (5) in the signal via (5) of two sides
(8) welding connection is to the differential signal line (2).
5. a kind of asymmetric via hole printed circuit board according to claim 1, it is characterised in that: the signal via
It (5) is single-ended signal hole.
6. a kind of asymmetric via hole printed circuit board according to claim 2, it is characterised in that: the narrow diameter section (5-
1) it is at least 0.02mm with the diameter difference of the wide diameter part (5-2).
7. a kind of asymmetric via hole printed circuit board according to claim 1, it is characterised in that: the adjacent signal mistake
The spacing in hole (5) is equal to the spacing between the adjacent signal via (5) and ground via (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710276471.9A CN107155258B (en) | 2017-04-25 | 2017-04-25 | A kind of asymmetry via hole printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710276471.9A CN107155258B (en) | 2017-04-25 | 2017-04-25 | A kind of asymmetry via hole printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107155258A CN107155258A (en) | 2017-09-12 |
| CN107155258B true CN107155258B (en) | 2019-05-10 |
Family
ID=59792614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710276471.9A Active CN107155258B (en) | 2017-04-25 | 2017-04-25 | A kind of asymmetry via hole printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107155258B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10709010B1 (en) * | 2019-06-12 | 2020-07-07 | Himax Technologies Limited | Flexible printed circuit and display module having flexible printed circuit |
| CN112512208A (en) | 2019-09-16 | 2021-03-16 | 中兴通讯股份有限公司 | Circuit board |
| CN117440594A (en) * | 2022-08-30 | 2024-01-23 | 中兴智能科技南京有限公司 | Printed circuit board, electronic device, and method of controlling propagation delay difference of differential pair |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123743A (en) * | 2005-10-31 | 2007-05-17 | Sony Corp | Flex-rigid board, optical transmission/reception module and optical transmission/reception device |
| CN101236948A (en) * | 2007-02-01 | 2008-08-06 | 力成科技股份有限公司 | Common base plate and semiconductor device using this common base plate |
| CN102065630A (en) * | 2009-11-13 | 2011-05-18 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board (PCB) with high-speed differential signal wiring structure |
| CN204180381U (en) * | 2014-10-23 | 2015-02-25 | 深圳市一博科技有限公司 | A kind of pcb board structure about via hole anti-pad |
| CN104969669A (en) * | 2013-01-29 | 2015-10-07 | 富加宜（亚洲）私人有限公司 | Pcb having offset differential signal routing |
-
2017
- 2017-04-25 CN CN201710276471.9A patent/CN107155258B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123743A (en) * | 2005-10-31 | 2007-05-17 | Sony Corp | Flex-rigid board, optical transmission/reception module and optical transmission/reception device |
| CN101236948A (en) * | 2007-02-01 | 2008-08-06 | 力成科技股份有限公司 | Common base plate and semiconductor device using this common base plate |
| CN102065630A (en) * | 2009-11-13 | 2011-05-18 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board (PCB) with high-speed differential signal wiring structure |
| CN104969669A (en) * | 2013-01-29 | 2015-10-07 | 富加宜（亚洲）私人有限公司 | Pcb having offset differential signal routing |
| CN204180381U (en) * | 2014-10-23 | 2015-02-25 | 深圳市一博科技有限公司 | A kind of pcb board structure about via hole anti-pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107155258A (en) | 2017-09-12 |
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An asymmetrical via printed circuit board Effective date of registration: 20230113 Granted publication date: 20190510 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: ANHUI HONGXIN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023110000023 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |