CN107124828B - Printed circuit board and print circuit plates making method - Google Patents
Printed circuit board and print circuit plates making method Download PDFInfo
- Publication number
- CN107124828B CN107124828B CN201710538937.8A CN201710538937A CN107124828B CN 107124828 B CN107124828 B CN 107124828B CN 201710538937 A CN201710538937 A CN 201710538937A CN 107124828 B CN107124828 B CN 107124828B
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- Prior art keywords
- wall
- printed circuit
- circuit board
- interfering bodies
- layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of printed circuit boards and print circuit plates making method, are related to art of printed circuit boards.Printed circuit board includes printed circuit board medium and interfering bodies, interfering bodies is embedded in printed circuit board medium, via hole is disposed on printed circuit board medium, the hole wall of via hole is equipped with metal layer, interfering bodies includes inner wall and outer wall, the diameter of outer wall and the diameter of via hole are identical, the diameter of inner wall and the internal diameter of metal layer are identical, the color for the material layer filled between the inner wall and outer wall of interfering bodies is identical as the color of material of metal layer is formed, and the inside of inner wall is the different obturator of hollow or filled with the material layer between inner wall and outer wall color.Printed circuit board provided by the invention can effectively prevent practitioner from replicating to molding printed circuit panel products with print circuit plates making method.
Description
Technical field
The present invention relates to art of printed circuit boards, in particular to a kind of printed circuit board and print circuit plates making
Method.
Background technique
Printed circuit board (PCB) is the substrate for carrying electronic component, is the specific carrying of electronic component interconnected relationship
And physics embodies, and is the important component of electronic product.
In general, the PCB design of electronic product and it is achieved in that unidirectional and positive, i.e., Electronics Engineer first passes through
Drawing principle figure embodies its design philosophy, and the connection relationship of schematic diagram and device information are then imported PCB, by drawing, adds
Work PCB, welding device realize its design philosophy.
But after the listing of certain electronic product, some practitioners can disassemble the product for this product of mountain vallage
Material object PCB is obtained, then by obtaining the device information on the PCB, patch coordinate information, the surface layer PCB copper sheet and the figure of route
The mode of shape and the information such as via hole aperture and location information, is copied as original product completely using above-mentioned All Files
Hardware circuit.Due to replicating hardware circuit in this way, research and development cost is not needed substantially, so duplication hardware circuit
Situation largely exists and can not prevent.
How to improve the above problem, is the emphasis of those skilled in the art's concern.
Summary of the invention
In view of the above problems, the invention proposes a kind of printed circuit boards and print circuit plates making method, and can have
Effect prevents practitioner from replicating to molding printed circuit panel products.
To achieve the goals above, technical solution used in the embodiment of the present invention is as follows:
In a first aspect, the embodiment of the present invention proposes a kind of printed circuit board, which includes that printed circuit board is situated between
Matter and interfering bodies, interfering bodies are embedded in printed circuit board medium, and via hole, the hole wall of via hole are disposed on printed circuit board medium
It is equipped with metal layer, interfering bodies includes inner wall and outer wall, and the diameter of outer wall and the diameter of via hole are identical, the diameter and metal of inner wall
The internal diameter of layer is identical, the color of the material of the color and formation metal layer for the material layer filled between the inner wall and outer wall of interfering bodies
Identical, the inside of inner wall is the different obturator of hollow or filled with the material layer between inner wall and outer wall color.
For being obtained on the printed circuit board when practitioner is desired based on the non-printed circuit board for filling out process for copper production
When via hole aperture and location information, first printed circuit board copper sheet, line layer can be abraded, abrading printed circuit board copper sheet, line
When road floor abrades, part interfering bodies can be abraded simultaneously, and makes interfering bodies exposure, and the color and metal layer of the interfering bodies after exposing
Color is identical, and size is also roughly the same with the size of metal layer.The via hole hole on the printed circuit board is obtained due to practitioner
Diameter mainly passes through the color of metal layer with location information and size is judged, so carrying out hole aperture and location information judgement
When, from exposed interfering bodies and via hole in appearance, it is via hole which, which can not be differentiated, which is interfering bodies, to can not obtain
Via hole information is taken, and then connection relationship cannot be obtained；Or using interfering bodies as via hole, the via hole information of mistake is obtained, thus
The connection relationship of mistake is obtained, and then manufactures the printed circuit board to make mistake, causes short circuit, printed circuit board is caused to be scrapped, from
And enabling the printed circuit board effectively prevents practitioner from replicating to molding printed circuit panel products.
