CN106993384A - A kind of microwave communication multi-layer PCB containing step trough compression method - Google Patents
A kind of microwave communication multi-layer PCB containing step trough compression method Download PDFInfo
- Publication number
- CN106993384A CN106993384A CN201710324258.0A CN201710324258A CN106993384A CN 106993384 A CN106993384 A CN 106993384A CN 201710324258 A CN201710324258 A CN 201710324258A CN 106993384 A CN106993384 A CN 106993384A
- Authority
- CN
- China
- Prior art keywords
- pressing
- step trough
- core material
- compression method
- microwave communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention provides a kind of microwave communication multi-layer PCB containing step trough compression method, including：Core material is provided, and drilled on core material, positioning hole is formed；Correspondence mills out step trough position on core material, and inner line figure is formed after then carrying out inner figure making, and etching；Pressing parameter is set, pressing typesetting, pressing PP windowings, bonding sheet, inspection gummosis is carried out.Microwave communication multi-layer PCB containing the step trough compression method that the present invention is provided, by suitably pressing parameter, optimization pressing row's plate designs and is modified processing to internal layer core plate surface, improve the activity of core plate surface, it is achieved thereby that ladder position filler fully and ladder position overflow adhesive purpose, efficiently solve ladder position difference in thickness the problem of.
Description
Technical field
The invention belongs to Manufacturing Technology for PCB field, and in particular to be a kind of microwave communication multilayer containing step trough
PCB compression methods.
Background technology
Wiring board is assembled and assembling needs locally to produce step trough in pcb board often, to meet modular assembly volume
Diminution and wiring density raising, and meet the realization of specific function.For example, in the electricity provided with microwave radio emitter
In the plate of road, often need suitable size step trough to lose and decay caused by stop signal disresonance.
Press and make for multi-layer PCB containing step trough at present, be primarily present following problem：First, PP has high fluidity, pressure
Glue overflow amount is unstable during conjunction, portioned product because gummosis deficiency cause ladder position two layers between exist cavity, influence two layers of core
Adhesion between plate, portioned product is excessive because of gummosis, there is excessive glue on the copper face for causing step trough position, influences follow-up ladder position electricity
Silver and plug-in unit connection；2nd, because tabula rasa thickness has error, ladder position and normal portions unbalance stress are caused；And tabula rasa without
Method is recycled, and there is tabula rasa waste, and the problem of production material cost is high, especially each ladder position is required for clogging tabula rasa,
Ladder position is more, and the tabula rasa that need to be clogged is more, and bonding operation efficiency is extremely inefficient.
In summary, filler is it is impossible to meet requiring in current multi-layer PCB bonding processes, and step trough position excessive glue is exceeded, shadow
Ring follow-up ladder position electricity silver and connection；Interlayer filler deficiency spacing is excessive, and ladder position has the risk of layering.
The content of the invention
Therefore, it is an object of the invention to provide a kind of microwave communication multi-layer PCB containing step trough compression method.
The purpose of the present invention is achieved through the following technical solutions.
A kind of microwave communication multi-layer PCB containing step trough compression method, including：
Sawing sheet, drilling, milling plate, inner figure, etching, pressing, drilling.
Further, sawing sheet and drilling：Core material is provided, and drilled on core material, positioning hole is formed；In described
Layer core material uses Arlon AD255IM.
Further, correspondence mills out step trough position on core material, then carries out shape after inner figure making, and etching
Into inner line figure.
Further, press：Pressing parameter is set, pressing typesetting, pressing PP windowings, bonding sheet, inspection gummosis is carried out.
Further, pressing parameter is set, slope, pressure, temperature parameter during adjustment pressing.
Further, typesetting is pressed：Mould release membrance, silica gel are stacked successively from the top down in the lower surface of the first core material
Pad, steel plate, brown paper；Stacked successively from the top down on the upper surface of the second core material brown paper, steel plate, silicagel pad, from
Type film；Prepreg, the semi-solid preparation are stacked between the lower surface of the upper surface of the first core material and the second core material
Windowing is provided with piece, and the reserved certain distance in windowing range step groove position is used as windowing spacing.
