CN107148143A - Printed circuit board (PCB) and print circuit plates making method - Google Patents
Printed circuit board (PCB) and print circuit plates making method Download PDFInfo
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- CN107148143A CN107148143A CN201710538939.7A CN201710538939A CN107148143A CN 107148143 A CN107148143 A CN 107148143A CN 201710538939 A CN201710538939 A CN 201710538939A CN 107148143 A CN107148143 A CN 107148143A
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- pad
- pcb
- circuit
- circuit board
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to electronic circuit field, and in particular to a kind of printed circuit board (PCB) and print circuit plates making method, and printed circuit board (PCB) includes dielectric layer, coating, the first pad, the second pad and anti-copying circuit.Anti-copying circuit includes first resistor, and first pad and second pad are electrically connected with by the anti-copying circuit.When imitated personnel are by detecting instrument, for example when universal meter detects the break-make relation between the first pad and the second pad, can because anti-copying circuit in first resistor resistance be more than universal meter detected value and the break-make relation between the pad of false judgment first and the second pad so that the circuit for the imitated whole printed circuit board (PCB) that can not be completed.So as to the right of protecting circuit designed person, it can effectively prevent imitated personnel from plagiarizing the fruit of labour of circuit designers.
Description
Technical field
The present invention relates to electronic circuit field, in particular to a kind of printed circuit board (PCB) and print circuit plates making side
Method.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is support electronic component and electronic component electricity
The carrier of gas connection.The schematic diagram of Electronic Design is realization principle and the embodiment of concrete scheme of whole hardware design, is hardware
The committed step of design, embodies the model of component in whole circuit, the important information of value and annexation etc. is electricity
The vital strategic secrets of sub- Chevron Research Company (CRC).Very big loss can be caused to company if leakage.And the design philosophy of schematic diagram, finally need
The device and its annexation of actual welding on PCB are converted into, so as to form the product with specific function.
In general, design and be achieved in that unidirectional and positive, i.e., Electronics Engineer first passes through drawing principle figure body
Its existing design philosophy, then by drawing, processing PCB, welding device realizes its design philosophy.
But, with the development of the whole industry of Electronic Design, practitioner is rapidly increasing, while the threshold of design exists
Gradually reduce.Then, the method for occurring in that so-called " reverse design " or " counter to paint " schematic diagram：I.e. in certain electronic product
Top-Down Design is completed, and after its launch, is disassembled its product, by the mark on the devices such as chip, is measured by instrument
The value of capacitance-resistance inductor component, obtains the product and uses device information, and by the on-off function of universal meter, each device is measured one by one
Annexation between each pin, so that the annexation of acquisition device, reversely draws out schematic diagram.
The way of above-mentioned this " counter to paint " schematic diagram is the very big infringement to former designer's intellectual property, for whole industry
Development, be a kind of serious infringement.But because the way is hidden, for simple circuit, it can carry out rapidly " reversely setting
Meter ".And " reverse design " causes reverse design person to have kind of the psychology of " decryption ", therefore after launch products, it is difficult to wipe out.
Therefore, the pcb board of " reverse design " can be prevented by being badly in need of design one kind.
The content of the invention
In view of this, the purpose of the embodiment of the present invention is to provide a kind of printed circuit board (PCB) and print circuit plates making side
Method, the problem of to improve above-mentioned, prevents imitated personnel from carrying out " reverse design ", makes imitated personnel can not be to the printed circuit of shaping
Plate is replicated.
To achieve these goals, the technical solution adopted by the present invention is as follows：
In a first aspect, the invention provides a kind of printed circuit board (PCB), printed circuit board (PCB) includes dielectric layer, coating, first
Pad, the second pad and anti-copying circuit.First pad and the second pad are arranged on coating, and anti-copying circuit is arranged at Jie
Matter layer, the first pad is electrically connected with by anti-copying circuit and the second pad, coating blanket dielectric layer.Wherein, anti-copying line
The electrology characteristic on road meets preset standard, for preventing from detecting the break-make shape that tool detection goes out between the first pad and the second pad
State.
