CN107876920A - A kind of preparation method with super more small grains docking solder joints - Google Patents
A kind of preparation method with super more small grains docking solder joints Download PDFInfo
- Publication number
- CN107876920A CN107876920A CN201711261152.7A CN201711261152A CN107876920A CN 107876920 A CN107876920 A CN 107876920A CN 201711261152 A CN201711261152 A CN 201711261152A CN 107876920 A CN107876920 A CN 107876920A
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- CN
- China
- Prior art keywords
- solder
- solder joint
- docking
- super
- preparation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
Abstract
A kind of preparation method with super more small grains docking solder joints, belongs to material preparation and connection area, removes copper bar section organic pollution and oxide, solder soldering paste is inserted between two copper bars, and be put into reflow soldering and welded.Maximum temperature is slightly above solder soldering paste melting temperature in welding process, cools down in atmosphere.This method can prepare the solder joint with tiny multiple grain, it is possible to prevente effectively from the failure of the whole solder joint brought by the damage of a crystal grain or several crystal grain.
Description
Technical field
The present invention is a kind of preparation method that solder joint is docked with super more small grains, belongs to material and prepares with being connected neck
Domain, the docking solder joint suitable for preparing super more small grains, the reliability applied to the mechanics of solder joint, calorifics and electricity are ground
Study carefully.This method can effectively ensure that docking solder joint has the formation of super more small grains, and then ensure that solder joint will not be because of one
The damage of individual or several crystal grain and fail.
Background technology
Solder joint is part indispensable in microelectronic interconnection, serves mechanical connection, electric signal transmission and radiating
Effect.In recent years, Electronic Packaging product gradually realized miniaturization and multifunction, and packaging density improves constantly so that encapsulation
Unleaded interconnection solder joint bears higher current density and Joule heat in body.The effect of higher current density and temperature promotes electricity
The generation of transport phenomena, metallic atom is migrated from negative pole to positive pole, cause at negative pole compound between substrate and interface metal
(Intermetallic Compounds, IMC) is dissolved, and produces cavity and crackle, and a large amount of IMC are formed at positive pole, so as to accelerate to weld
The failure of point, shorten the life-span of solder joint, turn into integrity problem important in interconnection solder joint.
Lead-free brazing is mainly Sn based alloys, and wherein Sn contents are generally greater than 90wt.%, thus Sn property is in very great Cheng
The performance of leadless solder welding spot military service process is determined on degree.β-Sn have body-centered tetragonal crystal structure, and its lattice constant isDue to this crystal structure, β-Sn crystal grain is in the performances such as mechanics, calorifics, electricity
Show different degrees of anisotropy.Research shows, at 25 DEG C, diffusion coefficients of the Cu along β-Sn lattice c-axis be 2 ×
10-6cm2/ s is it along 500 times of a, b axle.Therefore, the reliability such as the electromigration of Lead-Free Solder Joint crystal grain orientation butt welding point, heat fatigue
Play an important role.And Lead-Free Solder Joint is generally made up of one or three Sn crystal grain, therefore, the reliability of solder joint is more vulnerable to crystalline substance
The influence of grain orientation.
At present, the growth pattern for predicting and controlling Sn dendrite is a problem, and in welding process, each solder joint has
There is the crystal grain orientation of uniqueness, it is impossible to avoid the Sn crystal grain orientation butt welding point reliability of some solder joints unfavorable so that in electronic product
Premature failure in use, shorten the life-span of electronic product.Therefore, a kind of crystal grain orientation that can reduce is found to reliability effect
Means are very necessary.
The content of the invention
The purpose of the present invention is to overcome the miniature grain-oriented unicity of docking solder joint, prepares pair of the more small grains of excess of export
Connect solder joint.It is expected that as-welded, stretching, creep, aging, heat fatigue and the electricity to super more small grains solder joints can be passed through simultaneously
The sign of migratory behaviour, a series of reliability datas are obtained, be finally reached the purpose of evaluation docking welding spot reliability.
In order to achieve the above object, present invention employs following technical scheme.
