CN106231784A - The leakproof milling groove structure of printed circuit board and leakproof Xiyanping injection method - Google Patents
The leakproof milling groove structure of printed circuit board and leakproof Xiyanping injection method Download PDFInfo
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- CN106231784A CN106231784A CN201610662620.0A CN201610662620A CN106231784A CN 106231784 A CN106231784 A CN 106231784A CN 201610662620 A CN201610662620 A CN 201610662620A CN 106231784 A CN106231784 A CN 106231784A
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- China
- Prior art keywords
- circuit board
- printed circuit
- instrument connection
- leakproof
- groove milling
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The present invention relates to the manufacture method technical field of printed circuit board, particularly relate to leakproof milling groove structure and the leakproof Xiyanping injection method of printed circuit board, the leakproof milling groove structure of printed circuit board, by measurement jig, it is carried out leakproof groove milling detection, described measurement jig includes two testing needles, including printed circuit board, the surface of described printed circuit board is provided with groove milling region, and the inner side at the two ends of the length direction in described groove milling region is provided with two and connects to carry out the instrument connection of energising test for corresponding with two described testing needles.The leakproof milling groove structure of the printed circuit board of the present invention make use of cleverly the instrument connection of the layers of copper and the setting that are formed in the printed circuit board course of processing with the use of, it is thus possible to quickly determine that whether the groove milling region of printed circuit board leakage groove milling occurs by measurement jig, and then the effect of leakproof groove milling can be played.
Description
Technical field
The present invention relates to the manufacture method technical field of printed circuit board, particularly relate to the leakproof groove milling knot of printed circuit board
Structure and leakproof Xiyanping injection method.
Background technology
The flow process making metallization groove at present in printed circuit board industry is as follows: boring → groove milling → sink copper plate electric → outer layer
Figure → graphic plating → etching → welding resistance → character → surface process → molding → test → shipment.In actual manufacturing process
In, because of the easily appearance leakage groove milling that artificial carelessness is regular.And the most typically use the mode of Manual Visual Inspection to judge print
Whether circuit board processed there is leakage groove milling, and this kind of mode is easily because of artificial missing inspection, and causes the printed circuit board of Lou groove milling to enter
At client, thus cause the complaint of client, and then affect the reputation of enterprise because of the quality problems of printed circuit board.
Summary of the invention
It is an object of the invention to provide leakproof milling groove structure and leakproof Xiyanping injection method, the purport of a kind of printed circuit board
Easily there is leaking the technical problem of groove milling at solution printed circuit board of the prior art.
For achieving the above object, the technical scheme is that the leakproof milling groove structure of a kind of printed circuit board, by surveying
Examination tool carries out leakproof groove milling detection to it, and described measurement jig includes two testing needles, including printed circuit board, described printing
The surface of circuit board is provided with groove milling region, the inner side at the two ends of the length direction in described groove milling region be provided with two for two
Described testing needle correspondence connects to carry out the instrument connection of energising test.
Preferably, distance h between the end in the described groove milling zone length direction that each described instrument connection is adjacent >=
0.2mm。
Preferably, as the groove width H≤2.0mm in described groove milling region, the aperture D ＜ 1.8mm of described instrument connection；When described
During the groove width H ＞ 2.0mm in groove milling region, the aperture D=1.8mm of described instrument connection.
Beneficial effects of the present invention: the leakproof milling groove structure of the printed circuit board of the present invention, in the length side in groove milling region
To the inner side at two ends be respectively provided with an instrument connection, so can complete the Xiyanping injection operation to groove milling region follow-up
After, carry out energising test in being docked to two instrument connections respectively by the two of measurement jig testing needles；If groove milling region occurs
Leakage groove milling, owing to the surface in groove milling region is after sink copper plate electric, graphic plating, surface can plate copper and tin, at metallic tin
Under protection, the copper of groove milling region surface will not be etched at rear processing procedure, will pass through metallic copper between two such instrument connection
Connecting and form short circuit, there is short circuit alarm in measurement jig；If groove milling region is by if mill off, its sidewall can form metal level, but
Owing to instrument connection distance groove milling wall has a small distance, so will not encounter groove when the testing needle of correspondence tests instrument connection position
Wall, will not form short circuit, and measurement jig does not haves short circuit alarm.The leakproof milling groove structure of the printed circuit board of the present invention is ingenious
Make use of the instrument connection of the layers of copper and the setting that are formed in the printed circuit board course of processing with the use of such that it is able to by test
Tool quickly determines that whether the groove milling region of printed circuit board leakage groove milling occurs, and then can play the work of leakproof groove milling
With.
