CN107148149B - PCB circuit board bore process based on face induction technology - Google Patents
PCB circuit board bore process based on face induction technology Download PDFInfo
- Publication number
- CN107148149B CN107148149B CN201710532349.3A CN201710532349A CN107148149B CN 107148149 B CN107148149 B CN 107148149B CN 201710532349 A CN201710532349 A CN 201710532349A CN 107148149 B CN107148149 B CN 107148149B
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- Prior art keywords
- depth
- drilling
- circuit board
- face
- pcb circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The invention discloses a kind of PCB circuit board bore process based on face induction technology, including machine side inspection: checking drilling machine work top, guarantees that work top is flat and smooth；Substrate is fixed: PCB circuit board placement to be processed is fixed on the table and with pin；Working position setting: setting drilling machining position parameter；Face incudes depth setting: face is arranged according to drilling depth and incudes depth parameter；Drilling processing: starting drilling machine carries out drilling processing after completing above-mentioned steps, and using face induction technology continues to monitor drilling depth in process；Depth test: stop borehole test drilling depth；Drilling reprocessing: based on depth test as a result, terminating to drill if depth is up to standard, otherwise until drilling depth is up to standard.Using face induction technology of the present invention carries out compartmentalization detection to the drilling depth of PCB circuit board, simplifies its detection parameters, improves machining accuracy, and the qualification rate for increasing product reduces waste of material.
Description
Technical field
The present invention relates to PCB circuit board bore process, and in particular to a kind of PCB circuit board drilling based on face induction technology
Technique.
Background technique
In the manufacturing process of pcb board, through-hole is needed to realize the electrical connection of inner layer circuit board interlayer, through-hole is usually by boring
Machine is drilled with, and requirement on machining accuracy is higher, and drilling machine is drilled to after through-hole through heavy copper plating, is formed conductive layer in through-holes and is realized
Electrical connection.But the end of certain plated-through-holes is connectionless, this will lead to the fold-back of signal, and resonance can also mitigate, and will cause signal
Reflection, scattering, delay of transmission etc., the problem of " distortion " can be brought to signal.This just needs that plated-through-hole is further processed, i.e.,
Back drill.The effect of back drill is to bore to fall not playing the through hole section of any connection or transmitting effect, avoids signal transmission
Reflection, scattering, delay etc., bring " distortion " to signal, therefore generally will carry out back drill to the through-hole of consent non-on pcb board.Back
Brill is extremely important for the transmission of signal, but since processing request and precision are higher, and leakage is easy in operating process and is bored, to back
The bad control of the depth of drilling, and the method for detecting back drill hole depth at present mainly passes through manually to specified board layer
It is secondary carry out slice reuse microscopic back drill hole depth and level whether meet the requirements.
It further include blind hole machining in the manufacturing process of pcb board, and the precision of blind hole machining is higher than logical in addition to through-hole is processed
Hole machined, once the depth of blind hole, which sends error, will result in the serious problems such as pcb board power is uneven.
The prior art is all to carry out depth detection to drilling by sensor, then according to inspection when carrying out blind hole machining
Depth measurement degree hole to drilling machine is processed, its shortcoming is that: due to the case where will appear multiple blind holes on the same pcb board, such as
Detection sensor is respectively set to each blind hole in fruit, then sensor increased costs, and secondly multiple sensors detect later number
Drilling machine difficulty in computation can be made to increase according to drilling machine control centre is pooled to, be unfavorable for the control of drilling machine, however blind hole adds
Work belongs to Precision Machining, and it is not up to standard to be so bound to cause machining accuracy, causes a large amount of defect wares so that increased costs, material
Waste.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of PCB circuit boards based on face induction technology
Bore process, using face induction technology carry out compartmentalization detection to the drilling depth of PCB circuit board, simplify its detection parameters,
Machining accuracy is improved, the qualification rate for increasing product reduces waste of material.
The purpose of the present invention is achieved through the following technical solutions:
PCB circuit board bore process based on face induction technology comprising following steps:
Machine side inspection: checking drilling machine work top, guarantees that work top is flat and smooth；
Substrate is fixed: PCB circuit board placement to be processed is fixed on the table and with pin；
Working position setting: setting drilling machining position parameter；
Face incudes depth setting: face is arranged according to drilling depth and incudes depth parameter；
Drilling processing: starting drilling machine carries out drilling processing after completing above-mentioned steps, and using face incudes skill in process
Art continues to monitor drilling depth；
Depth test: stop borehole test drilling depth；
Drilling reprocessing: based on depth test as a result, terminate to drill if depth is up to standard, otherwise repeatedly drilling processing
With depth test step until drilling depth is up to standard.
Further, face induction depth setting specifically includes following sub-step:
S01: region division is carried out to PCB circuit board to be processed according to the depth that the position of drilling drills together；
S02: being numbered the region of division, and face induction depth parameter is respectively set to each region.
Further, following sub-step is specifically included in the drilling processing step:
S11: setting drilling machine drilling depth a reference value simultaneously starts drilling machine and makes it into bore state；
S12: drilling depth is detected based on face induction technology and will test result and be sent to drilling machine；
S13: the drilling depth that will test is compared with a reference value, and drilling is controlled when drilling depth approaches a reference value
Machine revolving speed makes it into slow machining state.
Further, described to refer to that drilling depth is less than the range of a reference value when drilling depth approaches a reference value
Between 0.1-0.5 microns.
Further, using face induction technology is specifically included in the depth test step carries out drilling depth detection,
Its detection accuracy is ± 0.05 micron.
Further, further include an examination and test of products step, the PCB circuit board batch after processing is placed on conveyer belt
It send to monitor station, the monitor station is placed under the induction detection of face, brill of the using face induction technology to the PCB circuit board after processing
Hole depth carries out batch detection.
Further, the conveyer belt is controlled by travel switch, and the PCB circuit board after processing is sent to row after monitor station
Journey switch control conveyer belt stops and enters detecting state, and detection time is 3-5 seconds.
It further, further include coloring spray gun, the coloring spray gun is mounted on monitor station side, when detecting unqualified production
Coloring spray gun is controlled by controller when product, coloured marking is carried out to the substandard product.
Further, the colorant in the coloring spray gun is toner, is soluble in organic solvent.
The beneficial effects of the present invention are: carrying out zonal drilling to PCB circuit board by face induction technology in the present invention
Depth detection simplifies multiple sensors the detection parameters data caused by single detection that drill, so that the control of drilling machine becomes
It obtains and more simplifies, enhance control of the drilling machine to drill bit, its borehole accuracy is made to get a promotion.
Detailed description of the invention
Fig. 1 is flow chart of the invention.
Specific embodiment
Technical solution of the present invention is described in further detail with reference to the accompanying drawing, but protection scope of the present invention is not limited to
It is as described below.
As shown in Figure 1,
PCB circuit board bore process based on face induction technology comprising following steps:
Machine side inspection: checking drilling machine work top, guarantees that work top is flat and smooth；Remove the particle on workbench
Object adjusts the levelness of workbench, closer to abswolute level, if cannot reach abswolute level measurement outlet error, mark
Remember non-data A.
Substrate is fixed: PCB circuit board to be processed is placed and is fixed on the table and with pin, when fixed by pair
Linea angulata is fixed；
Working position setting: setting drilling machining position parameter, and setting drill point position；
Face incudes depth setting: face is arranged according to drilling depth and incudes depth parameter, works according in machine side checking step
Parameter is arranged in the levelness of table top, and combined data A carries out parameter compensation setting；
Drilling processing: starting drilling machine carries out drilling processing after completing above-mentioned steps, and using face incudes skill in process
Art continues to monitor drilling depth；
Depth test: stop borehole test drilling depth；
Drilling reprocessing: based on depth test as a result, terminate to drill if depth is up to standard, otherwise repeatedly drilling processing
With depth test step until drilling depth is up to standard.
Further, face induction depth setting specifically includes following sub-step:
S01: region division is carried out to PCB circuit board to be processed according to the depth that the position of drilling drills together；
S02: being numbered the region of division, and face induction depth parameter is respectively set to each region.
Further, following sub-step is specifically included in the drilling processing step:
S11: setting drilling machine drilling depth a reference value simultaneously starts drilling machine and makes it into bore state；
S12: drilling depth is detected based on face induction technology and will test result and be sent to drilling machine；
S13: the drilling depth that will test is compared with a reference value, and drilling is controlled when drilling depth approaches a reference value
Machine revolving speed makes it into slow machining state.
Further, described to refer to that drilling depth is less than the range of a reference value when drilling depth approaches a reference value
Between 0.1-0.5 microns.
Further, using face induction technology is specifically included in the depth test step carries out drilling depth detection,
Its detection accuracy is ± 0.05 micron.
Further, further include an examination and test of products step, the PCB circuit board batch after processing is placed on conveyer belt
It send to monitor station, the monitor station is placed under the induction detection of face, brill of the using face induction technology to the PCB circuit board after processing
Hole depth carries out batch detection.
Further, the conveyer belt is controlled by travel switch, and the PCB circuit board after processing is sent to row after monitor station
Journey switch control conveyer belt stops and enters detecting state, and detection time is 3-5 seconds.
It further, further include coloring spray gun, the coloring spray gun is mounted on monitor station side, when detecting unqualified production
Coloring spray gun is controlled by controller when product, coloured marking is carried out to the substandard product.
Further, the colorant in the coloring spray gun is toner, is soluble in organic solvent.
The above is only a preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and can be at this
In the text contemplated scope, modifications can be made through the above teachings or related fields of technology or knowledge.And those skilled in the art institute into
Capable modifications and changes do not depart from the spirit and scope of the present invention, then all should be in the protection scope of appended claims of the present invention
It is interior.
