CN107068595A - Silicon chip ultrasonic wave cleaning device - Google Patents
Silicon chip ultrasonic wave cleaning device Download PDFInfo
- Publication number
- CN107068595A CN107068595A CN201710245070.7A CN201710245070A CN107068595A CN 107068595 A CN107068595 A CN 107068595A CN 201710245070 A CN201710245070 A CN 201710245070A CN 107068595 A CN107068595 A CN 107068595A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- bottom plate
- framework
- frame
- rinse bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000004140 cleaning Methods 0.000 title claims abstract description 39
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to silicon chip production equipment technical field, more particularly, to a kind of silicon chip ultrasonic wave cleaning device, including the frame with rinse bath, rotated in the frame and be provided with bottom plate, the bottom plate is located in the rinse bath, the bottom plate is provided with ultrasonic transducer, the frame is provided with the first driving means for being used for driving bottom plate to swing, the framework for being used for placing insert box is provided with the rinse bath, silicon chip ultrasonic wave cleaning device of the present invention is when in use, bottom plate is driven to swing by first driving means, so that ultrasonic transducer multi-angle is cleaned to silicon chip, realize that the silicon chip on framework is slightly rotated by swing mechanism simultaneously, so as to realize to the more preferable cleaning of silicon chip, the present invention can multi-angle silicon chip is cleaned, cleaning efficiency is high, avoid silicon chip transfixion in rinse bath, so that the impurity of more difficult cleaning can not be cleaned on silicon chip, reduce the problem of subsequent production comes out the quality of silicon chip.
Description
Technical field
The present invention relates to silicon chip production equipment technical field, more particularly, to a kind of silicon chip ultrasonic wave cleaning device.
Background technology
Transistor and integrated circuit production in, almost per procedure have Wafer Cleaning the problem of, Wafer Cleaning it is good
It is bad to have serious influence to device performance, deal with improperly, may scrap whole silicon chips, can not make pipe, or produce
The device performance come is inferior, and stability and reliability are very poor.Therefore high-cleanness, high, efficient silicon wafer cleaning method are developed, no
Pipe is the people for being engaged in silicon chip processing, or suffers from important meaning for being engaged in the people of semiconductor devices production.
Silicon chip is directly placed in rinse bath by existing Wafer Cleaning equipment, and silicon chip is cleaned using ultrasonic wave, and silicon chip is in cleaning
Transfixion in groove so that the impurity of more difficult cleaning can not be cleaned on silicon chip, reduces the quality that subsequent production comes out silicon chip,
Cause product rejection when serious.
The content of the invention
The technical problem to be solved in the present invention is：In order to solve silicon chip transfixion in rinse bath so that on silicon chip compared with
The impurity of hardly possible cleaning can not be cleaned, and reduce the problem of subsequent production comes out the quality of silicon chip, now super there is provided a kind of silicon chip
Sound wave cleaning device.
The technical solution adopted for the present invention to solve the technical problems is：A kind of silicon chip ultrasonic wave cleaning device, including tool
Have to rotate in the frame of rinse bath, the frame and be provided with bottom plate, the bottom plate is located in the rinse bath, is set on the bottom plate
There is ultrasonic transducer, the frame is provided with the first driving means for being used for driving bottom plate to swing, the rinse bath and is provided with
Framework for placing insert box, the framework is located above the bottom plate, and the frame, which is provided with, to be used to drive frame stroke
Swing mechanism.Bottom plate is driven to be swung back and forth in the rinse bath in frame by first driving means, while so that on bottom plate
Ultrasonic transducer also swing back and forth, then drive framework slightly to rotate by swing mechanism so that ultrasonic transducer can be more than enough
In the effect and silicon chip in direction, the cleaning to silicon chip multi-angle on framework is reached.
In order to realize frame stroke, further, the swing mechanism includes the connection rod set being arranged in frame, institute
The both sides for stating framework have been all provided with the connection rod set, and the connection rod set is made up of two connecting rods arranged in parallel, the connecting rod
It is connected with the frame member, the frame is provided with the second drive device, second drive device is relative with the connecting rod
Should, second drive device is used for drive link and rises or decline.By setting connection rod set in framework both sides, connection rod set is
It is made up of two connecting rods arranged in parallel, the one end for driving framework by the drive device of side rises, while the other end
Drivening rod declines so that framework is rotated to side, by drive device drivening rod so as to realize that framework is swung by a small margin；Together
When by controlling the second drive device framework can be caused to drive silicon chip while rising or declining, facilitate silicon chip extracting or clear
Wash.
In order to which to the more preferable cleaning of silicon chip, further, the both sides in the rinse bath positioned at framework are provided with
The ultrasonic transducer.By setting ultrasonic transducer in the both sides of rinse bath so that silicon chip both sides and lower section can
It is cleaned, it is ensured that Wafer Cleaning is totally thorough.
