CN107045265A - The recombination method of tilting scan data in direct-write type lithography machine - Google Patents

The recombination method of tilting scan data in direct-write type lithography machine Download PDF

Info

Publication number
CN107045265A
CN107045265A CN201710131473.9A CN201710131473A CN107045265A CN 107045265 A CN107045265 A CN 107045265A CN 201710131473 A CN201710131473 A CN 201710131473A CN 107045265 A CN107045265 A CN 107045265A
Authority
CN
China
Prior art keywords
data
ram
row
write
digital micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710131473.9A
Other languages
Chinese (zh)
Other versions
CN107045265B (en
Inventor
李显杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Speed Semiconductor Technology Co Ltd
Original Assignee
Wuxi Speed Semiconductor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Speed Semiconductor Technology Co Ltd filed Critical Wuxi Speed Semiconductor Technology Co Ltd
Priority to CN201710131473.9A priority Critical patent/CN107045265B/en
Publication of CN107045265A publication Critical patent/CN107045265A/en
Application granted granted Critical
Publication of CN107045265B publication Critical patent/CN107045265B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • G06F12/08Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
    • G06F12/10Address translation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Complex Calculations (AREA)

Abstract

The present invention relates to a kind of recombination method, the recombination method of tilting scan data, belongs to the technical field of direct-write type lithography machine tilting data processing in especially a kind of direct-write type lithography machine.The present invention enters line translation restructuring to tilt data, data storage is carried out using RAM in FGA according to obliquity factor, the write-in and reading of data needed for realizing, hardware manufacturing cost can be reduced, the speed of data conversion restructuring is improved, so as to effectively improve exposure resolution ratio and production production capacity.

Description

The recombination method of tilting scan data in direct-write type lithography machine
Technical field
The present invention relates to a kind of recombination method, the restructuring side of tilting scan data in especially a kind of direct-write type lithography machine Method, belongs to the technical field of direct-write type lithography machine tilting data processing.
Background technology
Direct-write type lithography machine equipment is also known as the direct transfer equipment of image, is a key in semiconductor and PCB production fields Equipment.Compared with traditional semi-automatic exposure equipment, it replaces the mask plate of conventional lithography machine using pattern generator, so as to Directly the graph data of computer is exposed on wafer or pcb board, the making sheet time is saved and makes the expense of mask plate.And be Further raising equipment exposure resolution ratio and production production capacity, in the data processing that image is directly shifted, can use tilting Data processing method.
Due to the data processing method using tilting, and the intrinsic row of pattern generator digital micro-mirror chip (DMD) Cloth structure, input data that the data after being tilted over can not be directly as DMD, it is necessary to by conversion restructuring, it is final arrange be in Existing gap tilt effect, and it is suitable for the data format of DMD eyeglass arrangements.
Usually, the conversion restructuring of data can be completed in FPGA, generally using extra addition RAM, by the number put in order According to keeping in RAM, it is necessary to be read when using, but can so increase manufacturing cost and hardware complexity.Or using in FPGA The logical resource progress data conversion restructuring in portion, generally non real-time nature, data processing speed can be seriously reduced, and then can not The purpose that increase equipment capacity is scanned using tilting is reached well.
The content of the invention
The purpose of the present invention is to overcome the deficiencies in the prior art to be swept there is provided tilting in a kind of direct-write type lithography machine The recombination method of data is retouched, it can reduce hardware manufacturing cost, the speed of data conversion restructuring is improved, so as to effectively improve exposure Resolution ratio and production production capacity.
The recombination method of tilting scan data in the technical scheme provided according to the present invention, a kind of direct-write type lithography machine, Methods described comprises the following steps:
Step 1, the digital micro-mirror chip DMD to 1920*1080P, according to obliquity factor K, obtain the data of tilt data Total amount is 2048*K, wherein, the bit wide of each tilt data is 256, and each tilt data is divided into K groups, and every group of data are 256/K, K=2n, n=1,2,3 ... ..., 8;The K RAMs temporary for data are chosen in FPGA;
Step 2, by all first (256/K) positions data in 4*K 256 data before in above-mentioned tilt data, group 1024 data before the first row into digital micro-mirror chip DMD to be written before the first row in 1024 eyeglasses;By above-mentioned inclination All first (256/K) digit data after in data in 4*K 256 data, constitute digital micro-mirror chip DMD to be written 1024 data after the first row after middle the first row in 1024 eyeglasses;
By all second (256/K) positions data in preceding 4*K 256 data in above-mentioned tilt data, constitute to be written Enter 1024 data before the second row in digital micro-mirror chip DMD before the second row in 1024 eyeglasses, and by above-mentioned tilt data In after all second (256/K) positions data in 4*K 256 data, constitute second in digital micro-mirror chip DMD to be written 1024 data after the second row after row in 102 eyeglasses;
Above-mentioned data building form is repeated, until by K row eyeglasses in all tilt datas and digital micro-mirror chip DMD Preceding 1024 eyeglasses, rear 1024 eyeglasses are corresponded;
Step 3, by 2048 data of the first row in above-mentioned digital micro-mirror chip DMD, be divided into 64 256 digits According to, and obtain 2048 data of the first row in digital micro-mirror chip DMD according to 64 256 data of division;Wherein, the first row First 256 data by first 256 data corresponding first (256/K) position into (K/2) individual 256 data Data and (1+4K) individual 256 data are to corresponding first (256/K) position data of (K/2+4K) individual 256 data Composition;
Second 256 data of the first row are by (1+K/2) position data into (K) individual 256 data corresponding One (256/K) position data and (1+9K/2) individual 256 data are corresponding first to (5K) individual 256 data (256/K) position data composition;
Above-mentioned data manipulation is repeated, until 256 all data of the first row in digital micro-mirror chip DMD are obtained, and 256 all data of line k in digital micro-mirror chip DMD;
