CN106981559A - A kind of vacuum plate sucking device - Google Patents
A kind of vacuum plate sucking device Download PDFInfo
- Publication number
- CN106981559A CN106981559A CN201710352313.7A CN201710352313A CN106981559A CN 106981559 A CN106981559 A CN 106981559A CN 201710352313 A CN201710352313 A CN 201710352313A CN 106981559 A CN106981559 A CN 106981559A
- Authority
- CN
- China
- Prior art keywords
- plate
- cover plate
- array
- cavity
- sucking device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H01L33/483—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H01L2933/0033—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a kind of vacuum plate sucking device, the present invention is provided with array on bottom plate and opens cavity, array cavity is connected together, connection forms arc island afterwards together, arc island and bottom plate surrounding are provided with mounting hole, mounting hole is embedded with magnet, magnet attraction cover plate, seal the binding face of cover plate and bottom plate, passage is provided with cover plate, bottom panel side is connected with gas joint, gas joint connects the air-path control system for providing negative pressure air by tracheae, after air-path control system work, array is set to open cavity air pressure drop low, passage on cover plate has absorption affinity, for adsorbed target object.Vacuum plate sucking apparatus structure of the present invention is simple, with low cost, versatility is fabulous, can be widely used for absorption, the fixation of various plate class objects.
Description
Technical field
The present invention relates to LED automation equipment fields, a kind of vacuum plate sucking device is particularly related to.
Background technology
Recently as LED product making extensively in multiple fields such as electronics, traffic indication signal, outdoor advertising, illuminations
With product category is also more and more more, and its is different, and species is various.Its corresponding LED support (load during LED semi-finished product
Plate) also there are very many species, but be all plate class shape substantially.
During the manufacturing, using its plate class feature, automation equipment often sets track, allows it to slide in orbit
Dynamic or rolling is carried to each station to realize.Such as Chinese patent：" the LED core of LED bonders introduced in CN201220257238
Plate rack passes in and out system automatically ".
This feed process has at least following shortcoming：
1, LED support can damage LED support and LED product directly with track friction and vibrations；
2, LED support for different size are general, it is necessary to adjust the width of track or replace spare and accessory parts to adapt to support
Property is poor；During in face of round LED support, it is impossible to ensure its not rotation displacement and can not feed.
3, complicated, part is more, needs to set the conveyers such as motor, belt, guide rail on track；It is flat in its work
More the clamping devices such as cylinder, bobbin are set to carry out fixed support on platform；Thus cause motion platform load very big, board speed is carried
Go up limit smaller.
The content of the invention
For deficiency of the prior art, the technical problem to be solved in the present invention is the provision of a kind of vacuum plate sucking dress
Put.
In order to solve the above technical problems, the present invention is realized by following scheme：A kind of vacuum plate sucking device, the vacuum is inhaled
Panel assembly includes bottom plate, cover plate, gas joint, magnet；
The upper surface of the bottom plate is plane, and array is provided with the plane and opens cavity, the array is opened
Cavity is connected, and the array of connection forms isolated island between opening cavity, and isolated island center and plate upper surface surrounding are provided with installation
Hole, mounting hole is embedded with magnet, and the one side of the bottom plate is provided with some air admission holes, and air admission hole is connected with open cavity, often
Individual air admission hole is provided with gas joint, the junction sealing of gas joint and air admission hole；
The upper and lower surface of the cover plate is plane, and its plate body has pliability, and the cover plate can be by magnet attraction, cover plate
After magnet attraction, its lower surface is close to the upper surface of bottom plate, and sealing structure is formed after being close to；
Some passage groups are provided with the cover plate plate body.
Further, the passage group on the cover plate is provided with two kinds of structures；
Stomata in the first structure, passage group is all placed within the scope of the oral area that the array opens cavity, and
It is adapted to target piece；
Stomata in second of structure, passage group is arbitrarily arranged and is covered with whole cover plate, when in use will be unwanted
Stomata is blocked.
A kind of LED bonders, including a kind of described vacuum plate sucking device.
A kind of bonding equipment, including a kind of described vacuum plate sucking device.
Relative to prior art, the beneficial effects of the invention are as follows：The present invention is provided with array on bottom plate and opens cavity,
Array cavity is connected together, and connection forms arc island afterwards together, and arc island and bottom plate surrounding are provided with mounting hole, and mounting hole is embedded
There is magnet, magnet attraction cover plate seals the binding face of cover plate and bottom plate, passage, bottom panel side connection are provided with cover plate
There is gas joint, gas joint is connected the air-path control system for providing negative pressure air by tracheae, after air-path control system work, makes battle array
Column opening cavity air pressure drop is low, and the passage on cover plate has absorption affinity, for adsorbed target object.Vacuum plate sucking of the present invention
Apparatus structure is simple, with low cost, versatility is fabulous, can be widely used for absorption, the fixation of various plate class objects.