A kind of preparation method with super more small grains docking solder joints, it is characterised in that comprise the following steps：
(1), copper bar is put with the organic pollution and oxide on acetone soln and aqueous solution of nitric acid removal copper bar respectively
In on the substrate for having adhered to double faced adhesive tape, leaving spacing to fill soldering paste solder, and ensure that the solder side of two copper bars is parallel to each other,
And perpendicular to substrate；
(2) between the solder soldering paste of selection, is packed into the solder side of two copper bars, and it is put into and has set temperature song
Welded in the reflow soldering of line.Peak value in welding process is less than 235 DEG C and is higher than 218 DEG C of solder melting temperature, is higher than
218 DEG C of institute's duration of solder melting temperature are 40s~50s, are cooled down in subsequent air；
(3) the docking solder joint that is welded on substrate, will be bonded to be immersed in acetone soln, will docking solder joint from substrate
Remove, obtain that there is certain grain-oriented docking solder joint.
Further, substrate is resistant to solder soldering paste welding temperature.
Further, substrate uses printed circuit board (PCB).
The advantage of the invention is that docking welding spot size can be controlled, ensure that miniature docking solder joint has and surpass how tiny crystalline substance
Grain；Technique is simple, and cost is cheap；The super more small grains solder joints obtained simultaneously disclosure satisfy that stretching, creep, aging, heat fatigue
With the various requirement of electro-migration testing, obtain a series of welding spot reliability data and evaluated.
Brief description of the drawings
Fig. 1 is the miniature docking solder joint photo of the embodiment of the present invention；
Fig. 2 is miniature docking solder joint distribution of orientations figure.
Embodiment
With reference to embodiment, the present invention is further described, but the invention is not restricted to following examples.
Embodiment 1
Herein below combination Fig. 1,2 are specifically described embodiments of the present invention.Solder soldering paste is stored in refrigerator, need to be shifted to an earlier date
2h takes out from refrigerator, is placed in room temperature environment to recover the viscosity of soldering paste, is sufficiently stirred solder soldering paste before use.
With super more small grains, sectional dimension is 400 μm of 350 μ m, and weld width is 200 μm of Cu/
Sn3.5Ag/Cu docks the making of solder joint.
1st, copper bar is prepared by the method for wire cutting, and its size is the μ m 20mm of 500 μ m 500；
2nd, copper bar (purity is more than 99.99wt%) is put into acetone soln, cleans 5min with ultrasonic wave, remove copper bar table
Face pollutant；Copper bar is taken out, is put into the 30vol.% aqueous solution of nitric acid configured in advance, is cleaned 10min with ultrasonic wave, go
Except copper bar oxide on surface；Then copper bar is taken out, is cleaned and dried with ethanol solution；
3rd, adhered on 20mm × 40mm × 1.5mm printed circuit board (PCB) (Printed Circuit Boards, PCB) resistance to
High temperature double faced adhesive tape, and copper bar is placed on it, while ensure that copper bar welded section spacing is 200 μm, and be parallel to each other；
4th, between Sn3.5Ag solder soldering paste being filled in into two copper bars with toothpick, and by with copper bar and solder soldering paste
Pcb board is put into reflow soldering and welded, and actual welding temperature is up to 230 DEG C, when continuing higher than melting temperature (218 DEG C)
Between be 45s, air cooling, obtain Sn3.5Ag docking solder joints；
5th, sample is placed in acetone soln together with PCB, linear solder joint is removed, without inlaying, with No. 2000 sand
Paper abrades redundant brazing filler metal, and the linear solder joint sectional dimension of gained is slightly larger than 400 μm of 350 μ m, and to specifying sightingpiston to be polished；
6th, the observation handled well with cross-polarization light microscope (Polarized Light Microscopy, PLM) observation
Face, it is chosen at the docking solder joint that super more small grains are presented under PLM；
7th, obtain sightingpiston EBSD (Electron Back-scattered Diffraction,
EBSD) data, it is determined that whether docking solder joint is the solder joint with super more small grains, with software I mageMeasure crystal grain
Average diameter is 33 μm.