Further, the prepreg is the windowing between CuClad 6700, and the prepreg and step trough position
Spacing is 2.0mm.
Further, before pressing typesetting, place is modified to the surface of the first core material and the second core material
Reason, and pressed after modification in 6 hours.
Microwave communication multi-layer PCB containing the step trough compression method that the present invention is provided, by suitably pressing parameter, optimization pressure
The row's of conjunction plate designs and internal layer core plate surface is modified processing, improves the activity of core plate surface, it is achieved thereby that ladder position
Filler fully and ladder position overflow adhesive purpose, efficiently solve ladder position difference in thickness the problem of.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
The invention provides a kind of microwave communication multi-layer PCB containing step trough compression method, to solve existing step trough multilayer
The problem of excessive glue and high production material cost in the presence of PCB bonding processes.
Wherein this method is specifically included：Sawing sheet, drilling, milling plate, inner figure, etching, pressing, drilling.
Sawing sheet：Using glass fiber reinforced polytetrafluoroethylene（Arlon AD255IM）The sheet material of material carries out sawing sheet, cuts
Into the core material of required size.
Drilling：Drilled on described core material, form positioning hole.
Milling plate：Correspondence mills out step trough position on core material, and the step trough position is according to graph position set in advance
Depending on.
Inner figure：Inner figure making is carried out to the core material for having formed step trough position, development is exposed, will
Line pattern correspondence is transferred on core plate surface.
Etching：The core material for having completed inner line figure is etched, unnecessary copper foil is etched away, in internal layer
The surface of core plate forms inner line figure.
Pressing：Press as committed step, it includes setting pressing parameter, carry out pressing typesetting, pressing PP windowings, bond
Piece, inspection gummosis.
It is provided with pressing parameter, slope, pressure, temperature parameter when mainly adjustment is pressed, referring specifically to following table.
In upper table, list in detailed pressing parameter setting, step 1-11, wherein parameter keeps column unit to be minute, slope
Represent to rise the time that temperature or boosting power need to the step data, pressure PSI table shows per square inch by how many pounds
Pressure, holding is the time that the step parameter is kept.
PCB pressing machines temperature is controlled by 0-180 DEG C, the min of used time 10, pressure is by 0-150PSI, used time 10min；Temperature by
180-200 DEG C, the min of used time 15；Pressure is by 150-180PSI, used time 15min；Then keeping temperature is increased to 225 DEG C, pressure
Adjust to 200PSI, press 30min；Adjustment temperature is to 225 DEG C afterwards, and temperature is adjusted to 200 DEG C, presses 12min；Finally cool
To 110 DEG C, pressure keeps 250PSI, controls pressing time 40min, completes pressing.
Press typesetting：Illustrate for the pressing of two pieces of core materials, first the first core material lower surface from the top down
Mould release membrance, silicagel pad, steel plate, brown paper are stacked successively；
Then brown paper, steel plate, silicagel pad, mould release membrance are stacked successively from the top down on the upper surface of the second core material；
The selection of wherein silicagel pad is used, and can solve the problem that ladder position differs larger with normal portions thickness of slab in sheeting process, leads
The problem of causing discontinuity in bonding processes.
Afterwards prepreg is stacked between the lower surface of the upper surface of the first core material and the second core material.
Windowing, and the reserved certain distance conduct in windowing range step groove position are provided with wherein described prepreg
Open a window spacing.
Prepreg in the present embodiment is the windowing between CuClad 6700, and the prepreg and step trough position
Spacing is 2.0mm.
It should be noted that the adhesive films of prepreg CuClad 6700 are that a kind of chlorotrifluoroethylene (CTFE) thermoplastic is common
Polymers, it is usually used in the bonding of PTFE (polytetrafluoroethylene (PTFE)) base material in microstrip line and other multilayer circuits.
And opened a window spacing using suitable PP for the selection for the spacing that opens a window, in bonding processes, between the optimal windowing in ladder position
Away from for 2.0mm, by rationally designing the problem of windowing spacing can effectively control ladder trough rim excessive glue.
Due to the particularity of core plate and prepreg, the adhesion directly pressed between the two is poor, before pressing, it is necessary to
Processing is modified to the surface of core material, the activity of core plate surface is improved, to strengthen the knot between core plate and prepreg
With joint efforts.
And because modified core plate can activity can progressively be deteriorated with the increase of standing time, therefore in order to ensure core
The adhesion of plate and prepreg within 6 hours after core plate modification, it is necessary to be pressed.
In summary, the present invention to pressing row's plate design by pressing parameter setting, optimizing and to internal layer core
Plate surface is modified the modes such as processing, the Optimal improvements to whole process for pressing is realized, so as to improve the pressing of product
Processing procedure, makes stepped plate both meet ladder position filler and sufficiently requires, the requirement of ladder position overflow adhesive, Er Qieshun are met again
Profit is solved the problem of in terms of adhesion and ladder position difference in thickness, while so that plate face uniform force is obtained in bonding processes
To be lifted, product quality is greatly improved, production cost is reduced.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (8)
1. a kind of microwave communication multi-layer PCB containing step trough compression method, it is characterised in that including：
Sawing sheet, drilling, milling plate, inner figure, etching, pressing, drilling.
2. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 1, it is characterised in that sawing sheet and drilling：
Core material is provided, and drilled on core material, positioning hole is formed；The core material material uses Arlon
AD255IM。
3. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 2, it is characterised in that in core material
Upper correspondence mills out step trough position, and inner line figure is formed after then carrying out inner figure making, and etching.
4. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 3, it is characterised in that pressing：Pressure is set
Parameter is closed, pressing typesetting, pressing PP windowings, bonding sheet, inspection gummosis is carried out.
5. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 4, it is characterised in that pressing ginseng is set
Number, slope, pressure, temperature parameter during adjustment pressing.
6. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 4, it is characterised in that pressing typesetting：
The lower surface of first core material stacks mould release membrance, silicagel pad, steel plate, brown paper successively from the top down；In the second core material
Upper surface on stack brown paper, steel plate, silicagel pad, mould release membrance successively from the top down；The upper surface of the first core material with
Stacked between the lower surface of second core material and windowing is provided with prepreg, the prepreg, and the windowing distance
The reserved certain distance in step trough position is used as windowing spacing.
7. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 6, it is characterised in that the semi-solid preparation
Piece is that the windowing spacing between CuClad 6700, and the prepreg and step trough position is 2.0mm.
8. microwave communication multi-layer PCB containing step trough compression method as claimed in claim 6, it is characterised in that in pressing typesetting
Before, processing is modified to the surface of the first core material and the second core material, and entered after modification in 6 hours
Row pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710324258.0A CN106993384A (en) | 2017-05-10 | 2017-05-10 | A kind of microwave communication multi-layer PCB containing step trough compression method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710324258.0A CN106993384A (en) | 2017-05-10 | 2017-05-10 | A kind of microwave communication multi-layer PCB containing step trough compression method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106993384A true CN106993384A (en) | 2017-07-28 |
Family
ID=59417641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710324258.0A Pending CN106993384A (en) | 2017-05-10 | 2017-05-10 | A kind of microwave communication multi-layer PCB containing step trough compression method |
Country Status (1)
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| CN (1) | CN106993384A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554063A (en) * | 2019-10-21 | 2019-12-10 | 长江存储科技有限责任公司 | TEM sample and method for preparing TEM sample |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
-
2017
- 2017-05-10 CN CN201710324258.0A patent/CN106993384A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554063A (en) * | 2019-10-21 | 2019-12-10 | 长江存储科技有限责任公司 | TEM sample and method for preparing TEM sample |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170728 |
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| RJ01 | Rejection of invention patent application after publication |