CN107113963A - Self contraposition and the spoke type weld pad of solderability to improve integrated antenna package - Google Patents
Self contraposition and the spoke type weld pad of solderability to improve integrated antenna package Download PDFInfo
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- CN107113963A CN107113963A CN201580069601.0A CN201580069601A CN107113963A CN 107113963 A CN107113963 A CN 107113963A CN 201580069601 A CN201580069601 A CN 201580069601A CN 107113963 A CN107113963 A CN 107113963A
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- pad
- solder
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- power
- weld pad
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 87
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 description 14
- 230000008595 infiltration Effects 0.000 description 12
- 238000001764 infiltration Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 230000005484 gravity Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009878 intermolecular interaction Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Abstract
A kind of central pad or oar, it is formed with least three bending pointed cones, the symmetrical shape with the central axis radiated from integrated antenna package, it utilizes the surface tension of solder, in the pad of contraposition to the matched shape on a circuit board surface, increased Turning matched power and increased centering power during resulting from welded encapsulation.
Description
Technical field
This exposure is on a kind of weld pad, especially with regard to a kind of weld pad with more than three spokes, for integrated circuit
Encapsulation and/or circuit board.
Background technology
When welding component a to circuit board for high number of lead wires, one of numerous challenges encountered are the appropriate right of chip
Position.Appropriate contraposition is especially challenging in the engineering welded manually, and will also result in the engineering of automatic welding
It is difficult.
Brief Description Of Drawings
The present invention aspect being relevant to accompanying drawings and read detailed description content and can be optimal understanding.Schema
Various different aspects, feature and the embodiment of this exposure are shown, therefore the embodiment shown in knowing is only representative rather than right
In the exhaustion of scope.This exposure will be illustrated referring to the drawings, wherein similar numeral refers to similar component.
More several radial directions that Fig. 1 displays are arranged according to the symmetrical layout around an installation central point of an embodiment
The plan of axis.
Plan view from above of Fig. 2 displays according to the weld pad with least three solderable valves of an embodiment, each is solderable
Valve symmetrically extends along a longitudinal axis.
Fig. 3 shows the view of the pre-filled solder on weld pad as shown in Figure 2.
Fig. 4 displays are put down according to the vertical view of the pre-filled solder infiltrated when welding along each longitudinal axis of an embodiment
Face figure.
Fig. 5 display according to an embodiment a weld pad together with the rotary shifted more several weld pads of the weld pad from matching rotate to
The plan view from above of contraposition.
More several weld pads of one weld pad of Fig. 6 display one embodiments of foundation together with the offset from center of the weld pad dislocation from matching
Move to the plan view from above of contraposition.
The vertical view in untapped proximity space with a weld pad of integrated circuit package of Fig. 7 displays according to an embodiment
Plan.
Fig. 8 displays have along more several longitudinal axis and more several straight welderings for symmetrically extending according to an embodiment
The plan view from above of one weld pad of valve, each weldering valve has a rounded ends.
Plan view from above of Fig. 9 displays according to a weld pad with more several straight weldering valves for an embodiment, each weldering valve
Symmetrically extend and with a curved end along a longitudinal axis.
Plan view from above of Figure 10 displays according to the weld pad with more several straight weldering valves of an embodiment, each weldering
Valve symmetrically extends and with a straight end along a longitudinal axis.
Plan view from above of Figure 11 displays according to the weld pad as shown in Figure 8 of an embodiment, each weldering valve has one
Straight end.
Plan view from above of Figure 12 displays according to a triangle weld pad of an embodiment, the corner of the triangle weld pad is from pad portion
Center symmetrically extend along three longitudinal axis.
Plan view from above of Figure 13 displays according to the weld pad with least three solderable pointed cones of an embodiment, each can
Weldering pointed cone symmetrically extends along a longitudinal axis.
Plan view from above of Figure 14 displays according to a weld pad of an embodiment, its solderable pointed cone is along more several longitudinal axis
And symmetrically extend.
