CN107112257A - 检测从旋转卡盘丢失的晶片 - Google Patents

检测从旋转卡盘丢失的晶片 Download PDF

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Publication number
CN107112257A
CN107112257A CN201480084511.4A CN201480084511A CN107112257A CN 107112257 A CN107112257 A CN 107112257A CN 201480084511 A CN201480084511 A CN 201480084511A CN 107112257 A CN107112257 A CN 107112257A
Authority
CN
China
Prior art keywords
microelectronic substrate
detection
rotary chuck
detection part
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480084511.4A
Other languages
English (en)
Chinese (zh)
Inventor
艾伦·D·罗斯
迈克尔·格林哈根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tel Manufacturing and Engineering of America Inc
Original Assignee
FSI International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSI International Inc filed Critical FSI International Inc
Publication of CN107112257A publication Critical patent/CN107112257A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201480084511.4A 2014-12-10 2014-12-10 检测从旋转卡盘丢失的晶片 Pending CN107112257A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/069557 WO2016093824A1 (en) 2014-12-10 2014-12-10 Detection of lost wafer from spinning chuck

Publications (1)

Publication Number Publication Date
CN107112257A true CN107112257A (zh) 2017-08-29

Family

ID=56107842

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480084511.4A Pending CN107112257A (zh) 2014-12-10 2014-12-10 检测从旋转卡盘丢失的晶片

Country Status (4)

Country Link
JP (1) JP2018501654A (https=)
KR (1) KR20170093949A (https=)
CN (1) CN107112257A (https=)
WO (1) WO2016093824A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458471A (zh) * 2022-08-31 2022-12-09 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7756571B2 (ja) * 2022-01-19 2025-10-20 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
US5554964A (en) * 1992-07-09 1996-09-10 Siemens Aktiengesellschaft Microswitch with a magnetic field sensor
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
US20030132746A1 (en) * 2002-01-16 2003-07-17 Applied Materials, Inc. Proximity sensor
US20040004713A1 (en) * 2002-07-08 2004-01-08 Seung-Jae Go Method of and apparatus for detecting a defect at the outer peripheral edge of a wafer, and cleaning equipment comprising the apparatus
CN102867771A (zh) * 2012-09-18 2013-01-09 北京七星华创电子股份有限公司 具有监测半导体晶片状态功能的夹持装置和方法
JP5379533B2 (ja) * 2009-03-27 2013-12-25 大日本スクリーン製造株式会社 基板保持機構、およびこの基板保持機構を備える基板処理装置
US20140152976A1 (en) * 2012-11-09 2014-06-05 Kla-Tencor Corporation System and Method for Detecting Cracks in a Wafer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529637Y2 (ja) * 1991-08-30 1997-03-19 大日本スクリーン製造株式会社 基板の回転保持装置
JP5646528B2 (ja) * 2012-03-09 2014-12-24 東京エレクトロン株式会社 液処理装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
US5554964A (en) * 1992-07-09 1996-09-10 Siemens Aktiengesellschaft Microswitch with a magnetic field sensor
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
US20030132746A1 (en) * 2002-01-16 2003-07-17 Applied Materials, Inc. Proximity sensor
US20040004713A1 (en) * 2002-07-08 2004-01-08 Seung-Jae Go Method of and apparatus for detecting a defect at the outer peripheral edge of a wafer, and cleaning equipment comprising the apparatus
JP5379533B2 (ja) * 2009-03-27 2013-12-25 大日本スクリーン製造株式会社 基板保持機構、およびこの基板保持機構を備える基板処理装置
CN102867771A (zh) * 2012-09-18 2013-01-09 北京七星华创电子股份有限公司 具有监测半导体晶片状态功能的夹持装置和方法
US20140152976A1 (en) * 2012-11-09 2014-06-05 Kla-Tencor Corporation System and Method for Detecting Cracks in a Wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458471A (zh) * 2022-08-31 2022-12-09 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法
CN115458471B (zh) * 2022-08-31 2024-07-23 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法

Also Published As

Publication number Publication date
JP2018501654A (ja) 2018-01-18
KR20170093949A (ko) 2017-08-16
WO2016093824A1 (en) 2016-06-16

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Application publication date: 20170829