CN107077914A - Conductive paste and connection structural bodies - Google Patents

Abstract

The present invention provides a kind of conductive paste, and scolding tin particle can be efficiently configured on electrode by it, can prevent interelectrode dislocation, can improve interelectrode conducting reliability.The conductive paste of the present invention contains multiple scolding tin particles and adhesive, part and the outer surface of conductive part are the particle of scolding tin centered on the scolding tin particle, on the surface of the scolding tin of the scolding tin particle, pass through ehter bond, the group that ester bond or following formula (X)s are represented, it is covalently bonded with the group with least one carboxyl, more than the temperature of -10 DEG C of the fusing point of the scolding tin, and in the temperature province below the fusing point of the scolding tin, the minimum value of the viscosity of conductive paste is more than 100mPas, more than the temperature of -10 DEG C of the fusing point of the scolding tin, and in the temperature province below the fusing point of the scolding tin, the maximum of the viscosity of conductive paste is below 2000mPas.

Description

Conductive paste and connection structural bodies

Technical field

The present invention relates to a kind of conductive paste containing multiple scolding tin particles.Moreover, it relates to a kind of using on having State the connection structural bodies of conductive paste.

Background technology

The anisotropic conductive material such as anisotropic conductive paste and anisotropic conductive film is well known.With regard to above-mentioned each For anisotropy conductive material, electroconductive particle is dispersed with adhesive.

In order to obtain various connection structural bodies, above-mentioned anisotropic conductive material is used for such as flexible printing substrate and glass Connection (COF (the Chip on of the connection (FOG (Film on Glass)) of glass substrate, semiconductor chip and flexible printing substrate Film)), the connection (COG (Chip on Glass)) of semiconductor chip and glass substrate and flexible printing substrate and glass Connection (FOB (Film on Board)) of epoxy substrate etc..

Passing through electricity of the above-mentioned anisotropic conductive material to such as electrode of flexible printing substrate and glass epoxy substrate When pole is electrically connected, the anisotropic conductive material containing electroconductive particle is configured on glass epoxy substrate.Secondly, to scratching Property printed base plate carry out lamination and heat and pressurize.Thus, solidify anisotropic conductive material, and make across electroconductive particle Electrically connected between electrode, so as to obtain connection structural bodies.

As an example of above-mentioned anisotropic conductive material, it is following recorded in patent document 1 it is a kind of each to Different in nature conductive material, it contains electroconductive particle and will not complete the resin component of solidification in the fusing point of the electroconductive particle.Make For above-mentioned electroconductive particle, specifically, it can enumerate：Tin (Sn), indium (In), bismuth (Bi), silver-colored (Ag), copper (Cu), zinc (Zn), lead (Pb), the alloy of cadmium (Cd), gallium (Ga), the silver-colored metal such as (Ag) and thallium (Tl) or these metals.

Recorded in patent document 1 by the fusing point than above-mentioned electroconductive particle it is high and will not complete above-mentioned resin into Point solidification at a temperature of the resin heating stepses that are heated to anisotropic conductive resin and make above-mentioned resin component solidification Resin component curing schedule, make to be electrically connected between electrode.In addition, being recorded in patent document 1 with Fig. 8 of patent document 1 Shown temperature curve is installed., will not be complete at a temperature of being heated to anisotropic conductive resin in patent document 1 Into in the resin component of solidification, electroconductive particle is melted.

There is a kind of splicing tape disclosed in following patent documents 2, it includes the resin bed containing heat-curing resin, scolding tin Powder and curing agent, above-mentioned solder powder and above-mentioned curing agent are present in above-mentioned resin bed.The splicing tape is membranaceous rather than pasty state.

In addition, there is a kind of adhering method for having used above-mentioned splicing tape disclosed in patent document 2.Specifically, from following Start successively to first substrate, splicing tape, second substrate, splicing tape and the 3rd substrate joining, so as to obtain laminated body.Now, Make the second electrode for being arranged at the first electrode on first substrate surface with being arranged at second substrate surface opposed.In addition, making setting Second electrode and the 3rd electrode contraposition for being arranged at the 3rd substrate surface in second substrate surface.Moreover, with specified temperature Heating laminated body is bonded.Thus connection structural bodies is obtained.

There is a kind of anisotropy that electroconductive particle is dispersed with insulating properties adhesive disclosed in following patent documents 3 Conductive material.Lowest melt viscosity [the η of the anisotropic conductive material₀] it is 1.0 × 10²~1.0 × 10⁶mPa·sec.This is each In anisotropy conductive material, 1 ＜ [η are met₁]/[η₀]≤3([η₀] be anisotropic conductive material lowest melt viscosity, [η₁] For the temperature T than showing lowest melt viscosity₀Low 30 DEG C of temperature T₁Under melt viscosity).

There is a kind of anisotropic conductive material disclosed in following patent documents 4,5, it contains：Thermocurable adhesive, Fusing point is less than 180 DEG C or less than 160 DEG C of scolding tin particle and flux constituents.As above-mentioned flux constituents, under can be used State formula (101) or the compound shown in (102).In addition, for anisotropic conductive material described in patent document 4, as Above-mentioned Thermocurable adhesive, it is necessary to contain epoxy resin and cationic curing initiator.In addition, described in patent document 4,5 There are flux constituents and scolding tin particle to carry out chelating ligands.

[chemical formula 1]

[chemical formula 2]

In above-mentioned formula (101) and above-mentioned formula (102), R₁~R₄Hydrogen atom, alkyl or hydroxyl are represented, X is represented to have and can be coordinated The isolated electron pair of metal or the atomic group of double bond pi-electron, Y represent to form the atom of main chain backbone or atomic group.Need Bright is, in patent document 5, and the Y in above-mentioned formula (101) and above-mentioned formula (102) is alkyl.

There is a kind of solder ball disclosed in following patent documents 6, it is 10~25 and by with carboxyl by carbon number At least two kinds of organic acids are coated to surface.In the solder ball, the carboxyl of above-mentioned organic acid and the surface of above-mentioned solder ball are entered Chelating ligands are gone.

Have a kind of solder powder disclosed in following patent documents 7, its make aliphatic acid and dicarboxylic acids at least one on surface Progress is chemically bonded to be formed so as to carry out cladding.In addition, there is one kind to contain above-mentioned solder powder, resin disclosed in patent document 7 With the conductive adhesive (anisotropic conductive material) of curing agent.

There is a kind of electroconductive particle disclosed in following patent documents 8, it has scolding tin on the surface of electric conductivity, in scolding tin Surface be covalently bonded with the group containing carboxyl.

Prior art literature

Patent document

Patent document 1:Japanese Unexamined Patent Publication 2004-260131 publications

Patent document 2:WO2008/023452A1

Patent document 3:Japanese Unexamined Patent Publication 2009-32657 publications

Patent document 4:Japanese Unexamined Patent Publication 2011-63727 publications

Patent document 5:WO2009/001448A1

Patent document 6:Japanese Unexamined Patent Publication 2008-272779 publications

Patent document 7:Japanese Unexamined Patent Publication 2010-126719 publications

Patent document 8:WO2013/125517A1

The content of the invention

The technical problems to be solved by the invention

In the anisotropic conductive paste of the conventional electroconductive particle containing solder powder or surface with soldering-tin layer, scolding tin Powder or electroconductive particle can not be efficiently configured on electrode (line) sometimes.In conventional solder powder or electroconductive particle, sometimes Solder powder or electroconductive particle are slow to the translational speed on electrode.

In addition, using the anisotropic conductive material described in patent document 1, with the method pair described in patent document 1 When being electrically connected between electrode, it is not efficiently configured on electrode (line) sometimes with the electroconductive particle of scolding tin.In addition, specially In the embodiment of sharp document 1, in order to make scolding tin fully move at a temperature of more than the fusing point of scolding tin, a constant temperature is maintained at Degree, the manufacture efficiency step-down of connection structural bodies.When being installed with the temperature curve shown in Fig. 8 of patent document 1, attachment structure The manufacture efficiency step-down of body.

In addition, the splicing tape described in patent document 2 is membranaceous rather than paste-like.Therefore, it is difficult solder powder is effective Ground is configured on electrode (line).For example, in splicing tape described in patent document 2, a part for solder powder is easily configurable at not There is the region (space) to form electrode.The solder powder for being configured at the region for not forming electrode does not contribute to interelectrode lead It is logical.

It should be noted that in patent document 2, on the electroconductive particle for anisotropic conductive material, not having The record of body.In the embodiment of patent document 3, it may be used on the surface of resin particle and is formed with layers of copper, and in the layers of copper Surface formed soldering-tin layer electroconductive particle.The core of the electroconductive particle is made up of resin particle.In addition, using special During anisotropic conductive material described in sharp document 2,3, electroconductive particle is difficult to be efficiently configured on electrode (line), sometimes Dislocation is produced between electrode above and below should connecting.

In addition, in patent document 7, at least one for making aliphatic acid and dicarboxylic acids is chemically bonded on surface.In addition, specially In sharp document 7, in order to obtain solder powder, reacted without using catalyst at 40~60 DEG C.Therefore, aliphatic acid and dicarboxyl Acid is on the surface of solder powder without covalent bonding.Even if using the solder powder described in this patent document 7, aliphatic acid or two Carboxylic acid also easily comes off from the surface of solder powder, interelectrode connection resistance rise, or can not be adequately suppressed space sometimes Produce.

It is an object of the present invention to provide a kind of conductive paste, it can be such that scolding tin particle is efficiently configured on electrode, Interelectrode dislocation can be prevented, interelectrode conducting reliability can be improved.In addition, it is an object of the present invention to provide one Plant using the connection structural bodies for having above-mentioned conductive paste.

Technical scheme for solving problem

According to the broad aspect of the present invention there is provided a kind of conductive paste, it contains multiple scolding tin particles and adhesive, institute The particle that part and the outer surface of conductive part centered on scolding tin particle are scolding tin is stated,

On the surface of the scolding tin of the scolding tin particle, the group represented by ehter bond, ester bond or lower formula (X), covalent bond Conjunction have the group with least one carboxyl, more than the temperature of -10 DEG C of the fusing point of the scolding tin and the scolding tin fusing point In following temperature province, the minimum value of the viscosity of conductive paste is more than 100mPas, in -10 DEG C of the fusing point of the scolding tin Temperature more than and the fusing point of the scolding tin below temperature province in, the maximum of the viscosity of conductive paste is 2000mPa Below s.

[chemical formula 3]

At certain specific aspect of the conductive paste of the present invention, described adhesive will not be in the molten of the scolding tin particle Point completes solidification.

At certain specific aspect of the conductive paste of the present invention, on the surface of the scolding tin of the scolding tin particle, pass through The group that the formula (X) represents, is covalently bonded with the group with least one carboxyl.

At certain specific aspect of the conductive paste of the present invention, described adhesive contains Thermocurable compound and thermosetting Agent.

At certain specific aspect of the conductive paste of the present invention, the Thermocurable compound contains crystallinity heat cure Property compound.

At certain specific aspect of the conductive paste of the present invention, the average grain diameter of the scolding tin particle for more than 1 μm and Less than 40 μm.

In certain specific aspect of the conductive paste of the present invention, the weight % of conductive paste 100, the scolding tin particle Content is more than 10 weight % and below 90 weight %.

According to the broad aspect of the present invention there is provided a kind of connection structural bodies, it possesses：Surface has the of first electrode One connecting object part, surface there is the second connecting object part of second electrode and by the first connecting object part and The connecting portion that the second connecting object part links together, the material of the connecting portion is described conductive paste, described First electrode and the second electrode realize electrical connection by the scolding tin particle.

The effect of invention

The conductive paste of the present invention contains part and conduction centered on multiple scolding tin particles and adhesive, above-mentioned scolding tin particle The outer surface in portion is the particle of scolding tin, on the surface of the scolding tin of above-mentioned scolding tin particle, passes through ehter bond, ester bond or above-mentioned formula (X) represent radicals covalent bonds close have the group with least one carboxyl, above-mentioned scolding tin more than -10 DEG C of fusing point and on State in the temperature province below the fusing point of scolding tin, the minimum value of the viscosity of conductive paste is more than 100mPas, above-mentioned scolding tin In temperature province below the fusing point of more than -10 DEG C of fusing point and above-mentioned scolding tin, the maximum of the viscosity of conductive paste is Below 2000mPas, therefore, it can scolding tin particle being efficiently configured on electrode, can prevent interelectrode dislocation, can To improve interelectrode conducting reliability.