Brief description of the drawings
Fig. 1 is vacuum plate sucking device stereogram of the present invention and the LED support schematic diagram being placed on vacuum plate sucking device；
Fig. 2 is vacuum plate sucking device explosion figure of the present invention and LED support schematic diagram；
Fig. 3 is the top view after vacuum plate sucking device of the present invention and LED support combination；
Fig. 4 is Fig. 3 A-A sectional views；
Fig. 5 is the B portions enlarged drawing in Fig. 4.
Embodiment
The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
Embodiment 1：
It refer to and be provided with LED support on accompanying drawing 1-5, a kind of vacuum plate sucking device of the invention, the vacuum plate sucking device 2
Plate 1, it includes bottom plate 21, cover plate 22, gas joint 23, magnet 24；
The upper surface of the bottom plate 21 is plane, and array is provided with the plane and opens cavity, the array is opened
Cavity connection is put, the array of connection forms isolated island between opening cavity, and isolated island center and plate upper surface surrounding are provided with peace
Hole is filled, mounting hole is embedded with magnet 24, and the one side of the bottom plate 21 is provided with some air admission holes, and air admission hole connects with open cavity
Logical, each air admission hole is provided with gas joint 23, and the junction of gas joint 23 and air admission hole is sealed；
The upper and lower surface of the cover plate 22 is plane, and its plate body has pliability, and the cover plate 22 can be inhaled by magnet 24
Close, after cover plate 22 is by the adhesive of magnet 24, its lower surface is close to the upper surface of bottom plate 21, and sealing structure is formed after being close to；
Some passage groups are provided with the plate body of cover plate 22.
Passage group on the cover plate 22 is provided with two kinds of structures；
Stomata in the first structure, passage group is all placed within the scope of the oral area that the array opens cavity, and
It is adapted to target piece；
Stomata in second of structure, passage group is arbitrarily arranged and is covered with whole cover plate (22), will be not required to when in use
The stomata wanted is blocked.
Embodiment 2：
Gas joint 23 with provide negative pressure air air-path control system be connected, air-path control system including single-chip microcomputer or its
Its main frame, and the input-output equipment with operation, such as touch-screen, keyboard, button, mouse.Pass through air-path control system
Negative pressure air is provided, connection bottom plate 21 fit formed cavity with cover plate 22, finally make the passage on cover plate 22 with suction
Attached power, passage adsorbed target object.
Embodiment 3：
The present embodiment is essentially consisted in embodiment 1-2 differences：On bottom plate 21 and magnet is not provided with, glue or sealing can be used
Grease makes cover plate 22 be brought into close contact with bottom plate 21, so as to reach sealing state, quick-replaceable lid equally can be achieved in non-rigid connection
The purpose of plate 22.
Embodiment 4：
In the present embodiment, on cover plate 22 and not only for the setting passage of property, but it is covered with whole cover plate, when in use
Useless passage can be blocked temporarily, can be changed without any accessory and be realized that cover plate is general.
Embodiment 5：
A kind of LED bonders or bonding equipment are present embodiments provided, it, which enters in rewinding manipulator and/or workbench, is set
Or include the vacuum plate sucking device of the present invention.
The present invention is provided with array on bottom plate and opens cavity, and array cavity is connected together, shape after connection together
Into arc island, arc island and bottom plate surrounding are provided with mounting hole, and mounting hole is embedded with magnet, and magnet attraction cover plate makes cover plate and bottom plate
Binding face sealing, passage is provided with cover plate, bottom panel side is connected with gas joint, and gas joint provides negative by tracheae connection
The air-path control system of air is pressed, after air-path control system work, makes array opening cavity air pressure drop low, the ventilation on cover plate
Hole has absorption affinity, for adsorbed target object.Vacuum plate sucking apparatus structure of the present invention is simple, with low cost, versatility is fabulous,
It can be widely used for absorption, the fixation of various plate class objects.
The preferred embodiment of the present invention is the foregoing is only, is not intended to limit the scope of the invention, every profit
The equivalent structure or equivalent flow conversion made with description of the invention and accompanying drawing content, or directly or indirectly it is used in other phases
The technical field of pass, is included within the scope of the present invention.
Claims (4)
1. a kind of vacuum plate sucking device, it is characterised in that：The vacuum plate sucking device (2) includes bottom plate (21), cover plate (22), gas and connect
Head (23), magnet (24)；
The upper surface of the bottom plate (21) is plane, and array is provided with the plane and opens cavity, the array is opened
Cavity is connected, and the array of connection forms isolated island between opening cavity, and isolated island center and plate upper surface surrounding are provided with installation
Hole, mounting hole is embedded with magnet (24), and the one side of the bottom plate (21) is provided with some air admission holes, air admission hole and open cavity
Connection, each air admission hole is provided with gas joint (23), and the junction of gas joint (23) and air admission hole is sealed；
The upper and lower surface of the cover plate (22) is plane, and its plate body has pliability, and the cover plate (22) can be by magnet (24)
Adhesive, after cover plate (22) is by magnet (24) adhesive, its lower surface is close to the upper surface of bottom plate (21), and sealing is formed after being close to
Structure；
Some passage groups are provided with cover plate (22) plate body.
