CN1563937A - Strain tester for microelectronic material and hig temp creep of soldering joint - Google Patents
Strain tester for microelectronic material and hig temp creep of soldering joint Download PDFInfo
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- CN1563937A CN1563937A CN 200410029947 CN200410029947A CN1563937A CN 1563937 A CN1563937 A CN 1563937A CN 200410029947 CN200410029947 CN 200410029947 CN 200410029947 A CN200410029947 A CN 200410029947A CN 1563937 A CN1563937 A CN 1563937A
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- 239000000463 material Substances 0.000 title claims description 41
- 238000004377 microelectronic Methods 0.000 title claims description 31
- 238000005476 soldering Methods 0.000 title description 8
- 238000012360 testing method Methods 0.000 claims abstract description 42
- 238000003384 imaging method Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
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- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
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- DBUTVDSHVUGWOZ-UHFFFAOYSA-N [Si].[Ni].[Cr].[Ni] Chemical compound [Si].[Ni].[Cr].[Ni] DBUTVDSHVUGWOZ-UHFFFAOYSA-N 0.000 description 3
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Images
Abstract
The testing equipment is capable of taking picture in real time for observed structural change occurred in creep deformation and creep process. The equipment includes main body and peripheral equipment. The main body is composed of heating device, sample, load, loading supporter, and micro imaging filming device including metallurgical microscope. Peripheral equipment consists of stabilized voltage supply, temperature controller, and thermocouple. The voltage supply is connected to temperature controller and micro imaging filming device. One output of the temperature controller is connected to thermocouple and sample welding, and another output is connected to heating device.
Description
One, technical field
This device belongs to the material properties test technical field, is specially adapted to the high temperature creep property test of microelectronics with material and soldered fitting.
Two, background technology
Material mechanical property at high temperature is a research and the very important part of evaluation material property, and wherein the high temperature creep property of material is a very important index.Soldered fitting will experience temperature cycles and power cycle in the process under arms, and its main failure forms is thermal fatigue fracture.Distortion of being experienced in the thermal fatigue course and damage, part is provided by the deformation of creep.Soldered fitting and corresponding microelectronics thereof are effectively assessed and life prediction with material, must be considered the influence of creep, especially for the alloy that promptly belongs to high-temerature creep at a lower temperature (as the microelectronics soft solder).
Tsing-Hua University's patent (89107018.4) provides a kind of refractory ceramics creep testing machine, but this creep testing machine is primarily aimed at stupalith, and the sample and the load that are adopted are bigger, are not suitable for the test of the less microelectronics of hardness with material and soldered fitting high temperature creep property; Computer control deformation of creep measurement and automatic data collection device (02273979.3) have been invented by Liming Aeroplane Engine (Group) Co., Ltd., Shenyang City.Though this device has been realized the measurement and the automatic data collection of the deformation of creep, it only is the accurate measurement to creep strain, does not relate to the creep test process; Mitsubishi Heavy Industry Ltd.'s patent 02148207.1 provides a kind of accuracy method and device of assessing creep rupture.This device mainly by measuring the croop property that assessment material is come in metal material grain size or crystal orientation, mainly is applicable to ferrous materials, and be not suitable for that hardness is less, the metallographic preparation relatively the microelectronics of difficulty with material and soldered fitting.
Owing to lack suitable microelectronics with material and soldered fitting high-temerature creep strain device, at present to the research of microelectronics, mainly concentrate on the microelectronics material with the croop property of material and soldered fitting, rather than soldered fitting; Load mode adopts compressive stress mostly, and at home, also not to the creep strain proving installation of the microelectronics under different temperatures and the load with material and soldered fitting.In fact, the inefficacy of electronic product mainly is the inefficacy of soldered fitting, and therefore, the croop property of measuring soldered fitting has more practical significance than measuring the croop property of microelectronics with material; Simultaneously soldered fitting usually suffers tension or draws shear stress in the process under arms, rather than compressive stress, and the croop property rule that obtains by compressive stress is not equal to tension or draws croop property rule under the shear stress condition simultaneously; In addition, microelectronics usually will experience temperature cycles and power cycle in the process under arms with material and soldered fitting, therefore measure the croop property under different temperatures and the load, prediction microelectronics is had crucial meaning with creep life of material and soldered fitting and assessment microelectronics with the reliability of material and soldered fitting.Therefore, develop and develop the high-temerature creep strain device of microelectronics with material and soldered fitting, measure the croop property of microelectronics, microelectronics in the correct predict electronic product is had crucial meaning with the creep life of material and soldered fitting with the reasonable assessment electronic product reliability with material and soldered fitting.