In step 4,256 data all to K rows in above-mentioned digital micro-mirror chip DMD, division obtains first 32 256 Data and rear 32 256 data;Wherein, to preceding 32 256 data of digital micromirror chip DMD the first rows, first 256 K (256/K) position data included in data are respectively written into K RAM first address area, second 256 data Included in K (256/K) positions data be respectively written into K RAM second address area, repeat said write and operate, directly K RAM the 32nd address area is respectively written into K (256/K) position data included in the 32nd 256 data Domain;
To rear 32 256 data of digital micromirror chip DMD the first rows, K included in the 33rd 256 data (256/K) position data are respectively written into included in K RAM the 33rd address area, the 34th 256 data K (256/K) position data are respectively written into K RAM the 34th address area, said write operation are repeated, until the 64th K (256/K) position data included in 256 data are respectively written into the 64th bit address region;
33rd 256 data write the data order in K RAM and write with first 256 data in K RAM Data order differs four groups of data;As (K/2)<When 32, to preceding 32 256 data or rear 32 256 data, at interval of (K/2) individual 256 data write sequence in K RAM is identical, in (K/2) individual 256 data, in K RAM of adjacent write-in Data order there is the dislocation of one group of data;
Above-mentioned data manipulation is repeated, until 256 all data of K rows are write in K RAM;
Step 5, the mode write according to above-mentioned data, under a clock, while the data accessed in K RAM are read, To obtain 256 data write in digital micro-mirror chip DMD in a line eyeglass needed for each eyeglass;Repeat above-mentioned data write-in Operation, until K row eyeglasses in digital micro-mirror chip DMD are write into full.
Opened up simultaneously in FPGA comprising K RAM in two RAM blocks, each RAM block, to being write in a RAM block During data, reading data are carried out to another RAM block.
Advantages of the present invention:According to obliquity factor, line translation restructuring is entered to tilt data, hardware manufacturing cost can be reduced, The speed of data conversion restructuring is improved, so as to effectively improve exposure resolution ratio and production production capacity.
Brief description of the drawings
Fig. 1 for the present invention with obliquity factor K=8 when, the schematic diagram of 256 tilt datas.
Fig. 2 is of the invention in obliquity factor K=8, the data total amount schematic diagram of tilt data.
Fig. 3 is the schematic diagram data of the invention for writing the first row eyeglass after restructuring in obliquity factor K=8.
Fig. 4, in obliquity factor K=8, writes the schematic diagram data of the second row eyeglass to be of the invention after restructuring.
Fig. 5 is of the invention in obliquity factor K=8, the schematic diagram in data write-in RAM.
Fig. 6 is of the invention in obliquity factor K=8, the schematic diagram that data are read from RAM.
Fig. 7 uses the schematic diagram of ping-pong operation for the present invention to the reading of data.
Embodiment
With reference to specific drawings and examples, the invention will be further described.
In order to be able to reduce hardware manufacturing cost, the speed of data conversion restructuring is improved, so as to effectively improve exposure resolution ratio And production capacity is produced, the present invention comprises the following steps:
Step 1, the digital micro-mirror chip DMD to 1920*1080P, according to obliquity factor K, obtain the data of tilt data Total amount is 2048*K, wherein, the bit wide of each tilt data is 256, and each tilt data is divided into K groups, and every group of data are 256/K, K=2n, n=1,2,3 ... ..., 8;The K RAMs temporary for data are chosen in FPGA;
Specifically, obliquity factor K quantity is consistent with the line number of eyeglass in digital micro-mirror chip DMD, for one really Fixed digital micro-mirror chip DMD, then obliquity factor K determine therewith.After obliquity factor K determinations, the data total amount of tilt data Determine therewith.The concrete numerical value of tilt data, specially this technology relevant with data to be written in digital micro-mirror chip DMD Known to the personnel of field, here is omitted., usually, RAM data bit width is also 256/K.Following specific data recombinations Change procedure is also completed in FPGA.
Step 2, by all first (256/K) positions data in 4*K 256 data before in above-mentioned tilt data, group 1024 data before the first row into digital micro-mirror chip DMD to be written before the first row in 1024 eyeglasses;By above-mentioned inclination All first (256/K) digit data after in data in 4*K 256 data, constitute digital micro-mirror chip DMD to be written 1024 data after the first row after middle the first row in 1024 eyeglasses;
By all second (256/K) positions data in preceding 4*K 256 data in above-mentioned tilt data, constitute to be written Enter 1024 data before the second row in digital micro-mirror chip DMD before the second row in 1024 eyeglasses, and by above-mentioned tilt data In after all second (256/K) positions data in 4*K 256 data, constitute second in digital micro-mirror chip DMD to be written 1024 data after the second row after row in 102 eyeglasses;