Brief description of the drawings

Fig. 1 is to schematically show the connection structural bodies obtained using the conductive paste of an embodiment of the invention Profile；

Fig. 2 (a)~(c) is for illustrating that the conductive paste using an embodiment of the invention manufactures connection structural bodies Method an example each operation profile；

Fig. 3 is the profile for the variation for representing connection structural bodies.

Description of symbols

1st, 1X ... connection structural bodies

2 ... first connecting object parts

2a ... first electrodes

3 ... second connecting object parts

3a ... second electrodes

4th, 4X ... connecting portions

4A, 4XA ... solder sections

4B, 4XB ... solidfied material portion

11 ... conductive pastes

11A ... scolding tin particles

11B ... Thermocurable compositions

Embodiment

Hereinafter, illustrate that the present invention's is detailed.

(conductive paste)

The conductive paste of the present invention contains multiple scolding tin particles and adhesive.Part and conduction centered on above-mentioned scolding tin particle The outer surface in portion is the particle of scolding tin.The core of above-mentioned scolding tin particle and the outer surface of conductive part are formed by scolding tin. On the surface of the scolding tin of above-mentioned scolding tin particle, the group represented by ehter bond, ester bond or following formula (X)s is covalently bonded with tool There is the group of at least one carboxyl.It is more than -10 DEG C of the fusing point (10 DEG C lower than the fusing point of scolding tin of temperature) of above-mentioned scolding tin and on State in the temperature province R below the fusing point of scolding tin, the minimum value of the viscosity of conductive paste is more than 100mPas, above-mentioned scolding tin More than -10 DEG C of fusing point and the fusing point of above-mentioned scolding tin below temperature province R in, the maximum of the viscosity of conductive paste is Below 2000mPas.It should be noted that in following formula (X)s, right part and left part represent to be bonded position.

[chemical formula 4]

Above-mentioned scolding tin particle to scolding tin particle by the compound with carboxyl with merely having carried out cladding processing Particle is different.In above-mentioned scolding tin particle, not only there is carboxyl on the surface of scolding tin, moreover, passing through ehter bond, ester on the surface of scolding tin The group that key or formula (X) are represented, is bonded with the group with least one carboxyl.In addition, above-mentioned scolding tin particle with scolding tin Chelated surface coordination (coordination bonding) has the scolding tin particle of the compound with carboxyl also different.

In the present invention, the above-mentioned composition due to possessing, therefore, and in the case of being electrically connected electrode, multiple welderings Tin particle is easily gathered between electrode opposed up and down, and multiple scolding tin particles can be efficiently configured on electrode (line).Separately Outside, a part for multiple scolding tin particles is difficult to be configured at the region (space) for not forming electrode, can make to be configured at no shape Amount into the scolding tin particle in the region of electrode is considerably less.In the present invention, it can make to be not at opposed interelectrode scolding tin grain Son is effectively moved between opposed electrode.It is thus possible to improve interelectrode conducting reliability.Furthermore, it is possible to which prevent can not The interelectrode electrical connection being laterally abutted of connection, can improve insulating reliability.And it is possible to prevent interelectrode dislocation. In the present invention, on the first connecting object part for be coated with conductive paste during overlapping second connecting object part, even in In the state of the alignment of the electrode of the electrode of one connecting object part and the second connecting object part deviates, overlapping first connection pair In the case of as part and the second connecting object part, can also correct its misplace and make the first connecting object part electrode and The electrode connection (self alignment effect) of second connecting object part.In order to obtain such effect, using specific scolding tin particle, And consider the fusing point of its scolding tin particle, so that the viscosity of conductive paste is controlled in specific scope, have contributed much.

It should be noted that the substrate particle formed using possessing by non-scolding tin and being configured on the surface of substrate particle In the case of the electroconductive particle rather than the above-mentioned scolding tin particle of use of soldering-tin layer, electroconductive particle is difficult aggregation on electrode, The mutual scolding tin zygosity of electroconductive particle is low, therefore, and the electroconductive particle moved on electrode is easier to move to outside electrode.Cause This, the inhibition of interelectrode dislocation also step-down.In the present invention, using scolding tin particle, rather than using possessing substrate particle With the electroconductive particle for the soldering-tin layer being configured on the surface of substrate particle, go far towards to make scolding tin grain between opposed electrode Son is effectively moved.

In above-mentioned scolding tin particle, the group represented on the surface of scolding tin by ehter bond, ester bond or formula (X) is covalently bonded with Group with least one carboxyl, therefore, it can to suppress the generation in the space in obtained connection structural bodies.It can suppress empty Connection reliability in the result of the generation of gap, connection structural bodies is improved.And it is possible to suppress the attachment structure as caused by space The rising of the connection resistance of body.In addition, being difficult to form oxide-film on scolding tin surface, and can have when being attached between electrode Effect ground excludes the oxide-film of electrode surface.

In addition, before scolding tin particle is scattered in adhesive, the surface of the scolding tin preferably in above-mentioned scolding tin particle On, the group represented by ehter bond, ester bond or formula (X) is bonded with the group with least one carboxyl.It is preferred that making in scolding tin On surface, the group represented by ehter bond, ester bond or formula (X) is bonded with the scolding tin particle of the group with least one carboxyl It is scattered in adhesive and obtains conductive paste.Before scolding tin particle is scattered in adhesive, by above-mentioned scolding tin grain On the scolding tin surface of son, the group represented by ehter bond, ester bond or formula (X) is bonded with the group with least one carboxyl, i.e., Make to mismatch fluxing agent in conductive paste, or the amount of the fluxing agent added in conductive paste is few, it is possibility to have effect ground Exclude the oxide-film of scolding tin surface and electrode surface.Due to mismatching fluxing agent, or the usage amount of fluxing agent is reduced, can more entered One step suppresses the generation in the space in connection structural bodies.

In above-mentioned scolding tin particle, it can make on scolding tin surface, the group represented by ehter bond, ester bond or formula (X), bonding There is the thickness of the covering portion of the group with least one carboxyl thickening.Thus, it is possible to effectively exclude scolding tin particle and electrode Surface oxide-film, interelectrode connection resistance can be reduced.In addition, in above-mentioned scolding tin particle, due to above-mentioned group Import, the hydroxyl of scolding tin particle surface is reduced, it is possible thereby to reduce the electric charge of scolding tin particle surface.As a result, being conductively connected When, scolding tin particle is easily and efficiently assembled.

In order that scolding tin particle is further efficiently configured on electrode, the group that above-mentioned formula (X) represents is preferably comprised Urethane bond.

From the viewpoint of the effect for effectively playing the present invention, above-mentioned adhesive preferably will not be in above-mentioned scolding tin particle Fusing point completes solidification.Refer to it should be noted that solidification will not be completed in the fusing point of scolding tin particle：In the fusing point of scolding tin particle, Adhesive is the state with mobility.

In order to which scolding tin particle is further efficiently configured on electrode, in the R of said temperature region, conductive paste The minimum value of viscosity is preferably more than 150mPas, more preferably more than 200mPas.In order to by scolding tin particle further Be efficiently configured on electrode, in the R of said temperature region, the maximum of the viscosity of conductive paste be preferably 1500mPas with Under, more preferably below 1000mPas.

In the R of said temperature region, " STRESSTECH " that the viscosity of conductive paste is manufactured using EOLOGICA companies, Root diameter 20mm, vibration deformation control, and start to warm up and be measured under conditions of 10 DEG C/min of speed from 23 DEG C.

From scolding tin particle is further efficiently configured on electrode, further effectively suppresses interelectrode mistake Position, further improve it is interelectrode conducting reliability and insulating reliability from the viewpoint of, above-mentioned conductive paste is at 25 DEG C Viscosity be preferably more than 100Pas, more preferably more than 150Pas, preferably below 600Pas, more preferably Below 500Pas.

Using E types viscosimeter, (Toki Sangyo Co., Ltd. manufactures viscosity of the above-mentioned conductive paste at 25 DEG C " TVE22L "), it is measured under conditions of 25 DEG C and 5rpm.

Above-mentioned conductive paste is preferably anisotropic conductive paste.Above-mentioned conductive paste is preferred for the electrical connection of electrode. Above-mentioned conductive paste is preferably circuit connection material.

Above-mentioned conductive paste and above-mentioned adhesive preferably comprise thermoplastic composition or Thermocurable composition.Above-mentioned conductive paste And above-mentioned adhesive can contain thermoplastic composition, Thermocurable composition can also be contained.Above-mentioned conductive paste and above-mentioned bonding Agent preferably comprises Thermocurable composition.Above-mentioned conductive paste and above-mentioned adhesive preferably comprise Thermocurable compound and heat cure Agent.

Hereinafter, each composition contained in above-mentioned conductive paste is illustrated.

(scolding tin particle)

Above-mentioned scolding tin particle has scolding tin in the outer surface of conductive part.Part and conductive part centered on above-mentioned scolding tin particle Outer surface is the particle of scolding tin.

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, it is excellent It is selected on the surface of scolding tin, the group containing carboxyl is covalently bonded with by ehter bond or ester bond.

There is hydroxyl on the surface of scolding tin.By making the hydroxyl and group containing carboxyl carry out covalent bonding, with utilization Other coordinate bonds (chelating ligands) etc. compare its situation about being bonded, and can form strong bonding, therefore, can obtain interelectrode The scolding tin particle that the reduction of connection resistance and the generation in space can be controlled.

In above-mentioned scolding tin particle, in the bonding pattern of the surface of scolding tin and group containing carboxyl, it can not contain and match somebody with somebody Position key, can also not contain the bonding based on chelating ligands.

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, on State scolding tin particle preferably by using with can with the compound of the functional group of hydroxyl reaction and carboxyl (it is following, sometimes referred to as Compound X), and make above-mentioned to obtain with the hydroxyl reaction on the functional group of hydroxyl reaction and the surface of scolding tin.In above-mentioned reaction, Form covalent bond.By making above-mentioned functional group's progress that can be with hydroxyl reaction in the hydroxyl and above-claimed cpd X on scolding tin surface Reaction, can be readily derived the scolding tin particle that the group containing carboxyl is covalently bonded with the surface of scolding tin, can also obtain To the scolding tin particle for being covalently bonded with the group containing carboxyl by ehter bond or ester bond on the surface of scolding tin.By make it is above-mentioned can Reacted with the functional group of hydroxyl reaction and the hydroxyl on above-mentioned scolding tin surface, above-mentioned chemical combination can be made on the surface of scolding tin Thing X is chemically bonded with the form of covalent bond.

As above-mentioned functional group that can be with hydroxyl reaction, hydroxyl, carboxyl, ester group and carbonyl etc. can be enumerated.It is preferred that hydroxyl or Carboxyl.Above-mentioned can be able to be hydroxyl with the functional group of hydroxyl reaction, or carboxyl.

As with can be with the functional group of hydroxyl reaction compound, can enumerate：Levulic acid, glutaric acid, butanedioic acid, apple Tartaric acid, oxalic acid, malonic acid, adipic acid, 5- ketohexonic acids, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- sulfydryls are different Butyric acid, 3- methylpropanethioates, 3- phenylpropionic acids, 3- phenylisobutyrics, 4-phenylbutyrate, capric acid, dodecylic acid, the tetradecane Acid, pentadecanoic acid, hexadecanoic acid, palmitoleic acid, Heptadecanoic acide, stearic acid, oleic acid, octadecadienoic acid, linoleic acid, (9,12,15)-leukotrienes, nonadecylic acid, arachidic acid, decanedioic acid and dodecanedioic acid etc..It is preferred that glutaric acid or glycolic.It is above-mentioned With independent a kind can be used with the compound of the functional group of hydroxyl reaction, two or more can also be applied in combination.Above-mentioned tool Having can be preferably the compound with least one carboxyl with the compound of the functional group of hydroxyl reaction.

Above-claimed cpd X preferably there is fluxing agent to act on, and above-claimed cpd X has preferably carried out bonding on the surface of scolding tin Under state there is fluxing agent to act on.The compound acted on fluxing agent can remove the oxide-film and electrode surface on scolding tin surface Oxide-film.Carboxyl has fluxing agent effect.

As the compound acted on fluxing agent, it can enumerate：Levulic acid, glutaric acid, butanedioic acid, 5- ketohexonic acids, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- mercaptoisobutyric acids, 3- methylpropanethioates, 3- phenylpropionic acids, 3- benzene Base isobutyric acid and 4-phenylbutyrate etc..It is preferred that glutaric acid or glycolic.The above-mentioned compound acted on fluxing agent can be used Independent a kind, two or more can also be applied in combination.

