CN107011831A - A kind of IMD glue of bumper supporting plate good moldability - Google Patents
A kind of IMD glue of bumper supporting plate good moldability Download PDFInfo
- Publication number
- CN107011831A CN107011831A CN201710069943.3A CN201710069943A CN107011831A CN 107011831 A CN107011831 A CN 107011831A CN 201710069943 A CN201710069943 A CN 201710069943A CN 107011831 A CN107011831 A CN 107011831A
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- CN
- China
- Prior art keywords
- parts
- imd
- glue
- trimethylbenzene
- vinyl acetate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09J127/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a kind of IMD glue of bumper supporting plate good moldability, it is formulated by the component of following parts by weight：15~25 parts of epoxy modified acrylic resin, 28~36 parts of carboxyl type vinyl chloride-vinyl acetate resin, 6~14 parts of trimethylbenzene, 2~8 parts of durene, 10~20 parts of cyclohexanone, 1~5 part of dibasic ester, silica 1~5 part, 10~15 parts of isophorone.IMD glue provided by the present invention has no adverse effects to IMD ink, and it does not contain toluene, dimethylbenzene, thiacyclohexane etc., safer to human body, environment, and it is one-pack-type evaporation drying type ink, is easy to operation.Mutual synergy of the IMD glue of the present invention by two kinds of resins in particular range, and under the cooperation of other components, realize while have the advantages that resistance to elevated temperatures, high adhesion force, high flexibility and good moldability, expand the scope of application and application potential of IMD technology.
Description
Technical field
The invention belongs to IMD technology field, and in particular to a kind of bumper supporting plate IMD glue and its preparation side
Method.
Background technology
IMD technology belongs to injection surface materials application technology, is to collect silk-screen printing, shaping and be molded the one kind being combined newly
Type decoration technique inside mold.Introduce domestic the Chinese nineties, in terms of being first application for household electric appliances control panel, in terms of electronic product
It is applied to first by Motorola in cellular phone flip, it is then fast-developing.IMD technology be one kind can synchronously complete part injection and
The decoration technique inside mold of product surface decoration, traditional injection molding technology is combined by it with post-processing technology, and collection is ornamental
With feature.Its process then carries out forming processes, then to be printed over the transparent substrate first to its surface
It is placed into injection mold and produces after shearing.Color in in-mould injection one-shot forming, reduce the following process of injection
Process, in addition IMD stereo shapings add the free degree of design, picture and text color adds the wear-resisting of product in plastic sandwich
Undermine corrosion resistance, color can keep long-term beautiful, printed patterns change at any time and need not more mold exchange.
During the special light-curable ink uses of IMD, in order to strengthen the bonding force of ink and casting resin, wire mark light is consolidated
Change after ink solidification, it is necessary to one layer of IMD glue of over print in the above.Because its rear photocuring is fully cured in light-curable ink
The surface tension of ink is smaller, and surface is closing, and IMD glue not only can protect ink layer not to be damaged before the forming
It is bad, also help that ink is compatible with casting resin, strengthen the bonding force between them.Based on injecting condition in IMD techniques with
And the protection requirement to IMD ink, IMD glue needs are while meet resistance to elevated temperatures, high adhesion force, with flexibility and shaping
The features such as property is good, and existing IMD glue or other glue are difficult while meeting above-mentioned requirements.And general glue can be to ink
Or other subsequent techniques produce harmful effect, it is difficult to directly apply.
The content of the invention
The purpose of the present invention is that there is provided a kind of IMD glue of good moldability on the basis of existing technology.
It is a further object of the present invention to provide a kind of preparation method of above-mentioned IMD glue.
The purpose of the present invention can be reached by following measures：
A kind of IMD glue of bumper supporting plate good moldability, it is formulated by the component of following parts by weight：Epoxy
Acrylic resin modified 15~25 parts, 28~36 parts of carboxyl type vinyl chloride-vinyl acetate resin, 6~14 parts of trimethylbenzene, 2~8 parts of durene, ring is
10~20 parts of ketone, 1~5 part of dibasic ester, silica 1~5 part, 10~15 parts of isophorone.
In a kind of preferred scheme, IMD glue of the invention is formulated by the component of following parts by weight：It is epoxide modified
18~22 parts of acrylic resin, 30~34 parts of carboxyl type vinyl chloride-vinyl acetate resin, 8~12 parts of trimethylbenzene, 3~7 parts of durene, cyclohexanone 13
~17 parts, 2~5 parts of dibasic ester, 2~5 parts of silica, 10~14 parts of isophorone.
