CN107001154B - cBN烧结体以及切削工具 - Google Patents

cBN烧结体以及切削工具 Download PDF

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CN107001154B
CN107001154B CN201580063831.6A CN201580063831A CN107001154B CN 107001154 B CN107001154 B CN 107001154B CN 201580063831 A CN201580063831 A CN 201580063831A CN 107001154 B CN107001154 B CN 107001154B
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松泽正人
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Abstract

本发明提供耐磨损性高的cBN烧结体以及使用该cBN烧结体的耐磨损性高的切削工具。一种cBN烧结体(1)以及具备由cBN烧结体(1)构成的cBN刀片(25)或整体由cBN烧结体(1)构成的切削镶刀(20)等切削工具,cBN烧结体(1)包括50体积%以上的cBN粒子(2)、以及含有Co的结合相(4),在结合相(4)中,存在含有CoaWb(0≤a≤0.95、0.05≤b≤1)的结合相内粒子(8),cBN烧结体(1)以及切削镶刀(20)等切削工具的耐磨损性提高。

Description

cBN烧结体以及切削工具
技术领域
本发明涉及cBN烧结体以及切削工具。
背景技术
cBN烧结体(立方晶氮化硼质烧结体的简称)具有优异的耐磨损性,因此例如作为切削工具而使用,特别是在铸铁、作为难切削材料的烧结合金的加工中被广泛使用。例如,在专利文献1中,公开了含有80重量%以上的cBN,并且作为结合相,包括含有比率超过50重量%的Al、铁族元素、W等高熔点元素的cBN烧结体。在专利文献1中,公开了在含有W的情况下作为硼化物而存在的内容。另外,在专利文献2中,公开了含有40~85体积%的cBN,并且作为结合相含有W、Co的cBN烧结体,在实施例中,公开了作为结合相而含有Co3W3C、CoWB、WC作为混晶的cBN烧结体。
在先技术文献
专利文献
专利文献1:日本特表2013-538937号公报
专利文献2:日本专利第5614460号公报
发明内容
用于解决课题的手段
本实施方式的cBN烧结体包括50体积%以上的cBN粒子、以及含有Co的结合相,在所述结合相中,存在含有CoaWb的结合相内粒子,其中,0≤a≤0.95、0.05≤b≤1。
另外,本实施方式的切削工具将所述cBN烧结体作为切削刃部。
附图说明
图1是关于本实施方式的cBN烧结体的组织的一例的示意图。
图2是关于具备由本实施方式的cBN烧结体构成的cBN刀片的切削工具的一例的概要立体图。
具体实施方式
cBN烧结体1包括50体积%以上的cBN粒子2,并且包括含有Co的结合相(以下,称作Co结合相)4、以及化合物粒子5。在本实施方式中,cBN烧结体1中的cBN粒子2的保持力高,因此cBN烧结体1的耐磨损性高。Co结合相4以及化合物粒子5具有抑制cBN粒子2的脱落的效果。需要说明的是,对于本实施方式的cBN粒子2、Co结合相4以及化合物粒子5的体积比率而言,测定cBN烧结体1的剖面照片中的cBN粒子2、Co结合相4以及化合物粒子5的面积比率,将该二维的面积比率视为与三维的体积比率相同,由此设定各相的体积比率。cBN粒子2的优选含有比率为80~97体积%,特别优选为90~96体积%。Co结合相4的优选范围为3~14体积%,化合物粒子5的优选范围为0.5~20体积%。
