CN108857132A - A kind of assessment Lead-Free Solder Joint reliability method - Google Patents
A kind of assessment Lead-Free Solder Joint reliability method Download PDFInfo
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- CN108857132A CN108857132A CN201810817275.2A CN201810817275A CN108857132A CN 108857132 A CN108857132 A CN 108857132A CN 201810817275 A CN201810817275 A CN 201810817275A CN 108857132 A CN108857132 A CN 108857132A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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Abstract
The present invention provides a kind of assessment Lead-Free Solder Joint reliability methods, include the following steps：S1, the lossless tomoscan mode using XRM, the crystal grain orientation of butt welding point carry out the observation of three-dimensional visualization, obtain solder joint internal grain misorientation statistical data；S2, by showing whether solder joint is in recrystallization state in crystal grain misorientatio statistical data, come assess solder joint continue be on active service reliability.Method of the invention is based on Lead-Free Solder Joint failure mechanism is probed into, and using the lossless tomoscan mode of XRM, the crystal grain orientation of butt welding point carries out the observation of three-dimensional visualization, so that butt welding point reliability carries out analysis and assessment.The sample that the present invention greatly reduces the grain-oriented method of conventional view prepares difficulty, realizes the reliability assessment of the accurate statistics and Lead-Free Solder Joint of solder joint internal grain orientation.
Description
Technical field
The present invention relates to unleaded soldering processes performance assessment technique field more particularly to a kind of assessment Lead-Free Solder Joint reliabilities
Method.
Background technique
Currently, welding spot reliability test method mainly has visual examination, X-ray examination, microsection, strength test, tired
The methods of labor service life, high temperature and humidity, drop test, random vibration.
Wherein, based on the test of the thermal fatigue life of temperature cycles utilize to be S-N curve assess and predict the longevity of solder joint
Life.In JESD22-104-B standard, experiment condition is described as follows：
Temperature：0 DEG C~100 DEG C, -25 DEG C~100 DEG C, -40 DEG C~125 DEG C, -55 DEG C~125 DEG C, -55 DEG C~100
℃；
The high/low temperature residence time：There is the solder joint of lead to stop 10min, unleaded solder joint stops 10~30min；
Rate temperature change：Less than 20 DEG C/min, recommend 20 DEG C/min~15 DEG C/min；
It is calculated by 1% crash rate：5 years service life correspondence 876~1000 circulation, 3 years service life correspondence 524 circulation.
Temperature cycling test is proposed based on traditional tin-lead solder joint, due to the even tissue of tin-lead solder joint, mechanical property
It can be isotropic, difference and little between each solder joint, so the reliability that this standard is suitable for traditional tin-lead solder joint is commented
Estimate.
But after solder joint is unleaded, failure mechanism obviously changes：By the homogeneous deformation failure fracture again of tin-lead solder joint
Become the heterogeneous deformation of Lead-Free Solder Joint failure fracture again.Since solder joint internal grain tails off, anisotropy is obviously increased, different
The crystal grain of solder joint is orientated difference, and the mechanical property difference embodied is larger, and fracture mode also differs widely.Therefore, traditional tin-lead
The reliability estimation method of solder joint is not particularly suited for the reliability assessment to Lead-Free Solder Joint from principle.
Summary of the invention
It in order to solve the problems in the prior art, can the present invention provides a kind of assessment Lead-Free Solder Joint reliability method
Realize the reliability assessment of the accurate statistics and Lead-Free Solder Joint of solder joint internal grain orientation.
The present invention is realized especially by following technical solution：
A kind of assessment Lead-Free Solder Joint reliability method, includes the following steps：S1, the lossless tomoscan mode using XRM,
The crystal grain orientation of butt welding point carries out the observation of three-dimensional visualization, obtains solder joint internal grain misorientation statistical data；S2, by crystal grain
It show whether solder joint is in recrystallization state in misorientation statistical data, continues the reliability being on active service to assess solder joint.