With reference to first aspect, for the present invention in the first implementation of first aspect, printed circuit board further includes resistance to height
Warm insulating layer, temperature-resistant insulation layer are coated on interference in vitro.Since the material between interfering bodies inner wall and outer wall may be metal,
So interfering bodies may be connected with the line layer on printed circuit board medium when interfering bodies is embedded in printed circuit board medium,
Cause short circuit.After temperature-resistant insulation layer is arranged in interfering bodies, it can effectively achieve the effect that insulation, to prevent by interfering bodies
After being embedded in printed circuit board medium, cause the generation of the situation of the line layer short circuit on printed circuit board medium.
With reference to first aspect, for the present invention in the first implementation of first aspect, temperature-resistant insulation layer includes glass
Layer or rubber layer or resin layer, to prevent the generation of the situation of the line layer short circuit on printed circuit board medium.
With reference to first aspect, the present invention is in second of implementation of first aspect, the shape of interfering bodies be it is spherical or
Person's cylindricality.By setting spherical or cylindricality for interfering bodies, printed circuit board copper sheet, line layer can be abraded in practitioner
When, part interfering bodies is abraded, and make interfering bodies exposure, and the color of the interfering bodies after exposing is identical as metal layer color, size
Also roughly the same with the size of metal layer, to interfere, make practitioner that can not obtain correct via hole information.
With reference to first aspect, for the present invention in the third implementation of first aspect, printed circuit board medium includes glass
Glass fiber cloth, interfering bodies are placed in the gap of glass fabric.
With reference to first aspect, for the present invention in the 4th kind of implementation of first aspect, obturator is resin obturator.
Second aspect, the embodiment of the invention provides a kind of print circuit plates making method, the print circuit plates making sides
Method includes that interfering bodies is embedded in printed circuit board medium well prepared in advance, then arranges via hole on printed circuit board medium,
Metal layer finally is set on the hole wall of via hole.Wherein, interfering bodies includes inner wall and outer wall, the diameter of outer wall and the diameter of via hole
Identical, the diameter of inner wall and the internal diameter of metal layer are identical, the color for the material layer filled between the inner wall and outer wall of interfering bodies with
The color for forming the material of metal layer is identical, and the inside of inner wall is hollow or filled with the material layer between inner wall and outer wall
The different obturator of color.The effect for realizing interference enables the printed circuit board effectively to prevent practitioner to molding
Printed circuit panel products replicated.
In conjunction with second aspect, the present invention is in the first implementation of second aspect, when the inside of the inner wall of interfering bodies
When filled with the obturator different from the color of the material of metal layer, interfering bodies is being embedded in printed circuit board well prepared in advance
Before the step of medium, print circuit plates making method further includes production different from the color of the material of metal layer, diameter and gold
Belong to the identical obturator of internal diameter of layer, interference layer identical with the material color of metal layer, interference are then wrapped up outside obturator
The diameter of layer outer wall is identical as the diameter of via hole.
In conjunction with second aspect, the present invention is in the first implementation of second aspect, package and metal outside obturator
After the step of identical material of material color of layer, formation interfering bodies, print circuit plates making method further includes in interference layer
The outer package temperature-resistant insulation layer different from the material color of metal layer.
In conjunction with second aspect, interfering bodies is being embedded in system in advance in second of implementation of second aspect by the present invention
After the step of printed circuit board medium got ready, print circuit plates making method further includes by the print after multiple insertion interfering bodies
Printed circuit board medium carries out lamination and high-temperature laminating.
The third aspect, the embodiment of the invention provides a kind of print circuit plates making method, print circuit plates making methods
Including interfering bodies to be embedded in printed circuit board medium well prepared in advance, wherein interfering bodies includes inner wall and outer wall, outer wall it is straight
Diameter is identical as the diameter of via hole, and the diameter of inner wall and the internal diameter of metal layer are identical, fills between the inner wall and outer wall of interfering bodies
The color of material layer is identical as the color of material of metal layer is formed, and the inside of inner wall is hollow or is filled with and inner wall and outer wall
Between material the different obturator of color.