Simultaneously, the tissue of material plays a part decision to performance, therefore observe microelectronics with the variation of the tissue of material and soldered fitting, to research with inquire into microelectronics and have crucial meaning, but also not have the patent and the report of being correlated with at present with material and soldered fitting performance with temperature and time.
Three, summary of the invention
The present invention is primarily aimed at mensuration microelectronics and designs with material and the strain of soldered fitting high-temerature creep, is applicable to the lower occasion of the less temperature of creep stress.
The invention provides a kind of proving installation of measuring microelectronics with material and the strain of soldered fitting high-temerature creep.This device is characterised in that promptly can measure microelectronics with material itself, also can measure the creep strain of soldered fitting; Load mode promptly can be tension or draw shear stress, also can adopt compressive stress; Simultaneously, under different temperatures and load, the deformation of creep and the variation of the tissue in the creep process with material and soldered fitting can realize Real Time Observation and take pictures to microelectronics, according to organizing situation of change in the image real time record deformation of creep of taking pictures and the deformation of creep process.
Microelectronics of the present invention is with material and soldered fitting high-temerature creep strain detection testing device, it is characterized in that, it is made of apparatus main body and peripherals two large divisions, as shown in Figure 1, wherein apparatus main body is made of heating arrangement, sample and load, loading support, micro-imaging filming apparatus according to from top to bottom order, heating arrangement links to each other with temperature controller in the apparatus main body, is placed in to load frame 10 upper surfaces; Wherein the micro-imaging filming apparatus by metaloscope, camera 6 and sleeve 2 with the shooting function of fixing time form, as shown in Figure 2; Load to support by the position adjustments fixed mechanism in the known technology 9 and load frame 10 and form, as shown in Figure 3; Peripherals is made of stabilized voltage supply, temperature controller and thermopair, and its annexation is as follows: stabilized voltage supply difference temperature controller and micro-imaging filming apparatus link to each other; Temperature controller has two groups of output terminals, and one group of output terminal is by thermopair and sample welding, and another group output terminal links to each other with heating arrangement.
Heating arrangement of the present invention requires to have following characteristics: firing rate is fast, and the flames of anger is difficult for getting an electric shock, and is safe.
Loading in apparatus of the present invention main body is supported should have following function: 1) support heating arrangement; 2) bearing load; 3) can freely move up and down with the objective table in the micro-imaging camera system 11, and after the position adjustment is suitable, be convenient to fix, avoid microscope to bear big load for a long time; 4) high temperature resistant, corrosion stability is good in air, and in light weight.This device is characterised in that to load to support and promptly can moves up and down at random with the metaloscope objective table, can bear plus load again, avoids metallography microscope to damage because of long-time carrying.
As shown in Figure 2, sleeve 2 in the micro-imaging filming apparatus of apparatus of the present invention main body is eyepiece lens barrel 1, the eyepiece 4 according to metaloscope, the boss 7 of camera 6 camera lenses with the shooting function of fixing time and maximum with shooting function camera 6 camera lenses 8 of the fixing time Design of length of protracting, purpose is sample 20 information are sent to be had in the shooting function of the fixing time camera 6, is convenient to have the fixing and loading and unloading of shooting function camera 6 of fixing time simultaneously.
Stabilized voltage supply in the peripherals of the present invention can be chosen existing product to the requirement of power supply according to having fix time shooting function camera 6, metaloscope and temperature controller; Temperature controller can be chosen the commercially available prod according to sample 20 and test accuracy; Thermopair can be bought existing product according to temperature controller, sample 20 and test accuracy.
