CN107075327B - 利用低温固化以形成电子类应用中的导热路径的可流动组合物及其相关方法 - Google Patents

利用低温固化以形成电子类应用中的导热路径的可流动组合物及其相关方法 Download PDF

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Publication number
CN107075327B
CN107075327B CN201580048196.4A CN201580048196A CN107075327B CN 107075327 B CN107075327 B CN 107075327B CN 201580048196 A CN201580048196 A CN 201580048196A CN 107075327 B CN107075327 B CN 107075327B
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weight
conductive
particle
flowable composition
flowable
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CN107075327A (zh
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D·惠
J·M·奥列克辛
J·K·帕森斯
G·M·福吉
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DuPont Electronics Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201580048196.4A 2014-07-11 2015-07-01 利用低温固化以形成电子类应用中的导热路径的可流动组合物及其相关方法 Expired - Fee Related CN107075327B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462023215P 2014-07-11 2014-07-11
US62/023,215 2014-07-11
PCT/US2015/038810 WO2016007351A1 (en) 2014-07-11 2015-07-01 Flowable compositions with low temperature curing to form thermally conductive pathways in electronics type applications and methods relating thereto

Publications (2)

Publication Number Publication Date
CN107075327A CN107075327A (zh) 2017-08-18
CN107075327B true CN107075327B (zh) 2019-05-28

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CN201580048196.4A Expired - Fee Related CN107075327B (zh) 2014-07-11 2015-07-01 利用低温固化以形成电子类应用中的导热路径的可流动组合物及其相关方法

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US (1) US9840651B2 (enExample)
EP (1) EP3167458B1 (enExample)
JP (1) JP6595575B2 (enExample)
CN (1) CN107075327B (enExample)
WO (1) WO2016007351A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107112249B (zh) * 2015-02-04 2020-04-14 纳美仕有限公司 导热膏及其制备方法
JP6786819B2 (ja) * 2016-03-07 2020-11-18 東洋インキＳｃホールディングス株式会社 光輝性呈色樹脂組成物、光輝性呈色物品およびその製造方法
DE102016125465B4 (de) * 2016-12-22 2022-08-11 Pas Deutschland Gmbh Siebdruckpaste, Verfahren zur Herstellung der Siebdruckpaste, Verwendung der Siebdruckpaste und elektrisch leitfähige Struktur
WO2018180746A1 (ja) * 2017-03-30 2018-10-04 富士フイルム株式会社 光学フィルムならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ－、抵抗膜式タッチパネルおよび静電容量式タッチパネル
CA3060077A1 (en) * 2017-04-13 2018-10-18 The Diller Corporation Electrically-conductive ink formulations containing microcrystalline cellulose, methods of printing electrically-conductive traces, and laminates containing the same
US11441010B2 (en) * 2017-10-04 2022-09-13 Dowa Electronics Materials Co., Ltd. Fine silver particle dispersion
JP6756085B2 (ja) * 2018-07-06 2020-09-16 千住金属工業株式会社 導電性ペースト及び焼結体
US11227702B2 (en) * 2019-04-04 2022-01-18 Dowa Electronics Materials Co., Ltd. Fine silver particle dispersion
CA3176494A1 (en) * 2020-05-17 2021-11-25 Ferro Coporation Inkjet ink system for handling high solid particles loaded inks

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101918505A (zh) * 2008-01-17 2010-12-15 E.I.内穆尔杜邦公司 导电粘合剂
CN102077301A (zh) * 2008-06-25 2011-05-25 Sscp有限公司 导电膏组合物及使用该导电膏组合物的电极制造方法
CN103413591A (zh) * 2013-08-09 2013-11-27 南京萨特科技发展有限公司 一种贴片保险丝熔断体用电子浆料及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302510A (ja) * 1994-05-10 1995-11-14 Sumitomo Metal Mining Co Ltd 導電ペースト組成物
JPH1166956A (ja) * 1997-08-12 1999-03-09 Tanaka Kikinzoku Kogyo Kk 導電性ペースト
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
JP5656380B2 (ja) * 2008-09-30 2015-01-21 三菱マテリアル株式会社 導電性インク組成物及び該組成物を用いた太陽電池セル及び太陽電池モジュールの製造方法
EP2481060B1 (en) * 2009-09-24 2015-07-15 E. I. du Pont de Nemours and Company Polymer thick film silver electrode composition for use as a plating link
JP2014512073A (ja) * 2011-03-24 2014-05-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 導電性ペースト組成物およびそれで製造される半導体デバイス
KR20130031414A (ko) 2011-09-21 2013-03-29 삼성전기주식회사 저온소성용 도전성 페이스트 조성물
US8767378B2 (en) * 2012-11-02 2014-07-01 E I Du Pont De Nemours And Company Electrically conductive paste composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101918505A (zh) * 2008-01-17 2010-12-15 E.I.内穆尔杜邦公司 导电粘合剂
CN102077301A (zh) * 2008-06-25 2011-05-25 Sscp有限公司 导电膏组合物及使用该导电膏组合物的电极制造方法
CN103413591A (zh) * 2013-08-09 2013-11-27 南京萨特科技发展有限公司 一种贴片保险丝熔断体用电子浆料及其制作方法

Also Published As

Publication number Publication date
JP2017530205A (ja) 2017-10-12
JP6595575B2 (ja) 2019-10-23
EP3167458A1 (en) 2017-05-17
CN107075327A (zh) 2017-08-18
US9840651B2 (en) 2017-12-12
US20160009976A1 (en) 2016-01-14
WO2016007351A1 (en) 2016-01-14
EP3167458B1 (en) 2020-04-29

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