Stereogram of Figure 15 displays according to the frictional force of the infiltration of the solder on the weld pad of resistance one of an embodiment.
Stereogram of Figure 16 displays according to the gravity of the infiltration of the solder on the weld pad of influence one of an embodiment.
Stereogram of Figure 17 displays according to the surface tension of the infiltration of the solder on the weld pad of influence one of an embodiment.
Figure 18 displays are according to intermolecular/interatomic attractive force of the infiltration of the solder on the weld pad of influence one of an embodiment
Stereogram.
A weld pad of Figure 19 displays according to an embodiment with a radial direction central pad portion and influence solder on weld pad
The interactive stereogram of power of infiltration.
Figure 20 displays according to the component (section view) of the weld pad with a radial direction central pad portion of an embodiment, solder with
And the exploded perspective figure of a circuit board of the matching weld pad with a radial direction central pad portion.
Figure 21 displays according to the component (section view) of the weld pad with a radial direction central pad portion of an embodiment, solder with
And the stereogram of a circuit board of the matching weld pad with a radial direction central pad portion.
Side view of Figure 22 displays according to a section of the component, solder and circuit board of an embodiment.
Embodiment
This document illustrates the method for shaping the central pad and corresponding circuit board pad of a chip, to re-registrate surface
Power and intermolecular force and contribute to by the stress resetted into more towards a vertical orientation with longitudinal axis from one
Central point on pad and extend.Re-registrating for surface tension and intermolecular force is the periphery distribution based on around the pad
Power balance and in the IC chip produce one rotation and position centering effect.According to various embodiments of the present invention, chatted
Spoke type weld pad equipment, the foregoing missing that system and method is the weld pad for overcoming known general types stated, to improve integrated electricity
Road is encapsulated and/or self contraposition of circuit board and solderability.More specifically, described embodiment provides at least one spoke
Bar formula weld pad, being formed has the bending pointed cone of more than three, with from the axis of integrated antenna package center radiation and shape
Symmetrically.Immersional wetting, intermolecular force and the surface tension of solder help to exert a force to surface mount integrated circuit package
And help them to feel relieved.Be related to solder flow through a pad surface scope appropriate immersional wetting the intermolecular force and table
Face tension force, to help to be balanced the power between surface sticking assembly and pad, with make the dynamic balance one
Point is entreated, the residual effect of the central point is the component centering relative to pad.
Integrated circuit (IC) encapsulation of larger pad number is particularly difficult to contraposition.They have a positive rectangular center pad sometimes,
Heat is transferred to the contraposition of plate and assistance component by help from the IC.The problem of positive rectangular center pad be intermolecular force and
Surface tension is had the tendency that itself is aligned, and the institute in the case where there is a positive rectangular center pad along the edge of the pad
State edge and be directed and cause the rotating lever effect that minimum is only provided over the assembly.To intermolecular force and surface
The periphery that tension force is oriented perpendicular to correspondence radial direction pointed cone will allow those power to apply to pointed cone pad, be allowed to such as lever actuation around
One central point rotatably aligns the component.One positive rectangular pad, which has no, provides relevant for the pre-filled required many of central pad
Lack solder to weld a good vision queue of the component to printed circuit board (PCB).In addition, positive rectangular pad only applies minimum
Power come the chip of feeling relieved, and because of their shape, the positive rectangular pad needs the solder more accurately measured so that fixed
Heart effect is worked.
Refering to the detailed description of embodiment as indicated in the drawings.In following detailed description of, on the accompanying drawing shown, structure
Into this paper part, and the specific embodiment that this exposure can be implemented is shown by way of illustration.Shown embodiment it is various
Aspect will use the term of those skilled in the art and be described, by their achievement content transmission to other this areas
Technical staff.However, being carried out in the aspect that embodiment described herein can be described only with some.In order to explain, tool
Numeral, material and the configuration of body may be proposed to provide the thorough understanding to shown embodiment.However, in this paper institutes
The embodiment of narration can be implemented under without these details.In other examples, known feature can be omitted or
Simplify to avoid obscuring shown embodiment.Furthermore, various operations can be discussed as multiple discrete operations, therefore, so that
It can help to understand embodiment described herein；However, the order of explanation is understood not to mean that these operations are necessary
According to order.Especially, these operations need not be performed with the order of presentation.
