CN106990270A - Miniature soldered fitting electro-migration testing structure and preparation method - Google Patents
Miniature soldered fitting electro-migration testing structure and preparation method Download PDFInfo
- Publication number
- CN106990270A CN106990270A CN201710313850.0A CN201710313850A CN106990270A CN 106990270 A CN106990270 A CN 106990270A CN 201710313850 A CN201710313850 A CN 201710313850A CN 106990270 A CN106990270 A CN 106990270A
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- CN
- China
- Prior art keywords
- solder
- banjo fixing
- fixing butt
- soldered fitting
- butt jointing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Abstract
A kind of miniature soldered fitting electro-migration testing structure and preparation method, belong to material to prepare and connection area, solder banjo fixing butt jointing is welded into using solder soldering paste remelting between two pads, solder banjo fixing butt jointing is adhered on substrate using epoxy resin, at least one side surface of solder banjo fixing butt jointing is as solder banjo fixing butt jointing section, and this is by grinding and polishing as the side surface in section.Solve its that cause greatly very much due to micro connector size unsuitable in the energization area of actual flip-chip soldered ball, or size too it is small cause its be difficult to be fixed during electro-migration testing, easily acted on by external force cause damage in addition fracture problem.
Description
Technical field
The present invention is a kind of new micro soldered fitting electro-migration testing device and building method, belongs to material and prepares with connecting
Connect field, it is adaptable to soldered fitting electromigration reliability testing research.
Background technology
Solder joint is indispensable part in microelectronic interconnection, serve mechanically connect and electric signal transmission work
With.At present, microelectronics Packaging space reduces, chip heat production aggravation, on the one hand, during solder joint formation or electronic product use
Compound between the generated interface metal of reaction between solder and pad metalization layer (Intermetallic Compounds,
IMCs) layer accounts for the proportion of whole solder joint and is continuously increased, the butt welding point reliability such as its pattern, size, crystal orientation and thickness
Influence is also more serious, and on the other hand, the current density that solder joint is born is continuously increased, in the drive of thermodynamics and dynamics factor
Liquid solder, which is soaked, under making, in reflow process can grow or dissolve in the IMCs formed on solid-state pad, cause the failure of solder joint,
The electromigration reliability of solder joint has been largely fixed reliability and the life-span of whole electronic product.Therefore, how boundary is controlled
Face IMCs reflex action is just particularly important, and this is accomplished by the electromigration reliability test for carrying out solder joint first.
For flip chip structure, when reaching the out-of-service time, resistance can be raised suddenly.And existing electromigration is surveyed
The energization area of test agent is suitable with the energization area of actual flip-chip soldered ball, therefore can also be seen in resistance recording process
To similar phenomenon.In resistance recording process, the place that solder resistance is risen sharply is set as the out-of-service time of solder.Current phase
Close research and document institute using joint be generally all according to researcher itself field of interest the need for and designed, designed, not
Corresponding professional standard.In the electromigration reliability test of solder joint, researchers are in order to obtain higher current density side by side
Except current-crowding effect, often using the soldered fitting of microsize.It is small yet with joint dimension, it is difficult to ensure that solder joint exists
Damage is not caused in test process by external force effect or even is broken, and butt welding point reliability testing brings harm.And if increase
Electro-migration testing sample size, the difference of itself and actual solder joint energization area can cause can not contrasting for electromigration reliability data
Property.Tested in conventional electromigration reliability, in order to ensure solder joint energization area and structural strength while to meet electromigration reliable
Property test request, there is researcher to employ a kind of U-type groove structure, but this structure fabrication is complicated, it is with high costs, it is portable
Difference, welding spot structure is also much more complex compared with docking or lap joint.
For problem above, the present invention is based in the existing miniature solder joint preparation method tested for electromigration reliability
The problem of existing, devises technique simply, miniature soldered fitting electro-migration testing structure with low cost.