Compared with the prior art, the invention has the following advantages:
The present invention provides a kind of printed circuit board and print circuit plates making method, which includes printing electricity
Road plate medium and interfering bodies, interfering bodies are embedded in printed circuit board medium, when related practitioner wants copying and printing circuit
When panel products, when needing to obtain via hole aperture and the location information on the printed circuit board.On obtaining the printed circuit board
When via hole aperture and location information, practitioner can first be abraded printed circuit board copper sheet, line layer, exposed printed circuit board and be situated between
Then matter again identifies via hole.When abrading printed circuit board copper sheet, line layer abrading, interfering bodies can be abraded simultaneously
A part, and make the exposure of remaining interfering bodies, and the face for the material layer filled between the inner wall and outer wall of the interfering bodies after exposing
Color with cross the metal layer color of hole surface it is identical, the diameter of inner wall and outer wall also with cross hole surface metal layer internal diameter and outer diameter
Roughly the same, when due to practitioner using intelligent terminal identification via hole information, the main color and shape for passing through metal layer is embedding
After entering interfering bodies, it is via hole which intelligent terminal, which can not tell, which is interfering bodies, so that via hole information can not be obtained, into
And connection relationship cannot be obtained；Prevent practitioner to molding printed circuit board to enable the printed circuit board effectively
Product is replicated.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows the structural schematic diagram of the printed circuit board of one embodiment of the present of invention offer.
It is cutting for hollow interfering bodies and temperature-resistant insulation layer Fig. 2 shows the inside that one embodiment of the present of invention provides
Face schematic diagram.
There are the interfering bodies and temperature-resistant insulation layer of obturator in the inside that Fig. 3 shows one embodiment of the present of invention offer
Section schematic diagram.
Fig. 4 shows the cross-sectional of the printed circuit board of one embodiment of the present of invention offer.
Fig. 5 show another embodiment of the present invention provides printed circuit board production method flow chart.
Icon: 100- printed circuit board；110- printed circuit board medium；120- interfering bodies；130- via hole；135- metal
Layer；121- outer wall；123- inner wall；125- interferes layer；127- obturator；129- temperature-resistant insulation layer.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile of the invention
In description, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " connected ", " connection " shall be understood in a broad sense,
It for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection, be also possible to electricity
Connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.For
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.It ties below
Attached drawing is closed, is elaborated to some embodiments of the present invention.In the absence of conflict, following embodiment and embodiment
In feature can be combined with each other.
Fig. 1 is please referred to, the embodiment of the invention provides a kind of printed circuit board 100, which includes printing
Circuit board medium 110 and interfering bodies 120, interfering bodies 120 are embedded in printed circuit board medium 110.
Specifically, further including on printed circuit board 100 to make each interlayer of printed circuit board 100 realize electrical connection
Via hole 130, and the electroplated metal layer 135 on the hole wall of via hole 130, to realize that each interlayer of printed circuit board 100 is electrically connected
It connects, which includes but is not limited to layers of copper, and the hole wall of via hole 130 is hollow metal cylinder at this time, for this hollow gold
Belong to cylinder, can use and retain hollow or be filled using insulators such as resins.In the prior art, when practitioner wants
When obtaining the information of via hole 130, the information of via hole 130 is the location information and mistake for obtaining via hole 130 and being located at printed circuit board 100
The aperture information in hole 130 can abrade the line layer of printed circuit board 100, exposure printed circuit board medium 110, and use coal
Oily or other developers develop to printed circuit board 100, then with high-precision camera to printed circuit board medium 110 into
Row is taken pictures, right then using the contrast of the color between the metal layer 135 and printed circuit board medium 110 of 130 hole wall of via hole
Via hole 130 is identified, to obtain 130 information of via hole.