A kind of leakproof Xiyanping injection method that another solution is that printed circuit board of the present invention, comprises the following steps:
S1: printed circuit board is provided, sets groove milling region on a printed circuit board；
S2: be drilled with an instrument connection respectively in the inner side at the two ends of the length direction in described groove milling region；
S3: described groove milling region is carried out Xiyanping injection；
S4: the described printed circuit board completing described Xiyanping injection is carried out graphic plating；
S5: the measurement jig with two testing needles is provided, and two described testing needles are respectively protruding into two described surveys
In the position, hole of prospect hole；
S6: judge whether described groove milling region occurs leaking described Xiyanping injection, the alarm if described measurement jig is short-circuited,
The most described groove milling region is not fully complete described Xiyanping injection；The alarm if described measurement jig is not short-circuited, the most described groove milling region
Complete described Xiyanping injection.
Further, in described step S3, lower cutter position when carrying out described Xiyanping injection and one of them described survey
Prospect hole aligns.
Further, in described step S3, feed speed when carrying out described Xiyanping injection is 0.3～0.4m/min.
Further, in described step S2, the described groove milling zone length direction that each described instrument connection is adjacent
Distance h between end >=0.2mm.
Further, in described step S2, as the groove width H≤2.0mm in described groove milling region, the hole of described instrument connection
Footpath D ＜ 1.8mm；As the groove width H ＞ 2.0mm in described groove milling region, the aperture D=1.8mm of described instrument connection.
Further, in described step S5, before described testing needle is stretched to described instrument connection, first guide described test
Pin moves the position overlapped to the axis of described testing needle and the axis of described instrument connection.
Further, in described step S5, described testing needle includes the following: with the para-position step of described instrument connection
S5.1: in employing laser instrument injection X-ray to described printed circuit board, to measure X-axis and the Y of described instrument connection
The coordinate of axle；
S5.2: control described testing needle and move the top to described instrument connection；
S5.3: according to X-axis and the coordinate of Y-axis of the described instrument connection measured, control described testing needle and move further
To the position overlapped with the X-axis of described instrument connection and the coordinate of Y-axis, so that the axis of described testing needle and described instrument connection
Axis overlap.
The leakproof Xiyanping injection method of the printed circuit board of the present invention, the groove milling region first set at printed circuit board
The inner side at the two ends of length direction offers an instrument connection respectively, then by by the two of measurement jig surveys in subsequent handling
Test point carries out energising test in being docked to two instrument connections respectively；If there is leakage groove milling in groove milling region, due to the table in groove milling region
Face is after sink copper plate electric, graphic plating, and surface can plate copper and tin, under the protection of metallic tin, and the copper of groove milling region surface
Will not be etched at rear processing procedure, will be connected by metallic copper between two such instrument connection and form short circuit, measurement jig goes out
Existing short circuit alarm；If groove milling region is by if mill off, its sidewall can form metal level, but owing to instrument connection distance groove milling wall has one
Little segment distance, so will not encounter cell wall when the testing needle of correspondence tests instrument connection position, will not form short circuit, measurement jig
Do not have short circuit alarm.The leakproof Xiyanping injection method of the printed circuit board of the present invention make use of printed circuit board to add cleverly
The instrument connection of the layers of copper and the setting that are formed during work with the use of such that it is able to quickly determine that printing by measurement jig
Whether the groove milling region of circuit board there is leakage groove milling, and then can play the effect of leakproof groove milling.
Accompanying drawing explanation
The structural representation of the leakproof milling groove structure of the printed circuit board that Fig. 1 provides for the embodiment of the present invention.
The structure that the leakproof milling groove structure of the printed circuit board that Fig. 2 provides for the embodiment of the present invention is connected with measurement jig is shown
It is intended to.
The flow chart of the leakproof Xiyanping injection method of the printed circuit board that Fig. 3 provides for the embodiment of the present invention.
To testing needle and testing needle in the leakproof Xiyanping injection method of the printed circuit board that Fig. 4 provides for the embodiment of the present invention
Carry out the flow chart of alignment operation.
Reference includes:
10 printed circuit board 11 groove milling region 12 instrument connections
20 measurement jig 21 testing needles.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that Fig. 1～4 describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " length ", " width ", " on ", D score, "front", "rear",
The orientation of the instruction such as "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward " or position relationship are for based on accompanying drawing institute
The orientation shown or position relationship, be for only for ease of and describe the present invention and simplify description rather than instruction or the dress of hint indication
Put or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limit to the present invention
System.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In describing the invention, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, in can being two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can be according to concrete feelings
Condition understands above-mentioned term concrete meaning in the present invention.
As shown in Figure 1 to Figure 2, the leakproof milling groove structure of a kind of printed circuit board that the embodiment of the present invention provides, by surveying
Examination tool 20 carries out leakproof groove milling detection to it, and described measurement jig 20 includes two testing needles 21, including printed circuit board 10,
The surface of described printed circuit board 10 is provided with groove milling region 11, and the inner side at the two ends of the length direction in described groove milling region 11 is provided with
Two are used for two corresponding connections of described testing needle 21 to carry out the instrument connection 12 of energising test.
Concrete, the leakproof milling groove structure of the printed circuit board of the embodiment of the present invention, at the length direction in groove milling region 11
The inner side at two ends be respectively provided with an instrument connection 12, so can complete the Xiyanping injection operation to groove milling region 11 follow-up
After, carry out energising test in being docked to two instrument connections 12 respectively by two testing needles 21 of measurement jig 20；If groove milling district
There is leakage groove milling in territory 11, and owing to the surface in groove milling region 11 is after sink copper plate electric, graphic plating, surface can plate copper and tin,
Under the protection of metallic tin, the copper on surface, groove milling region 11 will not be etched at rear processing procedure, between two such instrument connection 12
Will be connected by metallic copper and form short circuit, there is short-circuit alarm in measurement jig 20；If groove milling region 11 is by if mill off, its side
Wall can form metal level, but owing to instrument connection 12 has a small distance apart from groove milling wall, so testing needle 21 test of correspondence is arrived
Will not encounter cell wall during instrument connection 12 position, will not form short circuit, measurement jig 20 does not haves short circuit alarm.
The leakproof milling groove structure of the printed circuit board of the embodiment of the present invention make use of printed circuit board 10 processed cleverly
The instrument connection 12 of the layers of copper and the setting that are formed in journey with the use of such that it is able to quickly determine that printing by measurement jig 20
Whether the groove milling region 11 of circuit board 10 there is leakage groove milling, and then can play the effect of leakproof groove milling.
As it is shown in figure 1, in the present embodiment, described groove milling region 11 length direction that each described instrument connection 12 is adjacent
Distance h between end >=0.2mm.Concrete, this kind of structure can ensure that instrument connection 12 will not lean on groove milling region 11 length side
To distance h of end too near, and cause when being drilled with this instrument connection 12 end of the length direction by groove milling region 11 to bore and
Printed circuit board 10 is caused to be scrapped, so, it becomes possible to guarantee that instrument connection 12 is in groove milling region 11 all the time, when to this groove milling
After region 11 completes normal Xiyanping injection operation, this instrument connection 12 is also by milling cutter mill off, thus utilizes the survey of measurement jig 20
Test point 21 carries out energising test, between two testing needles 21 cannot electrical shorts, and then whether may determine that to groove milling region
11 there is leakage groove milling.
As it is shown in figure 1, more specifically, between the end of groove milling region 11 length direction that each instrument connection 12 is adjacent
Distance h can be 0.2mm, 0.3mm, 0.4mm or more than 0.5mm, can be at model according to the size in groove milling region 11 described in milling
Carry out adaptive selected in enclosing value.
As it is shown in figure 1, in the present embodiment, as the groove width H≤2.0mm in described groove milling region 11, described instrument connection 12
Aperture D ＜ 1.8mm；As groove width H≤2.0mm, in order to avoid the aperture of instrument connection 12 is excessive and affect or beyond groove milling region
The border of 11, is set as D ＜ 1.8mm by the aperture of instrument connection 12 such that it is able to make instrument connection 12 normally play its test
Function, avoids again causing printed circuit board 10 quality problems occur because being provided with this instrument connection 12.Concrete, such as, when
When groove width H in groove milling region 11 is 2.0mm, 1.5mm or 1.0mm, the aperture of corresponding instrument connection 12 can be set as
1.7mm, 1.2mm and 0.7mm.
As it is shown in figure 1, in the present embodiment, as the groove width H ＞ 2.0mm in described groove milling region 11, described instrument connection 12
Aperture D=1.8mm；In like manner, as groove width H ＞ 2.0mm, in order to avoid the aperture of instrument connection 12 is the least and the lower cutter pair of milling cutter is affected
Position, the aperture of instrument connection 12 is set as D=1.8mm such that it is able to make instrument connection 12 normally play its test function with
And play milling cutter is carried out positioning function effectively, avoid again because the excessive impact in aperture or the limit beyond groove milling region 11
Boundary, and cause printed circuit board 10 that quality problems occur.Concrete, such as, when groove width H in groove milling region 11 be 2.1mm,
During 2.5mm or 3.0mm, the aperture of corresponding instrument connection 12 is set as D=1.8mm.
As it is shown on figure 3, the embodiment of the present invention additionally provides a kind of leakproof Xiyanping injection method of printed circuit board, including with
Lower step:
S1: provide printed circuit board 10, sets groove milling region 11 on printed circuit board 10；
S2: be drilled with an instrument connection 12 respectively in the inner side at the two ends of the length direction in described groove milling region 11；
S3: carry out Xiyanping injection to completing described groove milling region 11；
S4: the described printed circuit board 10 completing Xiyanping injection is carried out graphic plating；
S5: the measurement jig 20 with two testing needles 21 is provided, and two described testing needles 21 are respectively protruding into two
In the position, hole of described instrument connection 12；
S6: judge whether described groove milling region 11 occurs leaking described Xiyanping injection, if described measurement jig 20 is short-circuited
Alarm, the most described groove milling region 11 is not fully complete described Xiyanping injection；The alarm if described measurement jig 20 is not short-circuited, then described
Groove milling region 11 has completed described Xiyanping injection.
The leakproof Xiyanping injection method of the printed circuit board of the embodiment of the present invention, the milling first set at printed circuit board 10
The inner side at the two ends of the length direction in groove region 11 offers an instrument connection 12 respectively, then by testing in subsequent handling
Two testing needles 21 of tool 20 carry out energising test in being docked to two instrument connections 12 respectively；If there is leakage milling in groove milling region 11
Groove, owing to the surface in groove milling region 11 is after sink copper plate electric, graphic plating, surface can plate copper and tin, the guarantor of metallic tin
Protecting down, the copper on surface, groove milling region 11 will not be etched at rear processing procedure, will pass through metal between two such instrument connection 12
Copper connects formation short circuit, and short-circuit alarm occurs in measurement jig 20；If groove milling region 11 is by if mill off, its sidewall can form metal
Layer, but owing to instrument connection 12 has a small distance apart from groove milling wall, so testing needle 21 test of correspondence is to instrument connection 12 position
Shi Buhui encounters cell wall, will not form short circuit, and measurement jig 20 does not haves short circuit alarm.
In the present embodiment, concrete, in described step S1, first pass through setting milling on the surface of printed circuit board 10
Groove region 11, so can carry out Xiyanping injection to this groove milling region 11 in subsequent handling, both can realize processing setting
Metallic channel.
In described step S2, use drill to be drilled with in the inner side at the two ends of the length direction in the groove milling region 11 set and add
Work goes out instrument connection 12, and it is internal to guarantee that instrument connection 12 is positioned at groove milling region 11, and drill so can be avoided groove milling region 11
End edge causes damage.
In described step S3, milling cutter is used groove milling region 11 to be carried out Milling Process, under milling cutter during cutter, with instrument connection 12
Carry out milling cutter para-position as hole, location, which reduce the processing of registration holes, decrease manufacturing procedure, and the position, hole of instrument connection 12
Setting to need to meet and carry out para-position with the testing needle 21 of measurement jig 20 and be connected, therefore the positional precision of instrument connection 12 is higher,
The most just improve the locating effect of milling cutter, improve the milling cutter precision to groove milling region 11 milling, it is ensured that the gold processed
Belong to groove to meet the requirements, be greatly improved the quality of product.
In described step S4, graphic plating can carry out increasing the thickness of metal to the line pattern on printed circuit board 10
Whether the layers of copper that degree, the reliability that lifting circuitous pattern uses, and this graphic plating are formed exists can also coordinate testing needle 21
To judge whether to process metallic channel, design ingenious.
In described step S5, if groove milling region 11 is normally fallen by milling cutter processing and milling, then testing needle 21 stretches into correspondence
Instrument connection 12 position, hole in time, the layers of copper without graphic plating contacts with testing needle 21；If groove milling region 11 is not by Xiyanping injection
Mill away, i.e. occur leakage groove milling phenomenon time, testing needle 21 stretch into correspondence instrument connection 12 interior time, graphic plating formed test
Layers of copper on the hole wall in hole 12 contacts conducting with corresponding testing needle 21.
In described step S6, cannot form short circuit between two testing needles 21, it is alert that measurement jig 20 does not haves short circuit
Report, i.e. can determine whether leakage groove milling do not occur；Two testing needles 21 are formed at the layers of copper on the hole wall of instrument connection 12 after graphic plating
And the layers of copper contact energising being formed on groove milling region 11, forming short circuit between two testing needles 21, measurement jig 20 can go out
Existing short circuit alarm, can judge leakage groove milling phenomenon occur, it is judged that quickly, practical.
The leakproof Xiyanping injection method of the printed circuit board of the embodiment of the present invention make use of printed circuit board 10 to add cleverly
The instrument connection 12 of the layers of copper and the setting that are formed during work with the use of such that it is able to quickly determined that by measurement jig 20
Whether the groove milling region 11 of printed circuit board 10 there is leakage groove milling, and then can play the effect of leakproof groove milling.
In the present embodiment, further, in described step S3, lower cutter position when carrying out described Xiyanping injection with wherein
One described instrument connection 12 aligns.Concrete, the setting of instrument connection 12 not only can make as when testing whether to occur leakage groove milling
With, when when carrying out Xiyanping injection operation, correspondence can be carried out for milling cutter, make use of instrument connection 12 to carry out milling cutter pair dexterously
Position, promotes the speed of the Xiyanping injection of printed circuit board 10, additionally it is possible to be greatly promoted the machining accuracy to groove milling region 11.
In the present embodiment, further, in described step S3, feed speed when carrying out described Xiyanping injection is 0.3
～0.4m/min.Concrete, groove milling region 11 can be carried out normally by the feed speed in the range of the 0.3～0.4m/min of setting
Xiyanping injection operation, and without above printed circuit board 10 increase cover plate, reduce material application, to groove milling region 11
Machining accuracy higher.
More specifically, feed speed when carrying out Xiyanping injection can be 0.3m/min, 0.35m/min or 0.4m/
Min, can be according to practical situation, i.e. according to different printed circuit boards 10, is to select in the range of 0.3～0.4m/min in speed
Fixed, the processing to the groove milling region 11 on printed circuit board 10 can be met all without using cover plate.