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, on State in compound X it is above-mentioned can be preferably hydroxyl or carboxyl with the functional group of hydroxyl reaction.Above-mentioned in above-claimed cpd X can be with The functional group of hydroxyl reaction can be hydroxyl, or carboxyl.It is above-mentioned can be with feelings that the functional group of hydroxyl reaction is carboxyl Under condition, above-claimed cpd X preferably has at least two carboxyl.By the carboxylic for the part for making the compound with least two carboxyl Base and the hydroxyl reaction on scolding tin surface, can obtain the scolding tin particle that the group containing carboxyl is covalently bonded with scolding tin surface.

The manufacture method of above-mentioned scolding tin particle includes, such as using scolding tin particle by the scolding tin particle, with can be with hydroxyl The process that the functional group of reaction and the compound of carboxyl, catalyst and solvent are mixed.The manufacture method of above-mentioned scolding tin particle In, by above-mentioned mixed processes, the weldering that the group containing carboxyl is covalently bonded with the surface of scolding tin can be readily derived Tin particle.

In addition, in the manufacture method of above-mentioned scolding tin particle, scolding tin particle is preferably used, to the scolding tin particle, with above-mentioned It can be mixed and heated with the functional group of hydroxyl reaction and compound, above-mentioned catalyst and the above-mentioned solvent of carboxyl.By mixed Close and heating process, can further be readily derived the weldering that the group containing carboxyl is covalently bonded with the surface of scolding tin Tin particle.

As above-mentioned solvent, it can enumerate：The alcoholic solvents such as methanol, ethanol, propyl alcohol, butanol, or acetone, methyl ethyl ketone, second Acetoacetic ester, toluene and dimethylbenzene etc..Above-mentioned solvent is preferably organic solvent, more preferably toluene.Above-mentioned solvent can use list Only a kind, two or more can also be applied in combination.

As above-mentioned catalyst, p-methyl benzenesulfonic acid, benzene sulfonic acid and 10- camphorsulfonic acids etc. can be enumerated.Above-mentioned catalyst is preferred For p-methyl benzenesulfonic acid.Above-mentioned catalyst can use independent a kind, and two or more can also be applied in combination.

It is preferred that being heated in above-mentioned mixing.Heating-up temperature is preferably more than 90 DEG C, more preferably more than 100 DEG C, excellent Elect less than 130 DEG C, more preferably less than 110 DEG C as.

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, on State work of the scolding tin particle preferably through the hydroxyl reaction on the surface for making above-mentioned isocyanates and scolding tin using isocyanate compound Sequence and obtain.In above-mentioned reaction, covalent bond is formed.By reacting the hydroxyl and above-mentioned isocyanate compound on scolding tin surface, The scolding tin for the nitrogen-atoms that the group from above-mentioned formula NCO is covalently bonded with the surface of scolding tin can be readily derived Particle.By making above-mentioned isocyanate compound and the hydroxyl reaction on the surface of above-mentioned scolding tin, it can make on the surface of scolding tin The above-mentioned group from NCO is chemically bonded with the form of covalent bond.

Furthermore it is possible to make silane coupler easily be reacted with the group from NCO.Due to can be easily Above-mentioned scolding tin particle is obtained, therefore, the above-mentioned group with least one carboxyl is preferably by using the silane with carboxyl The reaction of coupling agent and import, or preferably by after the reaction of silane coupler has been used, make have at least one carboxyl Compound with from silane coupler radical reaction and import.Above-mentioned scolding tin particle is preferably by using above-mentioned isocyanates Compound makes the hydroxyl reaction on the surface of above-mentioned isocyanate compound and scolding tin, then, makes the change with least one carboxyl Compound reacts and obtained.

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, on Stating the compound with least one carboxyl preferably has multiple carboxyls.

As above-mentioned isocyanate compound, it can enumerate：Diphenyl methane -4,4 '-diisocyanate (MDI), six methylenes Group diisocyanate (HDI), toluene di-isocyanate(TDI) (TDI) and IPDI (IPDI) etc..This can be used Isocyanate compound beyond a little.Make the compound after the surface reaction of scolding tin, make residual NCO and residual with this NCO has reactivity and the compound with carboxyl is reacted, it is possible thereby to represented on scolding tin surface by formula (X) Group imports carboxyl.

As above-mentioned isocyanate compound, the chemical combination with unsaturated double-bond and with NCO can be used Thing.Such as 2- acryloyloxyethyl isocyanates and methacrylic acid -2- isocyanato ethyls can be enumerated.Make the compound NCO after the surface reaction of scolding tin, make that there is reactive function containing the unsaturated double-bond relative to remaining Group and the compound reaction with carboxyl, it is possible thereby to import carboxyl in the group that scolding tin surface is represented by formula (X).

As above-mentioned silane coupler, 3- isocyanates propyl-triethoxysilicane (SHIN-ETSU HANTOTAI's chemical industry strain formula can be enumerated " KBE-9007 " of commercial firm's manufacture) and 3- isocyanates the propyl trimethoxy silicane (" Y- of MOMENTIVE companies manufacture 5187 ") etc..Above-mentioned silane coupler can use independent a kind, and two or more can also be applied in combination.

As the above-mentioned compound with least one carboxyl, it can enumerate：Levulic acid, glutaric acid, butanedioic acid, apple Acid, oxalic acid, malonic acid, adipic acid, 5- ketohexonic acids, 3- hydracrylic acids, 4-Aminobutanoicacid, 3- mercaptopropionic acids, 3- mercaptoisobutanoics Acid, 3- methylpropanethioates, 3- phenylpropionic acids, 3- phenylisobutyrics, 4-phenylbutyrate, capric acid, dodecylic acid, tetradecanoic acid, Pentadecanoic acid, hexadecanoic acid, palmitoleic acid, Heptadecanoic acide, stearic acid, oleic acid, 11- octadecene diacids, linoleic acid, (9,12,15)-leukotrienes, nonadecylic acid, arachidic acid, decanedioic acid and dodecanedioic acid etc..It is preferred that glutaric acid, adipic acid or ethanol Acid.The above-mentioned compound with least one carboxyl can use independent a kind, and two or more can also be applied in combination.

Make the hydroxyl reaction on the surface of above-mentioned isocyanate compound and scolding tin using above-mentioned isocyanate compound, so Afterwards, the carboxyl and the hydroxyl reaction on scolding tin surface of a part for the compound with multiple carboxyls are made, it is possible thereby to make to have extremely The group residual of a few carboxyl.

In the manufacture method of above-mentioned scolding tin particle, using scolding tin particle, and isocyanate compound is used, make above-mentioned isocyanide The hydroxyl reaction on the surface of ester compound and scolding tin, then, reacts the compound with least one carboxyl, so as to obtain On the surface of scolding tin, the group bonding represented by above-mentioned formula (X) has the scolding tin particle of the group with least one carboxyl. In the manufacture method of above-mentioned scolding tin particle, by above-mentioned process, can be readily derived be imported with the surface of scolding tin containing The scolding tin particle of the group of carboxyl.

As the specific manufacture method of above-mentioned scolding tin particle, following method can be enumerated.Being scattered in scolding tin particle has Machine solvent, silane coupler of the addition with NCO.Thereafter, using scolding tin particle scolding tin surface hydroxyl and isocyanide The catalysts of perester radical, make silane coupler carry out being covalently bonded to scolding tin surface.Secondly, it is even in silane by para-linkage The alkoxy for joining the silicon atom of agent is hydrolyzed and generates hydroxyl.Make carboxyl and the generation of the compound with least one carboxyl Hydroxyl reaction.

In addition, as the specific manufacture method of above-mentioned scolding tin particle, following method can be enumerated.Disperse scolding tin particle In organic solvent, compound of the addition with NCO and unsaturated double-bond.Thereafter, using the scolding tin surface of scolding tin particle Hydroxyl and NCO catalysts formation covalent bond.Thereafter, relative to the unsaturated double-bond being imported into, insatiable hunger is made With double bond and the compound with carboxyl reaction.

As the hydroxyl and the catalysts of NCO on the scolding tin surface of scolding tin particle, it can enumerate：Tin class is catalyzed Agent (dibutyltin dilaurate etc.), amines catalyst (triethylenediamine etc.), carboxylic acid ester catalyst (lead naphthenate, potassium acetate Deng) and trialkyl phosphine catalyst (triethyl phosphine etc.) etc..

From connection structural bodies is effectively reduced connection resistance, effectively suppress space generation from the viewpoint of, on It is preferably the compound that following formula (1) is represented to state the compound with least one carboxyl.The compound tool that following formula (1) is represented There is fluxing agent effect.In addition, the compound that following formula (1) is represented in the state of the surface of scolding tin is directed in there is fluxing agent to make With.

[chemical formula 5]

In above-mentioned formula (1), X represents functional group that can be with hydroxyl reaction, and R represents the organic group of the divalent of carbon number 1~5 Group.The organic group can contain carbon atom, hydrogen atom and oxygen atom.The organic group can be the divalent of carbon number 1~5 Alkyl.The main chain of above-mentioned organic group is preferably the alkyl of divalent.In the organic group, it can be bonded with the alkyl of divalent Carboxyl or hydroxyl.Such as citric acid is included in the compound that above-mentioned formula (1) represents.

The above-mentioned compound with least one carboxyl is preferably the compound that following formula (1A) or following formula (1B) are represented. The above-mentioned compound with least one carboxyl is preferably the compound that following formula (1A) is represented, more preferably following formula (1B) table The compound shown.

[chemical formula 6]

In above-mentioned formula (1A), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (1A) (1) R in is same.

[chemical formula 7]

In above-mentioned formula (1B), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (1B) (1) R in is same.

It is preferred that being bonded with the group that following formula (2A) or following formula (2B) are represented on the surface of scolding tin.It is preferred that in scolding tin The group of following formula (2A) expression is bonded with surface, the group of following formula (2B) expression is more preferably bonded with.Need explanation It is that in following formula (2A), left part represents to be bonded position.

[chemical formula 8]

In above-mentioned formula (2A), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (2A) (1) R in is same.It should be noted that in following formula (2B), left part represents to be bonded position.

[chemical formula 9]

In above-mentioned formula (2B), R represents the organic group of the divalent of carbon number 1~5.R and above-mentioned formula in above-mentioned formula (2B) (1) R in is same.

From the viewpoint of the wettability of the surface for improving scolding tin, the molecule of the above-mentioned compound with least one carboxyl Amount is preferably less than 10000, more preferably less than 1000, more preferably less than 500.

It is not polymer and above-mentioned in the above-mentioned compound with least one carboxyl on above-mentioned molecular weight In the case of the structural formula of compound with least one carboxyl is confirmable, refer to the molecule that can be calculated by the structural formula Amount.In addition, in the case where the above-mentioned compound with least one carboxyl is polymer, referring to weight average molecular weight.

From the viewpoint of scolding tin particle is effectively gathered on electrode, the zeta potential on the surface of preferably above-mentioned scolding tin particle For just.Wherein, in the present invention, the zeta potential on the surface of above-mentioned scolding tin particle can not be for just.

Zeta potential is measured as follows.

The assay method of zeta potential：

By the way that scolding tin particle 0.05g is put into methanol 10g, and ultrasonication etc. is carried out, be uniformly dispersed it, from And obtain dispersion liquid.Can use the dispersion liquid, and using Beckman Coulter companies manufacture " Delsamax PRO ", Zeta potential is determined with electrophoresis assays.

The zeta potential of scolding tin particle is preferably more than 0mV, more preferably more than 0mV, preferably below 10mV, more preferably Below 5mV, is still more preferably below 1mV, more preferably below 0.7mV, particularly preferably below 0.5mV.Zeta potential During for below the above-mentioned upper limit, when being conductively connected, scolding tin particle is easily assembled.When zeta potential is less than 0mV, scolding tin when mounted sometimes Cohesion of the particle on electrode is insufficient.

Above-mentioned scolding tin is preferably the metal (low-melting-point metal) that fusing point is less than 450 DEG C.Above-mentioned scolding tin particle is preferably molten Point is less than 450 DEG C of metallic (low-melting-point metal particle).Above-mentioned low-melting-point metal particle is to contain low-melting-point metal Particle.The low-melting-point metal represents the metal that fusing point is less than 450 DEG C.The fusing point of low-melting-point metal is preferably less than 300 DEG C, more Preferably less than 160 DEG C.In addition, above-mentioned scolding tin particle contains tin.In above-mentioned scolding tin particle in the contained weight % of metal 100, The content of tin is preferably more than 30 weight % more preferably more than 40 weight %, more preferably more than 70 weight %, especially Preferably more than 90 weight %.When the content of tin in above-mentioned scolding tin particle is more than above-mentioned lower limit, the company of solder sections and electrode Reliability is connect further to improve.