Further, if orientating deviation percentage in the statistics of solder joint internal grain misorientation, greater than 10 °>10%, then
Think that solder joint is in initial recrystallization state, solder joint is in failure early period at this time, it is not recommended that continues to be on active service.
The beneficial effects of the invention are as follows：Method of the invention based on probing into Lead-Free Solder Joint failure mechanism, using XRM without
Tomoscan mode is damaged, the crystal grain orientation of butt welding point carries out the observation of three-dimensional visualization, so that butt welding point reliability is assessed
Analysis.The sample that the present invention greatly reduces the grain-oriented method of conventional view prepares difficulty, realizes solder joint internal grain
The reliability assessment of the accurate statistics and Lead-Free Solder Joint of orientation.
Detailed description of the invention
Fig. 1 is assessment Lead-Free Solder Joint reliability method flow chart of the invention.
Specific embodiment
The present invention is further described for explanation and specific embodiment with reference to the accompanying drawing.
Traditional Pb-Sn solder joint, for structure by β-Sn and around rich Pb phase composition in its vicinity, tissue is fine and closely woven, and
Since rich Pb phase property is soft, so the mechanical property of entire solder is regarded as isotropic.And after solder joint is unleaded, Sn contains
Amount is occupied an leading position, and solder joint is mainly made of Sn base solder, and the group of solder joint becomes β-Sn and Ag3Sn and Cu6Sn5 group after reflux
At wherein Ag3Sn and Cu6Sn5 is generally evenly distributed near β-Sn, plays the role of dispersion-strengtherning, furthermore experimental observation
Crystal grain number inside to Lead-Free Solder Joint is far less than traditional Pb-Sn solder joint, and even there are the solder joints of single crystal grain sometimes.It is brilliant
Grain surrounds less, by dispersion strengthening phase, this two o'clock prevents Lead-Free Solder Joint from homogeneous deformation, that is, can show anisotropy, power
It learns performance and the orientation of β-Sn crystal grain is closely related.
The grain-oriented method of traditional observation is but this side by the method for backscattered electron diffraction (EBSD)
Method, sample preparation require high and can destroy original solder joint, and the apparent size of test sample also will receive limitation, not be suitable for
Reliability assessment is especially to continue with the assessment of service life.
XRM (X-ray microscope, X-ray Microscopy) is a kind of novel material characterization equipment, can use it
Lossless tomoscan mode, the crystal grain orientation of butt welding point carry out the observation of three-dimensional visualization.Losslessization detection greatly reduces biography
The sample that overall view examines grain-oriented method (EBSD) prepares difficulty, and can accomplish non-destructive testing, does not destroy solder joint influence
Later period is on active service.The accurate statistics of solder joint internal grain orientation may be implemented in three-dimensional visualization observation.Even relatively large sample
Product, advanced imaging solutions can also complete three-dimensional imaging, observable sample by high contrast and submicron resolution
Product apparent size range for EBSD compared to being greatly improved.So this patent is required using XRM come losslessization observation
The crystal grain of solder joint is orientated, and assesses the continuation service life of solder joint accordingly.
For the solder joint of single crystal grain, fracture failure occurs in the solder joint neck region close to interface, inside solder joint
Institute is impacted less.And for the solder joint of multiple crystal grain, crackle can also be from neck region to solder joint internal extended.The two
It is identical in that the neck region that the initial position of crackle is all most concentrated in stress, and the region of crack propagation all can be along with
Recrystallize the generation of phenomenon.Further analysis is found, before recrystallization, the region that stress is concentrated, which can also first will appear, was replied
Journey.In Recovery Process, subgrain occurs in the region that stress is concentrated, and is rotated by further crystal boundary and subgrain is mutually interpolymerized
The process of conjunction and develop as recrystal grain.Therefore, the fracture process of entire Lead-Free Solder Joint is the continuous of a recovery and recrystallization
Process.It is considered that reply is omen early period of solder joint thermal cycle fracture failure.The microstructure characteristic of reply is that subgrain occur
Grain.Observation is orientated by crystal grain it can be found that the orientation of subgrain and the orientation only slight difference of parent crystal grain and one
The continuous process occurred by crystal boundary rotation.Reply-recrystallization-fracture process i.e. subgrain crystal grain orientation and parent crystal
The process that grain orientation continuously enlarges.Therefore clothes locating for solder joint can be described by the situation of detection solder joint internal grain orientation
Labour state, and then can establish the service life of model prediction solder joint.