In a kind of preferred scheme, IMD glue of the invention is formulated by the component of following parts by weight：It is epoxide modified
19~21 parts of acrylic resin, 31~33 parts of carboxyl type vinyl chloride-vinyl acetate resin, 9~11 parts of trimethylbenzene, 4~6 parts of durene, cyclohexanone 14
~16 parts, 2~4 parts of dibasic ester, 2~4 parts of silica, 11~13 parts of isophorone.
In a kind of more preferably scheme, IMD glue of the invention is formulated by the component of following parts by weight：Epoxy changes
Property 20 parts of acrylic resin, 32 parts of carboxyl type vinyl chloride-vinyl acetate resin, 10 parts of trimethylbenzene, 5 parts of durene, 15 parts of cyclohexanone, dibasic ester 3
Part, 3 parts of silica, 12 parts of isophorone.
The epoxy modified acrylic resin of the present invention is selected from that promise Mick E44 thermoplastic epoxies are acrylic resin modified or weathercock
FB9801 epoxy modified acrylic resins；Carboxyl type vinyl chloride-vinyl acetate resin is selected from Taiwan V-38, Japanese SHIN-ETSU HANTOTAI SOLBIN-M5 or Tao Shi
VAGH carboxyl type vinyl chloride-vinyl acetate resins.
Trimethylbenzene, durene and cyclohexanone are used in the present invention, they are not limited only to solvent, and they are in specific consumption
Proportioning is lower can be with two kinds of resin complex with mutual synergy of the abundant hair by two kinds of resins so that final glue can be simultaneous
Have resistance to elevated temperatures and high adhesion force.
The invention provides a kind of preparation method of above-mentioned IMD glue：By epoxy-modified acrylic acid tree at 50~80 DEG C
Fat, carboxyl type vinyl chloride-vinyl acetate resin, trimethylbenzene, durene and cyclohexanone mixing after stirring and dissolving, continuously added after cooling dibasic ester,
Silica and isophorone are simultaneously well mixed, and obtain IMD glue.
It is preferred that, epoxy modified acrylic resin, carboxyl type vinyl chloride-vinyl acetate resin, trimethylbenzene, durene and cyclohexanone 60~
Dissolving is mixed and stirred at 70 DEG C.Need to be thoroughly mixed uniformly after dibasic ester, silica and isophorone is added
To obtain IMD glue.
In terms of the IMD glue of the present invention can apply to the printing of bumper supporting plate material, can also further it answer
With on the appearance members such as the panel of other field, mark.
Beneficial effects of the present invention：
IMD glue provided by the present invention has no adverse effects to IMD ink, and it does not contain toluene, dimethylbenzene, thiacyclohexane etc., right
Human body, environment are safer, and it is one-pack-type evaporation drying type ink, are easy to operation.The IMD glue of the present invention passes through two kinds
Mutual synergy of the resin in particular range, and under the cooperation of other components, realize and meanwhile have resistance to elevated temperatures,
The advantages of high adhesion force, high flexibility and good moldability, expand the scope of application and application potential of IMD technology.
Embodiment
The present invention will be further described with reference to embodiments, but the scope of the present invention is not limited to following each implementations
Example.
Embodiment 1
The parts by weight formula of IMD glue is：20 parts of epoxy modified acrylic resin (E44), carboxyl type vinyl chloride-vinyl acetate resin（Taiwan V-
38）32 parts, 10 parts of trimethylbenzene, 5 parts of durene, 15 parts of cyclohexanone, 3 parts of dibasic ester, 3 parts of silica, 12 parts of isophorone.
Preparation method is：By epoxy modified acrylic resin, carboxyl type vinyl chloride-vinyl acetate resin, trimethylbenzene, four at 60~70 DEG C
Stirring and dissolving after toluene and cyclohexanone mixing, continuously adds dibasic ester, silica and isophorone and fully stirs after cooling
Mix well mixed, produce.
Embodiment 2
The parts by weight formula of IMD glue is：22 parts of epoxy modified acrylic resin (E44), carboxyl type vinyl chloride-vinyl acetate resin（Taiwan V-
38）30 parts, 9 parts of trimethylbenzene, 5 parts of durene, 16 parts of cyclohexanone, 2 parts of dibasic ester, 3 parts of silica, 13 parts of isophorone.
Preparation method be the same as Example 1.
Embodiment 3
The parts by weight formula of IMD glue is：18 parts of epoxy modified acrylic resin (FB9801), carboxyl type vinyl chloride-vinyl acetate resin（SHIN-ETSU HANTOTAI
SOLBIN-M5）34 parts, 10 parts of trimethylbenzene, 5 parts of durene, 15 parts of cyclohexanone, 3 parts of dibasic ester, 3 parts of silica, different Fo Er
12 parts of ketone.Preparation method be the same as Example 1.