It should be noted that the content of above-mentioned tin can use high-frequency inductive coupling plasma body emission spectrophotometer (" ICP-AES " of Horiba Ltd's manufacture) or fluorescent x-ray analyzer (Shimadzu Scisakusho Ltd's system " EDX-800HS " made) etc. be measured.

By using above-mentioned scolding tin particle, scolding tin melting and and electrode engagement, solder sections make conducting between electrode.For example, by In solder sections and electrode, easily the face of progress contacts rather than a contact, therefore, connects resistance step-down.In addition, by using scolding tin The bond strength rise of particle, solder sections and electrode, as a result, being further not likely to produce the stripping of solder sections and electrode, leads Logical reliability and connection reliability are effectively improved.

The low-melting-point metal for constituting above-mentioned scolding tin particle is not particularly limited.The low-melting-point metal is preferably tin or contained The alloy of tin.The alloy can be enumerated：Tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-bismuth alloy electroplating, tin-zinc alloy, Sn-In alloy etc..From the aspect of the wetability relative to electrode is excellent, above-mentioned low-melting-point metal is preferably tin, Xi-silver conjunction Gold, tin-silver-copper alloy, tin-bismuth alloy electroplating, Sn-In alloy.More preferably tin-bismuth alloy electroplating, Sn-In alloy.

Above-mentioned scolding tin particle is preferably based on JIS Z3001：Term is welded, liquidus curve is less than 450 DEG C of filling metal. As the composition of above-mentioned scolding tin particle, the metal composition such as containing zinc, gold, silver, lead, copper, tin, bismuth, indium can be enumerated.It is preferred that Low melting point and for unleaded tin-indium system (117 DEG C of eutectics) or Sn-Bi system (139 DEG C of eutectics).That is, above-mentioned scolding tin particle is preferably not Containing lead, tin and indium are preferably comprised or containing tin and bismuth.

In order to further improve the bond strength of above-mentioned solder sections and electrode, above-mentioned scolding tin particle can containing nickel, copper, The metals such as antimony, aluminium, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium, molybdenum, palladium.In addition, from further improving solder sections From the viewpoint of the bond strength of electrode, above-mentioned scolding tin particle preferably comprises nickel, copper, antimony, aluminium or zinc.From further improving From the viewpoint of the bond strength of solder sections and electrode, for improve bond strength these metals content in scolding tin particle In 100 weight %, preferably more than 0.0001 weight %, preferably below 1 weight %.

The average grain diameter of above-mentioned scolding tin particle is preferably more than 0.5 μm, more preferably more than 1 μm, more preferably 3 μm More than, particularly preferably more than 5 μm, preferably less than 100 μm, more preferably less than 40 μm, still more preferably for 30 μm with Under, more preferably less than 20 μm, most preferably particularly preferably less than 15 μm, less than 10 μm.Above-mentioned scolding tin particle it is flat When equal particle diameter is more than above-mentioned lower limit and below the above-mentioned upper limit, scolding tin particle can be made further to be efficiently configured to electrode On.The average grain diameter of above-mentioned scolding tin particle is particularly preferably more than 3 μm, less than 30 μm.

" average grain diameter " of above-mentioned scolding tin particle represents number average bead diameter.The average grain diameter of scolding tin particle is for example, by with electronics Microscope or 50, the arbitrary scolding tin particle of observation by light microscope simultaneously calculate average value, or carry out laser diffraction formula granularity point Cloth is determined and tried to achieve.

The coefficient of alteration of the particle diameter of above-mentioned scolding tin particle is preferably more than 5%, more preferably more than 10%, preferably 40% Hereinafter, more preferably less than 30%., can be by when the coefficient of alteration of above-mentioned particle diameter is more than above-mentioned lower limit and below the above-mentioned upper limit Scolding tin particle is further efficiently configured on electrode.Wherein, the coefficient of alteration of the particle diameter of above-mentioned scolding tin particle can be less than 5%.

Above-mentioned coefficient of alteration (CV values) is represented by following formula.

CV values (%)=(ρ/Dn) × 100

ρ：The standard deviation of the particle diameter of scolding tin particle

Dn：The average value of the particle diameter of scolding tin particle

The shape of above-mentioned scolding tin particle is not particularly limited.The shape of above-mentioned scolding tin particle can be spherical, or Shape beyond flat equal sphere shape.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably more than 1 weight % more preferably 2 More than weight %, more preferably more than 10 weight %, particularly preferably more than 20 weight %, most preferably 30 weight % with On, preferably below 90 weight %, more preferably below 80 weight %, more preferably below 60 weight %, particularly preferably For below 50 weight %., can be by scolding tin grain when the content of above-mentioned scolding tin particle is more than above-mentioned lower limit and below the above-mentioned upper limit Son is further efficiently configured on electrode, is easily more configured at scolding tin particle between electrode, and conducting reliability is more entered One step is improved.From the viewpoint of conducting reliability is further improved, the content of preferably above-mentioned scolding tin particle is more.

(thermoplastic composition)

Above-mentioned thermoplastic composition is preferably thermoplastic compound.As above-mentioned thermoplastic compound, can enumerate phenoxy resin, Polyurethane resin, (methyl) acrylic resin, polyester resin, polyimide resin and polyamide etc..Above-mentioned thermoplasticity Compound can make independent a kind, and two or more can also be applied in combination.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned thermoplastic compound is preferably more than 20 weight %, more excellent Elect as more than 40 weight %, more preferably more than 50 weight %, preferably below 99 weight %, more preferably 98 weight % Hereinafter, more preferably below 90 weight %, particularly preferably below 80 weight %.From further raising impact resistance Viewpoint is set out, and the content of preferably above-mentioned Thermocurable composition is more.

(Thermocurable compound：Thermocurable composition)

Above-mentioned Thermocurable compound is the compound that can be solidified by heating.It is used as above-mentioned Thermocurable chemical combination Thing, can be enumerated：Oxetane compound, epoxide, episulfide compound, (methyl) acyclic compound, phenol Compound, amino-compound, unsaturated polyester compound, urethanes, silicon polysiloxane compound and polyimides Compound etc..From making, the curability and curability and viscosity of conductive paste are further good, further improve connection reliability From the viewpoint of, preferred epoxide.

From scolding tin particle is efficiently configured on electrode, effectively suppresses interelectrode dislocation and further improve From the viewpoint of interelectrode conducting reliability and insulating reliability, above-mentioned Thermocurable compound preferably comprises crystallinity thermosetting The property changed compound.

Scolding tin particle is further efficiently configured on electrode, further effectively suppress it is interelectrode dislocation, And further improve it is interelectrode conducting reliability and insulating reliability from the viewpoint of, above-mentioned crystallinity Thermocurable chemical combination Thing is solid preferably at 25 DEG C.

From scolding tin particle is further efficiently configured on electrode, further effectively suppresses interelectrode mistake Position and further improve it is interelectrode conducting reliability and insulating reliability from the viewpoint of, above-mentioned crystallinity Thermocurable The fusing point of compound is preferably more than 80 DEG C, more preferably more than 85 DEG C, preferably less than 150 DEG C, more preferably 140 DEG C with Under.

From scolding tin particle is further efficiently configured on electrode, further effectively suppresses interelectrode mistake Position and further improve it is interelectrode conducting reliability and insulating reliability from the viewpoint of, above-mentioned crystallinity Thermocurable The molecular weight of compound is preferably more than 300, more preferably more than 350, preferably less than 500, more preferably less than 400.

It is not the situation and above-mentioned Thermocurable of polymer in above-mentioned Thermocurable compound for above-mentioned molecular weight In the case of the structural formula of compound is confirmable, refer to the molecular weight that can be calculated by the structural formula.In addition, in above-mentioned thermosetting In the case that the property changed compound is polymer, refer to weight average molecular weight.

As above-mentioned crystallinity Thermocurable compound, epoxide and (methyl) acyclic compound etc. can be enumerated.

As above-mentioned epoxide, aromatic epoxy compound can be enumerated.Preferably resorcinol type epoxide, The crystallinity epoxides such as naphthalene type epoxide, biphenyl type epoxy compound, diphenyl ketone type epoxide.From will weldering Tin particle is further efficiently configured on electrode, further effectively suppresses interelectrode dislocation, further improves From the viewpoint of interelectrode conducting reliability and insulating reliability, above-mentioned epoxide and above-mentioned crystallinity epoxide Preferably resorcinol type epoxide, naphthalene type epoxide, biphenyl type epoxy compound or diphenyl ketone type epoxidation Double (glycidyl epoxide) benzophenone or 4 of compound, more preferably benzophenone cpd, most preferably 2,4-, 4 '-bis- (rings Oxygen propyl group epoxide) benzophenone.The stage of object Part is being fitted and connected by using above-mentioned preferred epoxide, is being glued Degree is high, so as to when assigning acceleration due to the impact such as conveying, can suppress the first connecting object part and the second connecting object The dislocation of part, is additionally, since heat during solidification, can substantially reduce the viscosity of conductive paste, can effectively carry out scolding tin The cohesion of particle.

" crystallinity " in above-mentioned crystallinity Thermocurable compound refers to the state that molecule chain rule is correctly arranged, on Stating crystallinity Thermocurable compound has glass transition temperature and fusing point.

From scolding tin particle is further efficiently configured on electrode, further effectively suppresses interelectrode mistake Position and further improve it is interelectrode conducting reliability and insulating reliability from the viewpoint of, above-mentioned crystallinity Thermocurable Compound is particularly preferably diphenyl ketone type epoxide, double (glycidyl epoxide) benzophenone of most preferably 2,4- or 4,4 '-bis- (glycidyl epoxide) benzophenone.

Above-mentioned (methyl) acyclic compound is the compound with (methyl) acryloyl group.It is used as above-mentioned (methyl) propylene Acid compound, can enumerate (methyl) acrylic acid epoxy ester compounds.Preferably by (methyl) acrylic acid etc. in epoxide The compound of (methyl) acryloyl group is imported.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned Thermocurable compound is preferably more than 20 weight %, more Preferably more than 40 weight %, more preferably more than 50 weight %, preferably below 99 weight %, more preferably 98 weights Measure below %, particularly preferably more preferably below 90 weight %, below 80 weight %.From further improving impact resistance From the viewpoint of property, the content of preferably above-mentioned Thermocurable composition is more.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned crystallinity Thermocurable compound is preferably 20 weight % More than, more preferably more than 40 weight %, more preferably more than 50 weight %, preferably below 99 weight %, more preferably For below 98 weight %, particularly preferably more preferably below 90 weight %, below 80 weight %.

In addition, in the overall 100 weight % of Thermocurable compound, the content of above-mentioned crystallinity Thermocurable compound is excellent Elect as more than 10 weight %, more preferably more than 30 weight %, more preferably more than 50 weight %, particularly preferably 70 weights Measure more than %, preferably below 100 weight %.

(thermal curing agents：Thermocurable composition)

Above-mentioned thermal curing agents make above-mentioned Thermocurable compound carry out heat cure.As above-mentioned thermal curing agents, it can enumerate：Miaow The polythiol hardeners such as azoles curing agent, amine hardener, phenol cured agent, Polymercaptan curing agent, acid anhydrides, hot cationic initiator (heat Cation curing agent) and hot radical producing agent etc..Above-mentioned thermal curing agents can use independent a kind, can also be applied in combination 2 kinds More than.

Due to conductive paste can be made further promptly to solidify at low temperature, therefore preferably imidazole curing agent, mercaptan Curing agent or amine hardener.Further, since being mixed by the curability that can be solidified by heating compound and above-mentioned thermal curing agents Storage stability is raised during conjunction, therefore the preferably curing agent of latency.The curing agent of latency is preferably the solidification of latency imidazoles Agent, latency polythiol hardener or latency amine hardener.It should be noted that above-mentioned thermal curing agents can use polyurethane resin Or the polymer substance such as polyester resin is coated.

As above-mentioned imidazole curing agent, it is not particularly limited, can enumerates：2-methylimidazole, 2-ethyl-4-methylimidazole, 1- cyano ethyl -2- phenylimidazoles, 1- cyano ethyl -2- phenylimidazoles trimellitate, 2,4- diaminourea -6- [2 '-methyl Imidazole radicals-(1 ')]-ethyl-s-triazine and 2,4- diaminourea -6- [2 '-methylimidazolyl-(1 ')]-ethyl-s-triazine isocyanide urea Sour addition product etc..

As above-mentioned polythiol hardener, it is not particularly limited, can enumerates：Trimethylolpropane tris -3-thiopropionate, season Penta four -3-thiopropionate of tetrol and six -3-thiopropionate of dipentaerythritol etc..