By our experiment statistics：Percentage of the solder joint crystal grain misorientatio being broken within the scope of 5 °~15 °
It is 49.7%, the percentage within the scope of 5 °~15 ° is 31.1%, and the percentage within the scope of 15 °~35 ° is 8.9%, 35 °~55 °
Percentage in range is 4.4%, and the percentage within the scope of 55 °~65 ° is 2.5%, and the percentage within the scope of 65 °~100 ° is
3.4%.
The state that solder joint is not broken：Orientating deviation percentage within the scope of 0 °~10 ° is 67%, 10 °~15 ° ranges
Inside it is 11.6%, is 21.4% within the scope of 15 °~180 °.And it is within the scope of the region recrystallized, 0 °~10 °
57.5%, the percentage within the scope of 10 °~15 ° is 15.0%, is 17.5% in 15 °~180 °.In non-recrystallization region
Interior, misorientation is distributed in 0 °~10 °, wherein 0 °~5 ° of percentage is 82.5%, and 5 °~10 ° of percentage is
17.5%, do not occur angle of elevation crystal boundary.
Therefore following reliability assessment standard is provided according to the above crystal grain data statistics：If solder joint internal grain misorientation
Orientating deviation percentage in statistics, greater than 10 °>10%, then it is assumed that solder joint is in initial recrystallization state, at this time at solder joint
Failure early period, it is not recommended that continue to be on active service.
In conclusion method of the invention, is derived to Lead-Free Solder Joint failure mechanism the assessment of Lead-Free Solder Joint reliability
Probe into, compared to method before, the present invention assesses Lead-Free Solder Joint reliability directly from failure mechanism, viewpoint innovation, and
And it is theoretically more rigorous.In addition, XRM is a kind of novel material characterization technology, its lossless tomoscan mode can use, it is right
The crystal grain orientation of solder joint carries out the observation of three-dimensional visualization, so that butt welding point reliability carries out analysis and assessment.Losslessization detection is big
The sample for reducing the grain-oriented method of conventional view greatly prepares difficulty, and three-dimensional visualization observation may be implemented brilliant inside solder joint
The accurate statistics of grain orientation.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (2)
1. a kind of assessment Lead-Free Solder Joint reliability method, it is characterised in that：It the described method comprises the following steps：S1, utilize XRM's
Lossless tomoscan mode, the crystal grain orientation of butt welding point carry out the observation of three-dimensional visualization, obtain solder joint internal grain misorientation
Statistical data；S2, by showing whether solder joint is in recrystallization state in crystal grain misorientatio statistical data, continue to take to assess solder joint
The reliability of labour.
2. according to the method described in claim 1, it is characterized in that：If in the statistics of solder joint internal grain misorientation, being greater than 10 °
Orientating deviation percentage>10%, then it is assumed that solder joint is in initial recrystallization state, and solder joint is in failure early period at this time, no
It is recommended that continuing to be on active service.
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Cited By (2)
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| CN110987649A (en) * | 2019-11-18 | 2020-04-10 | 中国空间技术研究院 | Low-temperature reliability evaluation method for interconnection welding spot of lead-free component |
| CN111104641A (en) * | 2019-12-10 | 2020-05-05 | 重庆大学 | Method for identifying crystal grains by computer in three-dimensional space |
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| CN111104641A (en) * | 2019-12-10 | 2020-05-05 | 重庆大学 | Method for identifying crystal grains by computer in three-dimensional space |
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| CN108857132B (en) | 2021-04-20 |
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