在本实施形方式中,基于提高cBN烧结体1的耐磨损性以及强度的观点,cBN粒子2的平均粒径处于0.5~5μm的范围,特别优选处于1~3μm的范围。若处于该范围,则能够提高cBN烧结体1的硬度并且抑制cBN粒子2的脱落。需要说明的是,对于本实施方式中的cBN粒子2的粒径的测定,以CIS-019D-2005所规定的超硬合金的平均粒径的测定方法为基准而进行测定。另外,在本实施形方式中,cBN烧结体1的剖面中的30μm平方的视野内所观察到的Co结合相4的最大粒径为0.1~0.5μm。若处于该范围,则不存在Co结合相4凝聚的区域,从而抑制因凝聚区域成为破坏源而使cBN烧结体1的强度降低的情况,由此cBN烧结体1的强度提高。本实施方式中的Co结合相4的最大粒径是,在cBN烧结体1的剖面中的30μm平方的扫描型电子显微镜(SEM)观察或者透射型电子显微镜(TEM)观察中,Co结合相4的与长度方向垂直的方向上的长度的最大值。
在本实施方式中,在Co结合相4中,存在有含有CoaWb(0≤a≤0.95、0.05≤b≤1)的结合相内粒子8。Co结合相4能够以沿着cBN粒子2的外周紧贴这样的复杂的形状存在,因此能够牢固地粘合于cBN粒子2的外周。其结果是,能够提高cBN粒子2的结合力。而且,结合相内粒子8的导热率高且即使在高温下也不易变形,因此Co结合相4的耐热性以及耐塑性变形性提高。因此,cBN烧结体1的高温下的耐磨损性也提高。其结果是,对于具备由本实施方式的cBN烧结体1构成的cBN刀片、或者整体由cBN烧结体1构成的切削工具而言,即使在切削部分成为高温的高速切削、难切削材料的切削中,耐磨损性也高,并且能够延长工具寿命。
需要说明的是,结合相内粒子8的a、b值能够通过晶格常数来确定,晶格常数能够通过TEM观察的限制视野中的EDS分析以及电子衍射像来测定。
结合相内粒子8在Co结合相4中以30~90体积%的比率存在。由此,能够提高cBN烧结体1的常温以及高温下的耐磨损性。在Co结合相4中,除结合相内粒子8以外,还存在有金属Co13作为基体。在金属Co13中,也可以含有W含有质量比率比结合相内粒子8中的W含有质量比率低10%以上的W。
作为结合相内粒子8,在包含有CoaWb(0.80≤a≤0.95、0.05≤b≤0.20)构成的合金(以下,称作合金粒子)9的情况下,能够提高Co结合相4的高温下的散热性,并且能够抑制塑性变形性,从而进一步提高Co结合相4的耐热性。
作为结合相内粒子8,在包含由CoaWb(0≤a≤0.8、0.2≤b≤1)C构成的碳化物(以下,称作碳化物粒子)11的情况下,能够抑制Co结合相4的高温下的塑性变形性,从而进一步提高Co结合相4的耐热性。对于碳化物粒子11,例如可以列举WC、W3Co3C、W4Co2C、W2Co2C、W6Co6C、W6Co3C2、Co3W10C4、W2Co4C。由此,能够提高Co结合相4的硬度以及导热性。其结果是,cBN烧结体1的高温下的耐磨损性提高。
在结合相内粒子8由合金粒子9构成、且合金粒子9在Co结合相4中以30~90体积%的比率存在的情况下,cBN烧结体1的耐热性以及耐塑性变形性提高。另外,在结合相内粒子8由碳化物粒子11构成、且碳化物粒子11在Co结合相4中以10~60体积%的比率存在的情况下,cBN烧结体1的耐热性以及耐塑性变形性提高。
需要说明的是,对于Co结合相4中的结合相内粒子8的比率,在TEM观察中,计算结合相内粒子8在Co结合相4中占据的面积比率,将该二维的面积比率视为与三维的体积比率相同,从而设为结合相内粒子8的体积比率。
结合相内粒子8也可以作为合金粒子9与碳化物粒子11的混合物而存在。在该情况下,结合相内粒子8优选在Co结合相4中以72~85体积%的比率存在。此时,在合金粒子9的体积比率S1与碳化物粒子11的体积比率S2之比(S2/S1)为0.1~1.2的情况下,能够抑制Co结合相4的变形,从而能够提高cBN烧结体1的耐塑性变形性。
另外,对于结合相内粒子8是合金粒子9还是碳化物粒子11,能够通过TEM观察的限制视野下的电子衍射像来确定。