Above-mentioned data building form is repeated, until by K row eyeglasses in all tilt datas and digital micro-mirror chip DMD Preceding 1024 eyeglasses, rear 1024 eyeglasses are corresponded;
Step 3, by 2048 data of the first row in above-mentioned digital micro-mirror chip DMD, be divided into 64 256 digits According to, and obtain 2048 data of the first row in digital micro-mirror chip DMD according to 64 256 data of division;Wherein, the first row First 256 data by first 256 data corresponding first (256/K) position into (K/2) individual 256 data Data and (1+4K) individual 256 data are to corresponding first (256/K) position data of (K/2+4K) individual 256 data Composition;
Second 256 data of the first row are by (1+K/2) position data into (K) individual 256 data corresponding One (256/K) position data and (1+9K/2) individual 256 data are corresponding first to (5K) individual 256 data (256/K) position data composition;
Above-mentioned data manipulation is repeated, until 256 all data of the first row in digital micro-mirror chip DMD are obtained, and 256 all data of line k in digital micro-mirror chip DMD;
In the embodiment of the present invention, first 256 data of the first row are by first 256 data to (K/2) individual 256 Corresponding first (256/K) position data and (1+4K) individual 256 data are individual 256 to (K/2+4K) in the data of position Corresponding first (256/K) position data composition of data, is specifically referred to, from first (256/K) position of first 256 data Data continuously take it is corresponding first (256/K) to (K/2) individual 256 data, meanwhile, from individual 256 digits of first (1+4K) According to first (256/K) data continuously take it is corresponding first (256/K) to (K/2+4K) individual 256 data so that To first 256 data of the first row, following data manipulation modes is similar, no longer describes one by one herein.
In step 4,256 data all to K rows in above-mentioned digital micro-mirror chip DMD, division obtains first 32 256 Data and rear 32 256 data;Wherein, to preceding 32 256 data of digital micromirror chip DMD the first rows, first 256 K (256/K) position data included in data are respectively written into K RAM first address area, second 256 data Included in K (256/K) positions data be respectively written into K RAM second address area, repeat said write and operate, directly K RAM the 32nd address area is respectively written into K (256/K) position data included in the 32nd 256 data Domain;
To rear 32 256 data of digital micromirror chip DMD the first rows, K included in the 33rd 256 data (256/K) position data are respectively written into included in K RAM the 33rd address area, the 34th 256 data K (256/K) position data are respectively written into K RAM the 34th address area, said write operation are repeated, until the 64th K (256/K) position data included in 256 data are respectively written into the 64th bit address region;
33rd 256 data write the data order in K RAM and write with first 256 data in K RAM Data order differs four groups of data;As (K/2)<When 32, to preceding 32 256 data or rear 32 256 data, at interval of (K/2) individual 256 data write sequence in K RAM is identical, in (K/2) individual 256 data, in K RAM of adjacent write-in Data order there is the dislocation of one group of data;
Above-mentioned data manipulation is repeated, until 256 all data of K rows are write in K RAM;
In the embodiment of the present invention, when (K/2) >=32, due to the pass with preceding 32 256 data, rear 32 256 data System, then in the absence of above-mentioned data order access relationships.
Step 5, the mode write according to above-mentioned data, under a clock, while the data accessed in K RAM are read, To obtain 256 data write in digital micro-mirror chip DMD in a line eyeglass needed for each eyeglass;Repeat above-mentioned data write-in Operation, until K row eyeglasses in digital micro-mirror chip DMD are write into full.
As shown in fig. 7, opened up comprising K RAM in two RAM blocks, each RAM block, to one in FPGA simultaneously In RAM block during write-in data, reading data are carried out to another RAM block.In the embodiment of the present invention, read by two RAM data Extract operation, can further increase recombination efficiency, reduce reorganization time.
As shown in Fig. 1~Fig. 6, by taking obliquity factor K=8 as an example, the detailed process to the present invention is illustrated, specifically:
Fig. 1 is to be tilted over 256 bit data formats exported afterwards, during obliquity factor K=8, and the data of output can be according to K= 8 are divided into 8 groups, and every group of data are 32.
As shown in Fig. 2 when as K=8, the total data volume of tilt data is 2048*8=16384, is divided into 64 256 Position, each 256 are the data structure form shown in Fig. 1, i.e., the total amount of data correspondence digital micro-mirror of described tilt data Chip DMD 8 row eyeglasses, often row eyeglass need 2048 data.