As above-mentioned amine hardener, it is not particularly limited, can enumerates：Hexamethylene diamine, eight methylene diamines, ten methylenes Double (3- aminopropyls) -2,4,8,10- four spiral shell [5.5] hendecanes of base diamines, 3,9-, double (4- aminocyclohexyls) methane, Phenylenediamine and diamino diphenyl sulfone etc..

As above-mentioned hot cationic initiator, can enumerate iodine cationoid curing agent, oxygen cationoid curing agent and Sulfonium cationoid curing agent etc..As above-mentioned iodine cationoid curing agent, double (4- tert-butyl-phenyls) iodine hexafluoros can be enumerated Phosphate etc..As above-mentioned oxygen cationoid curing agent, trimethyl oxygen tetrafluoro boric acid ester etc. can be enumerated.It is used as above-mentioned sulfonium class Cation curing agent, can enumerate three p-methylphenyl sulfonium hexafluorophosphoric acid esters etc..

As above-mentioned hot radical producing agent, it is not particularly limited, azo-compound and organic peroxide etc. can be enumerated. As above-mentioned azo-compound, azobis isobutyronitrile (AIBN) etc. can be enumerated.As above-mentioned organic peroxide, two uncles can be enumerated Butylperoxide and methyl-ethyl-ketone peroxide etc..

The reaction start temperature of above-mentioned thermal curing agents is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably For more than 80 DEG C, preferably less than 250 DEG C, more preferably less than 200 DEG C, more preferably less than 150 DEG C, particularly preferably Less than 140 DEG C.When the reaction start temperature of above-mentioned thermal curing agents is more than above-mentioned lower limit and below the above-mentioned upper limit, scolding tin particle is more Effectively further it is configured on electrode.The reaction start temperature of above-mentioned thermal curing agents be particularly preferably more than 80 DEG C, 140 DEG C with Under.

From the viewpoint of scolding tin is further efficiently configured on electrode, the reaction of preferably above-mentioned thermal curing agents is opened Beginning temperature is higher than the fusing point of the scolding tin in above-mentioned scolding tin particle, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.

The reaction start temperature of above-mentioned thermal curing agents refers to the temperature for starting to rise of the exothermic peak in DSC.

The content of above-mentioned thermal curing agents is not particularly limited.It is above-mentioned relative to the above-mentioned parts by weight of Thermocurable compound 100 The content of thermal curing agents is preferably more than 0.01 parts by weight, more than more preferably 1 parts by weight, below preferably 200 parts by weight, more Below preferably 100 parts by weight, below more preferably 75 parts by weight.When the content of thermal curing agents is more than above-mentioned lower limit, Easily cure sufficiently conductive paste.When the content of thermal curing agents is below the above-mentioned upper limit, solidification is had neither part nor lot in after hardening Remaining thermal curing agents are difficult residual, and further improve the heat resistance of solidfied material.

(fluxing agent)

Above-mentioned conductive paste preferably comprises fluxing agent.By using fluxing agent, scolding tin can be made further effectively to match somebody with somebody It is placed on electrode.The fluxing agent is not particularly limited.As fluxing agent, commonly used in scolding tin engagement etc. help can be used Flux.As above-mentioned fluxing agent, it can enumerate for example：Zinc chloride, the mixture of zinc chloride and inorganic halides, zinc chloride and inorganic Mixture, fuse salt, phosphoric acid, the derivative of phosphoric acid, organohalogen compounds, hydrazine, organic acid and rosin of acid etc..Above-mentioned fluxing agent can To use independent a kind, two or more can also be applied in combination.

From the storage stability for effectively improving conductive paste and carry out interelectrode connection when make except scolding tin particle it Outer composition is further difficult from the viewpoint of flowing, and above-mentioned fluxing agent is solid preferably at 25 DEG C.

As above-mentioned fuse salt, ammonium chloride etc. can be enumerated.As above-mentioned organic acid, it can enumerate：Lactic acid, citric acid, tristearin Acid, glutamic acid and glutaric acid etc..As above-mentioned rosin, activation rosin and deactivation rosin etc. can be enumerated.Above-mentioned fluxing agent Preferably there is organic acid, the rosin of more than 2 carboxyls.Above-mentioned fluxing agent can be the organic acid with more than 2 carboxyls, Can be rosin.By using the organic acid with more than 2 carboxyls, rosin, interelectrode conducting reliability is further carried It is high.

Above-mentioned rosin is the rosin using rosin acid as principal component.Fluxing agent is preferably rosin, more preferably rosin acid. By using the preferred fluxing agent, interelectrode conducting reliability is further improved.

The active temperature (fusing point) of above-mentioned fluxing agent is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably For more than 80 DEG C, preferably less than 200 DEG C, more preferably less than 190 DEG C, be still more preferably less than 160 DEG C, further excellent Elect less than 150 DEG C as, be still more preferably less than 140 DEG C.The active temperature of above-mentioned fluxing agent be above-mentioned lower limit more than and on When stating below the upper limit, fluxing agent effect is further effectively played, scolding tin particle is further efficiently configured on electrode. The active temperature (fusing point) of above-mentioned fluxing agent is preferably more than 80 DEG C, less than 190 DEG C.The active temperature (fusing point) of above-mentioned fluxing agent Particularly preferably more than 80 DEG C, less than 140 DEG C.

As the above-mentioned fluxing agent that the active temperature (fusing point) of fluxing agent is more than 80 DEG C, less than 190 DEG C, it can enumerate：Amber Amber acid (186 DEG C of fusing point), glutaric acid (96 DEG C of fusing point), adipic acid (152 DEG C of fusing point), pimelic acid (104 DEG C of fusing point), suberic acid Dicarboxylic acids such as (142 DEG C of fusing points), benzoic acid (122 DEG C of fusing point), malic acid (130 DEG C of fusing point) etc..

In addition, the boiling point of above-mentioned fluxing agent is preferably less than 200 DEG C.

From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of above-mentioned fluxing agent is preferably than upper The fusing point height of the scolding tin in scolding tin particle is stated, it is more preferably high more than 5 DEG C, it is further preferably high more than 10 DEG C.

From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of above-mentioned fluxing agent is preferably than upper The reaction start temperature for stating thermal curing agents is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.

Above-mentioned fluxing agent can be scattered in conductive paste, on the surface that can also be attached to scolding tin particle.

Above-mentioned fluxing agent releases the fluxing agent of cation preferably by heating.Cation is released by using by heating Fluxing agent, scolding tin particle can be made further to be efficiently configured on electrode.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned fluxing agent is preferably more than 0.5 weight % preferably 30 Below weight %, more preferably below 25 weight %.Above-mentioned conductive paste can not contain fluxing agent.The content of fluxing agent is upper When stating more than lower limit and below the above-mentioned upper limit, further it is difficult to form oxide film thereon on the surface of scolding tin and electrode, also, can Further effectively to remove the oxide film thereon on the surface for being formed at scolding tin and electrode.

(filler)

Filler can be added in above-mentioned conductive paste.Filler can be organic filler, or inorganic filler.Pass through The addition of filler, can suppress the distance that scolding tin particle is condensed, on whole electrodes of substrate, with making scolding tin uniform particle Cohesion.

In the above-mentioned weight % of conductive paste 100, the content of above-mentioned filler is preferably more than 0 weight % preferably 5 weight % Hereinafter, more preferably below 2 weight %, more preferably below 1 weight %.The content of above-mentioned filler is more than above-mentioned lower limit And when below the above-mentioned upper limit, scolding tin particle is further efficiently configured on electrode.

(other compositions)

Above-mentioned conductive paste can contain such as filler, extender, softening agent, plasticizer, polymerization catalyzed as needed Agent, curing catalysts, colouring agent, antioxidant, heat stabilizer, light stabilizer, ultra-violet absorber, lubricant, antistatic agent And the various additives such as fire retardant.

(manufacture method of connection structural bodies and connection structural bodies)

The connection structural bodies of the present invention possesses：Surface has the first connecting object part, the table of at least one first electrode Face has the second connecting object part of at least one second electrode, connects above-mentioned first connecting object part and above-mentioned second The connecting portion that object Part links together.In the connection structural bodies of the present invention, the material of above-mentioned connecting portion is above-mentioned conduction Paste.Above-mentioned connecting portion is formed by above-mentioned conductive paste.Above-mentioned connecting portion is the solidfied material of above-mentioned conductive paste.The present invention's In connection structural bodies, above-mentioned first electrode and above-mentioned second electrode are electrically connected by the solder sections in above-mentioned connecting portion.

The manufacture method of the connection structural bodies of the present invention possesses：Have at least using above-mentioned conductive paste, and on surface The process that above-mentioned conductive paste is configured on the surface of first connecting object part of one first electrode；In above-mentioned conductive paste On the surface opposite with above-mentioned first connecting object component side, configuration surface has the second connection pair of at least one second electrode As part, and make above-mentioned first electrode and the opposed process of above-mentioned second electrode；It is above-mentioned by the way that above-mentioned conductive paste is heated to More than the fusing point of scolding tin particle, the above-mentioned first connecting object part of connection and above-mentioned second connection pair are formed by above-mentioned conductive paste Above-mentioned first electrode and above-mentioned second electrode are electrically connected as the connecting portion of part, and by the solder sections in above-mentioned connecting portion The process connect.It is preferred that above-mentioned conductive paste is heated to more than the solidification temperature of above-mentioned Thermocurable composition.

In the manufacture method of the connection structural bodies of the present invention and the connection structural bodies of the present invention, due to using specific conductive Paste, therefore, multiple scolding tin particles are easily collected between first electrode and second electrode, can be effective by multiple scolding tin particles Ground is configured on electrode (line).In addition, a part for multiple scolding tin particles is difficult to be configured at the region (sky for not forming electrode Between), the amount for the scolding tin particle that can make to be configured at the region for not forming electrode is considerably less.It is thus possible to improve first electrode Conducting reliability between second electrode.Furthermore, it is possible to prevent that the interelectrode of adjoining is electrically connected in the transverse direction that can not be connected Connect, insulating reliability can be improved.

In addition, the inventors discovered that：In order to be efficiently configured on electrode by multiple scolding tin particles and make to be configured at do not have The amount for forming the scolding tin particle in the region of electrode is considerably less, it is necessary to using conductive paste, rather than uses conducting film.

, can be further using making multiple scolding tin particles effectively be gathered in interelectrode other methods in the present invention.Make For multiple scolding tin particles are effectively gathered in into interelectrode method, it can enumerate：Connect to the first connecting object part and second When connecing the conductive paste imparting heat between object Part, because the viscosity of conductive paste is reduced because of heat, so as to produce the first company Connect method of convection current of conductive paste between object Part and the second connecting object part etc..In this method, it can enumerate：Due to The electrode on the surface of connecting object part and its beyond surface elements thermal capacity difference and make convection current produce method；It is logical Overheat makes the method that the moisture of connecting object part produces convection current as vapor；And due to the first connecting object part and The temperature difference of two connecting object parts and produce method of convection current etc..Thus, it is possible to make the scolding tin particle in conductive paste effective Ground is moved to the surface of electrode.

, can be further using the method on condense upon electrode surface with making scolding tin particle selection in the present invention.As Condense upon the surface of electrode method with making scolding tin particle selection, can be enumerated：To the wetability of the scolding tin particle after melting The connecting object part of other Facing materials formation of the wetability difference of scolding tin particle after good electrode material and melting is carried out Selection, make the melting on the surface of arrival electrode scolding tin particle selection be attached to electrode, relative to its melting after scolding tin Particle, the method for making other scolding tin pellet meltings and adhering to；To by the other of the good electrode material of thermal conductivity and poor thermal conductivity When the connecting object part of Facing material formation is selected and assigns heat, by improving electrode relative to other surface elements Temperature, the method for optionally making scolding tin be melted on electrode；Using the scolding tin particle handled, make it relative to presence There is positive charge in the negative electrical charge on the electrode formed by metal, and condense upon the side on electrode with making scolding tin particle selection Method；And relative to the electrode with hydrophilic metal surface, the resin beyond the scolding tin particle in conductive paste is set to Hydrophobicity, condenses upon method on electrode etc. with thus making scolding tin particle selection.

The thickness of interelectrode solder sections is preferably more than 10 μm, more preferably more than 20 μm, preferably less than 100 μm, More preferably less than 80 μm.(scolding tin in the area 100% exposed of electrode is contacted scolding tin wetting areas on electrode surface Area, above-mentioned the be electrically connected relative to the above-mentioned first electrode before forming above-mentioned connecting portion and with above-mentioned first electrode The areas 100% exposed of two electrodes, the area of the above-mentioned solder sections contact formed after above-mentioned connecting portion) be preferably 50% with On, more preferably more than 60%, more preferably more than 70%, preferably less than 100%.

