CN107039294B - 引线环成型系统和利用该系统的方法 - Google Patents

引线环成型系统和利用该系统的方法 Download PDF

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Publication number
CN107039294B
CN107039294B CN201610825836.4A CN201610825836A CN107039294B CN 107039294 B CN107039294 B CN 107039294B CN 201610825836 A CN201610825836 A CN 201610825836A CN 107039294 B CN107039294 B CN 107039294B
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CN
China
Prior art keywords
wire
bonding
shaping tool
tool
bond head
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CN201610825836.4A
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English (en)
Chinese (zh)
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CN107039294A (zh
Inventor
J·M·拜厄斯
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Orthodyne Electronics Corp
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Orthodyne Electronics Corp
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Publication of CN107039294A publication Critical patent/CN107039294A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07163—Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
CN201610825836.4A 2012-02-07 2013-02-07 引线环成型系统和利用该系统的方法 Active CN107039294B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261596145P 2012-02-07 2012-02-07
US61/596,145 2012-02-07
US13/746,489 2013-01-22
US13/746,489 US8998063B2 (en) 2012-02-07 2013-01-22 Wire loop forming systems and methods of using the same
CN201310049313.1A CN103295934B (zh) 2012-02-07 2013-02-07 引线环成型系统和利用该系统的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310049313.1A Division CN103295934B (zh) 2012-02-07 2013-02-07 引线环成型系统和利用该系统的方法

Publications (2)

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CN107039294A CN107039294A (zh) 2017-08-11
CN107039294B true CN107039294B (zh) 2020-10-16

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CN201610825836.4A Active CN107039294B (zh) 2012-02-07 2013-02-07 引线环成型系统和利用该系统的方法
CN201310049313.1A Active CN103295934B (zh) 2012-02-07 2013-02-07 引线环成型系统和利用该系统的方法

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US (2) US8998063B2 (https=)
JP (1) JP6289808B2 (https=)
CN (2) CN107039294B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
DE102014011219B4 (de) * 2014-07-29 2017-10-26 Audi Ag Vorrichtung und Verfahren zur Ausbildung einer elektrischen Kontaktierung zwischen einer Energiespeicherzelle und einer Leiterblechstruktur
US9881891B1 (en) * 2016-11-15 2018-01-30 Asm Technology Singapore Pte Ltd Method of forming three-dimensional wire loops and wire loops formed using the method
DE102018221950A1 (de) 2018-12-17 2020-06-18 BINDER tecsys GmbH Verfahren zur Herstellung und Positionierung elektrischer Verbinder
KR102859474B1 (ko) 2020-07-10 2025-09-15 삼성전자주식회사 와이어 본딩 장치
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527730A (en) * 1982-02-10 1985-07-09 Hitachi, Ltd. Wire bonding apparatus
US20100059574A1 (en) * 2008-09-10 2010-03-11 Kaijo Corporation Wire bonding method, wire bonding apparatus, and wire bonding control program

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Publication number Priority date Publication date Assignee Title
US3218702A (en) * 1961-06-09 1965-11-23 Frederick W Steudler Method and apparatus for bonding wires to metal surfaces
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
JPS58192688A (ja) 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法
ES2059841T3 (es) * 1989-02-13 1994-11-16 Bayer Agrochem Kk Nitro compuestos con actividad insecticida.
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
JPH05144867A (ja) * 1991-11-19 1993-06-11 Hitachi Ltd 電子装置およびワイヤボンデイング方法ならびにワイヤボンデイング装置
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
JP2783125B2 (ja) 1993-07-23 1998-08-06 株式会社デンソー ワイヤボンディング方法
US5395038A (en) * 1994-04-25 1995-03-07 International Business Machines Corporation High placement accuracy wire bonder for joining small closely spaced wiring features
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
JPH09321074A (ja) * 1996-05-31 1997-12-12 Toyota Motor Corp ワイヤボンディング装置
JP4467175B2 (ja) * 2000-12-22 2010-05-26 株式会社新川 ボンディングデータ設定装置および方法
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
CN101517723B (zh) * 2006-10-27 2011-11-23 库利克和索夫工业公司 形成线环期间控制键合工具的轨迹的方法
US7597235B2 (en) 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
JP2010118400A (ja) * 2008-11-11 2010-05-27 Renesas Technology Corp 半導体装置及びその製造方法
US8434669B1 (en) * 2012-01-05 2013-05-07 Asm Technology Singapore Pte Ltd. Universal bond head for wire bonders

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527730A (en) * 1982-02-10 1985-07-09 Hitachi, Ltd. Wire bonding apparatus
US20100059574A1 (en) * 2008-09-10 2010-03-11 Kaijo Corporation Wire bonding method, wire bonding apparatus, and wire bonding control program

Also Published As

Publication number Publication date
US20130200134A1 (en) 2013-08-08
JP6289808B2 (ja) 2018-03-07
CN107039294A (zh) 2017-08-11
US20150144682A1 (en) 2015-05-28
CN103295934A (zh) 2013-09-11
CN103295934B (zh) 2016-11-16
JP2013191836A (ja) 2013-09-26
US8998063B2 (en) 2015-04-07

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