The content of the invention
The purpose of the present invention is to produce technique simply, and with low cost, strength of joint and energization area are satisfied by electromigration
The soldered fitting structure of reliability testing.
In order to achieve the above object, present invention employs following technical scheme.
A kind of miniature soldered fitting electro-migration testing structure, it is characterised in that solder soldering paste weight is used between two pads
Melting welding is connected into solder connector, and solder banjo fixing butt jointing is adhered on substrate using epoxy resin, at least one side of solder connector
Surface is as solder banjo fixing butt jointing section, and this is by grinding and polishing as the side surface in section.
It is preferred that the solder side of two pads is plane, two solders side are parallel, solder side vertical substrate；Further preferred two
Pad is columnar structures, and solder side is end face.
The substrate is resistant to remelting temperature and electromigration temperature and non-conductive, and further preferred substrate is printing electricity
Road plate.Wherein joint form is docking or overlaps.
The solder is bianry alloy, ternary alloy three-partalloy or the quaternary alloy of Sn bases；Preferably bianry alloy SnCu series,
SnAg series, SnZn series, SnBi series or SnIn series, ternary alloy three-partalloy SnAgCu series, SnAgBi series or SnAgIn systems
Row, quaternary SnAgBiIn series leadless solders；
The bridging method of above-mentioned a kind of miniature soldered fitting electro-migration testing structure, it is characterised in that comprise the following steps：
Double faced adhesive tape is adhered on substrate first, and two pads are placed on substrate, is noted ensureing between pad solder face
Away from and collimation, to ensure weld width and uniformity；Then the solder soldering paste of selection is coated on the solder side of two pads
Between, remelting is carried out, then cools down, obtains corresponding solder banjo fixing butt jointing；Solder banjo fixing butt jointing is placed in together with substrate
In acetone soln, solder banjo fixing butt jointing is removed from substrate, without inlaying, solder banjo fixing butt jointing surface is directly ground, removes many
Remaining solder；Finally obtained solder banjo fixing butt jointing is adhered on substrate by epoxy resin, and carries out a specified side
Surface is ground polishing as section, finally gives available for the soldered fitting for carrying out electro-migration testing.
Preferably 200 DEG C to 700 DEG C of the temperature range of remelting；The mode of cooling selects furnace cooling, air cooling, air-cooled, water cooling
Or the type of cooling of oil cooling.
It is due to that it meets general solder welding spot electromigration reliability test temperature requirement using epoxy resin, while may be used again
To ensure the structural strength of solder welding spot.
Because β-Sn have anisotropic BCT crystal structures, when light beam incides the β-Sn planes of crystal of polishing, it can divide
Solve to reflect along different directions for two-beam and occur birefringent phenomenon.Because the crystal grain of different orientation is aobvious in cross-polarization optics
Contrast is dramatically different under micro mirror (Polarized light microscopy, PLM), therefore observes what is polished by PLM
Soldering banjo fixing butt jointing section, can distinguish the β-Sn crystal grain of different crystal orientation, can be chosen under PLM and single crystal grain orientation is presented
Soldering banjo fixing butt jointing.
The advantage of the invention is that ensure that the size and weld width of soldered fitting, and meet solder connector electromigration
Reliability testing requirement.It is simple with technique suitable for soldered fitting electromigration reliability testing research, it is with low cost, easily
Ensure the size and weld width of soldered fitting, strength of joint and energization area are satisfied by the excellent of electromigration reliability test request
Point.It realizes that miniature soldered fitting is bonding with substrate by epoxy resin, and this is due to that epoxy resin meets general solder and connect
Head electromigration reliability test temperature requirement, while the structural strength of solder connector can be ensured again.Solve and connect due to miniature
Area of bed cause greatly very much it is suitable in the energization area of actual flip-chip soldered ball, or size too it is small cause its in electricity
It is difficult to be fixed in migration test process, the problem for causing damage or even being broken easily is acted on by external force.