Embodiment 4
The parts by weight formula of IMD glue is：24 parts of epoxy modified acrylic resin (FB9801), carboxyl type vinyl chloride-vinyl acetate resin（Tao Shi
VAGH）35 parts, 11 parts of trimethylbenzene, 5 parts of durene, 14 parts of cyclohexanone, 4 parts of dibasic ester, 3 parts of silica, isophorone 11
Part.Preparation method be the same as Example 1.
Comparative example 1
It is formulated and is：15 parts of acrylic resin, 25 parts of vinyl chloride-vinyl acetate resin, 5 parts of curing agent, 0.3 part of catalyst DBTDL-T12, gas silicon
0.7 part, 24 parts of n-butyl acetate, 30 parts of cyclohexanone.
Preparation method is：At 60~70 DEG C and under stirring by acrylic resin and vinyl chloride-vinyl acetate resin and n-butyl acetate and ring
Ketone is mixed to resin and is completely dissolved, and curing agent, the gentle silicon of catalyst DBTDL-T12 are sequentially added after cooling, is stirred.
Comparative example 2
It is formulated and is：20 parts of acrylic resin, carboxyl type vinyl chloride-vinyl acetate resin（Taiwan V-38）32 parts, 10 parts of trimethylbenzene, 5 parts of durene,
15 parts of cyclohexanone, 3 parts of dibasic ester, 3 parts of silica, 12 parts of isophorone.Its preparation method be the same as Example 1.
Comparative example 3
It is formulated and is：32 parts of epoxy modified acrylic resin (E44), carboxyl type vinyl chloride-vinyl acetate resin（Taiwan V-38）20 parts, trimethylbenzene 10
Part, 5 parts of durene, 15 parts of cyclohexanone, 3 parts of dibasic ester, 3 parts of silica, 12 parts of isophorone.The similar reality of its preparation method
Apply example 1.
Comparative example 4
It is formulated and is：Carboxyl type vinyl chloride-vinyl acetate resin（Taiwan V-38）52 parts, 10 parts of trimethylbenzene, 5 parts of durene, 15 parts of cyclohexanone, divalence
3 parts of acid esters, 3 parts of silica, 12 parts of isophorone.Its preparation method similar embodiment 1.
Embodiment 5：IMD glue performances are tested
Resistant to elevated temperatures IMD ink is printed on after IMD film surfaces to be put into 80 DEG C of baking box roasting 30 minutes, is stamped after cooling
The IMD glue of each embodiment and comparative example, has printed that to place into 90 DEG C of baking box after IMD glue roasting 60 minutes, produced after cooling by
IMD films for injection molding.The IMD films for being used for injection molding are tested
Heat resistance for the IMD films of injection molding refers to standard GB/T/T1735《Paint film Heat-tolerance Determination》, this reality
Test using resistance to 280 DEG C, the time that the phenomenons such as elephant skin, bubbling, cracking or discoloration do not occur for the glue layer of film surface represents glue
The heat resistance of layer.
Film adhesive is tested using ten stroke lattice tape pull methods, and test result is expressed as 0-5 grades, wherein 0 grade is best,
5 grades worst.
The peel strength of film is peeled off by force using testing its 180 ° after the IMD films for injection molding are molded
Degree, test result is expressed as 0-5 grades, wherein 0 grade best, 5 grades worst.
The weatherability of film use 15 W ultraviolet lamps before 250 mm place irradiation 200 h, printing surface without loss of gloss, discoloration, divide
Layer phenomenon, its middle grade 0 is good, and grade 1 is to have loss of gloss, discoloration or lamination.
The pliability of film is measured using hinge type bending tester, is bent with model on the mandrel rod of different-diameter
The diameter of minimum mandrel rod without causing film surface destruction represents the pliability of film.Test result is divided into 5 grades, its
Middle grade 1 is that pliability is best, and class 5 is that pliability is worst.
The ink film that each example is obtained by more than carries out performance test, as a result such as following table.
Claims (8)
1. a kind of IMD glue of bumper supporting plate good moldability, it is characterised in that it is matched somebody with somebody by the component of following parts by weight
System is formed：15~25 parts of epoxy modified acrylic resin, 28~36 parts of carboxyl type vinyl chloride-vinyl acetate resin, 6~14 parts of trimethylbenzene, durene
2~8 parts, 10~20 parts of cyclohexanone, 1~5 part of dibasic ester, silica 1~5 part, 10~15 parts of isophorone.