As shown in Figure 3, Figure 4, tilt data write-in digital micro-mirror chip DMD rule is:First 32 256 of tilt data All first 32 in the data of position, constitute before 1024 data, write-in digital micro-mirror chip DMD the first row eyeglass Among 1024 eyeglasses;All first 32 in rear 32 256 data of tilt data, 1024 data are constituted, are write Among rear 1024 eyeglasses for the first row eyeglass for entering digital micro-mirror chip DMD.
Similarly, all second 32 in preceding 32 256 data of tilt data, constitute 1024 data, to be written Among preceding 1024 eyeglasses for the second row eyeglass for entering digital micro-mirror chip DMD;In rear 32 256 data of tilt data All second 32, constitute 1024 data, rear 1024 eyeglasses of digital micro-mirror chip DMD to be written the second row eyeglass It is central.By that analogy, until tilt data can write 8 completely corresponding row eyeglasses.
Actually digital micro-mirror chip DMD data write-in channel width is similarly 256, the number for restructuring of remapping According to first 256 of, digital micro-mirror chip DMD the first row eyeglass, it is necessary to obtain above-mentioned the 1st 256 obtained in data Position data, the 2nd 256 data, the 3rd 256 data, first 32 data of the 4th 256 data and the 33rd 256 data, the 34th 256 data, the 35th 256 data, first 32 data of the 36th 256 data.Together Reason, 256, digital micro-mirror chip DMD the first row eyeglass second is, it is necessary to obtain above-mentioned the 5th 256 digits for obtaining data According to, the 6th 256 data, the 7th 256 data, first 32 data of the 8th 256 data and the 37th 256 Data, the 38th 256 data, the 39th 256 data, first 32 data of the 40th 256 data.With such Push away, until the first row eyeglass can be write to full.
First 256 to digital micromirror chip DMD the second row eyeglass above-mentioned obtain the 1st of data, it is necessary to obtain Individual 256 data, the 2nd 256 data, the 3rd 256 data, second 32 data and of the 4th 256 data 33 256 data, the 34th 256 data, the 35th 256 data, second 32 digit of the 36th 256 data According to.Similarly, second 256, the second row eyeglass, it is necessary to obtain above-mentioned the 5th 256 data for obtaining data, the 6th 256 Data, the 7th 256 data, second 32 data of the 8th 256 data and the 37th 256 data, the 38th 256 Position data, the 39th 256 data, second 32 data of the 40th 256 data.By that analogy, until can be by second Row eyeglass is write full.
According to above-mentioned data manipulation, obtain that full the third line eyeglass, fourth line eyeglass, fifth line eyeglass, the 6th row mirror can be write Piece, the 7th row eyeglass, the inclination recombination data of the 8th row eyeglass.
As shown in figure 5, according to above-mentioned data recombination conversion process, choosing K=8 RAM, each RAM data bit width For 32.Obtain to write after the data of completely all eyeglasses after restructuring conversion, to the data of the first row eyeglass, writing data into During RAM, i.e., 8 32 data that first 256 data are divided into group are respectively written into 8 RAM first address area;The 8 32 data that two 256 data are divided into group, rule as illustrated, misplace one group of data, is then respectively written into 8 Individual RAM second address area.According to such a rule, diagrammatically, preceding 32 256 data are respectively written into 8 RAM preceding 32 address areas.
To rear 32 256 data, since 4 32 grouped datas that misplace, the 33rd in 8 RAM is respectively written into Address area to the 64th address area.For the write-in RAM processes of other row eyeglasses, described above is may be referred to, herein not Repeat again.
As shown in fig. 6, RAM rule is write according to recombination data, can be simultaneously from the of RAM1 under a CLK clock One address area, RAM2 second address area, RAM3 the 3rd address area, RAM4 the 4th address area, RAM5 the 33rd address area, RAM6 the 34th address area, RAM7 the 35th address area, RAM8 the 36th address area read the 1st 256, the 2nd 256 data, the 3rd 256 data, the 4th 256 First 32 data of position data and the 33rd 256 data, the 34th 256 data, the 35th 256 data, 36 First 32 data of individual 256 data, reformulate first eyeglass that first 256 data writes the first row eyeglass It is interior.
Similarly, can simultaneously from RAM1 the 5th address area, RAM2 the 6th address area, RAM3 the 7th address Region, RAM4 the 8th address area, RAM5 the 37th address area, RAM6 the 38th address area, the 39th of RAM7 the Individual address area, RAM8 the 40th address area read the 5th 256 data, the 6th 256 data, the 7th 256 digits According to, first 32 data of the 8th 256 data and the 37th 256 data, the 38th 256 data, the 39th 256 Position data, first 32 data of the 40th 256 data, reformulate second 256 digit and write the first row mirror according to this In second eyeglass of piece.By that analogy, until 8 row eyeglasses are all write into full.
As shown in Figure 5, Figure 6, in the way of being read in the way of above-mentioned data write-in RAM and from RAM, it can reach most Fast write-in and reading speed, the write-in of all 256 data and read operation, can be completed, no under a CLK clock The time can be increased because of the restructuring of data.