In entire disclosure and schema, following term at least has the implication that correlation is described in detail herein, unless front and rear
Text is separately clearly stated.Lower note implication is not intended to limit these terms, but is only to provide as saying that term is used
Bright example.The implication of " one " and " described " may include both odd number and plural number.On " one embodiment " in specification
Or it is to be included in this exposure that " embodiment ", which means to be relevant to a specific feature, structure or characteristic that the embodiment described,
In at least one embodiment, but it need not be included in all embodiments of this exposure.Term as used herein " solder " is general
Refer to arbitrary various alloys, its contact for melting and being applied between two metal objects, and object need not heated to fusing point
In the case of they are engaged.Term as used herein " pad " refer generally to the solderable area of a shaping there is provided for a component with
A solder joint point between one plate.In addition, IC chip now has " matching pad ", IC chip and circuit board two are formed in
The pad of the separation of person, for matching each other.Term as used herein " surface tension " refers generally to have by subsurface molecule
Help pull to surface molecular to the main body of liquid and liquid is rendered as the shape with minimal surface area, and be applied to liquid
The attraction of the surface molecular of body.Therefore, surface tension is the class elastic force (elasticlike for being present in body surface
Force), liquid surface is particularly related to, helps to minimize surface area, it is the intermolecular interaction between surface molecular
Power it is asymmetric caused by.Term as used herein " cohesive force " refers generally to the molecular force between the particle in object or material
To combine them.Terms used herein " immersional wetting " refers generally to dissolution, and generation is dissolved and melted in heat fusing solder
When changing soldered surface, a new alloy for a mixture of the metal of solder and original surface is formed.Immersional wetting be for
Illustrating a material of melting can help to be combined with another metal by an intermolecular bond is formed in a surface junction
Degree together.Terms used herein " Turning matched " refers generally to a component and the one group of footpath extended from the center of a component
To axis for the contraposition for the match group longitudinal axis extended from the center of installation site, so that the axle of two pads is right each other
Position.Terms used herein " center contraposition " refers generally to center and the central contraposition of its installation site of a component.
Refering to Fig. 1, the symmetrical layout for surrounding an installation central point is shown according to an embodiment and is arranged is more several
The plan of longitudinal axis.In order that the manual welding of high pad number chip is simpler, the central pad can be with from less
The mode for more than the three symmetrical pointed cones of fillet that middle section extends is formed.Refering to Fig. 2, show have according to an embodiment
The plan view from above of the weld pad of solderable valve one of more than three.Each solderable valve symmetrically extends along a longitudinal axis.These
Pointed cone is symmetrical with the longitudinal axis like spoke, longitudinal axis be equally spaced in the component center around (see, for example,：Figure
1 and Fig. 2).These equidistant pointed cones increase the edge length of the central pad and formed along the axis.
Refering to Fig. 3, the plan view from above of the pre-filled solder on the weld pad is shown according to an embodiment.Solder can
It is filled with by pre-fill in the middle section of the spoke-like pad on plate.The middle section of the central pad is used as being placed on pad
Amount of solder measuring device (see, for example,：Fig. 3).A component with the spoke-like pad of foregoing one matching is placed on minimum
On the pad of the Turning matched error of degree.Now there is a state, in the heating of solder in the central pad and in component pad
Heating will cause solder since center with reference on the component to plate.
It can help to judge the quality of welding link with correct amount of solder in linking.When a solder joint is just being generated
When, the oxide layer on the metal surface being combined can prevent intermolecular attraction from occurring and prevent solder from fully infiltrating pad
Surface.Solder is an index for the appropriate infiltration of module wire and plate, indicates the condition foot for producing a solder joint
To produce a high-quality intermolecular bond between the metal and solder on the pad of plate and component.