Brief description of the drawings
Fig. 1：Soldering banjo fixing butt jointing electro-migration testing structure composition schematic diagram.
Fig. 2：Soldering banjo fixing butt jointing electro-migration testing photo.
Fig. 3：Cu/Sn3.5Ag/Cu banjo fixing butt jointings cross section microstructure.
Fig. 4：Banjo fixing butt jointing 1 × 10 shown in Fig. 34A/cm2Microstructure and crystal orientation after electromigration 168h.
Specific embodiment
With reference to embodiment, the invention will be further described, but the present invention is not limited to following examples.
Example：Embodiments of the present invention are illustrated in detail below, and wherein solder soldering paste is typically maintained in refrigerator, it is necessary to carry
Preceding 4-8h takes out from refrigerator be placed on room temperature environment in recover the viscosity of soldering paste, also need to fully stir it before use
Mix.
300 300 μm of μ ms, the system of the Cu/Sn3.5Ag/Cu banjo fixing butt jointing electro-migration testing structures of 200 μm of weld width
Make.
1st, Cu pads prepare：Copper bar cuboid pad is made of wire cutting mode, its size is the μ m of 500 μ m 500
20mm；
2nd, purity is more than 99.99wt.%, size is put into 30% prepared for the μ m 20mm of 500 μ m 500 Cu bars
HNO3Soaked in the aqueous solution a few minutes, remove Cu bond pad surfaces oxide and pollutant, then put it into acetone further
It is cleaned by ultrasonic, cleaning finishes dry for standby；
3rd, adhered on 10mm × 10mm × 1.5mm printed circuit board (PCB) (Printed circuit boards, PCB) double
Face glue, and two Cu pads are (two welding end surfaces are parallel, and are each perpendicular to printed circuit board (PCB)) placed on it, between two welding end surfaces
Away from for 200 μm, while noting ensureing that pad spacing is 200 μm, and ensure the collimation of Cu pads；
4 and then the Sn3.5Ag solder soldering paste being stirred is coated on two Cu pad solder end faces using thin paper cotton label
Between；
5th, remelt experiment is carried out using Rework workbench (U.S. PACE ST325), remelting temperature is set as 245 DEG C,
The remelting time is set as 50s, and air cooling obtains Sn3.5Ag solder banjo fixing butt jointings；
6th, sample is placed in acetone soln together with PCB, linear solder joint is removed by PCB, without inlaying, directly ground
Mill, removes redundant brazing filler metal, obtains Cu/Sn3.5Ag/Cu banjo fixing butt jointings；
7th, sample is adhered on the PCB that size is 10mm × 10mm × 1.5mm by epoxy resin, and carries out specified cut
The grinding and polishing in face, finally gives linear solder joint sectional dimension for 300 μm of 300 μ m, and solder joint thickness is 200 μm.Solder is powered
Area is 9 × 104μm2, it is suitable with the energization area of actual flip-chip soldered ball.
Claims (10)
1. a kind of miniature soldered fitting electro-migration testing structure, it is characterised in that solder soldering paste remelting is used between two pads
Solder connector is welded into, solder banjo fixing butt jointing is adhered on substrate using epoxy resin, at least one side table of solder connector
Face is as solder banjo fixing butt jointing section, and this is by grinding and polishing as the side surface in section.
2. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 1, it is characterised in that two pads
Solder side is plane, and two solders side are parallel, solder side vertical substrate.
3. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 2, it is characterised in that two pads are
Columnar structures, solder side is end face.
4. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 1, it is characterised in that substrate is printing
Circuit board.
5. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 1, it is characterised in that joint form is
Docking is overlapped.
6. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 1, it is characterised in that the solder is
Bianry alloy, ternary alloy three-partalloy or the quaternary alloy of Sn bases.
