CN101646308B - Circuit compensation system of circuit board and method for circuit compensation thereby - Google Patents
Circuit compensation system of circuit board and method for circuit compensation thereby Download PDFInfo
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- CN101646308B CN101646308B CN2008103033834A CN200810303383A CN101646308B CN 101646308 B CN101646308 B CN 101646308B CN 2008103033834 A CN2008103033834 A CN 2008103033834A CN 200810303383 A CN200810303383 A CN 200810303383A CN 101646308 B CN101646308 B CN 101646308B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000003384 imaging method Methods 0.000 claims abstract description 33
- 238000012545 processing Methods 0.000 claims abstract description 25
- 238000004458 analytical method Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000000295 complement effect Effects 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 238000011536 re-plating Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Abstract
The invention relates to a circuit compensation system of a circuit board and a method for circuit compensation thereby. The compensation system comprises an imaging device, a control device and a compensation device, wherein the imaging device is used for circuit imaging of the circuit board and transmitting a circuit image to the control device; the control device comprises a storage module, a data processing module and a control module, wherein the storage module is connected with the data processing module and used for storing preset size data and preset position coordinate data of a circuit and transmitting the data to the data processing module; the data processing module is also connected with the imaging device and used for converting the circuit image into the actual size and the actual position coordinates of the circuit, analyzing whether the actual size and the actual position are accordant with the preset size and the preset position or not and transmitting an analysis result to the control module. The compensation device is used for filling conducing materials at the position of the circuit, which needs compositing, according to instructions of the control module till the size and the position of the circuit are accordant with the preset size and the preset position of the circuit.
Description
Technical field
The present invention relates to the circuit board making field, relate in particular to a kind of circuit board line bucking-out system and use the method for this bucking-out system compensated line.
Background technology
Circuit board is made through press mold, exposure, development, etching, technology such as gold-plated by covering the copper base material usually.Referring to document: Traut, G.R; Rogers Corp., CT; Manufacturing and integration techniques of microwave circuits; IEEE colloquium on, Page4/1～4/4; Published on 10th Oct, 1988.
The conducting wire of circuit board makes the image transfer method that adopts usually.Particularly, this image transfer method may further comprise the steps: the first step, lay dry film in the conductive layer surface that covers the copper base material.Second step, adopt light shield that dry film is exposed, this light shield has opening, and this patterns of openings is identical with the conducting wire pattern of design.During exposure, the dry film corresponding with opening is subjected to irradiate light, polymerization reaction take place, and the dry film that is not subjected to irradiate light does not then react.The 3rd step is with developer solution spray dry film.Be not developed the liquid dissolving because the dry film of polymerization reaction has taken place, the dry film of polymerization reaction take place then is not developed the liquid dissolving, therefore, behind developing procedure, dry film is not dissolved with the dry film of opening corresponding region, and the dry film of remainder is all dissolved, thereby exposes the partially conductive layer.The 4th step, the conductive layer that exposes with copper etchant solution or laser-induced thermal etching.After etching, the partially conductive layer of being protected by photoresistance will not removed by copper etchant solution or laser-induced thermal etching, and will be then not etched by the conductive layer that photoresistance is protected, and form the conducting wire consistent with patterns of openings thus.
Yet the conducting wire of adopting this method to make circuit broken string or circuit somewhere size can occur unavoidably less than pre-set dimension, thereby influences the circuit board transmission signal, causes circuit board to scrap.
Therefore, the method that is necessary a kind of circuit board line bucking-out system to be provided and to use this bucking-out system compensated line is guaranteed the circuit board quality to improve the circuit board making yield.
Summary of the invention
Below will be that example illustrates a kind of circuit board line bucking-out system and uses the method for this bucking-out system circuit board manufacturing with embodiment.