Therefore, in this application, printed circuit board 100 is replicated in order to prevent, so being arranged in printed circuit board 100
Interfering bodies 120 can abrade the part of interfering bodies 120, and make remaining interfering bodies when practitioner abrades line layer
120 exposures, and the shape of the remaining interfering bodies 120 after exposing is in circular ring shape, the color of the remaining interfering bodies 120 of exposure with
135 color of metal layer is identical, and diameter is also identical as the diameter of metal layer 135, makes to obtain 130 information of via hole to practitioner
At interference, duplication of the practitioner to printed circuit board 100 is prevented.
Shape in order to realize exposed interfering bodies 120 is also identical with metal layer 135, in the present embodiment, interfering bodies
120 shape is spherical or cylindricality, after practitioner abrades line layer, spherical or cylindrical interfering bodies 120 can be made to grind
Except part, remaining interfering bodies 120 is in a ring, all the same with shape and the color of metal layer 135, to interfere.
It should be noted that the identical diameter for being not necessarily referring to exposed interfering bodies 120 and metal layer 135 that this implementation is described
Internal diameter is completely the same, and refers to that the diameter of exposed interfering bodies 120 is roughly the same with the internal diameter of metal layer 135.
In the present embodiment, interfering bodies 120 can be divided into it is internal be it is hollow or it is internal have 127 two kinds of obturator, below with ball
For shape interfering bodies 120, two kinds of interfering bodies 120 are illustrated respectively.
The first, inside is hollow interfering bodies 120:
Referring to Fig. 2, the interfering bodies 120 includes inner wall 123 and outer wall 121, the diameter of outer wall 121 is straight with via hole 130
Diameter is identical, and the diameter of inner wall 123 is identical as the internal diameter of metal layer 135, is formed between the inner wall 123 and outer wall 121 of interfering bodies 120
First cavity, the inside of the inner wall 123 of interfering bodies 120 form the second cavity, and are filled in the first cavity and form metal layer
The identical interference layer 125 of the color of 135 material, the second cavity are hollow cavity.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, printed circuit board 100 further includes having temperature-resistant insulation layer 129, temperature-resistant insulation layer 129
It is wrapped in the outside of 120 outer wall 121 of interfering bodies, i.e. temperature-resistant insulation layer 129 is wrapped in 125 outside of interference layer, plays insulation and makees
With.Also, due to being that temperature reaches as high as 200 degrees Celsius in the pressing of printed circuit board 100, so 129 energy of temperature-resistant insulation layer
It is enough effectively to prevent when printed circuit board 100 presses, the case where interfering bodies 120 is deformed because of high temperature, in the present embodiment, this
Temperature-resistant insulation layer 129 includes but is not limited to glassy layer or rubber layer or resin layer.
Second, there is the interfering bodies 120 of obturator 127 in inside:
Referring to Fig. 3, the interfering bodies 120 equally includes inner wall 123 and outer wall 121, the diameter and via hole 130 of outer wall 121
Diameter it is identical, the diameter of inner wall 123 is identical as the internal diameter of metal layer 135, between the inner wall 123 and outer wall 121 of interfering bodies 120
The first cavity is formed, the inside of the inner wall 123 of interfering bodies 120 forms the second cavity, and filled with golden with formation in the first cavity
Belong to the identical interference layer 125 of color of the material of layer 135, the second cavity is filled with obturator 127, and the face of the obturator 127
Color is different from the interference color of material of layer 125.Also, since the via hole of printed circuit board 100 130 can be hollow or filling
There is resin material, in view of this, in the present embodiment, obturator 127 uses resin obturator 127, to cause more effectively
Interference.Of course, other materials with interference 125 first cavity of layer can also be used in obturator 127 in some other embodiments
The different obturator 127 of the color of material, the present embodiment do not do any restriction to this.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, printed circuit board 100 further includes having temperature-resistant insulation layer 129, temperature-resistant insulation layer 129
It is wrapped in the outside of 120 outer wall 121 of interfering bodies, i.e. temperature-resistant insulation layer 129 is wrapped in 125 outside of interference layer, plays insulation and makees
With.Also, since when printed circuit board 100 presses, temperature reaches as high as 200 degrees Celsius, so 129 energy of temperature-resistant insulation layer
It is enough effectively to prevent when printed circuit board 100 presses, the case where interfering bodies 120 is deformed because of high temperature, in the present embodiment, this
Temperature-resistant insulation layer 129 includes but is not limited to glassy layer or rubber layer or resin layer.