2. IMD glue according to claim 1, it is characterised in that it is formulated by the component of following parts by weight：Epoxy
Acrylic resin modified 18~22 parts, 30~34 parts of carboxyl type vinyl chloride-vinyl acetate resin, 8~12 parts of trimethylbenzene, 3~7 parts of durene, ring is
13~17 parts of ketone, 2~5 parts of dibasic ester, 2~5 parts of silica, 10~14 parts of isophorone.
3. IMD glue according to claim 2, it is characterised in that it is formulated by the component of following parts by weight：Epoxy
Acrylic resin modified 19~21 parts, 31~33 parts of carboxyl type vinyl chloride-vinyl acetate resin, 9~11 parts of trimethylbenzene, 4~6 parts of durene, ring is
14~16 parts of ketone, 2~4 parts of dibasic ester, 2~4 parts of silica, 11~13 parts of isophorone.
4. IMD glue according to claim 3, it is characterised in that it is formulated by the component of following parts by weight：Epoxy
Acrylic resin modified 20 parts, 32 parts of carboxyl type vinyl chloride-vinyl acetate resin, 10 parts of trimethylbenzene, 5 parts of durene, 15 parts of cyclohexanone, divalent acid
3 parts of ester, 3 parts of silica, 12 parts of isophorone.
5. the IMD glue according to any one in Claims 1 to 4, it is characterised in that the epoxy-modified acrylic acid tree
Fat is selected from that promise Mick E44 thermoplastic epoxies are acrylic resin modified or weathercock FB9801 epoxy modified acrylic resins；The carboxylic
Fundamental mode vinyl chloride-vinyl acetate resin is selected from Taiwan V-38, Japanese SHIN-ETSU HANTOTAI SOLBIN-M5 or Tao Shi VAGH carboxyl type vinyl chloride-vinyl acetate resins.
6. the preparation method of the IMD glue described in a kind of claim 1, it is characterised in that will be epoxide modified at 50~80 DEG C
Stirring and dissolving after acrylic resin, carboxyl type vinyl chloride-vinyl acetate resin, trimethylbenzene, durene and cyclohexanone mixing, is continuously added after cooling
Dibasic ester, silica and isophorone are simultaneously well mixed, and obtain IMD glue.
7. preparation method according to claim 6, it is characterised in that the epoxy modified acrylic resin, carboxyl type chlorine vinegar
Resin, trimethylbenzene, durene and cyclohexanone are mixed and stirred for dissolving at 60~70 DEG C.
8. preparation method according to claim 6, it is characterised in that add after dibasic ester, silica and isophorone
It is thoroughly mixed uniform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710069943.3A CN107011831A (en) | 2017-02-08 | 2017-02-08 | A kind of IMD glue of bumper supporting plate good moldability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710069943.3A CN107011831A (en) | 2017-02-08 | 2017-02-08 | A kind of IMD glue of bumper supporting plate good moldability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107011831A true CN107011831A (en) | 2017-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710069943.3A Pending CN107011831A (en) | 2017-02-08 | 2017-02-08 | A kind of IMD glue of bumper supporting plate good moldability |
Country Status (1)
| Country | Link |
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| CN (1) | CN107011831A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103232755A (en) * | 2013-04-26 | 2013-08-07 | 深圳市美丽华油墨涂料有限公司 | IMD (In-Mold Decoration) calendaring silk-screen printing ink |
| CN103980814A (en) * | 2014-05-21 | 2014-08-13 | 三棵树涂料股份有限公司 | Polyurethane matt wearable top-coat paint for removing odor and preparation method thereof |
| CN105176224A (en) * | 2015-07-24 | 2015-12-23 | 中山市伯伦克专用化学产品有限公司 | Acid and alkali-resistant peelable blue glue |
-
2017
- 2017-02-08 CN CN201710069943.3A patent/CN107011831A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103232755A (en) * | 2013-04-26 | 2013-08-07 | 深圳市美丽华油墨涂料有限公司 | IMD (In-Mold Decoration) calendaring silk-screen printing ink |
| CN103980814A (en) * | 2014-05-21 | 2014-08-13 | 三棵树涂料股份有限公司 | Polyurethane matt wearable top-coat paint for removing odor and preparation method thereof |
| CN105176224A (en) * | 2015-07-24 | 2015-12-23 | 中山市伯伦克专用化学产品有限公司 | Acid and alkali-resistant peelable blue glue |
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Application publication date: 20170804 |
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