CN106231784B - The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board - Google Patents
The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board Download PDFInfo
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- CN106231784B CN106231784B CN201610662620.0A CN201610662620A CN106231784B CN 106231784 B CN106231784 B CN 106231784B CN 201610662620 A CN201610662620 A CN 201610662620A CN 106231784 B CN106231784 B CN 106231784B
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- printed circuit
- circuit board
- groove milling
- instrument connection
- leakproof
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The present invention relates to the manufacturing method technical fields of printed circuit board, more particularly to the leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board, the leakproof milling groove structure of printed circuit board, leakproof groove milling detection is carried out to it by test fixture, the test fixture includes two testing needles, including printed circuit board, the surface of the printed circuit board is equipped with groove milling region, sets that there are two for being correspondingly connected with two testing needles to carry out the instrument connection of energization test on the inside of the both ends of the length direction in the groove milling region.The instrument connection that the layers of copper and setting that are formed in printed circuit board process is cleverly utilized in the leakproof milling groove structure of printed circuit board of the invention is used cooperatively, so as to quickly determine that whether the groove milling region of printed circuit board leakage groove milling occurs by test fixture, and then leakproof groove milling can be played the role of.
Description
Technical field
The present invention relates to the manufacturing method technical field of printed circuit board more particularly to the leakproof groove milling knots of printed circuit board
Structure and leakproof Xiyanping injection method.
Background technique
The process of production metallization slot is as follows in printed circuit board industry at present: drilling → groove milling → heavy copper plate electric → outer layer
Figure → graphic plating → etching → welding resistance → character → surface treatment → molding → test → shipment.In actual manufacturing process
In, because artificial carelessness it is regular be easy to appear leakage groove milling.And generally determine to print by the way of Manual Visual Inspection at present
Whether circuit board processed there is leakage groove milling, this kind of mode causes the printed circuit board of leakage groove milling to enter easily because of artificial missing inspection
To at client, so as to cause the complaint of client, and then the reputation of enterprise is influenced because of the quality problems of printed circuit board.
Summary of the invention
The purpose of the present invention is to provide a kind of leakproof milling groove structure of printed circuit board and leakproof Xiyanping injection method, purports
Easily there is the technical issues of leaking groove milling solving printed circuit board in the prior art.
To achieve the above object, the technical scheme is that a kind of leakproof milling groove structure of printed circuit board, passes through survey
Examination jig carries out leakproof groove milling detection to it, and the test fixture includes two testing needles, including printed circuit board, the printing
The surface of circuit board is equipped with groove milling region, sets that there are two be used for and two on the inside of the both ends of the length direction in the groove milling region
The testing needle is correspondingly connected with to carry out the instrument connection of energization test.
Preferably, the distance between each instrument connection end in groove milling zone length direction adjacent thereto h >=
0.2mm。
Preferably, as the groove width H≤2.0mm in the groove milling region, the aperture D < 1.8mm of the instrument connection；When described
When the groove width H > 2.0mm in groove milling region, the aperture D=1.8mm of the instrument connection.
Beneficial effects of the present invention: the leakproof milling groove structure of printed circuit board of the invention, in the length side in groove milling region
To both ends on the inside of be respectively set an instrument connection, in this way can be in the subsequent Xiyanping injection process completed to groove milling region
Afterwards, it is docked in two instrument connections respectively by two testing needles of test fixture and carries out energization test；If groove milling region occurs
Groove milling is leaked, since the surface in groove milling region is after heavy copper plate electric, graphic plating, surface can plate copper and tin, in metallic tin
Under protection, the copper of groove milling region surface will not be etched in rear processing procedure, will pass through metallic copper between two such instrument connection
Connection forms short circuit, and short-circuit alarm occurs in test fixture；If groove milling region is by mill off, side wall will form metal layer, but
Since instrument connection has a small distance apart from groove milling wall, thus corresponding testing needle test to test hole site when will not encounter slot
Wall, not will form short circuit, and test fixture is not in short-circuit alarm.The leakproof milling groove structure of printed circuit board of the invention is ingenious
The instrument connection that the layers of copper and setting that are formed in printed circuit board process is utilized be used cooperatively, so as to pass through test
Jig quickly determines that whether the groove milling region of printed circuit board leakage groove milling occurs, and then can play the work of leakproof groove milling
With.
It is of the invention another solution is that a kind of leakproof Xiyanping injection method of printed circuit board, comprising the following steps:
S1: providing printed circuit board, sets groove milling region on a printed circuit board；
S2: it is drilled with an instrument connection respectively in the inside at the both ends of the length direction in the groove milling region；
S3: Xiyanping injection is carried out to the groove milling region；
S4: graphic plating is carried out to the printed circuit board for completing the Xiyanping injection；
S5: providing tool, there are two the test fixtures of testing needle, and two testing needles are respectively protruding into two surveys
In the hole location of prospect hole；
S6: judging whether the groove milling region occurs leaking the Xiyanping injection, if short-circuit alarm occurs for the test fixture,
Then the groove milling region does not complete the Xiyanping injection；If short-circuit alarm, the groove milling region do not occur for the test fixture
The Xiyanping injection is completed.
Further, in the step S3, lower cutter position and one of them described survey when carrying out the Xiyanping injection
Prospect hole alignment.
Further, in the step S3, feed rate when carrying out the Xiyanping injection is 0.3~0.4m/min.
Further, in the step S2, each instrument connection groove milling zone length direction adjacent thereto
The distance between end h >=0.2mm.
Further, in the step S2, as the groove width H≤2.0mm in the groove milling region, the hole of the instrument connection
Diameter D < 1.8mm；As the groove width H > 2.0mm in the groove milling region, the aperture D=1.8mm of the instrument connection.
Further, in the step S5, before the testing needle is stretched to the instrument connection, the test is first guided
Needle is moved to the position that the central axes of the testing needle are overlapped with the central axes of the instrument connection.
Further, in the step S5, the contraposition step of the testing needle and the instrument connection includes the following:
S5.1: it is projected in X-ray to the printed circuit board using laser, to measure the X-axis and Y of the instrument connection
The coordinate of axis；
S5.2: the top that the testing needle is moved to the instrument connection is controlled；
S5.3: it according to the coordinate of the X-axis for the instrument connection measured and Y-axis, controls the testing needle and further moves
To the position being overlapped with the coordinate of the X-axis of the instrument connection and Y-axis, so that the central axes of the testing needle and the instrument connection
Central axes be overlapped.
The leakproof Xiyanping injection method of printed circuit board of the invention, first in the groove milling region of printed circuit board setting
The inside at the both ends of length direction opens up an instrument connection respectively, then by surveying two of test fixture in subsequent handling
Test point is docked in two instrument connections respectively and carries out energization test；If there is leakage groove milling in groove milling region, due to the table in groove milling region
After heavy copper plate electric, graphic plating, surface can plate copper and tin in face, under the protection of metallic tin, the copper of groove milling region surface
It will not be etched in rear processing procedure, will connect to form short circuit by metallic copper between two such instrument connection, test fixture goes out
Existing short circuit alarm；If groove milling region, by if mill off, side wall will form metal layer, but since instrument connection apart from groove milling wall has one
Segment distance, so the test of corresponding testing needle not will form short circuit, test fixture to that will not encounter cell wall when testing hole site
It is not in short-circuit alarm.The leakproof Xiyanping injection method of printed circuit board of the invention is cleverly utilized printed circuit board and adds
The instrument connection of the layers of copper and setting that are formed during work is used cooperatively, so as to quickly determine that printing by test fixture
Whether the groove milling region of circuit board there is leakage groove milling, and then can play the role of leakproof groove milling.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the leakproof milling groove structure of printed circuit board provided in an embodiment of the present invention.
Fig. 2 is that the structure that the leakproof milling groove structure of printed circuit board provided in an embodiment of the present invention is connect with test fixture is shown
It is intended to.
Fig. 3 is the flow chart of the leakproof Xiyanping injection method of printed circuit board provided in an embodiment of the present invention.
Fig. 4 is in the leakproof Xiyanping injection method of printed circuit board provided in an embodiment of the present invention to testing needle and testing needle
Carry out the flow chart of alignment operation.
Appended drawing reference includes:
10-11-groove milling of printed circuit board region, 12-instrument connections
20-21-testing needles of test fixture.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment that Fig. 1~4 is described is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
As shown in Figure 1 to Figure 2, the leakproof milling groove structure of a kind of printed circuit board provided in an embodiment of the present invention, passes through survey
Examination jig 20 carries out leakproof groove milling detection to it, and the test fixture 20 includes two testing needles 21, including printed circuit board 10,
The surface of the printed circuit board 10 is equipped with groove milling region 11, and the inside at the both ends of the length direction in the groove milling region 11 is equipped with
Two for being correspondingly connected with two testing needles 21 to carry out the instrument connection 12 of energization test.
Specifically, the leakproof milling groove structure of the printed circuit board of the embodiment of the present invention, the length direction in groove milling region 11
Both ends on the inside of be respectively set an instrument connection 12, in this way can be in the subsequent Xiyanping injection process completed to groove milling region 11
Afterwards, it is docked in two instrument connections 12 respectively by two testing needles 21 of test fixture 20 and carries out energization test；If groove milling area
There is leakage groove milling in domain 11, and since the surface in groove milling region 11 is after heavy copper plate electric, graphic plating, surface can plate copper and tin,
Under the protection of metallic tin, the copper on 11 surface of groove milling region will not be etched in rear processing procedure, between two such instrument connection 12
It will connect to form short circuit by metallic copper, short-circuit alarm occurs in test fixture 20；If groove milling region 11 is by if mill off, side
Wall will form metal layer, but since instrument connection 12 apart from groove milling wall has a small distance, so the test of corresponding testing needle 21 is arrived
Cell wall will not be encountered when 12 position of instrument connection, not will form short circuit, and test fixture 20 is not in short-circuit alarm.
It is processed that printed circuit board 10 is cleverly utilized in the leakproof milling groove structure of the printed circuit board of the embodiment of the present invention
The instrument connection 12 of the layers of copper and setting that are formed in journey is used cooperatively, so as to quickly determine that printing by test fixture 20
Whether the groove milling region 11 of circuit board 10 there is leakage groove milling, and then can play the role of leakproof groove milling.
As shown in Figure 1, in the present embodiment, each instrument connection 12 11 length direction of groove milling region adjacent thereto
The distance between end h >=0.2mm.Specifically, this kind of structure can guarantee that instrument connection 12 will not lean on 11 length side of groove milling region
To end distance h it is too close, and the end of the length direction in groove milling region 11 bored when causing to be drilled with the instrument connection 12 and
Printed circuit board 10 is caused to be scrapped, in this way, ensuring that instrument connection 12 is in groove milling region 11 always, when to the groove milling
After normal Xiyanping injection process is completed in region 11, the instrument connection 12 is also by milling cutter mill off, to utilize the survey of test fixture 20
Test point 21 carries out energization test, between two testing needles 21 can not electrical shorts, and then whether may determine that groove milling region
11 there is leakage groove milling.
As shown in Figure 1, more specifically, between the end of each instrument connection 12 11 length direction of groove milling region adjacent thereto
Distance h can be 0.2mm, 0.3mm, 0.4mm or 0.5mm or more, can be in model according to the size for milling the groove milling region 11
It encloses to carry out being adapted in value and select.
As shown in Figure 1, in the present embodiment, as the groove width H≤2.0mm in the groove milling region 11, the instrument connection 12
Aperture D < 1.8mm；As groove width H≤2.0mm, groove milling region is influenced or exceeded in order to avoid the aperture of instrument connection 12 is excessive
The aperture of instrument connection 12 is set as D < 1.8mm by 11 boundary, so that instrument connection 12 normally plays its test
Function, and avoid causing printed circuit board 10 quality problems occur because the instrument connection 12 is provided with.Specifically, for example, working as
When the groove width H in groove milling region 11 is 2.0mm, 1.5mm or 1.0mm, the aperture of corresponding instrument connection 12 be can be set as
1.7mm, 1.2mm and 0.7mm.
As shown in Figure 1, in the present embodiment, as the groove width H > 2.0mm in the groove milling region 11, the instrument connection 12
Aperture D=1.8mm；Similarly, as groove width H > 2.0mm, in order to avoid the aperture of instrument connection 12 is too small and cutting pair for milling cutter is influenced
Position, the aperture of instrument connection 12 is set as D=1.8mm so that instrument connection 12 normally play its test function with
And it plays and positioning function effectively is carried out to milling cutter, and avoid because of the excessive influence in aperture or the side beyond groove milling region 11
Boundary, and printed circuit board 10 is caused quality problems occur.Specifically, for example, when groove milling region 11 groove width H be 2.1mm,
When 2.5mm 3.0mm, the aperture of corresponding instrument connection 12 is set as D=1.8mm.
As shown in figure 3, the embodiment of the invention also provides a kind of leakproof Xiyanping injection methods of printed circuit board, including with
Lower step:
S1: providing printed circuit board 10, and groove milling region 11 is set on printed circuit board 10；
S2: it is drilled with an instrument connection 12 respectively in the inside at the both ends of the length direction in the groove milling region 11；
S3: Xiyanping injection is carried out to the groove milling region 11 is completed；
S4: graphic plating is carried out to the printed circuit board 10 for completing Xiyanping injection；
S5: providing tool, there are two the test fixtures 20 of testing needle 21, and two testing needles 21 are respectively protruding into two
In the hole location of the instrument connection 12；
S6: judging whether the groove milling region 11 occurs leaking the Xiyanping injection, if short circuit occurs for the test fixture 20
Alarm, then the groove milling region 11 does not complete the Xiyanping injection；It is described if short-circuit alarm does not occur for the test fixture 20
The Xiyanping injection is completed in groove milling region 11.
The leakproof Xiyanping injection method of the printed circuit board of the embodiment of the present invention, the milling set first in printed circuit board 10
The inside at the both ends of the length direction in slot region 11 opens up an instrument connection 12 respectively, then by that will test in subsequent handling
Two testing needles 21 of jig 20, which are docked to respectively in two instrument connections 12, carries out energization test；If there is leakage milling in groove milling region 11
Slot, since the surface in groove milling region 11 is after heavy copper plate electric, graphic plating, surface can plate copper and tin, in the guarantor of metallic tin
Under shield, the copper on 11 surface of groove milling region will not be etched in rear processing procedure, will pass through metal between two such instrument connection 12
Copper connects to form short circuit, and short-circuit alarm occurs in test fixture 20；If groove milling region 11 is by mill off, side wall will form metal
Layer, but since instrument connection 12 apart from groove milling wall has a small distance, so 12 position of instrument connection is arrived in the test of corresponding testing needle 21
Shi Buhui encounters cell wall, not will form short circuit, and test fixture 20 is not in short-circuit alarm.
In the present embodiment, specifically, in the step S1, being milled first by being set on the surface of printed circuit board 10
Slot region 11 can carry out Xiyanping injection to the groove milling region 11 in this way in subsequent handling, both may be implemented to process setting
Metallic channel.
In the step S2, it is drilled with and is added on the inside of the both ends of the length direction in the groove milling region 11 of setting using drill
Work goes out instrument connection 12, and ensures that instrument connection 12 is located inside groove milling region 11, in this way can be to avoid drill to groove milling region 11
End edge causes to damage.
In the step S3, Milling Process is carried out to groove milling region 11 using milling cutter, when milling cutter is cut, with instrument connection 12
Milling cutter contraposition is carried out as location hole, reduces the processing of registration holes in this way, reduces manufacturing procedure, and the hole location of instrument connection 12
Setting, which needs to meet, carries out contraposition connection with the testing needle 21 of test fixture 20, therefore the position precision of instrument connection 12 is relatively high,
The locating effect of milling cutter is also just improved in this way, improves milling cutter to the precision of 11 milling of groove milling region, it is ensured that the gold processed
Belong to slot to meet the requirements, greatly improves the quality of product.
In the step S4, graphic plating can carry out increasing to the line pattern on printed circuit board 10 thickness of metal
The layers of copper that degree, the reliability that promotion circuitous pattern uses, and the graphic plating are formed, which whether there is, can also cooperate testing needle 21
It is ingenious in design to judge whether to process metallic channel.
In the step S5, if groove milling region 11 is normally fallen by milling cutter processing and milling, then testing needle 21 protrudes into correspondence
Instrument connection 12 hole location in when, the layers of copper of no graphic plating is contacted with testing needle 21；If groove milling region 11 is not by Xiyanping injection
Mill away, that is, occur leakage groove milling the phenomenon that when, testing needle 21 protrude into corresponding instrument connection 12 it is interior when, graphic plating formed test
Layers of copper on the hole wall in hole 12 contacts conducting with corresponding testing needle 21.
In the step S6, short circuit can not be formed between two testing needles 21, test fixture 20 is not in short-circuit police
Report, that is, can determine whether do not occur leakage groove milling；The layers of copper being formed in after two testing needles 21 and graphic plating on the hole wall of instrument connection 12
And the layers of copper contact being formed on groove milling region 11 is powered, and short circuit is formed between two testing needles 21, test fixture 20 can go out
Existing short circuit alarm, can judge leakage groove milling phenomenon occur, and judgement is quickly, practical.
The leakproof Xiyanping injection method of the printed circuit board of the embodiment of the present invention is cleverly utilized printed circuit board 10 and adds
The instrument connection 12 of the layers of copper and setting that are formed during work is used cooperatively, so as to be quickly determined that by test fixture 20
Whether the groove milling region 11 of printed circuit board 10 there is leakage groove milling, and then can play the role of leakproof groove milling.
In the present embodiment, further, in the step S3, lower cutter position when carrying out the Xiyanping injection with wherein
One instrument connection 12 is aligned.It tests whether to occur to make when leakage groove milling specifically, the setting of instrument connection 12 not only can be used as
With, when carrying out Xiyanping injection process, can be corresponded to for milling cutter, be dexterously utilized instrument connection 12 carry out milling cutter pair
Position promotes the speed of the Xiyanping injection of printed circuit board 10, additionally it is possible to greatly promote the machining accuracy to groove milling region 11.
In the present embodiment, further, in the step S3, feed rate when carrying out the Xiyanping injection is 0.3
~0.4m/min.Specifically, the feed rate within the scope of 0.3~0.4m/min of setting can carry out groove milling region 11 normally
Xiyanping injection process, and without printed circuit board 10 top increase cover board, the application of material is reduced, to groove milling region 11
Machining accuracy it is higher.
More specifically, feed rate when carrying out Xiyanping injection can be 0.3m/min, 0.35m/min or 0.4m/
Min can that is, according to different printed circuit boards 10, be selected in the range of rate is 0.3~0.4m/min according to the actual situation
It is fixed, it can satisfy the processing to the groove milling region 11 on printed circuit board 10 without using cover board.
As shown in Figure 1, further, in the step S2, each instrument connection 12 is adjacent thereto in the present embodiment
The distance between the end of 11 length direction of groove milling region h >=0.2mm.Specifically, by the step operation, it is ensured that
Instrument connection 12 will not lean on the distance h of the end of 11 length direction of groove milling region too close, and while causing to be drilled with the instrument connection 12 will milling
The end of the length direction in slot region 11 bores and printed circuit board 10 is caused to be scrapped, in this way, ensuring that instrument connection 12 begins
Eventually in groove milling region 11, after completing normal Xiyanping injection process to the groove milling region 11, the instrument connection 12 also by
Milling cutter mill off can not be powered short to carry out energization test using the testing needle 21 of test fixture 20 between two testing needles 21
Road, and then may determine that and whether leakage groove milling occur to groove milling region 11.
As shown in Figure 1, more specifically, each instrument connection 12 of step setting 11 length direction of groove milling region adjacent thereto
The distance between end h can be 0.2mm, 0.3mm, 0.4mm or 0.5mm or more, according to milling the groove milling region 11
It is selected that size can carry out adaptation in value range.
As shown in Figure 1, in the present embodiment, further, in the step S2, as the groove width H in the groove milling region 11
When≤2.0mm, the aperture D < 1.8mm of the instrument connection 12；As groove width H≤2.0mm, in order to avoid the aperture mistake of instrument connection 12
Influence or the boundary beyond groove milling region 11 greatly, are set as D < 1.8mm for the aperture of instrument connection 12, so that
Instrument connection 12 normally plays the function of its test, and avoids that printed circuit board 10 is caused to occur because the instrument connection 12 is provided with
Quality problems.Specifically, for example, when the groove width H in groove milling region 11 be 2.0mm, 1.5mm or 1.0mm when, corresponding instrument connection
12 aperture can be set as 1.7mm, 1.2mm and 0.7mm.
As shown in Figure 1, in the present embodiment, as the groove width H > 2.0mm in the groove milling region 11, the instrument connection 12
Aperture D=1.8mm；Similarly, as groove width H > 2.0mm, in order to avoid the aperture of instrument connection 12 is too small and cutting pair for milling cutter is influenced
Position, the aperture of instrument connection 12 is set as D=1.8mm so that instrument connection 12 normally play its test function with
And it plays and positioning function effectively is carried out to milling cutter, and avoid because of the excessive influence in aperture or the side beyond groove milling region 11
Boundary, and printed circuit board 10 is caused quality problems occur.Specifically, for example, when groove milling region 11 groove width H be 2.1mm,
When 2.5mm 3.0mm, the aperture of corresponding instrument connection 12 is set as D=1.8mm.
It should be further noted that the metallic channel processed on printed circuit board 10 to groove milling region 11 is perforative
Metallic channel.
As shown in figure 4, further, in the step S5, the testing needle 21 is stretched to described in the present embodiment
Before instrument connection 12, the testing needle 21 is first guided to be moved to the central axes of the testing needle 21 and the central axes of the instrument connection 12
The position of coincidence.Specifically, ensuring that testing needle 21 stretches to institute in this way by first aligning to testing needle 21 and instrument connection 12
When stating in instrument connection 12, it will not accidentally contact the other positions of printed circuit board 10, testing needle 21 thus can be effectively avoided
It causes testing needle 21 or printed circuit board 10 to damage because printed circuit board 10 is touched, guarantees that the safety of production carries out.
As shown in figure 4, in the present embodiment, further, in the step S5, the testing needle 21 and the instrument connection
12 contraposition step includes the following:
S5.1: being projected in X-ray to the printed circuit board 10 using laser (not shown), and mobile X-ray, to survey
Measure the X-axis of the instrument connection 12 and the coordinate of Y-axis；For example, the X-axis and Y-axis of the instrument connection 12 measured by laser
Coordinate is (2,2)；
S5.2: the top that the testing needle 21 is moved to the instrument connection 12 is controlled；First ensure mobile test needle 21 to print
The top of circuit board 10 processed is located at the top of instrument connection 12, rear in this way to stretch to testing needle 21 from top to bottom conducive to subsequent
In instrument connection 12；
S5.3: according to the coordinate of the X-axis for the instrument connection 12 measured and Y-axis, the testing needle 21 is controlled further
It is moved to the position being overlapped with the coordinate of the X-axis of the instrument connection 12 and Y-axis, so that the central axes of the testing needle 21 and institute
The central axes for stating instrument connection 12 are overlapped；Specifically, being (2,2) according to the coordinate of the X-axis of instrument connection 12 and Y-axis, by testing needle 21
The coordinate for being moved to X-axis and Y-axis is since testing needle 21 is in the top of instrument connection 12, to allow for surveying in this way on the position of (2,2)
Test point 21 is overlapped in the Z-axis direction with instrument connection 12, i.e., the central axes of testing needle 21 are overlapped with the central axes of instrument connection 12.
In this way, when controlling testing needle 21 again and stretching in instrument connection 12, it will be able to avoid testing needle 21 and printed circuit board
10 contacts, so as to avoid because testing needle 21 is contacted with printed circuit board 10 and causes printed circuit board 10 or testing needle
21 damage guarantees the safety and reliability of production.
Specifically, can manipulate testing needle 21 by multi-spindle machining hand be moved to the position of setting, multi-spindle machining hand can be with
It is three axle robert, four axis robots or five axis robots etc..
It certainly, in other embodiments, can also be directly logical in this way according to the figure of edge PTH hole, to make testing mould
Testing mould is crossed to ensure the contraposition of testing needle 21 Yu instrument connection.
In another example can also ensure the contraposition of testing needle 21 Yu instrument connection according to flying probe, i.e., according to printed circuit
Cursor point or location hole on plate are positioned, and then carry out electrical measurement to printed circuit board according to flying probe data figure
Examination.
The present invention known in summary is having above-described good characteristic, is able to enable it in use, is promoted previous
The efficiency that does not have in technology and there is practicability, become the product of a great practical value.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in think of of the invention
Want with any modification made within principle, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of leakproof milling groove structure of printed circuit board carries out leakproof groove milling detection, the test to it by test fixture
Jig includes two testing needles, which is characterized in that including printed circuit board, the surface of the printed circuit board is equipped with groove milling area
Domain, set on the inside of the both ends of the length direction in the groove milling region there are two for two testing needles be correspondingly connected with into
Row be powered test instrument connection, two instrument connections with the sidewall spacers in the groove milling region be arranged, two instrument connections with
The distance between its adjacent end in groove milling zone length direction h >=0.2mm.
2. the leakproof milling groove structure of printed circuit board according to claim 1, which is characterized in that when the groove milling region
When groove width H≤2.0mm, the aperture D < 1.8mm of the instrument connection；As the groove width H > 2.0mm in the groove milling region, the survey
The aperture D=1.8mm of prospect hole.
3. a kind of leakproof Xiyanping injection method of printed circuit board, which comprises the following steps:
S1: providing printed circuit board, sets groove milling region on a printed circuit board；
S2: it is drilled with an instrument connection respectively in the inside at the both ends of the length direction in the groove milling region, two instrument connections are equal
It is arranged with the sidewall spacers in the groove milling region, the end in two instrument connections groove milling zone length direction adjacent thereto
The distance between h >=0.2mm；
S3: Xiyanping injection is carried out to the groove milling region；
S4: graphic plating is carried out to the printed circuit board for completing the Xiyanping injection；
S5: providing tool, there are two the test fixtures of testing needle, and two testing needles are respectively protruding into two instrument connections
Hole location in；
S6: judging whether the groove milling region occurs leaking the Xiyanping injection, if short-circuit alarm, institute occur for the test fixture
It states groove milling region and does not complete the Xiyanping injection；If short-circuit alarm does not occur for the test fixture, the groove milling region is complete
At the Xiyanping injection.
4. the leakproof Xiyanping injection method of printed circuit board according to claim 3, which is characterized in that in the step S3
In, lower cutter position when carrying out the Xiyanping injection is aligned with instrument connection described in one of them.
5. the leakproof Xiyanping injection method of printed circuit board according to claim 3, which is characterized in that in the step S3
In, feed rate when carrying out the Xiyanping injection is 0.3~0.4m/min.
6. according to the leakproof Xiyanping injection method of the described in any item printed circuit boards of claim 3~5, which is characterized in that
In the step S2, as the groove width H≤2.0mm in the groove milling region, the aperture D < 1.8mm of the instrument connection；When the milling
When the groove width H > 2.0mm in slot region, the aperture D=1.8mm of the instrument connection.
7. according to the leakproof Xiyanping injection method of the described in any item printed circuit boards of claim 3~5, which is characterized in that
In the step S5, before the testing needle is stretched to the instrument connection, the testing needle is first guided to be moved to the testing needle
The position that is overlapped with the central axes of the instrument connection of central axes.
8. the leakproof Xiyanping injection method of printed circuit board according to claim 7, which is characterized in that in the step S5
In, the contraposition step of the testing needle and the instrument connection includes the following:
S5.1: being projected in X-ray to the printed circuit board using laser, to measure the X-axis and Y-axis of the instrument connection
Coordinate；
S5.2: the top that the testing needle is moved to the instrument connection is controlled；
S5.3: according to the coordinate of the X-axis for the instrument connection measured and Y-axis, control the testing needle move further into
The position that the X-axis of the instrument connection and the coordinate of Y-axis are overlapped, so that in the central axes of the testing needle and the instrument connection
Axis is overlapped.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610662620.0A CN106231784B (en) | 2016-08-12 | 2016-08-12 | The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board |
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| CN201610662620.0A CN106231784B (en) | 2016-08-12 | 2016-08-12 | The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board |
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| CN106231784B true CN106231784B (en) | 2019-04-02 |
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| CN107414152A (en) * | 2017-09-05 | 2017-12-01 | 梅州市志浩电子科技有限公司 | A kind of processing method of the strip gong groove of PCB |
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|---|---|---|---|---|
| CN203117344U (en) * | 2013-02-02 | 2013-08-07 | 汕头超声印制板公司 | On/off tester capable of detecting omitted hole |
| CN103308728A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Testing jig |
| CN204795846U (en) * | 2015-07-10 | 2015-11-18 | 胜宏科技（惠州）股份有限公司 | Prevent that circuit board from leaking gong plate structure |
| CN105228358A (en) * | 2015-10-23 | 2016-01-06 | 胜宏科技（惠州）股份有限公司 | A kind of method stopping wiring board gong groove leakage gong |
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2016
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103308728A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Testing jig |
| CN203117344U (en) * | 2013-02-02 | 2013-08-07 | 汕头超声印制板公司 | On/off tester capable of detecting omitted hole |
| CN204795846U (en) * | 2015-07-10 | 2015-11-18 | 胜宏科技（惠州）股份有限公司 | Prevent that circuit board from leaking gong plate structure |
| CN105228358A (en) * | 2015-10-23 | 2016-01-06 | 胜宏科技（惠州）股份有限公司 | A kind of method stopping wiring board gong groove leakage gong |
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Effective date of registration: 20210810 Address after: 116000 the Great Wall Road, Changxing Island Economic Zone, Dalian, Liaoning 108 Patentee after: DALIAN SUNTAK ELECTRONICS Co.,Ltd. Address before: 529000 Lian Hai Road 363, Jiangmen high tech Zone, Guangdong Province Patentee before: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY Co.,Ltd. |