When due to obtaining 130 information of via hole, the main color by metal layer 135 obtains 130 information of via hole, will print
After the line layer of circuit board 100 abrades, either internal is hollow interfering bodies 120 or the internal interference for having obturator 127
A part of interfering bodies 120 can be abraded, expose the interfering bodies 120 of remainder by body 120, referring to Fig. 4, wherein, by
In interference 125 color of layer it is identical as the color of metal layer 135, thus exposed image in appearance, which, which can not be differentiated, is
Metal layer 135, which is interfering bodies 120, that is, cannot be distinguished via hole 130 and interfering bodies 120, so that via hole 130 can not be obtained
Information, and then connection relationship cannot be obtained.Or it regard interfering bodies 120 as via hole 130,130 information of via hole of mistake is obtained, from
And the connection relationship of mistake is finally obtained, and then replicate the printed circuit board 100 to make mistake, in some instances it may even be possible to cause short circuit, cause
Printed circuit board 100 is scrapped, and is answered to effectively prevent practitioner the printed circuit board 100 that embodiment provides
System.Also, printed circuit board 100 provided in this embodiment is compatible with the processing of existing printed circuit board 100, paster technique, institute
It is low in cost with easy to process.
It should be noted that in the present embodiment, printed circuit board medium 110 has resin material and glass fabric group
At hot pressing is with after, and resin material is heating and curing, to form printed circuit board medium 110.It is embedding in order to facilitate interfering bodies 120
Enter in printed circuit board medium 110, in the present embodiment, 120 position of interfering bodies is random to be placed in the gap of glass fabric,
Then resin material is heating and curing, and interfering bodies 120 is embedded in printed circuit board medium 110 to realize.
Second embodiment
Referring to Fig. 5, the embodiment of the invention provides a kind of 100 production method of printed circuit board, the printed circuit board 100
Production method the following steps are included:
Step S201, production is different from the color of the material of metal layer 135, diameter is identical with the internal diameter of metal layer 135
Obturator 127.
Since the via hole 130 of printed circuit board 100 can be filled using resin, so in the present embodiment, in order to prevent
Practitioner can identify simultaneously when identifying via hole 130 according to interference layer 125 and the color of obturator 127, so this reality
Apply example be preferably filled with body 127 color it is identical as the color of resin material.Further, in order to make the color of obturator 127 with
The solid colour filled in via hole 130, in the present embodiment, obturator 127 use resin obturator 127, to make to expose
The whole color of integral color and via hole 130 of interfering bodies 120 it is identical, of course, in some other embodiments,
The obturator 127 of other materials can be used, the present embodiment does not do any restriction to this.
Step S202 wraps up interference layer 125 identical with the material color of metal layer 135 outside obturator 127, is formed dry
Disturb body 120, wherein the diameter of interference 125 outer wall 121 of layer is identical as the diameter of via hole 130.
The interference layer 125 exposed is in a ring, all the same with shape, the color of exposed metal layer 135, to make to obtain employment
Member is also identified as via hole 130 in copying and printing circuit board 100, by interference layer 125, so that the via hole 130 for obtaining mistake is believed
Breath.Of course, in some other embodiments, hollow interfering bodies 120 can also be directly made, without making obturator
127。
Step S203 wraps up the temperature-resistant insulation layer 129 different from the material color of metal layer 135 outside interference layer 125.
In order to prevent after interfering bodies 120 is embedded in printed circuit board medium 110, cause on printed circuit board medium 110
Line layer short circuit situation generation, so interference layer 125 outside wrapped up temperature-resistant insulation layer 129, do not only reached absolutely
The effect of edge, and printed circuit board 100 can be prevented in pressing since high temperature interferes the production for the case where body 120 deforms
It is raw.
Interfering bodies 120 after package temperature-resistant insulation layer 129 is embedded in printed circuit board well prepared in advance by step S204
Medium 110.
Since printed circuit board 100 is made of resin material and glass fabric, so, in order to more easily by interfering bodies
In 120 insertion printed circuit board media 110, interfering bodies can be placed at random between the gap of uncured preceding glass fabric
120。
Step S205 carries out lamination to the printed circuit board medium 110 after insertion interfering bodies 120.
Step S206 carries out high-temperature laminating to 100 medium of printed circuit board after lamination.
Step S207 arranges via hole 130 on 100 medium of printed circuit board.
In order to make the line conduction between every layer of printed circuit board medium 110 after lamination, so after need to be to high-temperature laminating
Printed circuit board 100 carry out drilling processing, then by realizing route between every layer in 130 electroplating metal material layer of via hole
Conducting.
Metal layer is arranged on the hole wall of the via hole 130 in step S208.
On the hole wall of via hole 130 after electroplated metal layer, the route on 100 medium of printed circuit board between every layer can be made to lead
It is logical.In the present embodiment, metal layer is layers of copper, but in some other embodiments, and metal layer may be other materials layer,
The present embodiment does not do any restriction to this.
It should be noted that in the present embodiment, step S204 can complete independently, i.e. other steps are without elder generation more than step S204
Sequence afterwards.
In conclusion the present invention provides a kind of printed circuit board and print circuit plates making method, the printed circuit board
Including printed circuit board medium and interfering bodies, interfering bodies is embedded in printed circuit board medium, when related practitioner wants again
When printed wiring board using them product, when needing to obtain via hole aperture and the location information on the printed circuit board.Obtaining the printing
When via hole aperture on circuit board and location information, practitioner can first be abraded printed circuit board copper sheet, line layer, expose print
Printed circuit board medium, then again identifies via hole.When abrading printed circuit board copper sheet, line layer abrading, can grind simultaneously
Except a part of interfering bodies, and make the exposure of remaining interfering bodies, and filled between the inner wall and outer wall of the interfering bodies after exposing
The color of material layer is identical as the metal layer color of hole surface is crossed, the diameter of inner wall and outer wall also with the metal layer of crossing hole surface
Internal diameter with roughly same outer diameter, due to practitioner using intelligent terminal identification via hole information when, mainly pass through the face of metal layer
Color and shape, after being early included in interfering bodies, it is via hole which intelligent terminal, which can not tell, which is interfering bodies, to can not obtain
Via hole information is taken, and then connection relationship cannot be obtained；Prevent to enabling the printed circuit board effectively practitioner at
The printed circuit panel products of type are replicated.
It should be noted that, in this document, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other Matching Elements in the process, method, article or apparatus that includes the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
The embodiment of the present invention further discloses:
A1, a kind of printed circuit board, wherein the printed circuit board includes printed circuit board medium and interfering bodies, described
Interfering bodies is embedded in the printed circuit board medium, and via hole, the hole of the via hole are disposed on the printed circuit board medium
Wall is equipped with metal layer, and the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the diameter of the via hole, institute
The diameter for stating inner wall is identical as the internal diameter of the metal layer, the face for the material layer filled between the inner wall and outer wall of the interfering bodies
Color is identical as the color of material for forming the metal layer, and the inside of the inner wall is hollow or filled with the inner wall and outside
The different obturator of the color of material layer between wall.
A2, printed circuit board according to a1, wherein the printed circuit board further includes temperature-resistant insulation layer, described
Temperature-resistant insulation layer is coated on outside the outer wall of the interfering bodies.
A3, the printed circuit board according to A2, wherein the temperature-resistant insulation layer includes glassy layer or rubber layer or tree
Rouge layer.
A4, printed circuit board according to a1, wherein the shape of the interfering bodies is spherical or cylindricality.
A5, printed circuit board according to a1, wherein the printed circuit board medium includes glass fabric, described
Interfering bodies is placed in the gap of the glass fabric.
A6, printed circuit board according to a1, wherein the obturator is resin obturator.
B7, a kind of print circuit plates making method, wherein the print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Via hole is arranged on the printed circuit board medium；
Metal layer is set on the hole wall of the via hole；
Wherein, the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the diameter of the via hole, described
The diameter of inner wall is identical as the internal diameter of the metal layer, the color and shape of the material layer between the inner wall and outer wall of the interfering bodies
Color at the material of the metal layer is identical, and the inside of the inner wall is hollow or filled between the inner wall and outer wall
Material layer the different obturator of color.