When there is the welding condition of abundance (cleannes and temperature that include surface), solder will infiltrate plate and component
On pad whole surface, and pair between the surface tension of the solder and the intermolecular force of the solder can be set up
To a balance of power.The balance of this opposite forces is when the amount of solder is enough and forms a recessed fillet between engaged surface
Arrived by range estimation, wherein solder is smoothly introduced into the surface.The recessed fillet will be with perpendicular to soldered metal surface
Edge, such as pad on the component and plate, and itself orient.
When excessive solder is used to produce a solder joint, the surface of solder joint can become convex and as bubble
It is outstanding.In the case of this excess solder connection, whether detecing on the surface of soldered plate is smoothly infiltrated for solder
Survey, it is impossible to estimate and be done through standard.Therefore, the situation of excess solder connection can hinder because improperly heating or oxidized surface institute
The detection of the solder joint defect of cause.More specifically, if improperly heating or aoxidizing, then solder joint may
It is bad, but can not be still detected because of excess solder connection.
Refering to Fig. 4, the pre-filled solder that is infiltrated when being shown in welding according to an embodiment along each longitudinal axis is bowed
Planar view.As the component shifts near downwards the plate, solder equably will flow out from center or infiltrate, shape along pointed cone
Into component pointed cone and install pad pointed cone between solder fillet (see, for example,：Fig. 4).The solder fillet is along by pointed cone
The longitudinal axis in center and felt relieved, pad and the surface tension of solder and intermolecular force cause a revolving force (referring to
For example：Fig. 5), its pointed cone for pulling and/or rotating on the component matches pointed cone contraposition to on the plate.
Refering to Fig. 6, show a weld pad together with the more several of the offset from center of the weld pad dislocation of Self Matching according to an embodiment
The plan view from above of the weld pad, wherein the more several pads misplaced are shifted into contraposition.Along the rotation of the longitudinal axis
Turning power causes both power reciprocations between a Turning matched power and all pointed cones and causes a centering to align power (referring to example
Such as：Fig. 6).
Refering to Fig. 7, being shown in untapped proximity space according to an embodiment has a weld pad of integrated circuit package
Plan view from above.It seems through hole that the radial direction sharp conical shape of the central pad, which produces some on the plate below component and can put,
The empty space of circuit connection.This additional space can cause component density even closer on circuit board (see, for example,：
Fig. 7).
Furthermore, when using a central pad with more several radial direction pointed cones, an important chip dislocation pointer feature energy
It is added to the chip.For example, in one embodiment, it is used in the pointed cone of odd number used in the IC package of a rectangle
During the central pad (or pointed cone does not match any quantity of the number of sides of the chip), an index pointed cone can be provided pair
Position.More specifically, the index pointed cone is aligned, so that index pointed cone is with pin 1 and a central pad of corresponding contraposition
The relativeness of definition and feel relieved and point to the longitudinal axis that comes out of chip center perpendicular to the edge of the chip-side
It is onboard.Afterwards, when solder flows to central pad, the chip will rotate with relative to the central pad by the chip
On pointed cone and the plate on pointed cone align.More specifically, when pin one be located at correct position when, relative to around
Other all pads on the outside of IC chip, the IC chip self will be aligned to correct position.In one embodiment, if institute
State chip be initially be placed in the case where pin 1 is not in the position, then solder in the central pad on the plate with pointed cone
Flow and the IC chip is when voluntarily aligning, the IC chip will be rotated to not with being aligned in the chip outline on the plate
A position, and can promptly manifest to be substantially misaligned and one understand index there is provided the dislocation of the pin 1 of the IC chip.