Claims (9)
1. the PCB circuit board bore process based on face induction technology, it is characterised in that the following steps are included:
Machine side inspection: checking drilling machine work top, guarantees that work top is flat and smooth；
Substrate is fixed: PCB circuit board placement to be processed is fixed on the table and with pin；
Working position setting: setting drilling machining position parameter；
Face incudes depth setting: face is arranged according to drilling depth and incudes depth parameter；
Drilling processing: starting drilling machine carries out drilling processing after completing above-mentioned steps, and using face induction technology is held in process
Continuous monitoring drilling depth；
Depth test: stop borehole test drilling depth；
Drilling reprocessing: based on depth test as a result, terminate to drill if depth is up to standard, otherwise repeatedly drilling processing and depth
Testing procedure is spent until drilling depth is up to standard.
2. the PCB circuit board bore process according to claim 1 based on face induction technology, it is characterised in that: described
Induction depth setting in face specifically includes following sub-step:
S01: region division is carried out to PCB circuit board to be processed according to the depth that the position of drilling drills together；
S02: being numbered the region of division, and face induction depth parameter is respectively set to each region, and face incudes depth ginseng
Number is that inductor initial parameter in face subtracts drilling depth.
3. the PCB circuit board bore process according to claim 1 based on face induction technology, it is characterised in that: described
Following sub-step is specifically included in drilling processing step:
S11: setting drilling machine drilling depth a reference value simultaneously starts drilling machine and makes it into bore state；
S12: drilling depth is detected based on face induction technology and will test result and be sent to drilling machine；
S13: the drilling depth that will test is compared with a reference value, and drilling machine is controlled when drilling depth approaches a reference value and is turned
Speed makes it into slow machining state.
4. the PCB circuit board bore process according to claim 3 based on face induction technology, it is characterised in that: described
The range for referring to that drilling depth is less than a reference value when drilling depth approaches a reference value is between 0.1-0.5 microns.
5. the PCB circuit board bore process according to claim 1 based on face induction technology, it is characterised in that: described
Using face induction technology is specifically included in depth test step and carries out drilling depth detection, and detection accuracy is ± 0.05 micron.
6. the PCB circuit board bore process according to any one of claims 1-5 based on face induction technology, feature exist
In: further include an examination and test of products step, the PCB circuit board batch after processing is placed on conveyer belt and is sent to monitor station, it is described
Monitor station is placed under the induction detection of face, and using face induction technology carries out batch to the drilling depth of the PCB circuit board after processing
Detection.
7. the PCB circuit board bore process according to claim 6 based on face induction technology, it is characterised in that: the biography
Band is sent to be controlled by travel switch, travel switch control conveyer belt stops simultaneously after the PCB circuit board after processing is sent to monitor station
Into detecting state, detection time is 3-5 seconds.
8. the PCB circuit board bore process according to claim 7 based on face induction technology, it is characterised in that: further include
Spray gun is coloured, the coloring spray gun is mounted on monitor station side, controls coloring spray by controller when detecting substandard product
Rifle carries out coloured marking to the substandard product.
9. the PCB circuit board bore process according to claim 8 based on face induction technology, it is characterised in that: described
Colorant in color spray gun is toner, is soluble in organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710532349.3A CN107148149B (en) | 2017-07-03 | 2017-07-03 | PCB circuit board bore process based on face induction technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710532349.3A CN107148149B (en) | 2017-07-03 | 2017-07-03 | PCB circuit board bore process based on face induction technology |
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| Publication Number | Publication Date |
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| CN107148149A CN107148149A (en) | 2017-09-08 |
| CN107148149B true CN107148149B (en) | 2019-07-16 |
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| CN201710532349.3A Active CN107148149B (en) | 2017-07-03 | 2017-07-03 | PCB circuit board bore process based on face induction technology |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161048B (en) * | 2018-02-23 | 2020-08-04 | 江西志浩电子科技有限公司 | Integrated PCB automatic drilling method |
| CN110893629B (en) * | 2018-09-13 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Method for manufacturing circuit board and drilling machine |
| CN112449495B (en) * | 2019-08-27 | 2021-11-30 | 南通深南电路有限公司 | Drilling detection method and drilling detection equipment |
| CN111787699A (en) * | 2020-07-13 | 2020-10-16 | 深圳市鹰眼在线电子科技有限公司 | Punching method of printed circuit board and method for detecting qualification |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5691762B2 (en) * | 2011-04-11 | 2015-04-01 | 日本電気株式会社 | Method for manufacturing printed circuit board |
| CN102883522B (en) * | 2012-09-28 | 2015-08-26 | 华为技术有限公司 | The boring method of printed circuit board (PCB), printed circuit board (PCB) and device |
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Effective date of registration: 20200117 Address after: 610000 4 / F, block a, building 5, No. 200, Tianfu 5th Street, Chengdu hi tech Zone, China (Sichuan) pilot Free Trade Zone, Chengdu Patentee after: Chengdu weishikai Technology Co., Ltd Address before: 629000 No. 1, South Airport Road, Chuangxin Industrial Park, Suining, Sichuan Patentee before: Wesky (Suining) Electronics Co., Ltd. |