Further, the first driving means are motor.
For the ease of installing and safeguarding, further, second drive device is cylinder.Because drive device is gas
Cylinder, air cylinder structure is simple, it is easy to installs and safeguards, strong adaptability.
The beneficial effects of the invention are as follows：Silicon chip ultrasonic wave cleaning device of the present invention when in use, passes through first driving means
Bottom plate is driven to swing so that ultrasonic transducer multi-angle is cleaned to silicon chip, while being realized by swing mechanism on framework
Silicon chip slightly rotate, so as to realize to the more preferable cleaning of silicon chip, the present invention can multi-angle silicon chip is cleaned, cleaning effect
Rate is high, it is to avoid silicon chip transfixion in rinse bath so that the impurity of more difficult cleaning can not be cleaned on silicon chip, after reducing
Continue the problem of producing the quality of silicon chip.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the front view of silicon chip ultrasonic wave cleaning device of the present invention；
Fig. 2 is the left view of silicon chip ultrasonic wave cleaning device of the present invention；
Fig. 3 is the top view of silicon chip ultrasonic wave cleaning device of the present invention.
In figure：1st, frame, 101, rinse bath, 2, bottom plate, 3, ultrasonic transducer, 4, first driving means, 5, framework, 6,
Connecting rod, the 7, second drive device.
Embodiment
Presently in connection with accompanying drawing, the present invention will be further described in detail.These accompanying drawings are simplified schematic diagram, only with
Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant with the present invention.
Embodiment
As Figure 1-3, a kind of silicon chip ultrasonic wave cleaning device, including the frame 1 with rinse bath 101, the frame 1
Upper rotation is provided with bottom plate 2, and the bottom plate 2 is located in the rinse bath 101, and the bottom plate 2 is provided with ultrasonic transducer 3,
Ultrasonic transducer 3 is connected with each other with supersonic generator, and ultrasonic transducer 3 is controlled by supersonic generator, described
Frame 1, which is provided with the first driving means 4 for being used for driving bottom plate 2 to swing, the rinse bath 101 to be provided with, to be used to place insert box
Framework 5, the framework 5 is located at the top of the bottom plate 2, and the frame 1 is provided with the oscillating machine for being used for driving framework 5 to swing
Structure.
The swing mechanism includes the connection rod set being arranged in frame 1, and the both sides of the framework 5 have been all provided with the connecting rod
Group, the connection rod set is made up of two connecting rods 6 arranged in parallel, and the connecting rod 6 is rotated with the framework 5 and is connected, described
Frame 1 is provided with the second drive device 7, and second drive device 7 is corresponding with the connecting rod 6, second drive device 7
Rise or decline for drive link 6.
Both sides in the rinse bath 101 positioned at framework 5 are provided with the ultrasonic transducer 3.
The first driving means 4 are motor.
Second drive device 7 is cylinder.Ultrasonic transducer 3, cylinder and motor are opened by peripheral control unit control
Close.
Above-mentioned silicon chip ultrasonic wave cleaning device is filled cleaning fluid when using in rinse bath 101, silicon chip will be inserted with first
Insert box be placed in the grid of framework 5, by controlling cylinder so that cylinder drive framework 5 drop in rinse bath 101,
And the silicon chip in framework 5 is immersed in cleaning fluid, start bottom plate 2 and the ultrasonic transducer 3 of the both sides of rinse bath 101, then
Start motor, motor drives the reciprocally swinging in rinse bath 101 of bottom plate 2 by crank and rocker mechanism so that the ultrasound on bottom plate 2
Wave transducer 3 follows swing, passes through the cylinder of the both sides of control framework 5 so that the connecting rod 6 of one end is upward, and the connecting rod 6 of the other end
Downwards, the slightly swing of framework 5 is realized, after the completion of cleaning, ultrasonic transducer 3 is closed, while stopping motor operation, passes through gas
Cylinder controls connecting rod 6 drives framework 5 to rise so that silicon chip is located above cleaning fluid, completes the cleaning of silicon chip.Set by swinging
Ultrasonic transducer 3 and the framework 5 for slightly rotating setting so that the silicon chip in framework 5 can realize that multi-angle is cleaned, it is ensured that silicon
Piece is cleaned up.
The above-mentioned desirable embodiment according to the present invention is enlightenment, and by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention'.This invention it is technical
Scope is not limited to the content on specification, it is necessary to its technical scope is determined according to right.