In the manufacture method of the connection structural bodies of the present invention, the process of above-mentioned second connecting object part and formation are being configured In the process of above-mentioned connecting portion, in the weight to the above-mentioned second connecting object part of above-mentioned conductive paste application without adding At least one process in pressure, or the process of the above-mentioned second connecting object part of configuration and the process of the above-mentioned connecting portion of formation In, pressurizeed, and configuring the process of above-mentioned second connecting object part and forming the process of above-mentioned connecting portion the two works In sequence, the pressure of pressurization is preferably less than 1MPa.By the pressure for the pressurization for not applying more than 1MPa, quite promote scolding tin particle Cohesion.From the viewpoint of the warpage for suppressing connecting object part, in the manufacture method of connection structural bodies of the invention, with In at least one process in the process for putting above-mentioned second connecting object part and the process for forming above-mentioned connecting portion, added Pressure, and in configuring the process of above-mentioned second connecting object part and forming the process of above-mentioned connecting portion the two processes, pressurization Pressure can be less than 1MPa.In the case where being pressurizeed, the work of above-mentioned second connecting object part only can configured In sequence, pressurizeed, be able to can be pressurizeed only in the process for forming above-mentioned connecting portion, can be in configuration above-mentioned second The process of connecting object part and formed in the process of above-mentioned connecting portion the two processes, pressurizeed.The pressure of pressurization is less than 1MPa includes the situation without pressurization.In the case where being pressurizeed, the pressure of pressurization is preferably below 0.9MPa, more preferably For below 0.8MPa.In the case where the pressure of pressurization is below 0.8MPa, exceed 0.8MPa situation phase with the pressure of pressurization Than being further obviously promoted the cohesion of scolding tin particle.

In the manufacture method of the connection structural bodies of the present invention, the process of above-mentioned second connecting object part and formation are being configured In the process of above-mentioned connecting portion, the above-mentioned conductive paste of preferred pair apply the weight of above-mentioned second connecting object part and without adding Pressure, is configuring the process of above-mentioned second connecting object part and is being formed in the process of above-mentioned connecting portion, the above-mentioned electroconductive paste of preferred pair Agent does not apply the moulding pressure of the power of the weight more than above-mentioned second connecting object part.In these cases, can be multiple Solder sections further improve soldering tin amount uniformity.And it is possible to further effectively thicken the thickness of solder sections, multiple welderings Tin particle is more easily gathered between electrode, and multiple scolding tin particles can be made further to be efficiently configured to electrode (line) On.In addition, a part for multiple scolding tin particles is difficult to be configured at the region (space) for not forming electrode, can further it subtract The amount of the scolding tin particle in the region for not forming electrode is configured at less.Therefore, it can further to improve interelectrode conducting can By property.Furthermore, it is possible to adjacent interelectrode electrical connection in the transverse direction that can not be connected further is prevented, can be further Improve insulating reliability.

Also, inventors have also discovered that：Configure the process of above-mentioned second connecting object part and form above-mentioned connecting portion Process in, if applying the weight of above-mentioned second connecting object part to above-mentioned conductive paste and without pressurization, being formed The scolding tin particle that the region (space) for not forming electrode is configured at before connecting portion is further easily gathered in first electrode Between second electrode, multiple scolding tin particles can be further efficiently configured on electrode (line).In the present invention, it will make Composition with conductive paste rather than using conducting film and the weight to the above-mentioned second connecting object part of above-mentioned conductive paste application Measure and be combined and use without the composition of pressurization, in order to obtain the effect of the present invention, tool with further high level Make great sense.

It should be noted that having been recorded in WO2008/023452A1, have it from solder powder is pushed into electrode surface From the viewpoint of effect ground is mobile, is pressurizeed, for moulding pressure, further may be used with specified pressure in bonding By the viewpoint aspect of ground formation soldering tin, record and be for example set to more than 0MPa, preferably more than 1MPa, even and if recording The pressure for intentionally putting on splicing tape is 0MPa, and splicing tape can also be applied by the deadweight for the part being configured on splicing tape Plus the pressure specified.Recorded in WO2008/023452A1 intentionally put on splicing tape pressure can be 0MPa, but on The difference of effect when assigning the pressure more than 0MPa and when being set to 0MPa, is recorded without any.In addition, WO2008/ In 023452A1, on the conductive paste using paste-like rather than using membranaceous importance, also without any understanding.

In addition, if using conductive paste rather than using conducting film, then easily adjusted according to the coating weight of conductive paste The thickness of whole connecting portion and solder sections.On the other hand, there are the following problems for conducting film：For the thickness of variations or modifications connecting portion Degree, it is necessary to prepare the conducting film of different-thickness, or prepare the conducting film of appointed thickness.In addition, there are the following problems for conducting film： The melt viscosity of conducting film can not be fully reduced under the melting temperature of scolding tin, the cohesion of scolding tin particle is hindered.

Hereinafter, on one side referring to the drawings, while the specific embodiment of the explanation present invention.

Fig. 1 is to schematically show the connection structural bodies obtained using the conductive paste of an embodiment of the invention Profile.

Connection structural bodies 1 shown in Fig. 1 possesses：First connecting object part 2, the second connecting object part 3, connection first The connecting portion 4 of the connecting object part 3 of connecting object part 2 and second.Connecting portion 4 is formed by above-mentioned conductive paste.This implementation In mode, above-mentioned conductive paste contains above-mentioned Thermocurable compound and above-mentioned thermal curing agents.

The solder sections 4A and Thermocurable composition that connecting portion 4 has multiple scolding tin particle buildups and is bonded with each other have carried out heat The solidfied material portion 4B of solidification.

First connecting object part 2 has multiple first electrode 2a on surface (upper surface).Second connecting object part 3 There are multiple second electrode 3a on surface (lower surface).First electrode 2a and second electrode 3a are electrically connected by solder sections 4A Connect.Therefore, the first connecting object part 2 and the second connecting object part 3 realize electrical connection by solder sections 4A.Need explanation , in connecting portion 4, in the different region (solidifications of the solder sections 4A from being gathered between first electrode 2a and second electrode 3a Thing portion 4B parts) scolding tin is not present.It is not present and departs from scolding tin in the region (solidfied material portion 4B parts) different from solder sections 4A Portion 4A scolding tin.It should be noted that if a small amount of, then in the weldering being gathered between first electrode 2a and second electrode 3a Regions (solidfied material portion 4B parts) different tin portion 4A may have scolding tin.

As shown in figure 1, in connection structural bodies 1, multiple scolding tin particle buildups first electrode 2a and second electrode 3a it Between, after multiple scolding tin pellet meltings, the fused mass of scolding tin particle solidified by the moistened surface of electrode and after sprawling and Form solder sections 4A.Therefore, solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a connection area become Greatly.That is, by using scolding tin particle, with using the outer surface of electric conductivity to be the feelings of the electroconductive particle of the metals such as nickel, gold or copper Condition is compared, and solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a contact area become big.Therefore, connect Conducting reliability and connection reliability in structure 1 are improved.It should be noted that conductive paste can contain fluxing agent. In the case of using fluxing agent, due to heating, it is however generally that fluxing agent is gradually inactivated.

It should be noted that in the connection structural bodies 1 shown in Fig. 1, solder sections 4A's is entirely located in first electrode 2a, Opposed region between two electrode 3a.In the connection structural bodies 1X of variation shown in Fig. 3, shown in only connecting portion 4X and Fig. 1 Connection structural bodies 1 is different.Connecting portion 4X has solder sections 4XA and solidfied material portion 4XB.As connection structural bodies 1X, many welderings Tin portion 4XA is located at first electrode 2a, second electrode 3a opposed region, and a part of of solder sections 4XA can be from first electrode 2a, the side in second electrode 3a opposed region are exposed.Side from first electrode 2a, second electrode 3a opposed region The solder sections 4XA exposed is a solder sections 4XA part, is departed from solder sections 4XA scolding tin.It should be noted that this In embodiment, it is possible to reduce depart from the amount of the scolding tin of solder sections, but the scolding tin departed from from solder sections may reside in solidification In thing portion.

If reducing the usage amount of scolding tin particle, connection structural bodies 1 is readily obtained.If increasing the use of scolding tin particle Amount, then be readily obtained connection structural bodies 1X.

From the viewpoint of conducting reliability is further improved, in above-mentioned first electrode, above-mentioned connecting portion and above-mentioned the When the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode is observed on the stack direction of two electrodes, preferably above-mentioned In the area 100% of the mutually opposing part of first electrode and above-mentioned second electrode more than 50% (more preferably more than 60%, Further preferred more than 70%, particularly preferred more than 80%, most preferably more than 90%) it is configured with the scolding tin in above-mentioned connecting portion Portion.

From the viewpoint of conducting reliability is further improved, with above-mentioned first electrode, above-mentioned connecting portion and above-mentioned When the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode is observed in the vertical direction of the stack direction of second electrode, It is preferred that being configured with the solder sections in above-mentioned connecting portion in the mutually opposing part of above-mentioned first electrode and above-mentioned second electrode More than 70% (more preferably more than 80%, further preferred more than 90%, particularly preferred more than 95%, most preferably more than 99%).

Below, illustrate to manufacture the one of the method for connection structural bodies 1 using the conductive paste of an embodiment of the invention Individual example.

First, preparing surface (upper surface) has first electrode 2a the first connecting object part 2.Secondly, such as Fig. 2 (a) It is shown, leading containing Thermocurable composition 11B and multiple scolding tin particle 11A is configured on the surface of the first connecting object part 2 Electric paste 11 (the first process).Conductive paste 11 is configured on the surface of the first electrode 2a provided with the first connecting object part 2. After the configuration of conductive paste 11, scolding tin particle 11A is configured on first electrode 2a (line) and does not form first electrode 2a's The two regions on region (space).

As the collocation method of conductive paste 11, it is not particularly limited, the coating carried out using point gum machine, silk screen can be enumerated Print and utilize spraying of ink discharge device etc..

In addition, preparing surface (lower surface) has second electrode 3a the second connecting object part 3.Secondly, such as Fig. 2 (b) It is shown, in the conductive paste 11 on the surface of the first connecting object part 2, in conductive paste 11 and the first connecting object portion The second connecting object part 3 (the second process) is configured on the surface of the opposite side in the side of part 2.From second on the surface of conductive paste 11 Electrode 3a sides configure the second connecting object part 3.Now, make first electrode 2a and second electrode 3a opposed.

Secondly, conductive paste 11 is carried out being heated to more than scolding tin particle 11A fusing point (the 3rd process).It is preferred that by conduction Paste 11 is heated to more than Thermocurable composition 11B (adhesive) solidification temperature.In the heating, it is present in and does not form electricity The scolding tin particle 11A in the region of pole is gathered between first electrode 2a and second electrode 3a (self-coagulation effect).Present embodiment In, due to using conductive paste rather than using conducting film, there is specific composition, scolding tin particle further as conductive paste 11A is effectively gathered between first electrode 2a and second electrode 3a.In addition, scolding tin particle 11A is melted and is bonded with each other.Separately Outside, Thermocurable composition 11B carries out heat cure.As a result, as shown in Fig. 2 (c), forming connection first by conductive paste 11 and connecting The connecting portion 4 of the connecting object part 3 of object Part 2 and second.By forming connecting portion 4, multiple scolding tin grains by conductive paste 11 Sub- 11A is engaged and is formed solder sections 4A, is carried out heat cure by Thermocurable composition 11B and is formed solidfied material portion 4B.If weldering Tin particle 11A is fully moved, then the scolding tin particle 11A being never located between first electrode 2a and second electrode 3a starts to move Move, completed until scolding tin particle 11A is moved between first electrode 2a and second electrode 3a, temperature can not be remained perseverance It is fixed.

In present embodiment, without pressurization preferably in above-mentioned second process and above-mentioned 3rd process.In this case, Apply the weight of the second connecting object part 3 to conductive paste 11.Therefore, in the formation of connecting portion 4, scolding tin particle 11A has It is gathered between first electrode 2a and second electrode 3a to effect.If it should be noted that in above-mentioned second process and above-mentioned Pressurizeed at least one process in three processes, then effect of the scolding tin particle buildup between first electrode and second electrode The tendency rise being obstructed.The situation is discovered by the present inventors.