With reference in a first aspect, the resistance value of anti-copying circuit, which is more than, is used for break-make between the first pad of measurement and the second pad
The detected value of the detection instrument of state.Anti-copying circuit includes first resistor and conductive layer, and conductive layer is arranged at dielectric layer, conductive
Layer offers mounting hole, and first resistor is arranged in mounting hole.Conductive layer is divided into independent first mutually by first resistor
Point and Part II, Part I and the first pad be electrically connected with, and Part II and the second pad are electrically connected with, Part I and
Part II is connected by first resistor.In the present invention, the resistance of first resistor is more than 80 ohm.
With reference in a first aspect, Part I is electrically connected with by the first via and the first pad, Part II passes through second
Via is electrically connected with.First via is arranged at the lower section of the first pad, and father's via is arranged at the lower section of the second pad, the first via
Metal level is provided with the inwall of the second via.
With reference in a first aspect, conductive layer is the copper sheet layer of printing.
With reference in a first aspect, setting the mode of first resistor to be plating resistance material.
Second aspect, the invention provides a kind of print circuit plates making method, print circuit plates making method is used for root
Printed circuit board (PCB) is made according to circuit diagram to be printed.Print circuit plates making method is included according to circuit diagram to be printed in circuit
First node and Section Point are chosen in figure.The first pad that wherein first node corresponds on printed circuit board (PCB), Section Point
Corresponding to the second pad on printed circuit board (PCB).Then formed on the dielectric layer of printed circuit board (PCB) for preventing detection instrument to examine
Measure the anti-copying circuit of the on off operating mode between the first pad and the second pad so that the first pad by anti-copying circuit with
Second pad is connected, so that imitated personnel can not judge that the break-make between the first pad and the second pad is closed by detecting instrument
System, effectively prevents imitated personnel from replicating the printed circuit board (PCB) of shaping.
With reference to second aspect, in the first implementation of second aspect of the present invention, first node and second is being chosen
During node, need to meet：First node and Section Point are electrically connected with, and the electric current between first node and Section Point is less than default
Value.
With reference to second aspect, in the first implementation of second aspect of the present invention, anti-copying circuit is set to be included in
Dielectric layer is applied and is set to conductive layer, and the installation region for installing first resistor is then etched on the electrically conductive；Then in conductive layer
Coat photoresists；The photoresists that covering installation region is removed after the photoresists of coating are exposed, are formed for installing first resistor
Mounting hole.Then it is coated with resistance material to form first resistor in mounting hole, remaining photoresists is removed after the completion of being coated with.
With reference to second aspect, in the first implementation of second aspect of the present invention, when being coated with resistance material, according to
The resistance of first resistor and the resistivity of resistance material, the width of conductive layer determine the length and width size and thickness of first resistor, root
Determine to be coated with the time of resistance material according to thickness.The mode for being coated with resistance material can be plating.
Compared with the prior art, the invention has the advantages that：
A kind of printed circuit board (PCB) and print circuit plates making method that the present invention is provided, printed circuit board (PCB) include dielectric layer,
Coating, the first pad, the second pad and anti-copying circuit.First pad and the second pad are arranged at the surface of coating, prevent
The surface that circuit is arranged at dielectric layer is replicated, the first pad and the second pad are electrically connected with by the anti-copying circuit.It is anti-
The electrology characteristic parameter for replicating circuit meets preset standard, to Interference Detection tool detection go out the first pad and the second pad it
Between on off operating mode.When imitated personnel are by detecting instrument, such as universal meter detects logical between the first pad and the second pad
During disconnected relation, can because the electrology characteristic parameter error of anti-copying circuit judge break-make between the first pad and the second pad
Relation, so as to can not complete to copy the circuit of whole printed circuit board (PCB).So as to the right of protecting circuit designed person, so as to
The enough fruit of labour for effectively preventing imitated personnel from plagiarizing circuit designers.
To enable the above objects, features and advantages of the present invention to become apparent, preferred embodiment cited below particularly, and coordinate
Appended accompanying drawing, is described in detail below.
Brief description of the drawings
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.Therefore, reality of the invention below to providing in the accompanying drawings
The detailed description for applying example is not intended to limit the scope of claimed invention, but is merely representative of the selected implementation of the present invention
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
Every other embodiment, belongs to the scope of protection of the invention.
Fig. 1 shows a kind of the first multi-angled view of printed circuit board (PCB) provided by the present invention.