2. a kind of vacuum plate sucking device according to claim 1, it is characterised in that：Passage group on the cover plate (22)
It is provided with two kinds of structures；
Stomata in the first structure, passage group is all placed within the scope of the oral area that the array opens cavity, and is adapted to
Target piece；
Stomata in second of structure, passage group is arbitrarily arranged and is covered with whole cover plate (22), when in use will be unwanted
Stomata is blocked.
3. a kind of LED bonders, it is characterised in that：Including a kind of vacuum plate sucking device as described in claim any one of 1-2.
4. a kind of bonding equipment, it is characterised in that：Including a kind of vacuum plate sucking device as described in claim any one of 1-2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710352313.7A CN106981559B (en) | 2017-05-18 | 2017-05-18 | Vacuum suction plate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710352313.7A CN106981559B (en) | 2017-05-18 | 2017-05-18 | Vacuum suction plate device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106981559A true CN106981559A (en) | 2017-07-25 |
| CN106981559B CN106981559B (en) | 2023-10-27 |
Family
ID=59343466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710352313.7A Active CN106981559B (en) | 2017-05-18 | 2017-05-18 | Vacuum suction plate device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106981559B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111101110A (en) * | 2018-10-29 | 2020-05-05 | 北京北方华创微电子装备有限公司 | Gas inlet integrated structure, process chamber and semiconductor processing equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157847A (en) * | 2005-12-01 | 2007-06-21 | Shin Etsu Polymer Co Ltd | Chucking device |
| JP2008270233A (en) * | 2007-04-16 | 2008-11-06 | Mitsui Kozan Material Kk | Vacuum adsorbing device and adsorbing body for same |
| CN201561039U (en) * | 2009-12-11 | 2010-08-25 | 伍坚垣 | Vacuum suction disk |
| CN203367259U (en) * | 2013-07-11 | 2013-12-25 | 正恩科技有限公司 | Wafer partition adsorption structure |
| CN203392511U (en) * | 2013-07-22 | 2014-01-15 | 上海坤大信息技术有限公司 | Concave cavity sucker for de-stacking |
| CN205098984U (en) * | 2015-10-14 | 2016-03-23 | 辽宁中蓝电子科技有限公司 | Vacuum adsorption permutation tool |
| CN106455326A (en) * | 2016-10-10 | 2017-02-22 | 中山新诺科技股份有限公司 | Vacuum board suction system |
| CN206774574U (en) * | 2017-05-18 | 2017-12-19 | 深圳市新益昌自动化设备有限公司 | A kind of vacuum plate sucking device, LED bonders and bonding equipment |
-
2017
- 2017-05-18 CN CN201710352313.7A patent/CN106981559B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157847A (en) * | 2005-12-01 | 2007-06-21 | Shin Etsu Polymer Co Ltd | Chucking device |
| JP2008270233A (en) * | 2007-04-16 | 2008-11-06 | Mitsui Kozan Material Kk | Vacuum adsorbing device and adsorbing body for same |
| CN201561039U (en) * | 2009-12-11 | 2010-08-25 | 伍坚垣 | Vacuum suction disk |
| CN203367259U (en) * | 2013-07-11 | 2013-12-25 | 正恩科技有限公司 | Wafer partition adsorption structure |
| CN203392511U (en) * | 2013-07-22 | 2014-01-15 | 上海坤大信息技术有限公司 | Concave cavity sucker for de-stacking |
| CN205098984U (en) * | 2015-10-14 | 2016-03-23 | 辽宁中蓝电子科技有限公司 | Vacuum adsorption permutation tool |
| CN106455326A (en) * | 2016-10-10 | 2017-02-22 | 中山新诺科技股份有限公司 | Vacuum board suction system |
| CN206774574U (en) * | 2017-05-18 | 2017-12-19 | 深圳市新益昌自动化设备有限公司 | A kind of vacuum plate sucking device, LED bonders and bonding equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111101110A (en) * | 2018-10-29 | 2020-05-05 | 北京北方华创微电子装备有限公司 | Gas inlet integrated structure, process chamber and semiconductor processing equipment |
| CN111101110B (en) * | 2018-10-29 | 2022-03-22 | 北京北方华创微电子装备有限公司 | Gas inlet integrated structure, process chamber and semiconductor processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106981559B (en) | 2023-10-27 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 Building C8, Ruiming Industrial Park, Heping Road, Fuyong Street, Bao'an District, Shenzhen, Guangdong Province (with business premises on the first and second floors of Building A, Rongtiansheng Industrial Zone, Heping Community, Fuyong Street, Bao'an District, Shenzhen) Applicant after: Shenzhen Xinyichang Science and Technology Co.,Ltd. Address before: 518000 building C8, Ruiming Industrial Park, Heping Road, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN XINYICHANG AUTOMATIC EQUIPMENT Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |