CN206602106U - Silicon chip ultrasonic wave cleaning device - Google Patents
Silicon chip ultrasonic wave cleaning device Download PDFInfo
- Publication number
- CN206602106U CN206602106U CN201720397483.2U CN201720397483U CN206602106U CN 206602106 U CN206602106 U CN 206602106U CN 201720397483 U CN201720397483 U CN 201720397483U CN 206602106 U CN206602106 U CN 206602106U
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- silicon chip
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- bottom plate
- frame
- rinse bath
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model is related to silicon chip production equipment technical field, more particularly, to a kind of silicon chip ultrasonic wave cleaning device, including the frame with rinse bath, rotated in the frame and be provided with bottom plate, the bottom plate is located in the rinse bath, the bottom plate is provided with ultrasonic transducer, the frame is provided with the first driving means for being used for driving bottom plate to swing, the framework for being used for placing insert box is provided with the rinse bath, the utility model silicon chip ultrasonic wave cleaning device is when in use, bottom plate is driven to swing by first driving means, so that ultrasonic transducer multi-angle is cleaned to silicon chip, realize that the silicon chip on framework is slightly rotated by swing mechanism simultaneously, so as to realize to the more preferable cleaning of silicon chip, the utility model can multi-angle silicon chip is cleaned, cleaning efficiency is high, avoid silicon chip transfixion in rinse bath, so that the impurity of more difficult cleaning can not be cleaned on silicon chip, reduce the problem of subsequent production comes out the quality of silicon chip.
Description
Technical field
The utility model is related to silicon chip production equipment technical field, more particularly, to a kind of silicon chip ultrasonic wave cleaning device.
Background technology
Transistor and integrated circuit production in, almost per procedure have Wafer Cleaning the problem of, Wafer Cleaning it is good
It is bad to have serious influence to device performance, deal with improperly, may scrap whole silicon chips, can not make pipe, or produce
The device performance come is inferior, and stability and reliability are very poor.Therefore high-cleanness, high, efficient silicon wafer cleaning method are developed, no
Pipe is the people for being engaged in silicon chip processing, or suffers from important meaning for being engaged in the people of semiconductor devices production.
Silicon chip is directly placed in rinse bath by existing Wafer Cleaning equipment, and silicon chip is cleaned using ultrasonic wave, and silicon chip is in cleaning
Transfixion in groove so that the impurity of more difficult cleaning can not be cleaned on silicon chip, reduces the quality that subsequent production comes out silicon chip,
Cause product rejection when serious.
Utility model content
The technical problems to be solved in the utility model is：In order to solve silicon chip transfixion in rinse bath so that silicon chip
On the impurity of more difficult cleaning can not be cleaned, the problem of subsequent production comes out the quality of silicon chip is reduced, now there is provided a kind of silicon
Piece ultrasonic cleaning equipment.
The utility model solves the technical scheme that its technical problem used：A kind of silicon chip ultrasonic wave cleaning device, bag
Include to rotate in the frame with rinse bath, the frame and be provided with bottom plate, the bottom plate is located in the rinse bath, the bottom plate
Ultrasonic transducer is provided with, the frame is provided with the first driving means for being used for driving bottom plate to swing, the rinse bath
Provided with the framework for placing insert box, the framework is located above the bottom plate, and the frame, which is provided with, to be used to drive framework
The swing mechanism of swing.Bottom plate is driven to be swung back and forth in the rinse bath in frame by first driving means, while so that bottom
Ultrasonic transducer on plate also swings back and forth, then drives framework slightly to rotate by swing mechanism so that ultrasonic transducer energy
Enough multidirectional effects are with silicon chip, reaching the cleaning to silicon chip multi-angle on framework.
In order to realize frame stroke, further, the swing mechanism includes the connection rod set being arranged in frame, institute
The both sides for stating framework have been all provided with the connection rod set, and the connection rod set is made up of two connecting rods arranged in parallel, the connecting rod
It is connected with the frame member, the frame is provided with the second drive device, second drive device is relative with the connecting rod
Should, second drive device is used for drive link and rises or decline.By setting connection rod set in framework both sides, connection rod set is
It is made up of two connecting rods arranged in parallel, the one end for driving framework by the drive device of side rises, while the other end
Drivening rod declines so that framework is rotated to side, by drive device drivening rod so as to realize that framework is swung by a small margin；Together
When by controlling the second drive device framework can be caused to drive silicon chip while rising or declining, facilitate silicon chip extracting or clear
Wash.
In order to which to the more preferable cleaning of silicon chip, further, the both sides in the rinse bath positioned at framework are provided with
The ultrasonic transducer.By setting ultrasonic transducer in the both sides of rinse bath so that silicon chip both sides and lower section can
It is cleaned, it is ensured that Wafer Cleaning is totally thorough.
Further, the first driving means are motor.
For the ease of installing and safeguarding, further, second drive device is cylinder.Because drive device is gas
Cylinder, air cylinder structure is simple, it is easy to installs and safeguards, strong adaptability.
The beneficial effects of the utility model are：The utility model silicon chip ultrasonic wave cleaning device when in use, passes through first
Drive device drives bottom plate to swing so that ultrasonic transducer multi-angle is cleaned to silicon chip, while real by swing mechanism
Silicon chip on existing framework is slightly rotated, so as to realize to the more preferable cleaning of silicon chip, the utility model can multi-angle silicon chip is entered
Row cleaning, cleaning efficiency is high, it is to avoid silicon chip transfixion in rinse bath so that the impurity of more difficult cleaning can not be by silicon chip
Cleaning, reduces the problem of subsequent production comes out the quality of silicon chip.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the front view of the utility model silicon chip ultrasonic wave cleaning device；
Fig. 2 is the left view of the utility model silicon chip ultrasonic wave cleaning device；
Fig. 3 is the top view of the utility model silicon chip ultrasonic wave cleaning device.
In figure：1st, frame, 101, rinse bath, 2, bottom plate, 3, ultrasonic transducer, 4, first driving means, 5, framework, 6,
Connecting rod, the 7, second drive device.
Embodiment
Presently in connection with accompanying drawing, the utility model is described in more detail.These accompanying drawings are simplified schematic diagram,
Only illustrate basic structure of the present utility model in a schematic way, therefore it only shows the composition relevant with the utility model.
Embodiment
As Figure 1-3, a kind of silicon chip ultrasonic wave cleaning device, including the frame 1 with rinse bath 101, the frame 1
Upper rotation is provided with bottom plate 2, and the bottom plate 2 is located in the rinse bath 101, and the bottom plate 2 is provided with ultrasonic transducer 3,
Ultrasonic transducer 3 is connected with each other with supersonic generator, and ultrasonic transducer 3 is controlled by supersonic generator, described
Frame 1, which is provided with the first driving means 4 for being used for driving bottom plate 2 to swing, the rinse bath 101 to be provided with, to be used to place insert box
Framework 5, the framework 5 is located at the top of the bottom plate 2, and the frame 1 is provided with the oscillating machine for being used for driving framework 5 to swing
Structure.
The swing mechanism includes the connection rod set being arranged in frame 1, and the both sides of the framework 5 have been all provided with the connecting rod
Group, the connection rod set is made up of two connecting rods 6 arranged in parallel, and the connecting rod 6 is rotated with the framework 5 and is connected, described
Frame 1 is provided with the second drive device 7, and second drive device 7 is corresponding with the connecting rod 6, second drive device 7
Rise or decline for drive link 6.
Both sides in the rinse bath 101 positioned at framework 5 are provided with the ultrasonic transducer 3.
The first driving means 4 are motor.
Second drive device 7 is cylinder.Ultrasonic transducer 3, cylinder and motor are opened by peripheral control unit control
Close.
Above-mentioned silicon chip ultrasonic wave cleaning device is filled cleaning fluid when using in rinse bath 101, silicon chip will be inserted with first
Insert box be placed in the grid of framework 5, by controlling cylinder so that cylinder drive framework 5 drop in rinse bath 101,
And the silicon chip in framework 5 is immersed in cleaning fluid, start bottom plate 2 and the ultrasonic transducer 3 of the both sides of rinse bath 101, then
Start motor, motor drives the reciprocally swinging in rinse bath 101 of bottom plate 2 by crank and rocker mechanism so that the ultrasound on bottom plate 2
Wave transducer 3 follows swing, passes through the cylinder of the both sides of control framework 5 so that the connecting rod 6 of one end is upward, and the connecting rod 6 of the other end
Downwards, the slightly swing of framework 5 is realized, after the completion of cleaning, ultrasonic transducer 3 is closed, while stopping motor operation, passes through gas
Cylinder controls connecting rod 6 drives framework 5 to rise so that silicon chip is located above cleaning fluid, completes the cleaning of silicon chip.Set by swinging
Ultrasonic transducer 3 and the framework 5 for slightly rotating setting so that the silicon chip in framework 5 can realize that multi-angle is cleaned, it is ensured that silicon
Piece is cleaned up.