结合相内粒子8的平均粒径为30~300nm。由此,抑制Co结合相4的cBN粒子2的脱落的效果提高,能够提高cBN烧结体1的耐磨损性。对于结合相内粒子8的平均粒径,计算通过显微镜观察到的结合相内粒子8的面积,把将面积换算为圆时的直径作为粒径。然后,求出通过显微镜观察到的、接近的至少五个以上的结合相内粒子8的粒径,将它们的平均值作为平均粒径。
化合物粒子5包括含有Al的Al化合物粒子6。作为Al化合物粒子6,可以列举AlN、AlB2、AlB12、Al2O3、Al3B6Co20。Al化合物粒子在提高cBN烧结体1的散热性方面优选。Al化合物粒子6的平均粒径为50~250nm。由此,能够抑制cBN粒子2的脱落,并且能够提高cBN烧结体1的耐热性。由于存在有Al化合物粒子6,从而cBN烧结体1的烧结性提高。Al化合物粒子6的一部分也可以存在于Co结合相4内。
此时,在作为Al化合物粒子6而含有Al3B6Co20的情况下,Co结合相4的紧贴性提高从而能够抑制cBN粒子2脱落,由此cBN烧结体1的耐磨损性提高。另外,cBN烧结体1的线放电加工变得容易。
Al3B6Co20的组成复杂,因此容易通过cBN烧结体1的X线衍射测定进行确认。在此,对于Al3B6Co20而言,在2θ=38.5°、42.2°、45.0°、49.2°、51.3°等情况下,存在有Al3B6Co20峰值,2θ=38.5°的情况下峰值与金属Al的峰值同时出现,2θ=49.2°、51.3°的情况下的峰值与BCo的峰值同时出现。因此,对于是否存在Al3B6Co20,通过有无不与其他晶相的峰值同时出现的2θ=42.2°以及45.0°的任一方的峰值的存在来进行判断。需要说明的是,对于各峰值而言,因固溶状态的略微不同、残留应力等而导致衍射角(2θ)的值有时存在偏差,但只要在能够维持Al3B6Co20的结晶晶格并检测到各衍射角的峰值的情况下,则判断为存在Al3B6Co20峰值。
优选Al3B6Co20的最大峰值强度相对于cBN(111)的峰值强度为0.02~0.25。在此,Al3B6Co20的最大峰值强度是指,2θ=42.2°以及45.0°中的峰值强度高的一方。若处于该范围,则能够抑制cBN粒子2的脱落。Al3B6Co20的最大峰值强度相对于cBN(111)的峰值强度的优选范围为0.1~0.25。
化合物粒子5包含含有W的W化合物粒子7。作为W化合物粒子7,可以列举WC、WB、W2B、Co2WB、W2Co21B6、Co3W3C,具有抑制cBN粒子2的脱落的效果。W化合物粒子7的平均粒径为100~1000nm。由此,能够提高cBN烧结体1的韧性。
在此,WC能够选择作为碳化物粒子11以及W化合物粒子7的任一种。如图1所示,在作为碳化物粒子11而存在的情况下,散布在Co结合相4内,在作为W化合物粒子7而存在的情况下,独立于Co结合相4而存在。
使用图2对具备由上述的cBN烧结体构成的cBN刀片25的切削工具的一例进行说明。对于图2的切削镶刀(以下,简称作镶刀)20,由cBN烧结体1构成的cBN刀片25经由由含有WC和Co的超硬合金构成的背衬层21钎焊于工具主体26的前端。cBN刀片25在图示面中的上表面具有前刀面22,在图示面的侧面具有后刀面23,在前刀面22以及后刀面23的交叉棱线的至少一部分具有切削刃24。工具主体26由超硬合金或者高速钢、合金钢等金属构成。需要说明的是,背衬层21也可以省略。另外,在图2的镶刀20中,仅刀片25由cBN烧结体1构成,但不限于该实施方式,也可以镶刀20整体由cBN烧结体1构成。在任一情况下,cBN烧结体1构成镶刀20的切削刃部。
接下来,对于上述cBN烧结体的制造方法进行说明。
例如,以如下比率进行调配,将平均粒径为1.0~4.5μm的cBN原料粉末设为75~88质量%,将平均粒径为1.0~2.5μm的金属Co原料粉末设为10~24.9质量%,将平均粒径为0.5~1.8μm的金属Al原料粉末设为0.1~5质量%,将平均粒径为0.3~1.5μm的WC原料粉末设为0~20质量%。
利用球磨机将上述调配粉末粉碎混合15~72小时。之后,根据需要成形为规定形状。对于成形,能够使用冲压成形、注射成形、浇铸成形、挤出成形等公知的成形手段。