But, if the ensuring that the interval of first electrode and second electrode, then can be pressurizeed.It is interelectrode as ensuring The means at interval, for example, add the sept equivalent to desired electric pole spacing, and at least one sept is configured between electrode , preferably more than 3.As sept, inorganic particulate, organic filler can be enumerated.Sept is preferably insulating properties particle.

In addition, in present embodiment, due to without pressurization, therefore in the first connecting object portion for being coated with conductive paste On part during overlapping second connecting object part, even in the electrode and the electricity of the second connecting object part of the first connecting object part In the state of the alignment of pole deviates, the first connecting object part and the second connecting object part are carried out it is overlapping in the case of, It can be corrected to deviate and make the electrode of the first connecting object part and electrode connection (the autoregistration effect of the second connecting object part Should).Because, just carry out self-coagulation between the electrode of the first connecting object part and the electrode of the second connecting object part Melting scolding tin for, due to the scolding tin between the electrode of the first connecting object part and the electrode of the second connecting object part Become stable on energy when the area contacted with other compositions of conductive paste turns into minimum, therefore become as area most The alignment of small attachment structure the power of corresponding attachment structure work.Now, preferably conductive paste without solidification, and With its temperature, time, the viscosity of the composition beyond the scolding tin particle of conductive paste is substantially low.

So, it can obtain the connection structural bodies 1 shown in Fig. 1.It should be noted that above-mentioned second process and above-mentioned 3rd work Sequence can be carried out continuously.In addition, after above-mentioned second process is carried out, obtained the first connecting object part 2, conduction can be made The laminated body of the connecting object part 3 of paste 11 and second is moved to heating part and carries out above-mentioned 3rd process.It is above-mentioned in order to carry out Heating, above-mentioned laminated body can be configured on heater block, above-mentioned laminated body can also be configured in heated space.

Above-mentioned heating-up temperature in above-mentioned 3rd process is preferably more than 140 DEG C, more preferably more than 160 DEG C, is preferably Less than 450 DEG C, more preferably more preferably less than 250 DEG C, less than 200 DEG C.

, can be by for the purpose of the reforming of the correction of position or manufacture it should be noted that after above-mentioned 3rd process First connecting object part or the second connecting object part are peeled off from connecting portion.Heating-up temperature for carrying out the stripping is preferred It is more than the fusing point for scolding tin particle, more preferably more than+10 DEG C of the fusing point (DEG C) of scolding tin particle.Heating for carrying out the stripping Temperature can be below+100 DEG C of the fusing point (DEG C) of scolding tin particle.

As the heating means in above-mentioned 3rd process, it can enumerate more than the fusing point of scolding tin particle and Thermocurable composition Solidification temperature more than, the method integrally heated to connection structural bodies using reflow ovens or using baking oven, or only to connection The method that the connecting portion of structure is partly heated.

As the utensil of the method for partly being heated, it can enumerate：Electric hot plate, heating gun, the electricity for assigning hot blast Flatiron and infrared heater etc..

In addition, when partly being heated with electric hot plate, preferably in the connecting portion positive bottom high metal of thermal conductivity, Other positions preferably do not heated form electric hot plate upper surface by the low material of the thermal conductivity such as fluororesin.

Above-mentioned first, second connecting object part is not particularly limited.As above-mentioned first, second connecting object part, Specifically, it can enumerate：The electronics zero such as semiconductor chip, semiconductor packages, LED chip, LED encapsulation, capacitor and diode Part and resin film, printed base plate, flexible printing substrate, flexible flat cable, rigidity flexible, glass epoxy substrate and Electronic components such as the circuit substrates such as glass substrate etc..Above-mentioned first, second connecting object part is preferably electronic component.

At least one part in above-mentioned first connecting object part and above-mentioned second connecting object part is preferably partly to lead Body chip, resin film, flexible printing substrate, rigidity flexible or flexible flat cable, more preferably resin film, flexible printing Substrate, flexible flat cable or rigidity flexible.Above-mentioned second connecting object part be preferably semiconductor chip, resin film, Flexible printing substrate, rigidity flexible or flexible flat cable, more preferably resin film, flexible printing substrate, flexibility are flat Cable or rigidity flexible.Resin film, flexible printing substrate, flexible flat cable and rigidity flexible have flexibility It is high, than the property of relatively lightweight.In the case of using conducting film in the connection of this connecting object part, there is scolding tin particle not Easily it is gathered in the tendency on electrode.On the other hand, by using conductive paste, even if using resin film, flexible printing substrate, scratching Property flat cable or rigidity flexible, are effectively gathered on electrode by making scolding tin particle, can fully improve electrode Between conducting reliability.In the case where using resin film, flexible printing substrate, flexible flat cable or rigidity flexible, Compared with using the situation of other connecting object parts such as semiconductor chip, further effectively obtain due to without pressurization And the raising effect of the interelectrode conducting reliability produced.

There is peripheral part or area array etc. in the form of above-mentioned connecting object part.As the feature of each part, In peripheral substrate, electrode exists only in the peripheral part of substrate.In area array substrate, there is electrode in face.

As the electrode for being arranged at above-mentioned connecting object part, it can enumerate：Gold electrode, nickel electrode, tin electrode, aluminium electrode, The metal electrodes such as copper electrode, molybdenum electrode, silver electrode, SUS electrodes and tungsten electrode.It is flexible printing base in above-mentioned connecting object part In the case of plate, above-mentioned electrode is preferably gold electrode, nickel electrode, tin electrode, silver electrode or copper electrode.In above-mentioned connecting object portion In the case that part is glass substrate, above-mentioned electrode is preferably aluminium electrode, copper electrode, molybdenum electrode, silver electrode or tungsten electrode.Need It is bright, can be the electrode only formed by aluminium, or in metal oxide in the case where above-mentioned electrode is aluminium electrode The surface stack of layer has the electrode of aluminium lamination.As the material of above-mentioned metal oxide layer, the metallic element doped with trivalent can be enumerated Indium oxide and the zinc oxide of metallic element doped with trivalent etc..As the metallic element of above-mentioned trivalent, Sn, Al and Ga can be enumerated Deng.

Hereinafter, embodiment and comparative example are enumerated, the present invention is specifically described.The present invention is not limited to following implementation Example.

Thermocurable compound 1：Double (glycidyl epoxide) benzophenone of 2,4- are (crystallinity Thermocurable compound, molten Point：94 DEG C, molecular weight 362)

The synthesis of double (glycidoxypropyl) benzophenone of 2,4-：

2,4 dihydroxyl benzophenone 27g, epichlorohydrin 230g, n-butanol 70g and tetraethyl benzyl are put into three-necked flask Ammonium chloride 1g, is stirred at room temperature, and dissolves it.Thereafter, under nitrogen atmosphere, 70 DEG C are warming up under stirring, is being subtracted Push back and flow down dropwise addition sodium hydrate aqueous solution (the weight % of concentration 48) 45g.It was added dropwise through 4 hours.Thereafter, used at 70 DEG C Dean-Stark (Dean-Stark) pipe is while remove moisture, while reacting 2 hours.Thereafter, remove under reduced pressure unreacted Epichlorohydrin.

Obtained reaction product is dissolved in MEK (methyl ethyl ketone):N-butanol=3:The mixed solvent of 1 (weight ratio) 400g, adds sodium hydrate aqueous solution (the weight % of concentration 10) 5g, is heated 2 hours at 80 DEG C.

Thereafter, room temperature is cooled to, is cleaned using pure water, until washing lotion turns into neutrality.While filtering organic layer, on one side Divide and take, residual moisture and mixed solvent are removed under reduced pressure, reaction product is obtained.

Above-mentioned reaction product 34g is purified by recrystallizing using n-hexane, removed by vacuum drying residual Stay solvent composition.

Obtained epoxide:It it is 94 DEG C using the DSC fusing points measured, epoxide equivalent is 176g/eq., utilizes mass spectrum The molecular weight measured is that the melt viscosity at 362,150 DEG C is 5mPas.

Differential Scanning Calorimetry determines (DSC) and determines device and condition determination

Device：" X-DSC7000 ", the sample size of Hitachi High-Tech Science Co., Ltd. manufacture：3mg, temperature Degree condition：10℃/min

Melt viscosity at 150 DEG C：According to ASTM D4287, manufactured using MST Engineering Co., Ltd. ICI cone and plate viscometers are measured

The measure of epoxide equivalent：According to JIS K7236：2001 are measured

The measure of molecular weight：Surveyed using GC-MS devices (" JMSK-9 " that Co., Ltd. of society of JEOL manufactures) It is fixed

Thermocurable compound 2：4,4 '-bis- (glycidyl epoxide) benzophenone are (crystallinity Thermocurable compound, molten Point：132 DEG C, molecular weight 362)

The synthesis of 4,4 '-bis- (glycidyl epoxide) benzophenone：

4,4 '-dihydroxy benaophenonel 27g, epichlorohydrin 230g, n-butanol 70g and tetraethyl are put into three-necked flask Benzyl ammonium chloride 1g, is stirred, dissolves at room temperature.Thereafter, under nitrogen atmosphere, stirring under be warming up to 70 DEG C, depressurizing back Flow down dropwise addition sodium hydrate aqueous solution (the weight % of concentration 48) 45g.It is added dropwise and was carried out through 4 hours.Thereafter.Enlightening is used at 70 DEG C Amp- Stark pipe is while remove moisture, while reacting 2 hours.Thereafter, unreacted epichlorohydrin is removed under reduced pressure.

Obtained reaction product is dissolved in MEK (methyl ethyl ketone):N-butanol=3:The mixed solvent of 1 (weight ratio) 400g, adds sodium hydrate aqueous solution (the weight % of concentration 10) 5g, is heated 2 hours at 80 DEG C.

Thereafter, room temperature is cooled to, is cleaned using pure water, neutrality is turned into washing lotion.While filtering organic layer, while entering Row point is taken, and residual moisture and mixed solvent are removed under reduced pressure, reaction product is obtained.

Above-mentioned reaction product 34g is purified by recrystallizing using n-hexane, removed by vacuum drying residual Stay solvent composition.

Obtained epoxide：It it is 135 DEG C using the DSC fusing points measured, epoxide equivalent is 176g/eq., utilizes mass spectrum The molecular weight measured is that the melt viscosity at 362,150 DEG C is 12mPas.

Thermocurable compound 3：Acrylate copolymer containing epoxy radicals, " the MARPROOF G- of Japan Oil Co's manufacture 0150M”

Thermal curing agents 1：Pentaerythrite four (3- mercaptobutylates), " the Karenz MT of Showa Denko K. K's manufacture PE1”

Latency epoxy-based thermoset agent 1：" the Fujicure 7000 " of T＆K TOKA Co., Ltd. manufacture

Fluxing agent 1：Glutaric acid, Wako Pure Chemical Industries, Ltd.'s manufacture, 152 DEG C of fusing point (active temperature)

The preparation method of scolding tin particle 1~3：

Scolding tin particle 1：

By SnBi scolding tin particle (" DS-10 ", 12 μm of the average grain diameter (median particle diameter) of the manufacture of Co., Ltd. of Mitsui Metal Co., Ltd.) With glutaric acid (have the compounds of 2 carboxyls, Wako Pure Chemical Industries, Ltd.'s manufacture " glutaric acid "), using being used as catalysis The p-methyl benzenesulfonic acid of agent, in being dehydrated at 90 DEG C while stir 8 hours, is thus obtained on the surface of scolding tin in toluene solvant On be covalently bonded with the scolding tin particle 1 of the group containing carboxyl.

For obtained scolding tin particle 1, CV values are 20%, and the zeta potential on surface is 1.2mV, constitutes the polymer on surface Molecular weight Mw=2000.

Scolding tin particle 2：

SnBi scolding tin particle (" DS-10 ", the average grain diameter of Co., Ltd. of Mitsui Metal Co., Ltd. manufacture is weighed in three-necked flask 12 μm of (median particle diameter)) 200g, with NCO silane coupler (Shin-Etsu Chemial Co., Ltd manufacture " KBE-9007 ") 10g, acetone 70g.On one side be stirred at room temperature, on one side addition as scolding tin particle surface hydroxyl with The dibutyltin dilaurate 0.25g of the catalysts of NCO, under agitation, under blanket of nitrogen in being heated at 60 DEG C 30 minutes.Thereafter, methanol 50g is added, under agitation, under blanket of nitrogen, in heating 10 minutes at 60 DEG C.

Thereafter, room temperature is cooled to, scolding tin particle is filtered with filter paper, 1 hour precipitation is carried out by vacuum drying at room temperature Agent.

Above-mentioned scolding tin particle is put into three-necked flask, it is addition acetone 70g, monoethyl adipatee 30g, anti-as ester exchange The Mono-n-butyltin 0.5g of catalyst is answered, under agitation, in reaction 1 hour at 60 DEG C under blanket of nitrogen.

