CN107134447A - A kind of compression joint type face matrix LED light source module - Google Patents
A kind of compression joint type face matrix LED light source module Download PDFInfo
- Publication number
- CN107134447A CN107134447A CN201710140996.XA CN201710140996A CN107134447A CN 107134447 A CN107134447 A CN 107134447A CN 201710140996 A CN201710140996 A CN 201710140996A CN 107134447 A CN107134447 A CN 107134447A
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- China
- Prior art keywords
- light source
- led light
- source module
- bus
- banding
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention belongs to semiconductor illumination technique neck city, and in particular to a kind of compression joint type face matrix LED light source module.LED light source module of the present invention includes module substrate, luminescence unit, banding positive pole, banding negative pole, positive bus, negative bus and module pressing plate；Banding positive pole is located at the both sides of luminescence unit with banding negative pole；Light source module is fixed on bottom plate by module pressing plate；Positive bus is closely crimped on banding positive pole by module pressing plate, and negative bus is closely crimped on banding negative pole by module pressing plate, keeps good electrical connection；Positive bus and negative bus as face matrix LED light source module electrode input/output terminal.Polylith face matrix LED light source module can be used in parallel or in series.Face matrix LED light source module can be crimped directly on the light source mounting surface of light fixture.The compression joint type electric connection mode of bus electrode bus proposed by the present invention is simple and reliable, is convenient for changing light source module, it is to avoid welded type bus electrode bus is to changing the trouble that LED light source module is brought.
Description
Technical field
The invention belongs to semiconductor illumination technique neck city, and in particular to a kind of compression joint type face matrix LED light source module.
Background technology
General lighting or special lighting LED/light source or light fixture needs certain luminous flux or radiation flux, and single envelope
The luminous flux or radiation flux for filling device or light source module may be not enough, therefore generally require multiple packagings or light source die
Block presses array arrangement, and the electrode pad of each packaging or light source module is electrically connected with the mode of welding.
Traditional LED light source module structure as shown in Figure 1, the LED formed after multiple LED chip integration packagings is luminous single
Member 1 is placed in the middle part of module substrate 4, and the surrounding of LED luminescence units 1 is with dot-shaped modules positive pole 2 and module negative 3.Module positive pole
Wire 6 is welded with module positive pole 2 and module negative 3 respectively with module negative wire 7.Fixed screw 10 through substrate fixing hole and
Bottom plate screw, LED light source module is fixed on bottom plate 8.
Because current LED packagings or light source module are all to be attached in a welding manner, to LED packagings or
The application of light source module brings many limitations, and it is to safeguard to carry out in the workshop for having welding condition especially to install.In LED street lamp
More troublesome, it is necessary to employ lift truck dismounting lamp package when safeguarding, maintenance is good to reinstall lamp stand with lift truck again afterwards, expense of taking a lot of work
When.Therefore need to propose it is a kind of be convenient for changing LED light source module be mounted and electrically connected mode.
The content of the invention
It is an object of the invention to provide a kind of installation, replacing, compression joint type face matrix LED light source module easy to maintenance.
The compression joint type face matrix LED light source module that the present invention is provided, including：Module substrate, luminescence unit, banding positive pole, band
Shape negative pole, positive bus, negative bus and module pressing plate；Wherein, banding positive pole is located at the both sides of luminescence unit with banding negative pole；
Light source module is fixed on bottom plate by module pressing plate by fixed screw；Positive bus is closely being crimped on banding just by module pressing plate
On extremely, negative bus is closely crimped on banding negative pole by module pressing plate, is allowed to keep good electrical connection；Positive bus and negative
Pole bus as face matrix LED light source module electrode input/output terminal.
In the LED light source module, positive bus is square, rectangle or pancake metal by section with negative bus
Conductor is made.
In the LED light source module, module pressing plate is made up of insulating materials, and specific material can be in plastics, resin, ceramics
One kind, or wherein several complexs.
In the LED light source module, the back side of LED light source module can attach flexible heat conductive pad.
Above-mentioned LED light source module, can turn into the combination of face matrix LED light source module, at this moment, with a plurality of banding just with polylith parallel connection
The positive bus that extreme pressure connects is as positive wire in parallel, and the negative bus crimped with a plurality of banding negative pole is led as negative pole in parallel
Line.
Above-mentioned LED light source module, can turn into the combination of face matrix LED light source module, at this moment, adjacent LED light source with polylith series connection
The opposite polarity of the band electrode of module；Positive bus is crimped with the banding positive pole of first piece of LED light source module, negative bus with
The banding negative pole crimping of last block LED light source module；Total wire crimp remaining adjacent heteropolarity band is connected by band electrode
Shape electrode, the length of band electrode connection bus is slightly less than 2 times of LED light source module crimping edge lengths.
The above-mentioned face matrix LED light source module or block combiner of the present invention, can directly crimp the light source installation installed in light fixture
On face.
The compression joint type electric connection mode of bus electrode bus proposed by the present invention is simple and reliable, can be on lamp stand directly more
Change face matrix LED light source module, it is to avoid welded type bus electrode bus is to changing the trouble that LED light source module is brought.The present invention
It is available for user more easily to carry out assembly, to be adapted to the demand of high-power indoor and outdoors light fixture adapted light source.
Brief description of the drawings
Fig. 1 is traditional LED light source module structural representation.
Fig. 2 is the compression joint type face matrix LED light source module structure schematic diagram of the present invention.
Fig. 3 is the polylith compression joint type face matrix LED light source module parallel combination splicing schematic diagram of the present invention.
Fig. 4 is the polylith compression joint type face matrix LED light source module tandem compound splicing schematic diagram of the present invention.
Fig. 5 is that compression joint type face matrix LED light source module schematic diagram is installed on lamp housing.
Label in figure
1 LED luminescence units, 2 module positive poles, 3 module negatives, 4 module substrates, 5 substrate fixing holes, 6 module positive poles are led
Line, 7 module negative wires, 8 bottom plates, 9 bottom plate screws, 10 fixed screws, 11 positive bus, 12 negative bus, 13 bands
Shape positive pole, 14 banding negative poles, 15 module pressing plates, 16 pressing plate through holes, 17 flexible heat conductive pads, 18 lamp casings, 19 crimping
Formula face matrix LED light source module, 20 band electrodes connection bus.
Embodiment
Below in conjunction with drawings and examples, the present invention will be further described.Described embodiment is only the present invention's
Section Example, based on the embodiment in the present invention, other all embodiments of creative achievement are made at end, belong to this hair
Bright protection domain.
Fig. 2 is a kind of compression joint type face matrix LED light source module, it is characterised in that the centre of face matrix LED light source module is a large amount of
The LED luminescence units of LED chip integration packaging, there are banding positive pole 13 and banding negative pole 14 in both sides respectively.Fixed screw 10
Screw 9 through on the pressing plate through hole 16 on module pressing plate 15 and bottom plate 8, LED light source module is fixed on bottom plate.
Positive bus 11 is accompanied between module pressing plate 15 and banding positive pole 13, is pressed from both sides between module pressing plate 15 and banding negative pole 14
There is negative bus 12.Face matrix LED light source module can be fixed on bottom plate 8 by module pressing plate 15, again be close to positive bus 11
Banding positive pole 13, negative bus 12 are close to banding negative pole 14, it is ensured that good electrical connection.
In order that when the face matrix LED light source module of ceramic substrate is crimped with bottom plate uniform force and be unlikely to rupture, module
The back side of substrate attaches flexible heat conductive pad 17.The radiating effect of face matrix LED light source module had so both been can ensure that, can ensure that again just
Good conductive contact, also facilitates LED/light source mould between pole bus 11 and banding positive pole 13, negative bus 12 and banding negative pole 14
The replacing of block.
Fig. 3 is the embodiment of polylith compression joint type face matrix LED light source module parallel connection splicing.N (N>=2) block compression joint type face battle array
LED light source module 19 is arranged with the adjacent compact fashion of same polarity, and 2NBlock module pressing plate 15 is by fixed screw 10 by light source die
Block 19 is fixed on bottom plate 8.Positive bus 11, module pressing plate are accompanied between module pressing plate 15 and the N ribbons positive pole 13 of homonymy
15 and homonymyNNegative bus 12 is accompanied between ribbon negative pole 14；The length of positive bus 11 and negative bus 12 isL, light
The crimping edge lengths of source module 19 area, haveL>Na.Thus can be used in parallel by polylith light source module.
Fig. 4 is the embodiment of polylith compression joint type face matrix LED light source module series connection splicing.N (N>=2) block adjacent LED light source
The opposite polarity of the band electrode of module.Positive bus 11 is connected with the banding positive pole of the 1st piece of LED light source module, negative bus
12 andNThe banding negative pole connection of block LED light source module；Bus 20 is connected by band electrode and connects remaining adjacent heteropolarity
Band electrode, the band electrode connection bus 20 length bel, LED light source module 19 crimping side length bea, havel< 2a。
The series winding assembly for being achieved in polylith face matrix LED light source module is used.
Fig. 5 is the embodiment that compression joint type face matrix LED light source module is installed on lamp housing.Bottom plate 8 is by a set of lamp casing 18
To replace.The mounting surface of LED light source module can be that the light source of the light fixtures such as street lamp, Projecting Lamp, bulkhead lamp, light supplementing lamp for plants is installed
Face.