Fig. 2 shows the schematic cross-section of printed circuit board (PCB).
Fig. 3 shows the flow chart of print circuit plates making method.
Fig. 4 shows the schematic diagram for making printed circuit board (PCB).
Fig. 5 shows the sub-step figure of step S20 in Fig. 3.
Fig. 6 shows the dielectric layer schematic diagram set after conductive layer.
Fig. 7 shows the dielectric layer schematic diagram set after photoresists.
Fig. 8 shows the dielectric layer schematic diagram for being provided with anti-copying circuit.
Fig. 9 shows the printed circuit board (PCB) schematic cross-section of shaping.
Icon：100- printed circuit board (PCB)s；101- pads；The pads of 102- first；The pads of 103- second；111- coatings；
The vias of 112- first；The vias of 113- second；120- dielectric layers；121- photoresists；130- anti-copying circuits；131- Part I；
132- Part II；133- first resistors；134- installation regions；135- mounting holes；136- conductive layers；200- schematic diagrams；U1-
One chip；The chips of U2- second；
Embodiment
Below in conjunction with accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Generally exist
The component of the embodiment of the present invention described and illustrated in accompanying drawing can be arranged and designed with a variety of configurations herein.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.
In the description of the invention, it is necessary to explanation, the orientation or position of the instruction such as term " on ", " under ", " interior ", " outer "
It is or the orientation or position that the invention product is usually put when using based on orientation shown in the drawings or position relationship to put relation
Relation is put, the description present invention is for only for ease of and simplifies description, rather than indicate or imply that the device or element of meaning are necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In the description of the invention, in addition it is also necessary to explanation, herein, such as first and second or the like relation art
Language is used merely to make a distinction an entity or operation with another entity or operation, and not necessarily requires or imply this
There is any this actual relation or order between a little entities or operation.Term " comprising ", "comprising" or its it is any its
His variant is intended to including for nonexcludability, so that process, method, article or equipment including a series of key elements are not
Only include those key elements, but also other key elements including being not expressly set out, or also include be this process, method,
Article or the intrinsic key element of equipment.In the absence of more restrictions, by wanting that sentence "including a ..." is limited
Element, it is not excluded that also there is other identical element in the process including the key element, method, article or equipment.For
For one of ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Below in conjunction with the accompanying drawings, some embodiments of the present invention are elaborated.It is following in the case where not conflicting
Feature in embodiment and embodiment can be mutually combined.
First embodiment
Fig. 1 and Fig. 2 are referred to, the first embodiment of the present invention provides a kind of printed circuit board (PCB) 100, the printed circuit
Plate 100 includes dielectric layer 120 and coating 111, and the coating 111 is covered in the dielectric layer 120.
Referring to Fig. 1, the coating 111 is provided with multiple pads 101, specifically, the pad 101 includes the first weldering
The pad 103 of disk 102 and second.First pad 102 and second pad 103 be used to welding circuit element pin or
Terminal, the coating 111 is additionally provided with multiple vias (figure is not marked), and the inwall of the via is provided with the metal level of conduction,
Each pad 101 is (such as conductive by the via for being arranged at the lower section of pad 101 and remaining element for being arranged at dielectric layer 120
136) layer is electrically connected with.
The surface of the dielectric layer 120 is provided with anti-copying circuit 130, first pad 102 and second pad
103 are electrically connected with by the anti-copying circuit 130, when first pad 102 and second pad 103 are welded with circuit
During the pin of element, the pin is electrically connected with by the anti-copying circuit 130.
In the embodiment of the present invention, the electrology characteristic of the anti-copying circuit 130 meets preset standard, for Interference Detection
The on off operating mode that tool detection goes out between the first pad 102 and the second pad 103, so as to prevent detection tool detection from going out
Annexation between first pad 102 and the second pad 103, that is to say the electricity for preventing detecting that the first pad 102 is connected
Annexation between the circuit element that circuit component and the second pad 103 are connected.Wherein, the pad of tool detection first is detected
102 and the second electrology characteristic between pad 103, the first pad 102 and the second pad are judged according to the electrology characteristic detected
On off operating mode between 103.