Claims (3)
1. a kind of preparation method with super more small grains docking solder joints, it is characterised in that comprise the following steps：
(1), copper bar is placed in the organic pollution and oxide on acetone soln and aqueous solution of nitric acid removal copper bar respectively
On the substrate for adhering to double faced adhesive tape, spacing is left to fill soldering paste solder, and ensures that the solder side of two copper bars is parallel to each other, and is hung down
Directly in substrate；
(2) between the solder soldering paste of selection, is packed into the solder side of two copper bars, and it is put into reflow soldering and is welded,
Peak value in welding process is less than 235 DEG C and is higher than 218 DEG C of solder melting temperature, and higher than solder melting temperature, 218 DEG C continue
Time is 40s~50s, is cooled down in subsequent air；
(3) the docking solder joint that is welded on substrate, will be bonded to be immersed in acetone soln, docking solder joint is taken from substrate
Under, obtain that there is grain-oriented docking solder joint；
Solder soldering paste is Sn3.5Ag eutectic solders.
2. according to a kind of preparation method that solder joint is docked with super more small grains described in claim 1, it is characterised in that base
Plate uses printed circuit board (PCB).
3. according to a kind of preparation method that solder joint is docked with super more small grains described in claim 1, it is characterised in that base
Plate is resistant to solder soldering paste welding temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711261152.7A CN107876920A (en) | 2017-12-04 | 2017-12-04 | A kind of preparation method with super more small grains docking solder joints |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711261152.7A CN107876920A (en) | 2017-12-04 | 2017-12-04 | A kind of preparation method with super more small grains docking solder joints |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107876920A true CN107876920A (en) | 2018-04-06 |
Family
ID=61773034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711261152.7A Pending CN107876920A (en) | 2017-12-04 | 2017-12-04 | A kind of preparation method with super more small grains docking solder joints |
Country Status (1)
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|---|---|
| CN (1) | CN107876920A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857132A (en) * | 2018-07-24 | 2018-11-23 | 哈尔滨工业大学（深圳） | A kind of assessment Lead-Free Solder Joint reliability method |
| CN108941818A (en) * | 2018-09-25 | 2018-12-07 | 北京工业大学 | Low temperature quickly prepares Cu6Sn5The method of intermetallic compound one-dimensional linear solder joint |
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN114211081A (en) * | 2021-12-15 | 2022-03-22 | 航天科工防御技术研究试验中心 | Preparation method of Sn-based lead-free polycrystalline welding spot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1444276A (en) * | 2002-03-13 | 2003-09-24 | 日本电气株式会社 | Semiconductor device and method for making the same |
| CN107097012A (en) * | 2017-05-05 | 2017-08-29 | 北京工业大学 | A kind of crystal grain is orientated consistent banjo fixing butt jointing electro-migration testing method |
| CN107138820A (en) * | 2017-05-05 | 2017-09-08 | 北京工业大学 | It is a kind of to ensure that docking monocrystalline solder joint crystal grain is orientated consistent method |
-
2017
- 2017-12-04 CN CN201711261152.7A patent/CN107876920A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1444276A (en) * | 2002-03-13 | 2003-09-24 | 日本电气株式会社 | Semiconductor device and method for making the same |
| CN107097012A (en) * | 2017-05-05 | 2017-08-29 | 北京工业大学 | A kind of crystal grain is orientated consistent banjo fixing butt jointing electro-migration testing method |
| CN107138820A (en) * | 2017-05-05 | 2017-09-08 | 北京工业大学 | It is a kind of to ensure that docking monocrystalline solder joint crystal grain is orientated consistent method |
Non-Patent Citations (1)
| Title |
|---|
| PENG LI等: "Microstructure and Intermetallic Compounds in Sn-3Ag-3Bi-3In solder joints on Cu Matrix", 《2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY(ICEPT)》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857132A (en) * | 2018-07-24 | 2018-11-23 | 哈尔滨工业大学（深圳） | A kind of assessment Lead-Free Solder Joint reliability method |
| CN108941818A (en) * | 2018-09-25 | 2018-12-07 | 北京工业大学 | Low temperature quickly prepares Cu6Sn5The method of intermetallic compound one-dimensional linear solder joint |
| CN109030235A (en) * | 2018-09-25 | 2018-12-18 | 北京工业大学 | The preparation and test method of miniature solder joint under the conditions of power coupled thermomechanics |
| CN114211081A (en) * | 2021-12-15 | 2022-03-22 | 航天科工防御技术研究试验中心 | Preparation method of Sn-based lead-free polycrystalline welding spot |
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