Above-mentioned is enlightenment according to desirable embodiment of the present utility model, passes through above-mentioned description, relevant staff
Various changes and amendments can be carried out in the range of without departing from this utility model technological thought completely.This practicality
New technical scope is not limited to the content on specification, it is necessary to determine that its is technical according to right
Scope.
Claims (5)
1. a kind of silicon chip ultrasonic wave cleaning device, including the frame (1) with rinse bath (101), it is characterised in that：The frame
(1) rotated on and be provided with bottom plate (2), the bottom plate (2) is located in the rinse bath (101), the bottom plate (2) is provided with ultrasound
Wave transducer (3), the frame (1) is provided with the first driving means (4) for being used for driving bottom plate (2) to swing, the rinse bath
(101) framework (5) for being used for placing insert box is provided with, the framework (5) is located above the bottom plate (2), the frame (1)
It is provided with the swing mechanism for being used for driving framework (5) to swing.
2. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：The swing mechanism includes being arranged on
Connection rod set in frame (1), the both sides of the framework (5) have been all provided with the connection rod set, and the connection rod set is parallel to each other by two
Connecting rod (6) composition of setting, the connecting rod (6) rotates with the framework (5) and is connected, and the frame (1) is provided with the second driving
Device (7), second drive device (7) is corresponding with the connecting rod (6), and second drive device (7) is used for the company of driving
Bar (6) rises or declined.
3. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：It is located in the rinse bath (101)
The both sides of framework (5) are provided with the ultrasonic transducer (3).
4. silicon chip ultrasonic wave cleaning device according to claim 1, it is characterised in that：The first driving means (4) are
Motor.
5. silicon chip ultrasonic wave cleaning device according to claim 2, it is characterised in that：Second drive device (7) is
Cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720397483.2U CN206602106U (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720397483.2U CN206602106U (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206602106U true CN206602106U (en) | 2017-10-31 |
Family
ID=60143790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720397483.2U Active CN206602106U (en) | 2017-04-14 | 2017-04-14 | Silicon chip ultrasonic wave cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206602106U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107931234A (en) * | 2017-11-03 | 2018-04-20 | 无锡琨圣科技有限公司 | A kind of Manual mechanical cleaning device |
| CN109201621A (en) * | 2018-09-07 | 2019-01-15 | 许国武 | A kind of metal wrist strap indicating quartz electronic wristwatch gap depth descaling rinsing device |
| CN110379733A (en) * | 2019-06-03 | 2019-10-25 | 厦门通富微电子有限公司 | Remove the cleaning device of photoresist on wafer |
| CN112038270A (en) * | 2020-11-02 | 2020-12-04 | 宁波丞达精机股份有限公司 | Wafer processing device and processing method |
-
2017
- 2017-04-14 CN CN201720397483.2U patent/CN206602106U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107931234A (en) * | 2017-11-03 | 2018-04-20 | 无锡琨圣科技有限公司 | A kind of Manual mechanical cleaning device |
| CN107931234B (en) * | 2017-11-03 | 2021-01-05 | 无锡琨圣智能装备股份有限公司 | Manual mechanical type belt cleaning device |
| CN109201621A (en) * | 2018-09-07 | 2019-01-15 | 许国武 | A kind of metal wrist strap indicating quartz electronic wristwatch gap depth descaling rinsing device |
| CN109201621B (en) * | 2018-09-07 | 2021-06-04 | 许国武 | Metal wrist strap pointer type quartz electronic watch gap deep descaling and cleaning device |
| CN110379733A (en) * | 2019-06-03 | 2019-10-25 | 厦门通富微电子有限公司 | Remove the cleaning device of photoresist on wafer |
| CN112038270A (en) * | 2020-11-02 | 2020-12-04 | 宁波丞达精机股份有限公司 | Wafer processing device and processing method |
| CN112038270B (en) * | 2020-11-02 | 2021-01-19 | 宁波丞达精机股份有限公司 | Wafer processing device and processing method |
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