接下来,将成形后的构件与另外准备的超硬合金制的背衬支承体一起装入超高压加热装置,实施超高压加热处理。根据本实施方式,通过第一加压工序和第二加压工序这两个工序进行加压,在第一加压工序中,以1100~1300℃的范围内的规定的温度,在5~7GPa的压力下保持1~10分钟,在第二加压工序中,以1450~1600℃的范围内的规定的温度,在4~6GPa且比第一加压工序低的压力下保持10~60分钟。由此,能够得到如下cBN烧结体,即,含有50体积%以上的cBN粒子与Co结合相,且在Co结合相中存在含有CoaWb(0≤a≤0.95、0.05≤b≤1)的结合相内粒子。
在此,若不存在第一加压工序,则Co结合相消失,Co作为化合物而存在。若第一加压工序中的保持时间比10分钟长,则W在Co结合相中均匀地扩散,无法在Co结合相中存在有结合相内粒子。另外,若原料粉末的平均粒径以及调配比率处于上述范围内,则能够稳定地制造上述的cBN烧结体。
由制成的cBN烧结体利用线放电加工切割为规定尺寸,将该切出的部位钎焊于形成在超硬合金制的工具主体的前端部的切入台阶部。之后,对上表面以及侧面进行磨削加工。并且,通过根据期望,对作为成为前刀面的上表面以及成为后刀面的侧面的交叉棱线的至少一部的切削刃的刃尖实施珩磨加工,能够制成本实施方式的切削工具。
实施例
使用表1所示的平均粒径的cBN粉末、金属Co粉末、金属Al粉末、WC粉末以表1的组成进行调配,将该粉体在利用氧化铝制滚珠的球磨机中混合15小时。接下来,将混合后的粉体在压力98MPa下加压成形。将该成形体与背衬支承体重叠,放置在超高压加热装置内,以表1所示的条件实施超高压加压加热处理,从而得到cBN烧结体。
接下来,由制成的cBN烧结体以及背衬层的一体物利用线放电加工切出规定的形状。然后,在形成于超硬合金制的工具主体的前端部的切入台阶部,以与背衬层接触的方式钎焊切出的部位,对上表面以及侧面进行磨削加工。然后,对作为上表面以及侧面的交叉棱线的至少一部分的切削刃的刃尖,利用金刚石砂轮实施刃尖处理(倒棱珩磨以及圆角珩磨),从而制成具备JIS·CNGA120408形状的由cBN烧结体构成的刀片的镶刀。
对于得到的镶刀,针对由cBN烧结体构成的刀片的任意剖面,通过基于SEM以及TEM的组织观察,确认cBN粒子、Co结合相、结合相内粒子(合金粒子、碳化物粒子)、化合物粒子(Al化合物粒子、W化合物粒子)的有无,并且计算它们的含有比率。CoaWb中的a、b值通过TEM观察的限制视野中的电子衍射像来确定。另外,以CIS-019D-2005中规定的超硬合金的平均粒径的测定方法为基准来测定各粒子的平均粒径。在表2~3中示出结果。
并且,从成为cBN刀片的前刀面的上表面以及成为后刀面的侧面,使用BrukerAXS社制D8DISCOVER with GADDS Super Speed,辐射源:CuKα,准直仪直径:
Figure BDA0001303314890000071
而进行X线衍射测定,确定cBN烧结体中的晶相,并且在表3中示出将cBN(111)的峰值强度设为1时的各晶相所归属的峰值中的最大峰值强度之比。
接下来,利用得到的镶刀在以下的切削条件下进行了切削试验。在表3中示出结果。
切削方法:外径车削加工
被切削件:FC250套筒件
切削速度:700m/分
进给:0.2mm/rev
切深:0.2mm
切削状态:湿式(有切削油)
评价方法:评价达到磨损或者缺损的切削长度。
[表1]
Figure BDA0001303314890000081
[表2]
Figure BDA0001303314890000091
*S2/S1:合金粒子的存在比率S1与碳化物粒子的存在比率S2之比
[表3]
Figure BDA0001303314890000101
根据表1~3所示的结果,在cBN粒子的含有量少于50体积%的料No.15、不含有结合相内粒子的试料No.13、14、结合相内粒子的a值大于0.95的试料No.12中,耐磨损性降低,切削长度短。
相对于此,在含有50体积%以上的cBN粒子并且含有存在CoaWb合金的Co结合相的试料No.1~11中,切削长度均长。其中,在结合相内粒子的平均粒径为30~300nm的试料No.1~9中,切削长度更长,在结合相内粒子以30~90体积%的比率存在于结合相中的试料No.1~7中,切削长度进一步变长。
另外,在结合相内粒子中的CoaWb合金中,0.80≤a≤0.95、0.05≤b≤0.2的试料No.1~8中,切削长度长,在Co结合相中,在CoaWb合金以20~90体积%的比率存在于Co结合相中的试料No.1~6中,切削长度更长。并且,在结合相内粒子中的CoaWbC为0≤a≤0.8、0.2≤b≤1的试料No.1~7中,切削长度长。并且,在合金粒子的存在比率S1与碳化物粒子的存在比率S2之比(S2/S1)为0.1~1.2的试料No.1~6中,切削长度长。
另外,在cBN粒子的平均粒径为1.5~2.5μm的试料No.1~9中,切削长度长,其中,在剖面中的30μm平方的视野内所观察到的结合相的最大粒径为0.1~0.5μm的试料No.1~6中,切削长度更长。
并且,在存在平均粒径为100~1000nm的W化合物粒子的试料No.1~7中切削长度更长,在存在Al化合物粒子的试料No.1~6中切削长度更长,特别是,在含有Al3B6Co20的试料No.1~5中切削长度更长,其中,Al3B6Co20的最大峰值强度与cBN(111)的峰值强度之比为0.02~0.25的试料No.1~4中切削长度更长。
附图标记说明
1 cBN烧结体
2 cBN粒子
4 Co结合相
5 化合物粒子
6 Al化合物粒子
7 W化合物粒子
8 结合相内粒子
9 合金粒子
11 碳化物粒子
13 金属Co

Claims (14)

1.一种cBN烧结体,其中,
所述cBN烧结体包括多个cBN粒子、以及含有Co的结合相,
所述多个cBN粒子占所述cBN烧结体的50体积%以上,
所述结合相位于所述多个cBN粒子之间,
在所述结合相中,包含由CoaWb构成的合金,其中,0.80≤a≤0.95、0.05≤b≤0.20。
2.根据权利要求1所述的cBN烧结体,其中,
所述合金以20~90体积%的比率存在于所述结合相中。
3.根据权利要求1所述的cBN烧结体,其中,
所述结合相包含由CoaWbC构成的碳化物,其中,0<a≤0.8、0.2≤b<1。
4.根据权利要求3所述的cBN烧结体,其中,
所述碳化物以10~60体积%的比率存在于所述结合相中。
5.根据权利要求3或4所述的cBN烧结体,其中,
在所述结合相中,所述合金的体积比率S1与所述碳化物的体积比率S2之比即S2/S1为0.1~1.2。
6.根据权利要求1或2所述的cBN烧结体,其中,
所述cBN粒子的平均粒径为1.5~2.5μm。
7.根据权利要求6所述的cBN烧结体,其中,
所述cBN烧结体的剖面中的30μm平方的视野内所观察到的所述结合相的最大粒径为0.1~0.5μm。
8.根据权利要求1所述的cBN烧结体,其中,
在所述结合相之外,还存在有Al化合物粒子。
9.根据权利要求8所述的cBN烧结体,其中,
所述Al化合物粒子的平均粒径为50~250nm。
10.根据权利要求8或9所述的cBN烧结体,其中,
作为所述Al化合物粒子,含有Al3B6Co20
11.根据权利要求10所述的cBN烧结体,其中,
在X线衍射测定中,所述Al3B6Co20的最大峰值强度与cBN(111)的峰值强度之比为0.02~0.25。
12.根据权利要求1或2所述的cBN烧结体,其中,
在所述结合相之外,还存在有W化合物粒子。
13.根据权利要求12所述的cBN烧结体,其中,
所述W化合物粒子的平均粒径为100~1000nm。
14.一种切削工具,其将权利要求1至13中任一项所述的cBN烧结体作为切削刃部。
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