B8, the print circuit plates making method according to B7, wherein when the inside of the inner wall of the interfering bodies is filled with
When different from the color of the material of metal layer obturator, interfering bodies is embedded in printed circuit well prepared in advance described
Before the step of plate medium, the print circuit plates making method further include:
Make, diameter with the internal diameter of the metal layer identical obturator different from the color of the material of the metal layer；
Interference layer identical with the material color of the metal layer is wrapped up outside the obturator, the interference layer outer wall
Diameter is identical as the diameter of the via hole.
B9, the print circuit plates making method according to B8, wherein it is described outside the obturator package with it is described
After the step of identical material of the material color of metal layer, formation interfering bodies, the print circuit plates making method further include:
The temperature-resistant insulation layer different from the material color of the metal layer is wrapped up outside the interference layer.
B10, the print circuit plates making method according to B7, wherein it is described interfering bodies is embedded in it is well prepared in advance
Printed circuit board medium the step of after, the print circuit plates making method further include:
The printed circuit board medium after multiple insertion interfering bodies is subjected to lamination and high-temperature laminating.
C11, a kind of print circuit plates making method, wherein the print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Wherein, the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the diameter of the via hole pre-seted,
The diameter of the inner wall is identical as the internal diameter of metal layer of preset value on the hole wall of the via hole, the inner wall of the interfering bodies and outer
The color for the material layer filled between wall is identical as the color of material for forming the metal layer, and the inside of the inner wall is hollow
Or the obturator that color filled with the material layer between the inner wall and outer wall is different.
Claims (11)
1. a kind of printed circuit board, which is characterized in that the printed circuit board includes printed circuit board medium and interfering bodies, described
Interfering bodies is embedded in the printed circuit board medium, and via hole, the hole of the via hole are disposed on the printed circuit board medium
Wall is equipped with metal layer, and the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the diameter of the via hole, institute
The diameter for stating inner wall is identical as the internal diameter of the metal layer, the face for the material layer filled between the inner wall and outer wall of the interfering bodies
Color is identical as the color of material for forming the metal layer, and the inside of the inner wall is hollow or filled with the inner wall and outside
The different obturator of the color of material layer between wall, so that a part of the interfering bodies is abraded the remaining institute of rear exposure
The metal layer can be interfered by stating interfering bodies.
2. printed circuit board as described in claim 1, which is characterized in that the printed circuit board further includes high-temperature insulation
Layer, the temperature-resistant insulation layer are coated on outside the outer wall of the interfering bodies.
3. printed circuit board as claimed in claim 2, which is characterized in that the temperature-resistant insulation layer includes glassy layer or rubber
Layer or resin layer.
4. printed circuit board as described in claim 1, which is characterized in that the shape of the interfering bodies is spherical or cylindricality.
5. printed circuit board as described in claim 1, which is characterized in that the printed circuit board medium includes glass fibre
Cloth, the interfering bodies are placed in the gap of the glass fabric.
6. printed circuit board as described in claim 1, which is characterized in that the obturator is resin obturator.
7. a kind of print circuit plates making method, which is characterized in that the print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Via hole is arranged on the printed circuit board medium；
Metal layer is set on the hole wall of the via hole；
Wherein, the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the diameter of the via hole, the inner wall
Diameter it is identical as the internal diameter of the metal layer, the color of the material layer between the inner wall and outer wall of the interfering bodies and form institute
The color for stating the material of metal layer is identical, and the inside of the inner wall is hollow or filled with the material between the inner wall and outer wall
The different obturator of the color of the bed of material.
8. print circuit plates making method as claimed in claim 7, which is characterized in that when the inside of the inner wall of the interfering bodies
When filled with the obturator different from the color of the material of the metal layer, interfering bodies is embedded in print well prepared in advance described
Before the step of printed circuit board medium, the print circuit plates making method further include:
Make, diameter with the internal diameter of the metal layer identical obturator different from the color of the material of the metal layer；
Interference layer identical with the material color of the metal layer, the diameter of the interference layer outer wall are wrapped up outside the obturator
It is identical as the diameter of the via hole.