As it is shown in figure 1, in the present embodiment, further, in described step S2, each described instrument connection 12 is adjacent
Distance h >=0.2mm between the end of described groove milling region 11 length direction.Concrete, through this step operation, it is ensured that
Instrument connection 12 will not lean on distance h of the end of groove milling region 11 length direction too closely, and causes milling when being drilled with this instrument connection 12
The end of the length direction in groove region 11 is bored and is caused printed circuit board 10 to be scrapped, so, it becomes possible to guarantee that instrument connection 12 begins
Be in eventually in groove milling region 11, after this groove milling region 11 is completed normal Xiyanping injection operation, this instrument connection 12 also by
Milling cutter mill off, thus utilize the testing needle 21 of measurement jig 20 to carry out energising test, cannot be energized between two testing needles 21 short
Road, and then may determine that whether occur leaking groove milling to groove milling region 11.
As it is shown in figure 1, more specifically, groove milling region 11 length direction that each instrument connection 12 that this step sets is adjacent
End between distance h can be 0.2mm, 0.3mm, 0.4mm or more than 0.5mm, according to groove milling region 11 described in milling
Size can carry out adaptive selected in value range.
As it is shown in figure 1, in the present embodiment, further, in described step S2, when groove width H in described groove milling region 11
During≤2.0mm, the aperture D ＜ 1.8mm of described instrument connection 12；As groove width H≤2.0mm, in order to avoid the aperture mistake of instrument connection 12
Affect or exceed greatly the border in groove milling region 11, the aperture of instrument connection 12 is set as D ＜ 1.8mm such that it is able to make
Instrument connection 12 normally plays the function of its test, avoids again causing printed circuit board 10 to occur because being provided with this instrument connection 12
Quality problems.Concrete, such as, when groove width H in groove milling region 11 is 2.0mm, 1.5mm or 1.0mm, corresponding instrument connection
The aperture of 12 can be set as 1.7mm, 1.2mm and 0.7mm.
As it is shown in figure 1, in the present embodiment, as the groove width H ＞ 2.0mm in described groove milling region 11, described instrument connection 12
Aperture D=1.8mm；In like manner, as groove width H ＞ 2.0mm, in order to avoid the aperture of instrument connection 12 is the least and the lower cutter pair of milling cutter is affected
Position, the aperture of instrument connection 12 is set as D=1.8mm such that it is able to make instrument connection 12 normally play its test function with
And play milling cutter is carried out positioning function effectively, avoid again because the excessive impact in aperture or the limit beyond groove milling region 11
Boundary, and cause printed circuit board 10 that quality problems occur.Concrete, such as, when groove width H in groove milling region 11 be 2.1mm,
During 2.5mm or 3.0mm, the aperture of corresponding instrument connection 12 is set as D=1.8mm.
Need it is further noted that the metallic channel on printed circuit board 10 being processed groove milling region 11 is run through
Metallic channel.
As shown in Figure 4, in the present embodiment, further, in described step S5, described testing needle 21 is stretched to described
Before instrument connection 12, first guide the axis of axis that described testing needle 21 moves to described testing needle 21 and described instrument connection 12
The position overlapped.Concrete, by first testing needle 21 and instrument connection 12 being carried out para-position, so guarantee that testing needle 21 stretches to institute
When stating in instrument connection 12, will not false touch to other positions of printed circuit board 10, thus can be effectively prevented from testing needle 21
Testing needle 21 or printed circuit board 10 is caused to damage because touching printed circuit board 10, it is ensured that the safety of production is carried out.