This circuit board line bucking-out system comprises imaging device, control device and compensation arrangement.This imaging device is used for the circuit board line imaging, and circuit image is transferred to control device.This control device links to each other with compensation arrangement with imaging device respectively, and it comprises memory module, data processing module and control module.This memory module links to each other with data processing module, is used to store circuit pre-set dimension data and preset position coordinates data, and with this transfer of data to data processing module.This data processing module links to each other with memory module with imaging device respectively, be used for circuit image is converted into circuit actual size and actual position coordinate, whether with this pre-set dimension and predeterminated position consistent, and analysis result is transferred to control module if analyzing this actual size and physical location.This control module links to each other with compensation arrangement, is used for the running of control compensation device.This compensation arrangement be used for instruction according to control module conductive materials is filled to circuit need compensation place.
A kind of circuit board line compensation method, it comprises the steps: to adopt imaging device to the circuit board line imaging, and circuit image is transferred to control device; Adopt the pre-set dimension and the preset position coordinates of the memory module storage circuit of control device, adopt the data processing module of control device that this circuit image is converted into circuit actual size and actual position coordinate, whether need compensate, and analysis result is transferred to control module according to this pre-set dimension and preset position coordinates and actual size and actual position coordinate analysis circuit; The compensation arrangement that employing comprises the ink discharge device with MEMS (micro electro mechanical system) is filled to circuit with the liquid thermosetting conductive materials need compensation place, until size and position and the pre-set dimension and the position consistency of this place's circuit.
The line build-out method of the technical program has the following advantages: adopt imaging device to the circuit imaging and use data processing module that this circuit image is converted into the circuit actual size and position coordinates has improved the line build-out precision; The mode that adopts compensation arrangement directly conductive materials to be filled to compensated line makes line build-out simple, convenient, helps enhancing productivity.
Description of drawings
Fig. 1 is the schematic diagram of the line build-out system that provides of the technical program embodiment.
Fig. 2 is the schematic diagram of the utilization that provides of the technical program embodiment line build-out system balance circuit shown in Figure 1.
Embodiment
The circuit board line bucking-out system that the technical program is provided below with reference to embodiment and accompanying drawing and use the method for this line build-out system circuit board manufacturing to be elaborated.
See also Fig. 1, the circuit board line bucking-out system 100 that the technical program embodiment provides comprises imaging device 10, control device 20 and compensation arrangement 30.Wherein, control device 20 links to each other with compensation arrangement 30 with imaging device 10 respectively.
Whether imaging device 10 is used for the conducting wire imaging of circuit board and whether circuit directly perceived needs compensation, that is, be used for circuit directly perceived and exist broken string or somewhere wire sizes less than pre-set dimension, and circuit image is transferred to control device 20.Imaging device 10 can be charge-coupled image sensor, complementary metal oxide semiconductor (CMOS) image sensor or the fiber microscope of using always.
Control device 20 comprises data processing module 21, control module 22 and memory module 23.Wherein, data processing module 21 links to each other with control module 23 with memory module 22 respectively.
Memory module 23 is used to store the pre-set dimension data of circuit and the data such as preset coordinate position of circuit each point, reads for data processing module 21.
Data processing module 21 is used for the circuit image that imaging device 10 obtains is converted to the actual size data of circuit and the actual position coordinate data of circuit each point, read the preset coordinate position data of circuit pre-set dimension data and circuit each point from memory module 23, and whether consistent, and this analysis result transferred to control module 22 with pre-set dimension and position coordinates according to the actual size and the position coordinates of this data message analysis circuit.
Control module 22 is used for the running according to the analysis result control compensation device 30 of data processing module 21 transmission.Particularly, the circuit image that obtains when imaging device 10 demonstrate circuit everywhere mutual conduction and data processing module 21 analyze the pre-set dimension of the actual size that draws circuit and circuit when consistent, control module 22 control compensation devices 30 do not compensate running; When the circuit image that obtains when imaging device 10 demonstrates actual size that circuit exists broken string or data processing module 21 to analyze to draw the somewhere circuit less than pre-set dimension, control module 22 is opened compensation arrangement 30, and making compensation arrangement 30 spray conductive materials to circuit need compensation place.Preferably, described conductive materials is the thermosetting conductive materials, as copper slurry or silver slurry.
Compensation arrangement 30 is used for according to the instruction of control module 22 circuit being compensated so that circuit everywhere mutual conduction and circuit everywhere size equal pre-set dimension.Compensation arrangement 30 can be ink discharge device.Make precision for improving, can preferably have the injector head of MEMS (micro electro mechanical system) as ink discharge device.
In the present embodiment, control module 22 is arranged in the control device 20, is appreciated that control device 20 also can be integrated in the compensation arrangement 30.
More than circuit board line bucking-out system that the technical program embodiment is provided have been described in detail, will be example with the circuit 210 of line build-out system 100 compensating circuit plates 200 below, the circuit board line compensation method that the technical program provides is described.
This circuit board line compensation method may further comprise the steps:
The first step adopts circuit 210 imagings of 10 pairs of circuit boards 200 of imaging device, and the image of this circuit 210 is transferred to control device 20.
See also Fig. 1 and Fig. 2, in the present embodiment, because there is broken string in circuit 210, circuit 210 images that imaging device 10 obtains will demonstrate circuit 210 and have breach 2101.
Second step, adopt the pre-set dimension and the preset position coordinates of the memory module 23 storage circuits of control device 20, adopt data processing module 21 that this circuit image is converted into circuit actual size and actual position coordinate, whether need compensate according to this pre-set dimension and preset position coordinates and actual size and actual position coordinate analysis circuit, and this analysis result is transferred to control module 22.
In a single day data processing module 21 receives the image of the circuit 210 of imaging device 10 transmission, it is corresponding circuit actual size and actual position coordinate data immediately with image transitions, and the circuit pre-set dimension and the preset position coordinates of this data message and memory module 23 transmission compared, to determine whether circuit need compensate.In the present embodiment, because there is broken string in circuit 210, data processing module 21 draws circuit with analysis and need compensate, and the size and the position coordinate data of circuit breach 2101 transferred to control module 22.
The 3rd step, utilize compensation arrangement 30 that conductive materials is filled to and need the compensated line place, consistent until the size of this place's circuit 210 with pre-set dimension.
In the present embodiment, control module 22 control compensation devices 30 are injected into conductive materials in the breach 2101, can finish compensating operation until conductive materials complete filling breach.
The circuit board line compensation method of present embodiment can further comprise curing conductive material and the step of electroplating circuit.Described curing can be carried out when compensation arrangement 30 injection conductive materials are to breach 2101, and it can adopt this area soft roasting, roasting firmly or ultraviolet light polymerization commonly used.But the field common chemical plating of described plating circuit board making, plating or first chemical plating re-plating.
More than to the circuit board line bucking-out system of the technical program and use the method for this bucking-out system compensated line to describe in detail, but can not be interpreted as it is restriction to the technical program design.For those of ordinary skills, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to the application's claim with distortion according to the technical conceive of the technical program.
Claims (5)
1. circuit board line bucking-out system, it comprises imaging device, control device and compensation arrangement, this imaging device is used for the circuit board line imaging, and circuit image transferred to control device, this control device links to each other with compensation arrangement with imaging device respectively, it comprises memory module, data processing module and control module, this memory module links to each other with data processing module, be used to store circuit pre-set dimension data and preset position coordinates data, and with this transfer of data to data processing module, this data processing module links to each other with memory module with imaging device respectively, be used for circuit image is converted into circuit actual size and actual position coordinate, whether analyze this actual size and physical location consistent with this pre-set dimension and predeterminated position, and analysis result transferred to control module, this control module links to each other with compensation arrangement, be used for the running of control compensation device, this compensation arrangement comprises the ink discharge device with MEMS (micro electro mechanical system), being used for according to the instruction of control module the liquid thermosetting conductive materials being filled to circuit need compensation place, consistent with circuit pre-set dimension and predeterminated position until size and position of this place's circuit.
2. circuit board line bucking-out system as claimed in claim 1 is characterized in that, this imaging device comprises charge-coupled image sensor, complementary metal oxide semiconductor (CMOS) image sensor or fiber microscope.