Claims (2)

1. the recombination method of tilting scan data in a kind of direct-write type lithography machine, it is characterized in that:Methods described includes following step Suddenly:
Step 1, the digital micro-mirror chip DMD to 1920*1080P, according to obliquity factor K, obtain the data total amount of tilt data For 2048*K, wherein, the bit wide of each tilt data is 256, and each tilt data is divided into K groups, and every group of data are 256/K Position, K=2n, n=1,2,3 ... ..., 8;The K RAMs temporary for data are chosen in FPGA;
Step 2, by all first (256/K) positions data in 4*K 256 data before in above-mentioned tilt data, composition is treated Write 1024 data before the first row in digital micro-mirror chip DMD before the first row in 1024 eyeglasses;By above-mentioned tilt data In after all first (256/K) digit data in 4*K 256 data, constitute in digital micro-mirror chip DMD to be written the 1024 data after the first row after a line in 1024 eyeglasses;
By all second (256/K) positions data in preceding 4*K 256 data in above-mentioned tilt data, number to be written is constituted 1024 data before the second row in word micromirror chip DMD before the second row in 1024 eyeglasses, and by after in above-mentioned tilt data All second (256/K) positions data in 4*K 256 data, are constituted in digital micro-mirror chip DMD to be written after second row 1024 data after the second row in 102 eyeglasses;
Above-mentioned data building form is repeated, until by before K row eyeglasses in all tilt datas and digital micro-mirror chip DMD 1024 eyeglasses, rear 1024 eyeglasses are corresponded;
Step 3,64 256 data in 2048 data of the first row in above-mentioned digital micro-mirror chip DMD, will be divided into, and 2048 data of the first row in digital micro-mirror chip DMD are obtained according to the 64 of division 256 data;Wherein, the of the first row One 256 data corresponding first (256/K) digit into (K/2) individual 256 data by first 256 data According to and (1+4K) individual 256 data to corresponding first (256/K) position data group of (K/2+4K) individual 256 data Into;
Second 256 data of the first row are by (1+K/2) position data into (K) individual 256 data corresponding first (256/K) position data and (1+9K/2) individual 256 data are corresponding first (256/K) to (5K) individual 256 data Position data composition;
Above-mentioned data manipulation is repeated, until 256 all data of the first row in digital micro-mirror chip DMD are obtained, and numeral 256 all data of line k in micromirror chip DMD;
In step 4,256 data all to K rows in above-mentioned digital micro-mirror chip DMD, division obtains preceding 32 256 data With rear 32 256 data;Wherein, to preceding 32 256 data of digital micromirror chip DMD the first rows, first 256 data Included in K (256/K) positions data be respectively written into institute in K RAM first address area, second 256 data Comprising K (256/K) positions data be respectively written into K RAM second address area, said write operation is repeated, up to the K (256/K) position data included in 32 256 data are respectively written into K RAM the 32nd address area;
To rear 32 256 data of digital micromirror chip DMD the first rows, K included in the 33rd 256 data (256/K) position data are respectively written into included in K RAM the 33rd address area, the 34th 256 data K (256/K) position data are respectively written into K RAM the 34th address area, said write operation are repeated, until the 64th K (256/K) position data included in 256 data are respectively written into the 64th bit address region;
33rd 256 data write the data that the data order in K RAM is write in K RAM with first 256 data Order differs four groups of data;As (K/2)<When 32, to preceding 32 256 data or rear 32 256 data, at interval of (K/2) Individual 256 data write sequence in K RAM is identical, in (K/2) individual 256 data, the data in K RAM of adjacent write-in There is the dislocation of one group of data in order;
Above-mentioned data manipulation is repeated, until 256 all data of K rows are write in K RAM;
Step 5, the mode write according to above-mentioned data, under a clock, while the data accessed in K RAM are read, with 256 data write into digital micro-mirror chip DMD in a line eyeglass needed for each eyeglass;Repeat above-mentioned data write-in behaviour Make, until K row eyeglasses in digital micro-mirror chip DMD are write into full.
2. the recombination method of tilting scan data in direct-write type lithography machine according to claim 1, it is characterized in that: Opened up simultaneously in FPGA comprising K RAM in two RAM blocks, each RAM block, it is right when to writing data in a RAM block Another RAM block carries out reading data.
CN201710131473.9A 2017-03-07 2017-03-07 The recombination method of tilting scan data in direct-write type lithography machine Active CN107045265B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710131473.9A CN107045265B (en) 2017-03-07 2017-03-07 The recombination method of tilting scan data in direct-write type lithography machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710131473.9A CN107045265B (en) 2017-03-07 2017-03-07 The recombination method of tilting scan data in direct-write type lithography machine