Aim to show that pulvilliform change how can cause solder to soak in the variant of Fig. 2, Fig. 8 to Figure 14 layout painted
The slight change of profit or the characteristic of rate of discharge, and with solder along the pointed cone pad infiltrate and for intermolecular force and
Surface tension is changed in orientation of.More specifically, the alteration of form of the pointed cone can influence wetting or flow rate,
The direction of power over time, the mobility of the component over time also have solder integrally to flow to.The sharp pointed cone
(see, for example,：Figure 12 to Figure 14) represent for solder flow into one linearly reduction pad area also have have and the axis
One edge of orientation.Include camber line sharp conical shape (see, for example,：Fig. 2, Fig. 8 and Fig. 9) can be as solder be along pointed cone
Edge infiltrates and changes over time the force for solder, and is changed to the power that a non-thread is sexually revised from the power linearly changed.
Refering to Fig. 8, according to an embodiment show with along more several longitudinal axis symmetrically extend it is more several straight
Weld the plan view from above of the weld pad of valve one.According to an embodiment, each weldering valve has rounded ends.In addition, below the central pad
Each solder fillet increased surface area play the effect as the fin on a radiator and significantly increase
Plus the contact area between the central pad and air around it.This causes more heat to be transferred to the core from the solder
Air below piece.This heat transfer improved application is every in the various spoke type pad layouts shown in Fig. 2, Fig. 8 to Figure 14
One.
Refering to Fig. 9, the plan view from above of the weld pad with more several straight weldering valves, each weldering are shown according to an embodiment
Valve symmetrically extends along a longitudinal axis and with a curved end.
Refering to Figure 10, the plan view from above of the weld pad with more several straight weldering valves is shown according to an embodiment, respectively
Individual weldering valve symmetrically extends along a longitudinal axis and with a straight end.
Refering to Figure 11, the plan view from above of a weld pad is shown according to an embodiment, each weldering valve has a straight end.
Refering to Figure 12, the plan view from above of a weld pad, the corner of the triangle weld pad of the weld pad are shown according to an embodiment
It is symmetrically extended from the center in pad portion along three longitudinal axis.The simplest form of the arranged radially of pointed cone is a triangle, because
The minimum number of longitudinal axis necessary to reaching desired centering effect is embodied for it.
Refering to Figure 13, the plan view from above of the weld pad with the solderable pointed cone of more than three is shown according to an embodiment,
Each solderable pointed cone symmetrically extends along a longitudinal axis.The triangle weld pad shown in Figure 12 can be as shown in figure 13 by drawing
Enter side and increase the length at its edge in longitudinal axis and changed.The length for increasing edge along an axis means solder
Surface tension will more be pointed to the axis.
Refering to Figure 14, the plan view from above of a weld pad is shown according to an embodiment, its solderable pointed cone is along a longitudinal axis
Symmetrically extend.
During welding procedure, various contraposition power play a role in the movement or contraposition of a component.Four kinds main
Align power or wetting power include gravity (see, for example,：Figure 16), frictional force (see, for example,：Figure 15), surface tension (ginseng
See for example：Figure 17), and intermolecular/interatomic attractive force (see, for example,：Figure 18).These wetting power connect in a welding
In knot combine with determine solder by how along a weld pad surface infiltration (see, for example,：Figure 19).These wetting power
Combination have relative to solder, component and plate durection component.The wherein two (surface tension and frictional force) of the power
With the negative component for hindering wetting.3rd power, gravity may have negative sense or positive acting, depending on the component
Orientation.For surface sticking assembly, gravity would is that a positive force.4th power (intermolecular force) typically have along
The effect that solder is drawn out by surface, therefore there is a positive acting for wetting.Among many configurations, inhaled between atom
Gravitation or intermolecular interaction force component are one of most strong force components.
Refering to Figure 15, the solid of more several frictional force of the infiltration of the solder on one weld pad of resistance is shown according to an embodiment
Figure.
Refering to Figure 16, according to an embodiment using the more several potential of the infiltration of the stereogram display influence solder of a weld pad
Gravity.