7. according to a kind of miniature soldered fitting electro-migration testing structure described in claim 6, it is characterised in that bianry alloy is selected
From SnCu series, SnAg series, SnZn series, SnBi series or SnIn series, ternary alloy three-partalloy is selected from SnAgCu series, SnAgBi
Series or SnAgIn series, quaternary alloy are selected from SnAgBiIn series leadless solders.
8. prepare a kind of method of miniature soldered fitting electro-migration testing structure described in claim any one of 1-7, its feature
It is, comprises the following steps：Double faced adhesive tape is adhered on substrate first, and two pads are placed on substrate, notes ensureing pad
The spacing and collimation of solder side, to ensure weld width and uniformity；Then the solder soldering paste of selection is coated on two welderings
Between the solder side of disk, remelting is carried out, then cools down, obtains corresponding solder banjo fixing butt jointing；By solder banjo fixing butt jointing together with base
Plate is placed in acetone soln together, and solder banjo fixing butt jointing is removed from substrate, without inlaying, and directly grinds solder banjo fixing butt jointing table
Face, removes redundant brazing filler metal；Finally obtained solder banjo fixing butt jointing is adhered on substrate by epoxy resin, and carries out specifying one
The surface of individual side is ground polishing as section, finally gives available for the soldered fitting for carrying out electro-migration testing.
9. according to the method for claim 8, it is characterised in that preferably 200 DEG C to 700 DEG C of the temperature range of remelting.
10. according to the method for claim 8, it is characterised in that the mode of cooling select furnace cooling, air cooling, air-cooled, water cooling or
The type of cooling of oil cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313850.0A CN106990270A (en) | 2017-05-05 | 2017-05-05 | Miniature soldered fitting electro-migration testing structure and preparation method |
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| CN201710313850.0A CN106990270A (en) | 2017-05-05 | 2017-05-05 | Miniature soldered fitting electro-migration testing structure and preparation method |
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| CN106990270A true CN106990270A (en) | 2017-07-28 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
| CN108941818A (en) * | 2018-09-25 | 2018-12-07 | 北京工业大学 | Low temperature quickly prepares Cu6Sn5The method of intermetallic compound one-dimensional linear solder joint |
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN109396769A (en) * | 2018-12-10 | 2019-03-01 | 北京工业大学 | A kind of preparation method for micro linear docking solder joint in electric field |
| CN109396768A (en) * | 2018-12-10 | 2019-03-01 | 北京工业大学 | Apply the method that transient pulse electric field prepares miniature polycrystalline solder joint |
| CN112255526A (en) * | 2020-09-09 | 2021-01-22 | 北京航天控制仪器研究所 | Preparation method and test method of copper-filled silicon through hole electromigration test structure |
| CN113953730A (en) * | 2021-11-19 | 2022-01-21 | 北京工业大学 | Polishing assembly capable of accurately controlling polishing quality of one-dimensional linear butt welding spot |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
| CN108646159B (en) * | 2018-03-14 | 2020-06-16 | 北京工业大学 | Micro welding spot thermoelectric coupling test method |
| CN108941818A (en) * | 2018-09-25 | 2018-12-07 | 北京工业大学 | Low temperature quickly prepares Cu6Sn5The method of intermetallic compound one-dimensional linear solder joint |
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN109396769A (en) * | 2018-12-10 | 2019-03-01 | 北京工业大学 | A kind of preparation method for micro linear docking solder joint in electric field |
| CN109396768A (en) * | 2018-12-10 | 2019-03-01 | 北京工业大学 | Apply the method that transient pulse electric field prepares miniature polycrystalline solder joint |
| CN112255526A (en) * | 2020-09-09 | 2021-01-22 | 北京航天控制仪器研究所 | Preparation method and test method of copper-filled silicon through hole electromigration test structure |
| CN113953730A (en) * | 2021-11-19 | 2022-01-21 | 北京工业大学 | Polishing assembly capable of accurately controlling polishing quality of one-dimensional linear butt welding spot |
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