Claims (7)
1. a kind of compression joint type face matrix LED light source module, it is characterised in that born including substrate, luminescence unit, banding positive pole, banding
Pole, positive bus, negative bus and module pressing plate；Wherein, banding positive pole is located at the both sides of luminescence unit with banding negative pole；Module
Light source module is fixed on bottom plate by pressing plate by fixed screw；And positive bus is closely being crimped on banding just by module pressing plate
On extremely, negative bus is closely crimped on banding negative pole by module pressing plate, is allowed to keep good electrical connection；Positive bus and negative
Pole bus as face matrix LED light source module electrode input/output terminal.
2. according to the compression joint type face matrix LED light source module described in claim 1, it is characterised in that described positive bus is with bearing
Pole bus is made up of section of square, rectangle or pancake metallic conductor.
3. according to the compression joint type face matrix LED light source module described in claim 1 or 2, it is characterised in that described module pressing plate by
Insulating materials is made, and material is one kind in plastics, resin, ceramics, or wherein several complex.
4. according to the compression joint type face matrix LED light source module described in claim 3, it is characterised in that the back side patch of LED light source module
With flexible heat conductive pad.
5. a kind of block combiner being made up of multiple compression joint type face matrix LED light source modules as described in one of claim 1-3, its
It is characterised by, is divided into parallel combination and tandem compound two ways；During parallel combination mode, in multiple face matrix LED light source modules,
The positive bus crimped with a plurality of banding positive pole is as positive wire in parallel, the negative bus conduct crimped with a plurality of banding negative pole
Cathode conductor in parallel；In tandem compound mode, the opposite polarity of the band electrode of adjacent LED light source module；Positive bus with
The banding positive pole crimping of first piece of LED light source module, negative bus is crimped with the banding negative pole of last block LED light source module；
Total wire crimp remaining adjacent heteropolarity band electrode is connected by band electrode, the length of band electrode connection bus is smaller
2 times of edge lengths are crimped in LED light source module.
6. according to the compression joint type face matrix LED light source module described in claim 1, it is characterised in that the face matrix LED light source module is straight
Crimping is connect on the light source mounting surface of light fixture.
7. according to the block combiner described in claim 5, it is characterised in that the block combiner directly crimps the light installed in light fixture
On the mounting surface of source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140996.XA CN107134447B (en) | 2017-03-10 | 2017-03-10 | Crimping type area array LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140996.XA CN107134447B (en) | 2017-03-10 | 2017-03-10 | Crimping type area array LED light source module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107134447A true CN107134447A (en) | 2017-09-05 |
| CN107134447B CN107134447B (en) | 2023-06-27 |
Family
ID=59721940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710140996.XA Active CN107134447B (en) | 2017-03-10 | 2017-03-10 | Crimping type area array LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107134447B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332688A (en) * | 2006-07-10 | 2006-12-07 | Rabo Sufia Kk | Led chip laminate and led chip array |
| CN202469683U (en) * | 2012-03-28 | 2012-10-03 | 瑞安市华隆灯饰有限公司 | Flexible LED (Light Emitting Diode) patch lamp band |
| CN202733667U (en) * | 2012-07-31 | 2013-02-13 | 四川新力光源股份有限公司 | Pressure welding light-emitting diode (LED) module street lamp |
| CN203607403U (en) * | 2013-11-20 | 2014-05-21 | 杭州友旺科技有限公司 | High-voltage LED integration packaging light source and high-voltage LED light fixture |
| CN203934023U (en) * | 2014-07-09 | 2014-11-05 | 梅州江南电器有限公司 | Driving power box and use the LED light source of this driving power box |
| CN105805616A (en) * | 2016-05-17 | 2016-07-27 | 复旦大学 | LED area light source modules capable of being spliced in array |
-
2017
- 2017-03-10 CN CN201710140996.XA patent/CN107134447B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332688A (en) * | 2006-07-10 | 2006-12-07 | Rabo Sufia Kk | Led chip laminate and led chip array |
| CN202469683U (en) * | 2012-03-28 | 2012-10-03 | 瑞安市华隆灯饰有限公司 | Flexible LED (Light Emitting Diode) patch lamp band |
| CN202733667U (en) * | 2012-07-31 | 2013-02-13 | 四川新力光源股份有限公司 | Pressure welding light-emitting diode (LED) module street lamp |
| CN203607403U (en) * | 2013-11-20 | 2014-05-21 | 杭州友旺科技有限公司 | High-voltage LED integration packaging light source and high-voltage LED light fixture |
| CN203934023U (en) * | 2014-07-09 | 2014-11-05 | 梅州江南电器有限公司 | Driving power box and use the LED light source of this driving power box |
| CN105805616A (en) * | 2016-05-17 | 2016-07-27 | 复旦大学 | LED area light source modules capable of being spliced in array |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107134447B (en) | 2023-06-27 |
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