The electrology characteristic includes resistance value, current value or the magnitude of voltage between the first pad 102 and the second pad 103, excellent
In selection of land, the embodiment of the present invention, the electrology characteristic between the first pad 102 and the second pad 103 is resistance value.The pre- bidding
Standard refers to that the resistance value between the first pad 102 and the second pad 103 is more than preset value, and the preset value is according to detection instrument
It is different and different.In the present embodiment, for imitated personnel, on printed circuit board (PCB) 100 to be judged two pads 101 it
Between break-make relation, the resistance value of the break-make shelves detection circuit of universal meter can be used to judge circuit on-off, break-make shelves be for
The conducting of measurement circuitry whether (short circuit).Buzzer and LED can typically be coordinated, buzzer sends sound or LED is bright, represented
Circuit is conducting.What is typically defined is 80 ohm and following for conducting, otherwise to be not turned on.That is, by universal meter
Red-black two test pencils are connected on a circuit both sides, if the resistance of this circuit is less than 80 ohm, universal meter sends sound, and
It is conducting to think this circuit.From above universal meter break-make Cleaning Principle, universal meter is the resistance by detecting circuit
Value judges circuit on-off, if the resistance value at circuit two ends is more than preset value (this example is 80 ohm), universal meter thinks this
Service interruption, is open circuit.One end in the red-black two ends of the break-make shelves of universal meter is connected to first pad 101, the other end
Second pad 101 is connected to, universal meter can test out the break-make relation between two pads 101.
Referring to Fig. 2, the anti-copying circuit 130 includes conductive layer 136 and first resistor 133.The conductive layer 136 is set
It is placed in the dielectric layer 120.In the present embodiment, the conductive layer 136 can be one layer of copper sheet for being printed in dielectric layer 120
Layer, but not limited to this, can also be remaining metal with good conductivity, the mode of printing can be plating.The conductive layer
136 offer mounting hole 135.The mounting hole 135 is used to set first resistor 133.
In the present embodiment, the conductive layer 136 is divided into separate Part I 131 by the mounting hole 135
With Part II 132, first resistor 133 is provided with the mounting hole 135.Part I 131 is not direct with Part II 132
It is connected, but is connected by first resistor 133.
In the In remaining embodiment of the present invention, conductive layer 136 can also be divided into Part I by the mounting hole 135
131 and Part II 132, Part I 131 and the connection of the part of Part II 132, mounting hole 135 need not completely cut off conductive layer
136.Mounting hole 135 is used to set first resistor 133, only needs the resistance value between the first pad 102 and the second pad 103 to be more than
Preset value.
The Part I 131 is electric by the first via 112 and the first pad 102 for being arranged at the lower section of the first pad 102
Property connection, the Part II 132 is electrical by the second via 113 and the second pad 103 for being arranged at the lower section of the second pad 103
Connection.The Part I 131 and the Part II 132 are electrically connected with by the first resistor 133.
In the present embodiment, the first resistor 133 can be arranged at the installation by way of electroplating resistance material
Hole 135.The resistance of the first resistor 133 is more than 80 ohm, in the present embodiment, and the resistance of the first resistor 133 can be with
It is set to 82 ohm., can be according to formula according to the resistivity of the width of the conductive layer 136, and used resistance material：
Try to achieve the thickness of plating resistance material.Wherein, R is the resistance of first resistor 133, and L is the length of first resistor 133
Degree, ρ is by resistivity of the first resistor 133 using resistance material, and S is the cross-sectional area of first resistor 133.In the present embodiment
In, the width of the first resistor 133 is identical with the width of the conductive layer 136, therefore can determine cross section according to formula
Product S, so that it is determined that be coated with the thickness of resistance material, the thickness and the speed of plating that resistance material is coated with as needed can be true
Surely the time of resistance material is electroplated.
In the present embodiment, the dielectric layer 120 and the coating 111 are made by insulating materials, when the covering
When layer 111 is covered in the dielectric layer 120, anti-copying circuit 130 is blanked, and the coating 111 only has pad 101 and is emerging in
Outside, imitated personnel can not intuitively obtain the internal structure of printed circuit board (PCB) 100, when the break-make shelves measurement first using universal meter
It is anti-due to being provided between the first pad 102 and the second pad 103 during break-make relation between the pad 103 of pad 102 and second
Circuit 130 is replicated, and the anti-copying circuit 130 includes the first resistor 133 that resistance value is more than preset value, in the present embodiment
In, the resistance of first resistor 133 is 82 ohm.Therefore universal meter will determine that between the first pad 102 and the second pad 103 be disconnected
Road, so as to mistakenly judge the break-make relation between the first pad 102 and the second pad 103, has reached the purpose of anti-copying,
Protect the right of circuit designers.