As shown in Figure 4, in the present embodiment, further, in described step S5, described testing needle 21 and described instrument connection
The para-position step of 12 includes the following:
S5.1: in employing laser instrument (not shown) injection X-ray to described printed circuit board 10, and mobile X-ray, to survey
Measure X-axis and the coordinate of Y-axis of described instrument connection 12；Such as, the X-axis of the instrument connection 12 measured by laser instrument and Y-axis
Coordinate is (2,2)；
S5.2: control described testing needle 21 and move the top to described instrument connection 12；First guarantee mobile test pin 21 to print
The top of circuit board 10 processed, is i.e. positioned at the top of instrument connection 12, so after be beneficial to follow-up be stretched to from top to bottom by testing needle 21
In instrument connection 12；
S5.3: according to X-axis and the coordinate of Y-axis of the described instrument connection 12 measured, control described testing needle 21 further
Mobile to the position overlapped with the described X-axis of instrument connection 12 and the coordinate of Y-axis, so that the axis of described testing needle 21 and institute
The axis stating instrument connection 12 overlaps；Concrete, it is (2,2) according to the X-axis of instrument connection 12 and the coordinate of Y-axis, by testing needle 21
Mobile to the position that coordinate is (2,2) of X-axis and Y-axis, owing to testing needle 21 is above instrument connection 12, thus make to survey
Test point 21 overlaps in the Z-axis direction with instrument connection 12, i.e. the axis of testing needle 21 overlaps with the axis of instrument connection 12.
So, then control testing needle 21 when stretching in instrument connection 12, it becomes possible to avoid testing needle 21 and printed circuit board
10 contacts such that it is able to avoid causing printed circuit board 10 or testing needle because testing needle 21 contacts with printed circuit board 10
The damage of 21, it is ensured that the safety and reliability of production.
Concrete, can be moved to the position set by multi-spindle machining hands manipulation testing needle 21, multi-spindle machining hands is permissible
It is three axle robert, four axis robot or five axis robot etc..
Certainly, in other embodiments, it is also possible to according to the figure of edge PTH hole, make testing mould, the most logical
Cross testing mould to guarantee the para-position of testing needle 21 and instrument connection.
Again for example, it is also possible to guarantee the para-position of testing needle 21 and instrument connection according to flying probe, i.e. according to printed circuit
Light punctuate or hole, location on plate position, and then according to flying probe data figure, printed circuit board are carried out electrical measurement
Examination.
Understanding the present invention in sum is to have above-described good characteristic, is made it on using, promotes in the past
The usefulness that do not has in technology and there is practicality, become the product of a great practical value.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all think ofs in the present invention
Want with principle within any amendment, equivalent or the improvement etc. made, should be included within the scope of the present invention.
Claims (10)
1. a leakproof milling groove structure for printed circuit board, carries out leakproof groove milling detection, described test by measurement jig to it
Tool includes two testing needles, it is characterised in that include that printed circuit board, the surface of described printed circuit board are provided with groove milling district
Territory, the inner side at the two ends of the length direction in described groove milling region is provided with two and connects to enter for corresponding with two described testing needles
The instrument connection of row energising test.
The leakproof milling groove structure of printed circuit board the most according to claim 1, it is characterised in that each described instrument connection and its
Distance h >=0.2mm between the end in adjacent described groove milling zone length direction.
The leakproof milling groove structure of printed circuit board the most according to claim 1 and 2, it is characterised in that when described groove milling district
During groove width H in territory≤2.0mm, the aperture D ＜ 1.8mm of described instrument connection；As the groove width H ＞ 2.0mm in described groove milling region, institute
State the aperture D=1.8mm of instrument connection.
4. the leakproof Xiyanping injection method of a printed circuit board, it is characterised in that comprise the following steps:
S1: printed circuit board is provided, sets groove milling region on a printed circuit board；
S2: be drilled with an instrument connection respectively in the inner side at the two ends of the length direction in described groove milling region；
S3: described groove milling region is carried out Xiyanping injection；
S4: the described printed circuit board completing described Xiyanping injection is carried out graphic plating；
S5: the measurement jig with two testing needles is provided, and two described testing needles are respectively protruding into two described instrument connections
Position, hole in；
S6: judge whether described groove milling region occurs leaking described Xiyanping injection, alarm, then institute if described measurement jig is short-circuited
State groove milling region and be not fully complete described Xiyanping injection；The alarm if described measurement jig is not short-circuited, the most described groove milling region is the completeest
Become described Xiyanping injection.