Thus, relative to the silanol group from silane coupler, make the ester group of monoethyl adipatee anti-by ester exchange It should be reacted, so as to carry out covalent bonding.

Thereafter, additional adipic acid 10g, reacts 1 hour at 60 DEG C, thus, relative to silicon not with monoethyl adipatee The residual ethyl ester of silane alcohol base reaction, addition adipic acid.

Thereafter, room temperature is cooled to, scolding tin particle is filtered with filter paper, scolding tin particle is cleaned with hexane on filter paper, removed not It is dry by vacuum after reaction and the residual monoethyl adipatee adhered on the surface of scolding tin particle by non-covalent bond, adipic acid It is dry to carry out 1 hour desolventizing at room temperature.

After being crushed with ball mill to obtained scolding tin particle, sieve is selected in the way of as the CV values specified.

For the molecular weight for being formed in the polymer on scolding tin surface, after 0.1N dissolving with hydrochloric acid scolding tin, pass through Filter and reclaim polymer, weight average molecular weight is obtained using GPC.

Thus, scolding tin particle 2 is obtained.For obtained scolding tin particle 2, CV values are that the zeta potential on 20%, surface is 0.9mV, constitutes the molecular weight Mw=9800 of the polymer on surface.

Scolding tin particle 3：

In the process for obtaining above-mentioned scolding tin particle 2, monoethyl adipatee is changed to glutaric acid mono ethyl ester, by adipic acid Glutaric acid is changed to, in addition, is similarly operated, scolding tin particle 3 is obtained.

For obtained scolding tin particle 3, CV values are 20%, the zeta potential 0.92mV on surface, constitute the polymer on surface Molecular weight Mw=9600.

Scolding tin particle A：SnBi scolding tin particle (" DS-10 ", average grain diameter (the intermediate value grain of Co., Ltd. of Mitsui Metal Co., Ltd. manufacture Footpath) 12 μm)

(zeta potential measure)

Obtained scolding tin particle 0.05g is put into methanol 10g, it is equably divided by carrying out ultrasonication Dissipate, obtain dispersion liquid." the Delsamax PRO ", electricity consumption manufactured using the dispersion liquid and using Beckman Coulter companies Determination method of swimming determines zeta potential.

(the CV values of the particle diameter of scolding tin particle)

CV is determined with laser diffraction formula particle size distribution device (" LA-920 " that Horiba Ltd manufactures) Value.

Electroconductive particle 1：The layers of copper of 1 μm of thickness is formed on the surface of resin particle, thickness is formed on the surface of the layers of copper Soldering-tin layer (the tin of 3 μm of degree:The weight % of bismuth=42:58 weight %) electroconductive particle

The preparation method of electroconductive particle 1：

By the divinylbenzene resin particle of 10 μm of average grain diameter (Sekisui Chemical Co., Ltd's manufacture " Micropearl SP-210 ") electroless nickel plating is carried out, the substrate nickel plating of 0.1 μm of thickness is formed on the surface of resin particle Layer.Then, the resin particle for being formed with substrate nickel coating is subjected to electrolytic copper plating, forms the layers of copper of 1 μm of thickness.Also, use Electrolytic plating solution containing tin and bismuth carries out electrolysis plating, forms the soldering-tin layer of 3 μm of thickness.So, it is produced on the table of resin particle The layers of copper of 1 μm of thickness is formed with face, the soldering-tin layer (tin of 3 μm of thickness is formed on the surface of the layers of copper:The weight % of bismuth=42:58 Weight %) electroconductive particle 1.

(embodiment 1~7 and comparative example 1~3)

(1) making of anisotropic conductive paste

Composition shown in following tables 1 is coordinated with the use level shown in following tables 1, anisotropic conductive is obtained Paste.

The making of (2) first connection structural bodies (L/S=50 μm/50 μm)

Preparing upper surface, there is L/S to be 50 μm/50 μm, and electrode length is the 3mm copper electrode pattern (thickness 12 of copper electrode μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 50 μm/50 μm, electrode length is flexible printing substrate (the second connecting object portion of 3mm copper electrode pattern (12 μm of the thickness of copper electrode) Part).

The overlapping area of glass epoxy substrate and flexible printing substrate is set to 1.5cm × 3mm, and the number of electrodes of connection is set to 75 It is right.

In the upper surface of above-mentioned glass epoxy substrate, on the electrode of glass epoxy substrate, using metal mask, pass through silk Wire mark brushes the anisotropic conductive paste for applying and just having made so that using thickness as 100 μm, forms anisotropic conductive paste layer. Then, with the above-mentioned flexible printing substrate of electrode mode lamination opposite each other above anisotropic conductive paste layer.Now, Without pressurization.Apply the weight of above-mentioned flexible printing substrate to anisotropic conductive paste layer.Thereafter, while being heated, Making the temperature of anisotropic conductive paste layer turns into 190 DEG C, while melting scolding tin, by anisotropic conductive paste layer with 190 DEG C and solidified within 10 seconds, obtain the first connection structural bodies.

The making of (3) second connection structural bodies (L/S=75 μm/75 μm)

Preparing upper surface, there is L/S to be 75 μm/75 μm, and electrode length is the 3mm copper electrode pattern (thickness 12 of copper electrode μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 75 μm/75 μm, the flexible printing substrate (the second connecting object part) of electrode length 3mm copper electrode pattern (12 μm of the thickness of copper electrode).

In addition to the above-mentioned glass epoxy substrate and flexible printing substrate different using L/S, with the first connection structural bodies Making is similarly operated, and obtains the second connection structural bodies.

The making of (4) the 3rd connection structural bodies (L/S=100 μm/100 μm)

Preparing upper surface, there is L/S to be 100 μm/100 μm, and electrode length is the 3mm copper electrode pattern (thickness of copper electrode 12 μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 100 μ M/100 μm, flexible printing substrate (the second connecting object of electrode length 3mm copper electrode pattern (12 μm of the thickness of copper electrode) Part).

In addition to the use of L/S being different above-mentioned glass epoxy substrate and flexible printing substrate, with the first connection structural bodies Making similarly operate, obtain the 3rd connection structural bodies.

(evaluation)

(1) viscosity 1

Using E types viscosimeter (" TVE22L " that Toki Sangyo Co., Ltd. manufactures), surveyed under conditions of 25 DEG C and 5rpm Determine viscosity (η 25) of the anisotropic conductive paste at 25 DEG C.

(2) viscosity 2

Determine in temperature province (mp-10~mp) of the scolding tin below more than -10 DEG C of fusing point, the fusing point of scolding tin, electroconductive paste The minimum value and maximum of the viscosity of agent.Specifically, using rheometer (" STRESSTECH " that EOLOGICA companies manufacture) Deng, root diameter 20mm, vibration deformation control and 10 DEG C/min of programming rate under conditions of be measured.

(3) thickness of solder sections

By carrying out section observation to obtained the first connection structural bodies, interelectrode solder sections above and below being located at are evaluated Thickness.

(4) the configuration precision 1 of the scolding tin on electrode

In obtained the first connection structural bodies, the second connection structural bodies and the 3rd connection structural bodies, in first electrode, even Socket part and second electrode stack direction observation first electrode and second electrode mutually opposing part when, evaluate first electrode In the area 100% of the mutually opposing part of second electrode, the ratio X of the area for the solder sections being configured with connecting portion. The configuration precision 1 of the scolding tin on electrode is judged with following benchmark.

[determinating reference of the configuration precision 1 of the scolding tin on electrode]

○○：Ratio X is more than 70%

○：Ratio X is 60% less than 70%

△：Ratio X is 50% less than 60%

×：Ratio X is less than 50%

(5) the configuration precision 2 of the scolding tin on electrode

In obtained the first connection structural bodies, the second connection structural bodies and the 3rd connection structural bodies, with first electrode, During the mutually opposing part of the connecting portion direction observation first electrode vertical with the stack direction of second electrode and second electrode, Evaluate in the solder sections 100% in connecting portion, connecting portion is configured with the mutually opposing part of first electrode and second electrode In solder sections ratio Y.The configuration precision 2 of the scolding tin on electrode is judged with following benchmark.

[determinating reference of the configuration precision 2 of the scolding tin on electrode]

○○：Ratio Y is more than 99%

○：Ratio Y is 90% less than 99%

△：Ratio Y is 70% less than 90%

×：Ratio Y is less than 70%

(6) the interelectrode conducting reliability above and below

In obtained the first connection structural bodies, the second connection structural bodies and the 3rd connection structural bodies (n=15), respectively The connection resistance of every 1 junction between upper/lower electrode is determined using 4 terminal methods.Calculate the average value of connection resistance.Need It is bright, can be by determining voltage when flowing through certain electric current according to the relation of voltage=electric current × resistance, so as to obtain Connect resistance.Conducting reliability is judged with following benchmark.

[determinating reference of conducting reliability]

○○：The average value for connecting resistance is below 50m Ω

○：The average value of connection resistance is more than 50m Ω and is below 70m Ω

△：The average value of connection resistance is more than 70m Ω and is below 100m Ω

×：The average value of resistance is connected more than 100m Ω or bad connection is produced

(7) in the interelectrode insulating reliability being laterally abutted

In obtained the first connection structural bodies, the second connection structural bodies and the 3rd connection structural bodies (n=15), 85 DEG C, place 100 hours in the atmosphere of humidity 85% after, apply 5V between the electrode being laterally abutted, determine resistance value at 25.Below The benchmark stated judges insulating reliability.

[determinating reference of insulating reliability]

○○：The average value for connecting resistance is 10⁷More than Ω

○：The average value for connecting resistance is 10⁶Ω is less than 10⁷Ω

△：The average value for connecting resistance is 10⁵Ω is less than 10⁶Ω

×：The average value for connecting resistance is less than 10⁵Ω

(8) the interelectrode dislocation above and below

In obtained the first connection structural bodies, the second connection structural bodies and the 3rd connection structural bodies, in first electrode, even Socket part and second electrode stack direction observation first electrode and second electrode mutually opposing part when, evaluate first electrode Center line it is whether consistent with the center line of second electrode, and dislocation distance.With the electrode above and below following benchmark judgements Between dislocation.

[determinating reference of interelectrode dislocation up and down]

○○：Dislocation is less than 15 μm

○：Misplace as 15 μm less than 25 μm

△：Misplace as 25 μm less than 40 μm

×：Misplace as more than 40 μm

Detailed and result is shown in following tables 1.

In the case where replacing flexible printing substrate using resin film, flexible flat cable and rigidity flexible, also may be used See same tendency.

Claims (8)

1. a kind of conductive paste, it contains multiple scolding tin particles and adhesive,

Part and the outer surface of conductive part are the particle of scolding tin centered on the scolding tin particle,

On the surface of the scolding tin of the scolding tin particle, the group represented by ehter bond, ester bond or lower formula (X) is covalently bonded with Group with least one carboxyl,

In temperature province more than the temperature of -10 DEG C of the fusing point of the scolding tin and below the fusing point of the scolding tin, electroconductive paste The minimum value of the viscosity of agent is more than 100mPas,

In temperature province more than the temperature of -10 DEG C of the fusing point of the scolding tin and below the fusing point of the scolding tin, electroconductive paste The maximum of the viscosity of agent is below 2000mPas,

2. conductive paste as claimed in claim 1, wherein,

Described adhesive will not complete solidification in the fusing point of the scolding tin particle.

3. conductive paste as claimed in claim 1 or 2, wherein,

On the surface of the scolding tin of the scolding tin particle, the group represented by the formula (X) is covalently bonded with least one The group of individual carboxyl.

4. such as conductive paste according to any one of claims 1 to 3, wherein,

Described adhesive contains Thermocurable compound and thermal curing agents.

5. conductive paste as claimed in claim 4, wherein,

The Thermocurable compound contains crystallinity Thermocurable compound.

6. such as conductive paste according to any one of claims 1 to 5, wherein,

The average grain diameter of the scolding tin particle is more than 1 μm and less than 40 μm.

7. such as conductive paste according to any one of claims 1 to 6, wherein,

In the weight % of conductive paste 100, the content of the scolding tin particle is more than 10 weight % and below 80 weight %.

8. a kind of connection structural bodies, it possesses：

Surface have first electrode the first connecting object part,

Surface have second electrode the second connecting object part and

The connecting portion that the first connecting object part and the second connecting object part are linked together,

The material of the connecting portion is conductive paste according to any one of claims 1 to 7,

The first electrode and the second electrode realize electrical connection by the scolding tin particle.