Second embodiment
Second embodiment of the invention discloses a kind of print circuit plates making method.Print circuit plates making method be used for according to
The printed circuit board (PCB) 100 described in first embodiment is manufactured according to the circuit diagram to be printed being pre-designed.Refer to Fig. 3：
The print circuit plates making method comprises the following steps：
Step S10：First node and Section Point are chosen in circuit diagram according to circuit diagram to be printed.Wherein, it is described
First node corresponds to the first pad 102 of the printed circuit board (PCB) 100, and the Section Point corresponds to the printed circuit board (PCB)
100 the second pad 103.
The selection of first node and Section Point need to meet following condition：In circuit diagram, the first node and second
Node is directly electrically connected with, for example, be directly connected to by wire；Electric current between first node and Section Point is less than preset value,
Such as 0.01 milliampere (this preset value should according to circuit diagram to be printed and detect instrument parameter setting), according to be printed
Each component of circuit diagram electrical parameter, and each component annexation, it may be determined that the electricity between each component
The information such as stream, voltage.Setting anti-copying circuit 130 between wherein less two nodes of electric current is chosen, so that anti-when being provided with
Replicate after circuit 130, the first resistor 133 of anti-copying circuit 130 does not interfere with the quality of electric signal, and will not produce larger
Power consumption.Referring to Fig. 4, can be believed with the RST signal in selection principle Figure 200 between the first chip U1 and the second chip U2, piece choosing
Number (CS), signal (EN) is enabled, for example, the first chip U1 RST ends are first node, then corresponding second chip U2
RST ends are Section Point.
Step S20：Anti-copying circuit 130 is formed on the dielectric layer 120 of printed circuit board (PCB) 100 so that first weldering
Disk 102 is connected by the anti-copying circuit 130 with second pad 103.
Wherein, the electrology characteristic parameter of the anti-copying circuit 130 meets preset standard, for preventing from detecting tool detection
The on off operating mode gone out between first pad 102 and second pad 103.
By anti-copying circuit 130 by being coated with or the mode such as electronic printing is arranged on the surface of dielectric layer 120, anti-copying
Circuit 130 includes conductive layer 136 and first resistor 133.Conductive layer 136 is separated into the He of Part I 131 by first resistor 133
Part II 132.The pad 102 of Part I 131 and first is electrically connected with, and the pad 103 of Part II 132 and second electrically connects
Connect.Part I 131 and Part II 132 are connected by first resistor 133.
The electrology characteristic of the anti-copying circuit 130 meets preset standard, so as to make detection instrument make what is made mistake
Judge, when the resistance value of anti-copying circuit 130 is more than preset value, the detection instrument made mistakenly judge the first pad 102 with
Break-make relation between second pad 103 is open circuit, so as to prevent from detecting the company that tool detection goes out between different pads 101
Relation is connect, such as in the present embodiment, when imitated librarian use universal meter is measured, if between two measured pads 101
Resistance value be more than 80 ohm of preset value, then universal meter can judge to be open circuit between two measured pads 101.
Step S20 includes sub-step S201-S207, refers to Fig. 5：
Step S201：Conductive layer 136 is coated with the dielectric layer.
Wherein, the conductive layer 136 can be applied the one layer of copper sheet layer for being located at the surface of dielectric layer 120 or be coated with
Remaining conductive metal layer in the surface of dielectric layer 120.The mode being coated with can be electroplated, but not limited to this.
Step S202：The installation region 134 for installing first resistor 133 is etched in the conductive layer 136.
Etching is the technology that material is acted on and removed by chemical reaction or physical shock., can be with the present embodiment
By photochemical etching, conductive layer 136 is contacted chemical solution in etching, reach the effect of dissolved corrosion, formed depression or
The effect of hollow out shaping.