The leakproof Xiyanping injection method of printed circuit board the most according to claim 4, it is characterised in that in described step S3
In, lower cutter position when carrying out described Xiyanping injection aligns with instrument connection one of them described.
The leakproof Xiyanping injection method of printed circuit board the most according to claim 4, it is characterised in that in described step S3
In, feed speed when carrying out described Xiyanping injection is 0.3～0.4m/min.
7. according to the leakproof Xiyanping injection method of the printed circuit board described in any one of claim 4～6, it is characterised in that
In described step S2, distance h between the end in the described groove milling zone length direction that each described instrument connection is adjacent >=
0.2mm。
8. according to the leakproof Xiyanping injection method of the printed circuit board described in any one of claim 4～6, it is characterised in that
In described step S2, as the groove width H≤2.0mm in described groove milling region, the aperture D ＜ 1.8mm of described instrument connection；When described milling
During the groove width H ＞ 2.0mm in groove region, the aperture D=1.8mm of described instrument connection.
9. according to the leakproof Xiyanping injection method of the printed circuit board described in any one of claim 4～6, it is characterised in that
In described step S5, before described testing needle is stretched to described instrument connection, described testing needle is first guided to move to described testing needle
The position that overlaps with the axis of described instrument connection, axis.
The leakproof Xiyanping injection method of printed circuit board the most according to claim 9, it is characterised in that in described step
In S5, described testing needle includes the following: with the para-position step of described instrument connection
S5.1: use laser instrument injection X-ray on described printed circuit board, to measure the X-axis of described instrument connection and Y-axis
Coordinate；
S5.2: control described testing needle and move the top to described instrument connection；
S5.3: according to X-axis and the coordinate of Y-axis of the described instrument connection measured, control described testing needle move further into
The position that the coordinate of the X-axis of described instrument connection and Y-axis overlaps so that the axis of described testing needle with in described instrument connection
Dead in line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610662620.0A CN106231784B (en) | 2016-08-12 | 2016-08-12 | The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610662620.0A CN106231784B (en) | 2016-08-12 | 2016-08-12 | The leakproof milling groove structure and leakproof Xiyanping injection method of printed circuit board |
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| Publication Number | Publication Date |
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| CN106231784B CN106231784B (en) | 2019-04-02 |
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Cited By (1)
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| CN107414152A (en) * | 2017-09-05 | 2017-12-01 | 梅州市志浩电子科技有限公司 | A kind of processing method of the strip gong groove of PCB |
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| CN103308728A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Testing jig |
| CN204795846U (en) * | 2015-07-10 | 2015-11-18 | 胜宏科技（惠州）股份有限公司 | Prevent that circuit board from leaking gong plate structure |
| CN105228358A (en) * | 2015-10-23 | 2016-01-06 | 胜宏科技（惠州）股份有限公司 | A kind of method stopping wiring board gong groove leakage gong |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103308728A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Testing jig |
| CN203117344U (en) * | 2013-02-02 | 2013-08-07 | 汕头超声印制板公司 | On/off tester capable of detecting omitted hole |
| CN204795846U (en) * | 2015-07-10 | 2015-11-18 | 胜宏科技（惠州）股份有限公司 | Prevent that circuit board from leaking gong plate structure |
| CN105228358A (en) * | 2015-10-23 | 2016-01-06 | 胜宏科技（惠州）股份有限公司 | A kind of method stopping wiring board gong groove leakage gong |
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| CN107414152A (en) * | 2017-09-05 | 2017-12-01 | 梅州市志浩电子科技有限公司 | A kind of processing method of the strip gong groove of PCB |
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| CN106231784B (en) | 2019-04-02 |
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Effective date of registration: 20210810 Address after: 116000 the Great Wall Road, Changxing Island Economic Zone, Dalian, Liaoning 108 Patentee after: DALIAN SUNTAK ELECTRONICS Co.,Ltd. Address before: 529000 Lian Hai Road 363, Jiangmen high tech Zone, Guangdong Province Patentee before: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY Co.,Ltd. |