Temperature controller among the present invention and sample 20 link to each other by thermopair, link to each other with heating arrangement again simultaneously, test temperature can and accurately be controlled by the temperature controller setting, thereby make this device observe and to measure with the croop property or the tissue variation of material and soldered fitting sample 20 microelectronics at various temperatures.This system's groundwork principle is: the heating arrangement by temperature controller control is heated to predetermined temperature with sample, thermopair passes to temperature controller with the actual temperature of sample 20, by temperature controller with sample 20 temperature limitation in predetermined temperature range, thereby be implemented under the different temperatures, microelectronics is observed and measured with the performance and the variation of the tissue in the creep process of material or soldered fitting creep sample 20.
The present invention is under different temperatures and load, to have the shooting function of fixing time camera 6 organically combines by sleeve 2 with metaloscope, image enters through metaloscope has the shooting function of fixing time camera 6, have the shooting function of fixing time camera 6 every certain time interval with filming image and store, thereby realize Real Time Observation and record that the tissue in the deformation of creep and the deformation of creep is changed.
Four, description of drawings
Fig. 1: high-temerature creep strain testing assembling synoptic diagram
Fig. 2: the assembling synoptic diagram of metaloscope, sleeve and digital camera
The camera lens of the boss 8-digital camera of the recess 6-digital camera 7-digital camera on the 4-eyepiece 5-sleeve of 1-microscope ocular lens barrel 2-sleeve 3-gap
Fig. 3: the assembling synoptic diagram that loads support, objective table and sample
9-position adjustments fixed mechanism 10-loads frame 11-microscope stage 12-U type pipe 13-pulley 14-pulley spindle 15-trip bolt 16-line 17-load 18-set bolt 19-objective aperture 20-sample
Fig. 4: life-span of creep rupture test sample
21-motherboard (Cu), the 22-brazing metal
Fig. 5: creep joint side dash synoptic diagram
The 23-cut
Fig. 6: t
c=0 the line synoptic diagram of creep does not take place constantly
Cut before the 24-distortion
Fig. 7: t
cAfter=t the deformation of creep constantly the line synoptic diagram
Line after the 25-deformation of creep
Fig. 8: Sn-3.8Ag-0.7Cu soldered fitting creep curve figure
Fig. 9: the Ni particle strengthens compound microelectronics material intermetallic compound (500 *) on the Cu substrate
(a) heating (b) is not incubated 250h for 100 ℃
Five, embodiment
The method of testing and the device of the high-temerature creep strain of miniature single lap brazing joint are described below by accompanying drawing and corresponding specific embodiment.But be understood that, wherein at embodiment about the description of the configuration of the size of sample, material type, componentry and positioned opposite and do not mean that and limit the invention to particular forms disclosed, this programme only is open in the mode of example, unless otherwise specified.
The high-temerature creep strain detection testing device of miniature single lap brazing joint is made of apparatus main body and peripherals two large divisions, and assembling and connected mode are as shown in Figure 1.Wherein apparatus main body according to from top to bottom order mainly by flush type pottery edge infrared hot plate, miniature single overlap joint creep soldered fitting 20 and load 17, load support, the micro-imaging filming apparatus constitutes, wherein the micro-imaging filming apparatus is made up of common metaloscope, Casio QV-2300UX digital camera 6 and sleeve 2, as shown in Figure 2; Load to support by four drawer type slide rails 9 and load frame 10 and form, as shown in Figure 3.Peripherals is made of high precision full-automatic AC voltage stabilizer, XMTE series digital display temperature controller and the nickel chromium-nickel silicon thermocouple of commercially available SVC-500VAII type.