Referring to Fig. 6, conductive layer 136 is divided into Part I 131 and second independent mutually by the installation region 134
Part 132.Part I 131 and Part II 132 are not directly connected.
Step S203：Photoresists 121 are coated in the conductive layer 136.
The photoresists 121 cover the Part I 131, Part II 132 and the installation region 134.It is photosensitive
Glue 121 is also known as emulsion, is the photosensitive material generally used at present.Conductive layer can be coated on by being dissolved in after water stirs
136 so that conductive layer 136 to be covered.
Step S204：Expose the photoresists 121 of coating.
Processing is exposed to the photoresists 121 of coating, the photoresists 121 of coating exposed under ultraviolet light, ultraviolet
The irradiated part of photoresists 121 can lose water solubility, so that photoresists 121 depart from moisture, solidification, it is photosensitive after solidification
Glue 121 is easy to be removed, and re-expose can also be carried out in some processes, and the time of re-expose is identical with the main exposure time,
The resistance to print of printed circuit board (PCB) 100 can be improved.
Step S205：The photoresists 121 for being covered in installation region 134 are removed, to form the installation for installing first resistor 133
Hole 135.
The photoresists 121 for being covered in installation region 134 are removed, retain the photoresists 121 in remaining region, to form mounting hole
135.After mounting hole 135 is molded, as shown in Figure 7.
Step S206：It is coated with resistance material to form first resistor 133 in the mounting hole 135.
The mode for being coated with resistance material can be plating.According to the resistance of first resistor 133 and the resistance of resistance material
Rate, the width of conductive layer 136 can determine the length and width size and thickness of first resistor 133.Determined to electroplate according to the thickness
The time of resistance material.In the present embodiment, the resistance of the first resistor 133 is more than 80 ohm, could be arranged to 82 ohm.
Step S207：Removal is covered in the installation region 134 of conductive layer 136 with the photoresists 121 of exterior domain.
The photoresists 121 for covering remaining region are removed, appear conductive layer 136.The photoresists 121 of residual are covered in conduction
Layer 136 can cause heating, be easily damaged printed circuit board (PCB) 100.
Referring to Fig. 9, removing after photoresists 121, shaping figure is as shown in Figure 8.
Printed circuit board (PCB) 100 is processed into by above-mentioned steps, then by paster.Pass through traditional technique processing and fabricating, example
Such as covering, paster, welding, the printed circuit board (PCB) 100 after processing is as shown in figure 9, procedure of processing is traditional handicraft, existing skill
Art, is no longer described in detail herein.
In summary, the present invention is provided a kind of printed circuit board (PCB) and print circuit plates making method, printed circuit board (PCB) bag
Include dielectric layer, coating, the first pad, the second pad and anti-copying circuit.The anti-copying circuit includes first resistor, described
First pad and second pad are electrically connected with by the anti-copying circuit.When imitated personnel are by detecting instrument, for example
, can be because the resistance of the first resistor in anti-copying circuit when universal meter detects the break-make relation between the first pad and the second pad
Value more than universal meter detected value and the break-make relation between the pad of false judgment first and the second pad, so as to can not complete
Copy the circuit of whole printed circuit board (PCB).So as to the right of protecting circuit designed person, so as to effectively prevent from copying
Personnel plagiarize the fruit of labour of circuit designers.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
The embodiment of the present invention is further disclosed：
A1. a kind of printed circuit board (PCB), including dielectric layer, coating, the first pad, the second pad and anti-copying circuit, institute
State the first pad and the second pad is arranged on the coating, the anti-copying circuit is arranged at the dielectric layer, described
One pad is electrically connected with by the anti-copying circuit and second pad, and the coating covers the dielectric layer, wherein,
The electrology characteristic parameter of the anti-copying circuit meets preset standard, for Interference Detection tool detection go out first pad with
On off operating mode between second pad.
A2. the printed circuit board (PCB) according to A1, the resistance value of the anti-copying circuit is more than preset value, for making detection
It is off state that instrument, which measures the first pad and the on off operating mode of the second pad,.
A3. the printed circuit board (PCB) according to A1, the resistance value of the anti-copying circuit is more than 80 ohm.