9. print circuit plates making method as claimed in claim 8, which is characterized in that it is described outside the obturator package with
After the step of material color of the metal layer identical interference layer, the print circuit plates making method further include:
The temperature-resistant insulation layer different from the material color of the metal layer is wrapped up outside the interference layer.
10. print circuit plates making method as claimed in claim 7, which is characterized in that be embedded in interfering bodies in advance described
After the step of printed circuit board medium prepared, the print circuit plates making method further include:
The printed circuit board medium after multiple insertion interfering bodies is subjected to lamination and high-temperature laminating.
11. a kind of print circuit plates making method, which is characterized in that applied in the printed circuit board of not via hole, institute
Stating print circuit plates making method includes:
Interfering bodies is embedded in printed circuit board medium well prepared in advance；
Wherein, the interfering bodies includes inner wall and outer wall, and the diameter of the outer wall is identical as the via diameter pre-seted, described interior
The metal layer internal diameter pre-seted on the diameter of wall and the hole wall of the via hole is identical, fills out between the inner wall and outer wall of the interfering bodies
The color for the material layer filled is identical as the color of material for forming the metal layer, and the inside of the inner wall is hollow or is filled with
The different obturator of the color of material layer between the inner wall and outer wall.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350548.1A CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
| CN201710538937.8A CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538937.8A CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910350548.1A Division CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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| Publication Number | Publication Date |
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| CN107124828A CN107124828A (en) | 2017-09-01 |
| CN107124828B true CN107124828B (en) | 2019-06-18 |
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| CN201710538937.8A Expired - Fee Related CN107124828B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
| CN201910350548.1A Withdrawn CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910350548.1A Withdrawn CN110022642A (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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| CN (2) | CN107124828B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022642A (en) * | 2017-07-04 | 2019-07-16 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726935A (en) * | 2020-07-17 | 2020-09-29 | 刘群 | Printed circuit board for computer and manufacturing method thereof |
| CN112698184A (en) * | 2020-12-17 | 2021-04-23 | 珠海杰赛科技有限公司 | Low resistance test method of PCB |
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| CN105555017A (en) * | 2016-01-28 | 2016-05-04 | 深圳市华思通科技有限公司 | Encryption technology for preventing copying of PCB |
| CN205354524U (en) * | 2016-02-01 | 2016-06-29 | 温州豪格防伪科技有限公司 | Protect card membrane antifalsification label |
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|---|---|---|---|---|
| DE3120706C2 (en) * | 1981-05-25 | 1983-10-20 | Manfred 8200 Rosenheim Becker | Method for manufacturing a drill scanning template for a copy drilling machine, which is intended for drilling electrical circuit boards |
| JPS5939097A (en) * | 1982-08-30 | 1984-03-03 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Method of producing printed circuit board |
| WO2010100812A1 (en) * | 2009-03-02 | 2010-09-10 | 株式会社ビッズソリューション | Printed circuit board, electronic device, and method of producing printed circuit board |
| FR2983775B1 (en) * | 2011-12-08 | 2014-01-10 | Arjowiggins Security | SECURITY STRUCTURE INCORPORATING AN ELECTRONIC DEVICE |
| DE102013102067B4 (en) * | 2013-03-01 | 2018-06-28 | Bundesdruckerei Gmbh | Security element and method for producing the same |
| CN107124828B (en) * | 2017-07-04 | 2019-06-18 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
-
2017
- 2017-07-04 CN CN201710538937.8A patent/CN107124828B/en not_active Expired - Fee Related
- 2017-07-04 CN CN201910350548.1A patent/CN110022642A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555017A (en) * | 2016-01-28 | 2016-05-04 | 深圳市华思通科技有限公司 | Encryption technology for preventing copying of PCB |
| CN205354524U (en) * | 2016-02-01 | 2016-06-29 | 温州豪格防伪科技有限公司 | Protect card membrane antifalsification label |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022642A (en) * | 2017-07-04 | 2019-07-16 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and print circuit plates making method |
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|---|---|
| CN107124828A (en) | 2017-09-01 |
| CN110022642A (en) | 2019-07-16 |
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