Publications (2)

Publication Number Publication Date
CN107045265A true CN107045265A (en) 2017-08-15
CN107045265B CN107045265B (en) 2019-04-16

Family

ID=59544129

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710131473.9A Active CN107045265B (en) 2017-03-07 2017-03-07 The recombination method of tilting scan data in direct-write type lithography machine

Country Status (1)

Country Link
CN (1) CN107045265B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107506153A (en) * 2017-09-26 2017-12-22 深信服科技股份有限公司 A kind of data compression method, data decompression method and related system
CN109656101A (en) * 2018-12-07 2019-04-19 东莞市多普技术研发有限公司 A kind of data processing method of digital micro-mirror dip sweeping
WO2020238118A1 (en) * 2019-05-27 2020-12-03 苏州苏大维格科技集团股份有限公司 Photoetching method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453814A (en) * 1994-04-13 1995-09-26 Nikon Precision Inc. Illumination source and method for microlithography
CN102890429A (en) * 2012-09-18 2013-01-23 天津芯硕精密机械有限公司 Method for increasing data transmission speed in photoetching system through skew scanning display
CN102890427A (en) * 2012-09-18 2013-01-23 天津芯硕精密机械有限公司 Method for preparing skewed data in field programmable gate array (FPGA) of direct-writing type photoetching system
CN104216238A (en) * 2014-09-15 2014-12-17 江苏影速光电技术有限公司 Method for realizing data skew of direct writing type lithography machine in FPGA

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453814A (en) * 1994-04-13 1995-09-26 Nikon Precision Inc. Illumination source and method for microlithography
CN102890429A (en) * 2012-09-18 2013-01-23 天津芯硕精密机械有限公司 Method for increasing data transmission speed in photoetching system through skew scanning display
CN102890427A (en) * 2012-09-18 2013-01-23 天津芯硕精密机械有限公司 Method for preparing skewed data in field programmable gate array (FPGA) of direct-writing type photoetching system
CN104216238A (en) * 2014-09-15 2014-12-17 江苏影速光电技术有限公司 Method for realizing data skew of direct writing type lithography machine in FPGA

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107506153A (en) * 2017-09-26 2017-12-22 深信服科技股份有限公司 A kind of data compression method, data decompression method and related system
CN109656101A (en) * 2018-12-07 2019-04-19 东莞市多普技术研发有限公司 A kind of data processing method of digital micro-mirror dip sweeping
WO2020238118A1 (en) * 2019-05-27 2020-12-03 苏州苏大维格科技集团股份有限公司 Photoetching method

Also Published As

Publication number Publication date
CN107045265B (en) 2019-04-16

Similar Documents

Publication Publication Date Title
CN107045265A (en) The recombination method of tilting scan data in direct-write type lithography machine
CN107688999A (en) A kind of parallel transaction based on block chain performs method
CN112183003B (en) Step-by-step multi-threshold voltage unit distribution method based on time sequence margin and time sequence path
CN109522428A (en) A kind of external memory access method of the figure computing system based on index positioning
CN1932642A (en) Method for reticle shapes analysis and correction
Bourne A SPATIAL ALLOCATION-LAND USE CONVERSION MODEL OF URBAN GROWTH.
CN115525693A (en) Incremental event log-oriented process model mining method and system
CN102542528B (en) Image conversion processing method and system
CN109741421B (en) GPU-based dynamic graph coloring method
JP3464621B2 (en) Bank variable memory
WO2006105721A1 (en) Method and apparatus capable of producing fm lattice points in high speed
CN115796110A (en) Method and system for accelerating layout loading based on expanded layout format
CN108932172A (en) A kind of fine granularity shared drive communication synchronization method calculated based on OpenMP/MPI hybrid parallel CFD
CN116307015A (en) Environmental performance prediction method and device based on pix2pix
CN102651120B (en) Memory access method for image processing and image processing device
Hong et al. CASH: A novel quadratic placement algorithm for very large standard cell layout design based on clustering
CN106527058A (en) Method of data shift in inclined scanning
CN111739111A (en) Method and system for optimizing intra-block offset of point cloud projection coding
CN116228963A (en) Improved three-dimensional reconstruction method for porous medium
US12000891B2 (en) Scan correlation-aware scan cluster reordering method and apparatus for low-power testing
CN118133778A (en) Failure point analysis method, device, computer equipment and storage medium
CN1372681A (en) Method and apparatus for symbol storage and display
CN115270695B (en) Splitting verification method for circuit layout, double-pattern photoetching method and storage medium
Lu et al. FPRM circuit area optimization based on MRFOtent Algorithm
CN108920746B (en) Pre-compression method and system for layout planning of integrated circuit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Reorganization of Tilt Scan Data in Direct Write Lithography

Effective date of registration: 20221219

Granted publication date: 20190416

Pledgee: Bank of Jiangsu Limited by Share Ltd. Wuxi branch

Pledgor: WUXI YSPHOTECH SEMICONDUCTOR TECHNOLOGY CO.,LTD.

Registration number: Y2022320010819