Among pointed wetting power, have two for can reset to.Specifically, can reset to solder leaching
Profit power be surface tension (see, for example,：Figure 17) and intermolecular force (see, for example,：Figure 18).It is related to solder and flows through a pad
The intermolecular force and surface tension of the appropriate immersional wetting of the scope on surface, contribute to surface sticking assembly with
And the power between pad is balanced, so that the residual effect of a central point of the dynamic balance is centering of the component relative to pad.
The shape of weld pad has a restriction effect for being related to the power of wetting.The shape of the pad is used in the direction for changing power,
So as to change the direction that these power are applied to the component.
Refering to Figure 17, one embodiment of foundation shows the vertical of more several surface tension of the infiltration of the solder on one weld pad of influence
Body figure.
Refering to Figure 18, more several intermolecular/atoms of the infiltration of the solder on one weld pad of influence are shown according to an embodiment
Between attraction stereogram.The border that the edge of pad on one component is pulled as intermolecular/interatomic attractive force.Solder is not
Can infiltrate and exceed the pad, so in most embodiment, between the shape restriction molecule at pad portion edge/atom between
Attraction.On a component in typical annular central pad, the power will more along one outwardly axis contraposition and
Because the sides aligned parallel of pad in center provides rotates effe without progressively being infiltrated with solder.In being described for radial direction central pad
Embodiment, then power contraposition infiltrate to allow solder to infiltrate along the length of pad perpendicular to the longitudinal axis.
In one embodiment, producing for pad portion edge can be by central two input signal marked and drawed relative to pad
Relative position and be achieved.In one embodiment, first input signal is pointed out a little to obtain from what is moved around a central point
The current angle position of the subsequent point gone out.It is the polar coordinates measured with radian around angle that one marking wave, which can be used for producing the point,
The rotation of a central point (0,0) in system.
Second input signal can represent a marking wave, and marking wave can be used to as the point of rotation rotates around the central point
And change the radius of the point of rotation.The quantity of the valve produced in the central pad can be drawn by formula：
The quantity of valve=radius modulation frequency/speed
For example：If the point is rotated with 1 turn per second of frequency around a central axial line, and the radius of point is using every
The sinusoidal wave mode of second three ripples and moved in and out along radius, then the central pad with three valves will be generated.
In many examples, circuit is matched with more several weld pads on the component.However, in an at least embodiment
In, as long as the quantity with most valves has identical relatively large to have the multiple of the quantity of minimum valve on weld pad on weld pad
Small more several weld pads are compatible.In this way, the weld pad with three valves can be soldered to six valves, nine valves, 12
One weld pad of the valve for the multiple that valve, 15 valves or other sums are three.
Refering to Figure 19, the stereogram display according to the weld pad with a radial direction central pad portion of an embodiment is influenceed in institute
State the reciprocation of many kinds of force of the infiltration of solder on weld pad.
In one embodiment, the central portion of the radial direction weld pad can be changed, between restriction molecule/interatomic force simultaneously
And the tension force of a balance at the edge along the pad is formed to go out the edge of the pad with wetting.
The direction of power and tension force depend on the shape of the solder and the shape of the pad.As solder flows out weld pad
Edge, many kinds of force contraposition perpendicular to the edge and positive force (gravity and atom attraction) and negative force (surface tension and
Frictional force) between produce balance and tension force.Determine solder drawing or stream as pulvilliform is based on gravity and atom attraction
Dynamic direction, the tension force of many kinds of force will be aligned towards the edge of the pad.Surface tension and frictional force can be always
Inwardly pull and resist the movement in solder direction outwardly.
Refering to Figure 20, a component (section view), the solder of the weld pad with radial direction central pad portion are shown according to an embodiment
And the exploded perspective figure of a circuit board of the matching weld pad with a radial direction central pad portion.
Refering to Figure 21, a component (section view), the solder of the weld pad with radial direction central pad portion are shown according to an embodiment
And the explosive view of a circuit board of the matching weld pad with a radial direction central pad portion.