A4. the printed circuit board (PCB) according to A1, the anti-copying circuit includes conductive layer and first resistor, the conduction
Layer is arranged at the dielectric layer, and first pad is electrically connected with the conductive layer, second pad and the conductive layer
It is electrically connected with, the conductive layer offers mounting hole, and the first resistor is arranged in the mounting hole.
A5. the printed circuit board (PCB) according to A4, it is characterised in that the conductive layer is divided into mutually by the mounting hole
Independent Part I and Part II, the Part I and first pad are electrically connected with by the first via, described
Part II is electrically connected with second pad by the second via, and the Part I passes through described with the Part II
First resistor is electrically connected with.
A6. the printed circuit board (PCB) according to A5, first via is arranged at the lower section of first pad, described
Two vias are arranged at the lower section of second pad, and the hole wall of first via and second via is provided with metal
Layer, the metal level that first pad passes through first via on hole wall is electrically connected with the Part I, and described the
The metal level on hole wall that two pads pass through second via is electrically connected with the Part II.
A7. the printed circuit board (PCB) according to A4, the conductive layer for printing copper sheet layer.
A8. the printed circuit board (PCB) according to A7, the set-up mode of the first resistor is plating resistance material.
B9. a kind of print circuit plates making method, methods described includes：
First node and Section Point are chosen in circuit diagram according to circuit diagram to be printed, wherein, the first node
Corresponding to the first pad of printed circuit board (PCB), the Section Point corresponds to the second pad of printed circuit board (PCB)；
Formed on the dielectric layer of printed circuit board (PCB) for preventing detection tool detection from going out first pad and described the
The anti-copying circuit of on off operating mode between two pads so that first pad passes through the anti-copying circuit and described second
Pad is electrically connected with.
B10. it is described to be chosen according to circuit diagram to be printed in circuit diagram according to described print circuit plates making method
First node and Section Point include：
The first node is electrically connected with the Section Point, the electricity between the first node and the Section Point
Stream is less than preset value.
B11. it is described to form anti-copying on the dielectric layer of printed circuit board (PCB) according to described print circuit plates making method
Circuit includes：
Conductive layer is coated with the dielectric layer；
It is used for the installation region for installing first resistor in the Conductive Layer Etch；
Photoresists are coated in the conductive layer；
Expose the photoresists of coating；
The photoresists for being covered in the installation region are removed, to form the mounting hole for installing first resistor；
Resistance material is coated with the mounting hole to form first resistor；
Removal is covered in the installation region of conductive layer with the photoresists of exterior domain.
B12. the print circuit plates making method according to B11, it is described be coated with the mounting hole resistance material with
Forming first resistor includes：
First electricity is determined according to the resistance of the first resistor and the resistivity of resistance material, the width of conductive layer
The length and width size and thickness of resistance, determine to be coated with the time of resistance material according to the thickness.
B13. the print circuit plates making method according to B12, the mode for being coated with resistance material is plating.
Claims (10)
1. a kind of printed circuit board (PCB), it is characterised in that the printed circuit board (PCB) includes dielectric layer, coating, the first pad, second
Pad and anti-copying circuit, first pad and the second pad are arranged on the coating, and the anti-copying circuit is set
In the dielectric layer, first pad is electrically connected with by the anti-copying circuit and second pad, the coating
The dielectric layer is covered, wherein, the electrology characteristic parameter of the anti-copying circuit meets preset standard, for Interference Detection instrument
Detect the on off operating mode between first pad and second pad.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that the resistance value of the anti-copying circuit is more than default
Value, the on off operating mode for making detection instrument measure the first pad and the second pad is off state.
3. printed circuit board (PCB) as claimed in claim 1, it is characterised in that the resistance value of the anti-copying circuit is more than 80 Europe
Nurse.
4. printed circuit board (PCB) as claimed in claim 1, it is characterised in that the anti-copying circuit includes conductive layer and the first electricity
Resistance, the conductive layer is arranged at the dielectric layer, and first pad is electrically connected with the conductive layer, second pad with
The conductive layer is electrically connected with, and the conductive layer offers mounting hole, and the first resistor is arranged in the mounting hole.
5. printed circuit board (PCB) as claimed in claim 4, it is characterised in that the conductive layer is divided into mutually by the mounting hole
Independent Part I and Part II, the Part I and first pad are electrically connected with by the first via, described
Part II is electrically connected with second pad by the second via, and the Part I passes through described with the Part II
First resistor is electrically connected with.