3. circuit board line compensation method, it comprises the steps:
Adopt imaging device to the circuit board line imaging, and circuit image is transferred to control device; Adopt the pre-set dimension and the preset position coordinates of the memory module storage circuit of control device, adopt the data processing module of control device that this circuit image is converted into circuit actual size and actual position coordinate, whether need compensate, and analysis result is transferred to control module according to this pre-set dimension and preset position coordinates and actual size and actual position coordinate analysis circuit;
The compensation arrangement that employing comprises the ink discharge device with MEMS (micro electro mechanical system) is filled to circuit with the liquid thermosetting conductive materials need compensation place, until size and position and the pre-set dimension and the position consistency of this place's circuit.
4. circuit board line compensation method as claimed in claim 3 is characterized in that this compensation method further comprises the curing conductive material.
5. circuit board line compensation method as claimed in claim 3 is characterized in that, this compensation method further comprises the chemical plating circuit, electroplates circuit or first chemical plating circuit re-plating circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103033834A CN101646308B (en) | 2008-08-05 | 2008-08-05 | Circuit compensation system of circuit board and method for circuit compensation thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103033834A CN101646308B (en) | 2008-08-05 | 2008-08-05 | Circuit compensation system of circuit board and method for circuit compensation thereby |
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| Publication Number | Publication Date |
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| CN101646308A CN101646308A (en) | 2010-02-10 |
| CN101646308B true CN101646308B (en) | 2011-09-21 |
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| CN2008103033834A Active CN101646308B (en) | 2008-08-05 | 2008-08-05 | Circuit compensation system of circuit board and method for circuit compensation thereby |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102189282B (en) * | 2010-03-12 | 2013-03-06 | 宏恒胜电子科技（淮安）有限公司 | System and method for making short slot hole of circuit board |
| CN108668444B (en) * | 2018-06-25 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Collapsible control method, machining method and system, computer storage medium and device |
| CN113351999A (en) * | 2021-05-31 | 2021-09-07 | 昆山大洋电路板有限公司 | Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86100704A (en) * | 1985-03-14 | 1986-09-10 | 罗伯特·比少普 | Automatically inspected object and to it known and unknown portions carries out utensil and the method that defect recognition etc. is used |
| CN1245632A (en) * | 1997-12-04 | 2000-02-23 | 大宇电子株式会社 | PCB testing circuit for automatic inserting apparatus and testing method therefor |
| CN1519569A (en) * | 2003-01-21 | 2004-08-11 | 英业达股份有限公司 | Method for checking linewidth of power wire in wiring overall arrangement |
| CN1960602A (en) * | 2005-10-21 | 2007-05-09 | 以色列商奥宝科技股份有限公司 | Automatic detection, repair and apparatus and method for automatic marking printed circuit board |
| JP2007258213A (en) * | 2006-03-20 | 2007-10-04 | Micronics Japan Co Ltd | Method and apparatus for repairing wire of circuit board |
-
2008
- 2008-08-05 CN CN2008103033834A patent/CN101646308B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86100704A (en) * | 1985-03-14 | 1986-09-10 | 罗伯特·比少普 | Automatically inspected object and to it known and unknown portions carries out utensil and the method that defect recognition etc. is used |
| CN1245632A (en) * | 1997-12-04 | 2000-02-23 | 大宇电子株式会社 | PCB testing circuit for automatic inserting apparatus and testing method therefor |
| CN1519569A (en) * | 2003-01-21 | 2004-08-11 | 英业达股份有限公司 | Method for checking linewidth of power wire in wiring overall arrangement |
| CN1960602A (en) * | 2005-10-21 | 2007-05-09 | 以色列商奥宝科技股份有限公司 | Automatic detection, repair and apparatus and method for automatic marking printed circuit board |
| JP2007258213A (en) * | 2006-03-20 | 2007-10-04 | Micronics Japan Co Ltd | Method and apparatus for repairing wire of circuit board |
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| CN101646308A (en) | 2010-02-10 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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