Refering to Figure 22, display is soldered to the side view of a section of a component of the circuit board.It is drawn on the left side
Be attached to central pad of the larger pad of the component and circuit board for matching, the two have from component center and from
One radial direction pattern of more several valves that the center that the component on the circuit board installs coverage area is extended.In the figure
Less pad (over the assembly and on the circuit board) on the right of formula represents the integrated circuit and correspondence component
More several pads of coverage area, installation site on the periphery of the component and its corresponding described circuit board are installed and divided
Cloth.
Although having shown and having illustrated specific embodiment herein, do not departing from the scope of this exposure, various replacements and/or
Impartial alternative the described specific embodiment of embodiment.The application is intended to any of the embodiment being discussed herein and changed
Write or change.
Claims (10)
1. a kind of pad layout, including：
One central pad portion；And
At least three radial direction lobes, are coupled in the central pad portion, are radially equidistantly set in the central pad portion, with by
It is that for increased Turning matched power, the Turning matched power system is relative to independent to increase the ratio of the amount at pad portion edge and produce one
Correlate and be increase in the contraposition power of the central pad.
2. pad layout as claimed in claim 1, wherein the central pad portion includes a central pre-filled region, the center
Pre-filled region as pre-filled solder pre-packed canister or measure region to improve the solderability of an encapsulation.
3. pad layout as claimed in claim 1, wherein at least three radial directions lobe includes most pointed cone pads, the point
Cone pad flows into for solder as expansion storage area or allows encapsulation to be placed on plate.
4. pad layout as claimed in claim 1, wherein at least three radial directions lobe includes most pointed cone pads, the point
Cone pad can be along an edge of contraposition by the counterbalancing power for providing intermolecular attraction and surface tension, and provides with solder
Outwards infiltrated and increased Turning matched power from the center of encapsulation.
5. pad layout as claimed in claim 1, wherein at least three radial directions lobe includes most pointed cone pads, the point
Cone pad extends outwardly tapered, and centering power is provided as solder is outwards infiltrated to a gradually small storage area.
6. pad layout as claimed in claim 1, wherein at least three radial directions lobe includes most pointed cone pads, the point
The orientation for the pattern that cone pad is extended outwardly based on they from the centre of chip provides centering power.
7. pad layout as claimed in claim 1, wherein at least three radial directions lobe includes most pointed cone pads, the point
Cone pad increases surface area along in the edge of the solder fillet in the central pad, it is allowed to which more heat is transferred to one from solder
Air below device wafer.
8. pad layout as claimed in claim 1, wherein the institute with the central portion and at least three radial directions lobe
State that pad layout is comparable relative to one circular or rectangular pads and reduce the encapsulation, plate and to fix a component extremely
The overall weight of the solder of one circuit board.
9. pad layout as claimed in claim 1, wherein the institute with the central portion and at least three radial directions lobe
State that pad layout is comparable relative to one to be had at least rectangle of same widths and/or height or have at least same diameter
Circular weld pad, less copper and the less solder of use is used in the plate and component of a final products, fee of material is caused
Reduction and/or increased material are recaptured.
10. a kind of radial direction weld pad, including：
One central pad or oar；And
The bending pointed cone of more than three, with from least three axis that the central pad is radiated and symmetrical shape, with contraposition extremely
During the pad of the matched shape on the surface of one circuit board, increased Turning matched power and increase during resulting from welded encapsulation
Centering power.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| US201462094842P | 2014-12-19 | 2014-12-19 | |
| US62/094,842 | 2014-12-19 | ||
| PCT/US2015/067224 WO2016100984A1 (en) | 2014-12-19 | 2015-12-21 | Spoked solder pad to improve solderability and self-alignment of integrated circuit packages |
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| CN107113963A true CN107113963A (en) | 2017-08-29 |
| CN107113963B CN107113963B (en) | 2020-07-24 |
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| CN107113963B (en) | 2020-07-24 |
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