6. printed circuit board (PCB) as claimed in claim 5, it is characterised in that first via is arranged at first pad
Lower section, second via is arranged at the lower section of second pad, and the hole wall of first via and second via is equal
Metal level is provided with, the metal level on hole wall that first pad passes through first via electrically connects with the Part I
Connect, the metal level on hole wall that second pad passes through second via is electrically connected with the Part II.
7. a kind of print circuit plates making method, it is characterised in that methods described includes：
First node and Section Point are chosen in circuit diagram according to circuit diagram to be printed, wherein, the first node correspondence
In the first pad of printed circuit board (PCB), the Section Point corresponds to the second pad of printed circuit board (PCB)；
Formed on the dielectric layer of printed circuit board (PCB) for preventing detection tool detection from going out first pad and the described second weldering
The anti-copying circuit of on off operating mode between disk so that first pad passes through the anti-copying circuit and second pad
It is electrically connected with.
8. print circuit plates making method as claimed in claim 7, it is characterised in that described to be existed according to circuit diagram to be printed
First node and Section Point are chosen in circuit diagram to be included：
The first node is electrically connected with the Section Point, and the electric current between the first node and the Section Point is small
In preset value.
9. print circuit plates making method as claimed in claim 7, it is characterised in that the dielectric layer in printed circuit board (PCB)
Upper formation anti-copying circuit includes：
Conductive layer is coated with the dielectric layer；
It is used for the installation region for installing first resistor in the Conductive Layer Etch；
Photoresists are coated in the conductive layer；
Expose the photoresists of coating；
The photoresists for being covered in the installation region are removed, to form the mounting hole for installing first resistor；
Resistance material is coated with the mounting hole to form first resistor；
Removal is covered in the installation region of conductive layer with the photoresists of exterior domain.
10. print circuit plates making method as claimed in claim 9, it is characterised in that described to be coated with the mounting hole
Resistance material is included with forming first resistor：
The first resistor is determined according to the resistance of the first resistor and the resistivity of resistance material, the width of conductive layer
Length and width size and thickness, determine to be coated with the time of resistance material according to the thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538939.7A CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538939.7A CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Publications (2)
| Publication Number | Publication Date |
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| CN107148143A true CN107148143A (en) | 2017-09-08 |
| CN107148143B CN107148143B (en) | 2019-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710538939.7A Expired - Fee Related CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070204173A1 (en) * | 2006-02-15 | 2007-08-30 | Wrg Services Inc. | Central processing unit and encrypted pin pad for automated teller machines |
| US20140028335A1 (en) * | 2012-07-27 | 2014-01-30 | Johnson Electric S.A. | Security wrap with breakable conductors |
| CN103839317A (en) * | 2014-03-06 | 2014-06-04 | 淮安市金恒泰科技有限公司 | Intelligent antitheft alarm device adopting key |
| CN205082051U (en) * | 2015-10-26 | 2016-03-09 | 博罗康佳精密科技有限公司 | V -cut foolproof circuit board |
| CN105930747A (en) * | 2015-08-20 | 2016-09-07 | 天地融科技股份有限公司 | Electronic device and protection method for electronic device |
-
2017
- 2017-07-04 CN CN201710538939.7A patent/CN107148143B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070204173A1 (en) * | 2006-02-15 | 2007-08-30 | Wrg Services Inc. | Central processing unit and encrypted pin pad for automated teller machines |
| US20140028335A1 (en) * | 2012-07-27 | 2014-01-30 | Johnson Electric S.A. | Security wrap with breakable conductors |
| CN103839317A (en) * | 2014-03-06 | 2014-06-04 | 淮安市金恒泰科技有限公司 | Intelligent antitheft alarm device adopting key |
| CN105930747A (en) * | 2015-08-20 | 2016-09-07 | 天地融科技股份有限公司 | Electronic device and protection method for electronic device |
| CN205082051U (en) * | 2015-10-26 | 2016-03-09 | 博罗康佳精密科技有限公司 | V -cut foolproof circuit board |
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| Publication number | Publication date |
|---|---|
| CN107148143B (en) | 2019-08-30 |
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