Claims (5)
1. a kind of silicon chip ultrasonic wave cleaning device, including the frame (1) with rinse bath (101), it is characterised in that：The frame
(1) rotated on and be provided with bottom plate (2), the bottom plate (2) is located in the rinse bath (101), the bottom plate (2) is provided with ultrasound
Wave transducer (3), the frame (1) is provided with the first driving means (4) for being used for driving bottom plate (2) to swing, the rinse bath
(101) framework (5) for being used for placing insert box is provided with, the framework (5) is located above the bottom plate (2), the frame (1)
It is provided with the swing mechanism for being used for driving framework (5) to swing.
2. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：The swing mechanism includes being arranged on
Connection rod set in frame (1), the both sides of the framework (5) have been all provided with the connection rod set, and the connection rod set is parallel to each other by two
Connecting rod (6) composition of setting, the connecting rod (6) rotates with the framework (5) and is connected, and the frame (1) is provided with the second driving
Device (7), second drive device (7) is corresponding with the connecting rod (6), and second drive device (7) is used for the company of driving
Bar (6) rises or declined.
3. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：It is located in the rinse bath (101)
The both sides of framework (5) are provided with the ultrasonic transducer (3).
4. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：The first driving means (4) are
Motor.
5. silicon chip ultrasonic wave cleaning device according to claim 2, it is characterised in that：Second drive device (7) is
Cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245070.7A CN107068595A (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245070.7A CN107068595A (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107068595A true CN107068595A (en) | 2017-08-18 |
Family
ID=59601107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710245070.7A Pending CN107068595A (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107068595A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993964A (en) * | 2017-11-23 | 2018-05-04 | 上海华力微电子有限公司 | Slot type wet-cleaning board |
| CN108580446A (en) * | 2018-05-23 | 2018-09-28 | 杨喜兰 | A kind of free rocking equipment of the removal hard yellow mud in Radix Codonopsis surface |
| CN108950630A (en) * | 2018-09-20 | 2018-12-07 | 江苏金曼科技有限责任公司 | A kind of plated item ultrasonic cleaning equipment |
| CN110010534A (en) * | 2019-04-18 | 2019-07-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer film magazine hand basket |
| CN110517975A (en) * | 2019-08-08 | 2019-11-29 | 若名芯半导体科技(苏州)有限公司 | Cleaning device and its cleaning method after a kind of CMP |
| CN111957657A (en) * | 2020-07-06 | 2020-11-20 | 陈实 | Cinnabar elutriation device |
| CN112058786A (en) * | 2020-08-26 | 2020-12-11 | 黄伟华 | Semiconductor wafer cleaning device |
| CN112427401A (en) * | 2020-12-01 | 2021-03-02 | 张家港三能机电设备有限公司 | Ultrasonic automatic cleaner convenient to operate |
| CN112546582A (en) * | 2020-11-24 | 2021-03-26 | 胡富强 | Cleaning device for double-swinging type sports football special for children |
| CN113578859A (en) * | 2021-08-02 | 2021-11-02 | 史荃 | Staggered phase difference frequency type ultrasonic online sterilization, crushing, stirring and cleaning method and equipment |
| CN113909209A (en) * | 2021-09-29 | 2022-01-11 | 深圳市美雅洁技术股份有限公司 | Mixed frequency ultrasonic wave subassembly |
| CN114273328A (en) * | 2021-12-30 | 2022-04-05 | 上海至纯洁净系统科技股份有限公司 | Double-layer megawave cleaning system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06112184A (en) * | 1992-09-29 | 1994-04-22 | Mitsubishi Electric Corp | Cleaning apparatus |
| JPH0714814A (en) * | 1993-06-28 | 1995-01-17 | Fuji Film Micro Device Kk | Ultrasonic cleaning method and device |
| JP2004235366A (en) * | 2003-01-29 | 2004-08-19 | Atokku:Kk | Apparatus, method, and system for ultrasonic washing |
| JP2006035139A (en) * | 2004-07-28 | 2006-02-09 | Ptc Engineering:Kk | Ultrasonic cleaner |
-
2017
- 2017-04-14 CN CN201710245070.7A patent/CN107068595A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06112184A (en) * | 1992-09-29 | 1994-04-22 | Mitsubishi Electric Corp | Cleaning apparatus |
| JPH0714814A (en) * | 1993-06-28 | 1995-01-17 | Fuji Film Micro Device Kk | Ultrasonic cleaning method and device |
| JP2004235366A (en) * | 2003-01-29 | 2004-08-19 | Atokku:Kk | Apparatus, method, and system for ultrasonic washing |
| JP2006035139A (en) * | 2004-07-28 | 2006-02-09 | Ptc Engineering:Kk | Ultrasonic cleaner |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993964A (en) * | 2017-11-23 | 2018-05-04 | 上海华力微电子有限公司 | Slot type wet-cleaning board |
| CN107993964B (en) * | 2017-11-23 | 2020-06-30 | 上海华力微电子有限公司 | Groove type wet cleaning machine table |
| CN108580446A (en) * | 2018-05-23 | 2018-09-28 | 杨喜兰 | A kind of free rocking equipment of the removal hard yellow mud in Radix Codonopsis surface |
| CN108950630A (en) * | 2018-09-20 | 2018-12-07 | 江苏金曼科技有限责任公司 | A kind of plated item ultrasonic cleaning equipment |
| CN108950630B (en) * | 2018-09-20 | 2023-09-12 | 江苏金曼科技有限责任公司 | Ultrasonic cleaning device for electroplated part |
| CN110010534A (en) * | 2019-04-18 | 2019-07-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer film magazine hand basket |
| CN110010534B (en) * | 2019-04-18 | 2021-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box lifting basket |
| CN110517975A (en) * | 2019-08-08 | 2019-11-29 | 若名芯半导体科技(苏州)有限公司 | Cleaning device and its cleaning method after a kind of CMP |
| CN111957657A (en) * | 2020-07-06 | 2020-11-20 | 陈实 | Cinnabar elutriation device |
| CN111957657B (en) * | 2020-07-06 | 2022-11-25 | 邳州市景鹏创业投资有限公司 | Cinnabar elutriation device |
| CN112058786A (en) * | 2020-08-26 | 2020-12-11 | 黄伟华 | Semiconductor wafer cleaning device |
| CN112058786B (en) * | 2020-08-26 | 2022-02-11 | 杰梯晞精密机电(上海)有限公司 | Semiconductor wafer cleaning device |
| CN112546582A (en) * | 2020-11-24 | 2021-03-26 | 胡富强 | Cleaning device for double-swinging type sports football special for children |
| CN112427401A (en) * | 2020-12-01 | 2021-03-02 | 张家港三能机电设备有限公司 | Ultrasonic automatic cleaner convenient to operate |
| CN112427401B (en) * | 2020-12-01 | 2022-03-15 | 莱芜成威电子材料有限公司 | Ultrasonic automatic cleaner convenient to operate |
| CN113578859A (en) * | 2021-08-02 | 2021-11-02 | 史荃 | Staggered phase difference frequency type ultrasonic online sterilization, crushing, stirring and cleaning method and equipment |
| CN113909209A (en) * | 2021-09-29 | 2022-01-11 | 深圳市美雅洁技术股份有限公司 | Mixed frequency ultrasonic wave subassembly |
| CN114273328A (en) * | 2021-12-30 | 2022-04-05 | 上海至纯洁净系统科技股份有限公司 | Double-layer megawave cleaning system |
| CN114273328B (en) * | 2021-12-30 | 2024-04-12 | 上海至纯洁净系统科技股份有限公司 | Double-layer megasonic cleaning system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107068595A (en) | Silicon chip ultrasonic wave cleaning device | |
| CN206602106U (en) | Silicon chip ultrasonic wave cleaning device | |
| CN108835655A (en) | Intelligent potato automatic annular peeling device | |
| CN106424468A (en) | Automatic pin cutter for network transformer | |
| CN103444835B (en) | Scallop shell opening machine | |
| CN102059230B (en) | Rocking washing device for washing wafer | |
| CN107866413A (en) | Medical saw saw blade cleaning device | |
| CN219233333U (en) | Batch cleaning device | |
| CN106952848A (en) | Bonder and its pickup bonding apparatus | |
| CN208289656U (en) | Burr remover is used in titanium alloy production | |
| CN201913089U (en) | Swinging cleaning device for cleaning wafers | |
| CN216698333U (en) | Wafer clamping device | |
| CN207126468U (en) | A kind of beverage made of fruits or vegetables homogenizer | |
| CN209979301U (en) | Potato tissue sampling device | |
| CN205949399U (en) | High -efficient silicon chip ultrasonic cleaning groove of horizontal rotation formula | |
| CN207719159U (en) | A kind of silicon wafer cleaner silicon chip cleaning device | |
| CN208160013U (en) | A kind of coconut fruit gravy magma obtains the air pressure plasma discharge mechanism of machine | |
| CN110508556A (en) | A kind of Clean- auxiliary device of single groove ultrasonic | |
| CN207431707U (en) | Ji Zui pumps semi-automatic assembling equipment | |
| CN219395590U (en) | Fruit traditional chinese medicine picking device | |
| CN106269471A (en) | A kind of cell negative electrode material ultrasonic activation with defecator sieves | |
| CN211854739U (en) | Traditional chinese medicine is handled with air-drying device | |
| CN206227663U (en) | A kind of oranges and tangerines point valve workbench | |
| CN210794996U (en) | Be used for quick conveyor of diced fruit | |
| CN209334346U (en) | A kind of automatic flushing device of chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170818 |