The annexation of the high-temerature creep strain detection testing device of miniature single lap brazing joint is as follows: the high precision full-automatic AC voltage stabilizer difference XMTE series digital display temperature controller and the micro-imaging filming apparatus of SVC-500VAII type link to each other, and provide the energy to them; XMTE series digital display temperature controller has two groups of output terminals, and one group of output terminal is by nickel chromium-nickel silicon thermocouple and 20 welding of miniature single lap brazing joint, and another group output terminal links to each other with flush type pottery edge infrared hot plate, realizes the accurate control of test temperature.Wherein the fit of the common metaloscope in the micro-imaging filming apparatus, Casio QV-2300UX digital camera 6 and sleeve 2 is among the embodiment: 20 * eyepiece 4 is housed in the sleeve 2, one end of sleeve 2 links to each other with the eyepiece lens barrel 1 of common metaloscope, and the other end links to each other with Casio QV-2300UX digital camera 6.Fig. 3 is for loading the fit of objective table 11, miniature single lap brazing joint 20 and the load 17 of metaloscope in support, the micro-imaging filming apparatus, promptly the loading frame 10 that loads in supporting is placed in above the common metaloscope objective table 11, directly contacts with the upper surface of objective table 11; Miniature single lap brazing joint 20 be placed on objective table objective aperture 19 directly over, and link to each other with load 17 by the pulley 13 of φ 0.2 high temperature wire 16 through loading on the frame 10.
The rated voltage of the flush type pottery edge infrared hot plate of embodiment device main body is 220V, and power is 400W, and specification is 120mm * 120mm.The advantage of this kind heating plate is that firing rate is fast, can make environment temperature reach 150 ℃ under open condition at short notice, and the flames of anger, and security is higher; In addition, compare,, be difficult for getting an electric shock, be convenient to operation because heater strip is imbedded pottery inside with common resistance wire.
Loading frame 10 during loading in the embodiment device main body is supported is made up of two U type pipes 12, pulley 13 and pulley spindles 14.Place on the objective table 11 of metaloscope owing to load frame 10, and objective table 11 liftings are to lean on the precision lead screw of handel to drive.Excessive load will produce very big additional bending moment, damages leading screw probably, thereby destroys microscopical imaging effect.In order to alleviate self the weight that loads frame as far as possible, the U sections pipe 12 that has adopted hollow in design process is as loading frames 10 materials.Simultaneously, consider that maximum load reaches nearly 10kg in the designed creep test, and the needed time of creep process is also longer, therefore, is necessary to apply an external support, thereby most of load transfer is gone out loading frame.For this consideration, present embodiment has adopted commercially available drawer type slide rail 9 as loading the support section that supports.This drawer type slide rail is made up of interior rail and outer rail two parts, and the centre is equipped with ball, can move by easy on and off.Simultaneously, two screws 15 have been installed on each drawer type slide rail, have been used for fastening.During test, regulate objective table 11 by the knob on the microscopical handel earlier, move up and down (at this moment to drive loading frame 10, the interior rail of drawer type slide rail keeps contacting with desktop under action of gravity, and outer rail is owing to link to each other with frame 10, then along with frame moves up and down), until image definition and till reaching requirement.Then, the adjusting knob of objective table 11 is fastening, and the screw on the slide rail is fastening 15, move down to avoid objective table 11, avoid microscope to bear bigger load for a long time simultaneously.
Used sample 20 is miniature single lap brazing joints in the present embodiment, and shape as shown in Figure 4.In order to simulate soldered fitting in the actual product, the overlap joint area of this soldered fitting only is 1mm * 1mm, and braze metal 22 thickness are 0.1-0.15 μ m.Motherboard 21 adopts commercially available 0.1mm red copper foil.
The resolution of the employed Casio QV-2300UX of the micro-imaging filming apparatus digital camera 6 in the present embodiment apparatus main body is 2,100,000 pixels, and camera inside is furnished with 320,000,000 memory card, can be used for storing maximum 2484 pictures, and has the shooting function of fixing time.Image enters digital camera 6 through common metaloscope, Casio QV-2300UX digital camera 6 every certain time interval with filming image and store.
The used sleeve 2 of micro-imaging filming apparatus in the present embodiment apparatus main body is that the maximum preceding elongation of the boss 7 according to Casio QV-2300UX digital camera 6, common metaloscope eyepiece lens barrel 1 and eyepiece 4 and digital camera lens 8 designs.For easy to loading and unloading, should leave suitable gap (0.5-5mm) between the boss 7 of sleeve 2, eyepiece 4, digital camera 6 and the metaloscope eyepiece lens barrel 1.The diameter of the boss 7 of Casio QV-2300UX digital camera 6 camera lenses part is 40mm, so the diameter of the recess 5 of sleeve 2 is 42mm; Casio QV-2300UX digital camera 6 is when taking, camera lens 8 will protract and focus on automatically, therefore, the maximum castor that the design of the recess 5 of sleeve 2 inside need be considered camera lens 8 from, the maximum castor of these camera 6 camera lenses 8 is from being 15mm, so the degree of depth of recess 5 is 20mm; The external diameter of common metaloscope eyepiece lens barrel 1 is 25mm, and therefore the internal diameter of the sleeve 2 that matches with it is 26mm; Sleeve 2 center sections and eyepiece 4 are complementary.
The test process of the high-temerature creep strain testing of miniature single lap brazing joint 20 of present embodiment is as follows: with the sightingpiston sanding and polishing of miniature single lap brazing joint 20, and delineation observation line, the nickel chromium-nickel silicon thermocouple weldering that will link to each other with temperature controller is then linked on miniature single lap brazing joint 20, and miniature single lap brazing joint 20 is adjusted to the correct position of common metaloscope objective table objective aperture 19, apply test load 17, open CasioQV-2300UX digital camera 6 then, handel by common metaloscope is adjusted object distance, make clear picture, set test temperature by temperature controller, be communicated with power supply then, make the heating of flush type pottery edge infrared hot plate.When temperature reach test temperature and constant after, adjust object distance again, make clear picture, fixing with trip bolt 15, can regularly take pictures, then the image of taking pictures is handled, can obtain miniature single lap brazing joint 20 creep strains under this test condition.
The use of embodiment is described below by concrete test.
The mensuration of the miniature single lap brazing joint steady creep rate of example 1 Sn-3.8Ag-0.7Cu.
Measuring process is as follows:
1) handle in creep soldered fitting and early stage thereof
The shape and size embodiment of miniature single lap brazing joint 20 is described.
With thickness is that the Sn-3.8Ag-0.7Cu strip of 0.1mm is cut into the square of 1mm * 1mm.Use 50% HNO successively
3Aqueous solution and alcohol wash copper sheet surface are to remove oxide film.The place applies the IF710 solder resist in advance at the copper sheet face of weld, and making its end reserve area is 1mm
2The welding district.Subsequently, splash into 22%ZnCl in the welding district
2+ 2%NH
4Cl aqueous solution brazing flux is clipped in the square Sn-3.8Ag-0.7Cu strip that is cut between two copper sheets.Adopt ZnCl
2+ NH
4Cl corrosivity brazing flux.Soldering processes guarantee that generally the soldered fitting temperature was 260 ℃ of insulations 2 minutes.
Miniature single lap brazing joint 20 that soldering is good is at first polished with 600# and 1000# sand paper, and with the antiscuffing paste of 2.5 μ m with surface finish.Under stereomicroscope, rule perpendicular to the draw direction of joint along transverse direction in miniature single lap brazing joint 20 sides with blade, as shown in Figure 5 then.
2) test condition
Test temperature 298K, drawing shear stress is 7.02MPa.
3) test method and process of the test
Under above-mentioned test condition, finish the creep test of miniature single lap brazing joint 20, and carry out timing and take pictures.
4) acquisition of data
Fig. 6 has shown the side dash that miniature single lap brazing joint 20 does not deform.Point 1 and the vertical height of putting between 2 24 are the thickness of brazing metal.
Owing to above the eyepiece stalk 1 of common metaloscope, sleeve 2 has been installed, distance between eyepiece 4 and the object lens has increased, therefore, can not think merely that the enlargement ratio of the image that Casio QV-2300UX digital camera 6 is captured is the product of the multiplying power of object lens and eyepiece 4.Therefore, concrete enlargement ratio needs to calculate separately after each test.Concrete computing method are as follows: the picture that Casio QV-2300UX digital camera 6 is filmed at regular intervals downloads on the computing machine, with the first captured pictures as calculating object, utilize the some query function of AutoCAD mapping software, calculate the one-tenth-value thickness 1/10 after joint Cu paper tinsel 21 amplifies, at actual (real) thickness divided by Cu paper tinsel 21, be about 0.115mm, thereby can calculate the enlargement factor of this time test.
Then, calculate the original thickness 24 of miniature single lap brazing joint 20 brazing metal layers.Identical with the method for top calculating enlargement ratio, the difference of calculating chart 6 mid points 1 and point 2 ordinates can draw the thickness 24 that amplifies back brazing metal layer, again divided by enlargement ratio, can draw the thickness of actual miniature single lap brazing joint 20.
Then, choose corresponding picture by section at regular intervals, utilize the some query function, demonstrate a little 1 and the horizontal ordinate of point 2 as shown in Figure 7, thereby calculate at the interface between 2 along the variation that draws high the length travel of stress direction,, obtain actual change in displacement value divided by enlargement ratio, divided by the actual (real) thickness of miniature single lap brazing joint 20, can draw the creep strain value of this miniature single lap brazing joint 20 again in this moment.Then, draw creep strain curve over time.
After miniature single lap brazing joint 20 fractures, fracture deducts the hole of diameter greater than 10 μ m in the AutoCAD mapping software from the total area, thereby calculates the real loaded area of joint, calculates true stress again.
5) processing of data
According to above-mentioned picture, measure the dependent variable over time of miniature single lap brazing joint 20, make strain-time curve, i.e. creep curve, utilize least square method that the data point of its straight line portion is carried out match, the slope of the straight-line equation of gained is a steady state creep speed.The creep curve that Fig. 8 is a Sn-3.8Ag-0.7Cu soldered fitting 20 under 25 ℃ and 7.02MPa.
Can measure the steady state creep strain rate of this miniature single lap brazing joint 20 under this test condition by Fig. 8 is 8.1927 * 10
-9/ s.
The growth of SnCu base composite soldering intermetallic compound on the Cu plate that example 2:Ni particle strengthens
Concrete steps are as follows:
1) preparation of test material and sample 20
The SnCu base composite soldering that test material strengthens for the Ni particle, wherein the Ni particle is 1 μ m, the percent by volume of Ni is 3%.Get the sample of sprawling of this compound solder alloy, cut (red copper foil that the motherboard of sprawling test is selected 0.2mm for use) along the sample center open, adopt that epoxy resin is cold to be set in the brass tube.Polish with 200#-1000# metallographic waterproof abrasive paper respectively, and then polish with the diamond polishing cream of 2.5 μ m, 1.0 μ m, 0.5 μ m.HNO with 4%
3Alcoholic solution corrodes about 1～2 second.
2) test condition
Test temperature is 100 ℃.
3) test method
The method of SnCu base composite soldering growth of intermetallic compound on the Cu plate that mensuration Ni particle strengthens is identical with the method for measuring the miniature single lap brazing joint 20 steady creep rates of Sn-3.8Ag-0.7Cu, only miniature single lap brazing joint 20 is changed into the metallographic specimen 20 in this example, and need not to load.
4) data processing
According to the photo of taking pictures, measure the thickness of the intermetallic compound on the Cu substrate of inscribing when different, study this microelectronics and be combined in intermetallic compound on the Cu substrate in time growth rhythm under this test condition with material.For example Fig. 9 strengthens the picture of composite soldering intermetallic compound growth on the Cu substrate for the Ni particle, the image of the intermetallic compound of 9 (a) when not heating wherein, the image of the intermetallic compound when Fig. 9 (b) is 100 ℃ of insulation 250h, the thickness of the intermetallic compound through recording Fig. 9 (a) is 3.62 μ m, and the thickness of the intermetallic compound of Fig. 9 (b) is 22.4 μ m.According to a series of like this data, in the time of can studying 100 ℃, the growth rhythm of the intermetallic compound of SnCu base composite soldering on the Cu substrate that the Ni particle strengthens.
Claims (1)
1, microelectronics is with material and soldered fitting high-temerature creep strain detection testing device, it is characterized in that, it is made of apparatus main body and peripherals two large divisions, as shown in Figure 1, wherein apparatus main body is made of heating arrangement, sample and load, loading support, micro-imaging filming apparatus according to from top to bottom order, heating arrangement links to each other with temperature controller in the apparatus main body, is placed in to load frame 10 upper surfaces; Wherein the micro-imaging filming apparatus is made up of metaloscope, the camera 6 and the sleeve 2 that have regularly a shooting function, as shown in Figure 2; Load to support by the position adjustments fixed mechanism in the known technology 9 and load frame 10 and form, as shown in Figure 3; Peripherals is made of stabilized voltage supply, temperature controller and thermopair, and its annexation is as follows: stabilized voltage supply difference temperature controller and micro-imaging filming apparatus link to each other; Temperature controller has two groups of output terminals, and one group of output terminal is by thermopair and sample welding, and another group output terminal links to each other with heating arrangement.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410029947 CN1258673C (en) | 2004-04-06 | 2004-04-06 | Strain tester for microelectronic material and hig temp creep of soldering joint |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410029947 CN1258673C (en) | 2004-04-06 | 2004-04-06 | Strain tester for microelectronic material and hig temp creep of soldering joint |
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| CN1258673C CN1258673C (en) | 2006-06-07 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281144B (en) * | 2008-05-16 | 2011-05-11 | 北京工业大学 | Device for testing leadless solder welding spot crystal crack |
| CN101706400B (en) * | 2009-11-27 | 2011-07-27 | 北京工业大学 | Detection and evaluation method for dropping impact property of solder connector for electronic packaging |
| CN102252899A (en) * | 2011-07-05 | 2011-11-23 | 芜湖杰锋汽车动力系统有限公司 | Welding seam fatigue testing device |
| CN102607936A (en) * | 2010-12-23 | 2012-07-25 | 通用电气公司 | Method and system for online creep monitoring |
| CN103364282A (en) * | 2013-07-25 | 2013-10-23 | 常熟理工学院 | Test method for soft-solder alloy creep-deformation performance and testing device used by method |
| CN103808567A (en) * | 2014-02-28 | 2014-05-21 | 中国石油大学(华东) | Mechanical property testing device and mechanical property testing method for soldered joint |
| CN106990270A (en) * | 2017-05-05 | 2017-07-28 | 北京工业大学 | Miniature soldered fitting electro-migration testing structure and preparation method |
| CN109100242A (en) * | 2018-07-31 | 2018-12-28 | 中国石油大学(华东) | A kind of soldered fitting shear creep performance testing device and test method |
-
2004
- 2004-04-06 CN CN 200410029947 patent/CN1258673C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281144B (en) * | 2008-05-16 | 2011-05-11 | 北京工业大学 | Device for testing leadless solder welding spot crystal crack |
| CN101706400B (en) * | 2009-11-27 | 2011-07-27 | 北京工业大学 | Detection and evaluation method for dropping impact property of solder connector for electronic packaging |
| CN102607936A (en) * | 2010-12-23 | 2012-07-25 | 通用电气公司 | Method and system for online creep monitoring |
| CN102252899A (en) * | 2011-07-05 | 2011-11-23 | 芜湖杰锋汽车动力系统有限公司 | Welding seam fatigue testing device |
| CN103364282A (en) * | 2013-07-25 | 2013-10-23 | 常熟理工学院 | Test method for soft-solder alloy creep-deformation performance and testing device used by method |
| CN103808567A (en) * | 2014-02-28 | 2014-05-21 | 中国石油大学(华东) | Mechanical property testing device and mechanical property testing method for soldered joint |
| CN106990270A (en) * | 2017-05-05 | 2017-07-28 | 北京工业大学 | Miniature soldered fitting electro-migration testing structure and preparation method |
| CN109100242A (en) * | 2018-07-31 | 2018-12-28 | 中国石油大学(华东) | A kind of soldered fitting shear creep performance testing device and test method |
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