CN106981539A - A kind of preparation method and application of nano-stack conductive film - Google Patents
A kind of preparation method and application of nano-stack conductive film Download PDFInfo
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- CN106981539A CN106981539A CN201710063481.4A CN201710063481A CN106981539A CN 106981539 A CN106981539 A CN 106981539A CN 201710063481 A CN201710063481 A CN 201710063481A CN 106981539 A CN106981539 A CN 106981539A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000002161 passivation Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 229910052757 nitrogen Inorganic materials 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 12
- 229910052593 corundum Inorganic materials 0.000 claims description 11
- 238000010926 purge Methods 0.000 claims description 11
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 7
- 239000012159 carrier gas Substances 0.000 claims description 4
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000010025 steaming Methods 0.000 claims 1
- 210000004027 cell Anatomy 0.000 abstract description 18
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 abstract description 9
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 abstract description 9
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 26
- 239000011787 zinc oxide Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 229960001296 zinc oxide Drugs 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000024241 parasitism Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
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- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
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Abstract
The invention belongs to field of semiconductor devices, and in particular to solar cell manufactures field, more particularly to prepares the preparation method of the transparent conductive film of nano-stack and the application in solar cell surface passivation and electric current collection with reference to technique for atomic layer deposition.For the technological process of existing PERC battery technologies, the metal oxide nano lamination conductive film prepared using technique for atomic layer deposition is as passivation layer, so as to the problem of solving dead resistance and big contact resistance, lift battery conversion efficiency, and suitable for producing in enormous quantities.
Description
Technical field
This patent belongs to field of semiconductor devices, and in particular to solar cell manufactures field, more particularly to combines atom
Layer deposition techniques prepare the preparation method of the transparent conductive film of nano-stack and received in solar cell surface passivation and electric current
The application of concentration.
Background technology
Surface passivation is to reduce surface recombination rate, the important technical of the conversion efficiency of raising silicon solar cell.
(Solar Energy Materials&Solar Cells, 2006, (90):82-92) passivation emitter rear-face contact technology
(PERC technologies), does backside passivation layer with PECVD method plating alundum (Al2O3) film after surface flocking and diffusion, arranges in pairs or groups
Silicon nitride film anti-reflection layer.Because alundum (Al2O3) and silicon nitride are insulating materials, follow-up silver paste aluminium paste electrode will be by swashing
The method and silicon face of light punching are connected.But the area of laser beam drilling is limited, so the dead resistance of electrode and silicon
Influence whether the collection of electric current to influence the efficiency of battery, and the technique that partially perforation causes PERC technologies with contact resistance
Complexity, and partially perforation also results in tapping in the presence of compound phenomenon.German Fraunhofer solar energy research institute
(Fraunhofer ISE) devises contact passivating technique:Passivation layer is that one layer of ultra-thin silica and one layer of doping silicon thin layer are constituted
Passivation, without perforate, the conduction of passivation layer is realized by metal oxide tunneling effect, but passivation layer is very thin in itself, needed
The technique wanted is relative complex.Therefore, on the basis of PERC technologies, in addition it is also necessary to develop the surface passivation side without partially perforation
Method.
Another scheme is to replace alundum (Al2O3) as passivation layer using conductive material, is expected to solve parasitism
The problem of resistance and big contact resistance, lift battery conversion efficiency.Transparent conductive oxide (TCO) is as electrode material in photoelectricity
Devices field is widely applied, and the zinc oxide (Aluminum doped Zinc oxide, AZO) of wherein aluminium doping has
Preparation technology is simple, easily realize the features such as adulterating, and has document (Solar Energy, 2014 (110), 595-602) report, passes through
AZO prepared by wet method has certain passivation properties, but technique prepared by wet method is complex, is not suitable for large-scale production.
Technique for atomic layer deposition (ALD technique) is a kind of advanced film growth techniques.It is excellent, suitable using ALD technique processability
The transparent conductive oxide material of passivation layer is done in PERC technologies, and there is not been reported.
The content of the invention
1st, the technical problems to be solved by the invention
The present invention be directed to the technological process of existing PERC battery technologies, it is processed using ALD technique, directly using can
Conductive transparent material layer is as passivation layer, so that the problem of solving dead resistance and big contact resistance, lifts battery conversion efficiency,
And suitable for producing in enormous quantities.
2nd, the technical scheme that the present invention is provided
The transparent conductive film of nano-stack based on technique for atomic layer deposition (ALD) preparation, for solar cell table
The passivation in face and electric current collection.Specific technical scheme is as follows:
The preparation method of the transparent conductive film of nano-stack, is prepared using technique for atomic layer deposition, is specifically included
Following main step:
(1) it will remove to carry on the back the silicon cell closed after washing and be loaded into the cavity of plated film, the face for needing plated film is in cavity
Exposed state, it is not necessary to blocked in the face of plated film;
(2) the technique vacuum that cavity is vacuumized in simultaneously holding chamber body is constant, and it is required that heating reaches the temperature in cavity
Technological temperature;
(3) 1~200 Al is circulated2O3Be deposited as transition zone, corresponding thickness range is 0.1-20 nanometers;
(4) n1 ZnO deposition is circulated, n2 Al is circulated2O3Deposition, wherein n1, n2 is non-zero positive integer;
(5) repeat step (4), the nano-stack conductive film of thickness needed for preparing;
(6) cavity directly cools or increased and cools after annealing steps, and vacuum breaker takes out silicon cell.
5~20 Al of preferred cycle in step (3)2O3Sedimentary be used as transition zone.Optimal cycle-index is 10 times.
The effect of this transition zone is that chemical bond passivation and field-effect passivation, the particularly negative electrical charge in transition zone are carried out to silicon face, is deposited
It is in the 1-3 nanometer ranges of interface, can effectively repels the electronics of silicon face, reduces hole with electronics near interface
It is compound, so as to lift the open-circuit voltage and photoelectric transformation efficiency of battery.Because nano-stack plays a part of electric current collection simultaneously,
So transition zone can not be hindered electric current while passivation is ensured by being formed.When the thickness of transition zone aluminum oxide film exists
At less than 2 nanometers, electric current can be in the form of tunnelling directly through not having obstruction.The preferred thickness range of corresponding transition zone
It is 0.5-2 nanometers.
Specifically, when being processed in step (1) to multi-disc silicon cell:In cell backside plated film, by multi-disc electricity
Pond is put and compressed face-to-face, in battery front side plated film, is put two panels battery is back-to-back and is compressed, to save process chamber
Space, increase production capacity.
Specifically, the range of choice of the technique vacuum in step (2) is 100 handkerchiefs to 1000 handkerchiefs, the selection model of technological temperature
Enclose for 100-300 degrees Celsius.
Specifically, step (3) conveys trimethyl aluminium into cavity by completely self-contained pipeline and gone in a pulsed fashion
The steam of ionized water, carrier gas uses nitrogen;The pulse train of deposition cycle is every time:Trimethyl aluminium pulse, nitrogen purging, go from
The pulse of sub- water vapour, nitrogen purging, the time is respectively 0.1 second, 2 seconds, 0.1 second, 2 seconds.
Specifically, step (4) conveys diethyl zinc, front three into cavity in a pulsed fashion by completely self-contained pipeline
The steam of base aluminium and deionized water, carrier gas uses nitrogen;The pulse train of each deposition cycles of ZnO is:Diethyl zinc pulse, nitrogen
Air-blowing is swept, the pulse of deionized water steam, nitrogen purging, the time is respectively 0.1 second, 2 seconds, 0.1 second, 2 seconds;Al2O3Deposit every time
The pulse train of circulation is:Trimethyl aluminium pulse, nitrogen purging, the pulse of deionized water steam, nitrogen purging, the time is respectively
0.1 second, 2 seconds, 0.1 second, 2 seconds.
Specifically, the preferred scope of the frequency n 1 of circulation is 1-100, and n2 preferred scope is 1-10.
Specifically, in step (6), after being circulated throughout of deposition plating, the step of annealing can also be increased before cavity cooling
Suddenly, required annealing time is defined by the annealing temperature that practical application needs.Such as 500 degrees Celsius of annealing temperature uses 30 points
The annealing of clock.
The application for the passivation layer that the transparent conductive film of nano-stack is used in solar cell, nano-stack is transparent
Conductive film is prepared using the above method, and when n-type is adulterated, the transparent conductive film of nano-stack can be used for cell p emitter stage
Field passivation, in p-doping the transparent conductive film of nano-stack be used for battery n emitter stages field be passivated.
Specifically, the transparent conductive film of described nano-stack mainly includes by ZnO layer and Al2O3It is basic that layer is constituted
Unit;The cycle-index n3 × (thickness of ZnO individual layers × ZnO individual layers circulation of gross thickness=elementary cell of conductive film in itself
Frequency n 1+Al2O3Thickness × Al of individual layer2O3Individual layer cycle-index n2);Aluminum oxide is in the transparent conduction of described nano-stack
Doping level in film is n2/ (n1+n2) at%.
Specifically, the scope of the gross thickness of the transparent conductive film of nano-stack is between 5 nanometers to 200 nanometers.
More specifically, the handkerchief of technique vacuum 100, technological temperature when preparing film in step (2) are 200 degrees Celsius, ZnO
The thickness of individual layer be 0.12nm, error range ± 0.01nm (can be different according to different method of testings and instrument error scope,
In the acceptable error range of those skilled in the art, similarly hereinafter), Al2O3The thickness of individual layer be 0.1nm, error range ±
0.01nm;On this condition, when the transparent conductive film of nano-stack aluminium doping level between 1.0at% to 7.1at% (this
Place includes endpoint value) when, the resistivity of film is 1.5 × 10-3Ohmcm to 3.0 × 10-3(wrapped herein between ohmcm
Include endpoint value).
The transparent conductive film of the nano-stack prepared using the above method is used to the solar cell for PERC structures
In back of the body passivation layer, make field passivation of type n semiconductor material available in p+ emitter stages, or in n+ emitter stages p-type half
Conductor material does field passivation.Passivation effect is than traditional Al-BSF battery (such as Solar Energy, 2014 (110), 595-602)
0.8% can be at least lifted in photoelectric transformation efficiency, electric conductivity can accomplish the Al-BSF battery directly contacted with sial
Quite.
On the material that other can be used, by taking AZO as an example, the material such as B, Al, Ga, In of ZnO doping three races;Or
Seven races' material such as Cl, I can become type n semiconductor material.The material of ZnO doping first family such as Li, Na, K;Or the 5th race
Material such as N, P, As can become p-type semi-conducting material.
3rd, beneficial effect:
(1) back of the body that the transparent conductive film of the nano-stack of this patent preparation is used in the solar cell of PERC structures is blunt
Change layer, passivation effect can at least lift 0.8% than traditional Al-BSF battery in photoelectric transformation efficiency, electric conductivity can be with
Accomplish that the Al-BSF battery directly contacted with sial is suitable.
(2) Al of PERC batteries2O3Passivation is to be based on Al2O3The interface passivation effect that the negative electrical charge of internal institute's band reaches
Should.ZnO inherently n-type semiconductors, more free electrons can be provided to reach its resistivity of reduction by being adulterated by Al
Effect.
(3) passivation layer, the conversion efficiency for the reduction solar cell that will not shut out the light are used as using transparent conductive oxide.
Brief description of the drawings
The cyclic sequence of the transparent conductive film of Fig. 1 nano-stacks
The example that the transparent conductive film of Fig. 2 nano-stacks is applied with the passivation on p-type PERC batteries.
The example that the transparent conductive film of Fig. 3 nano-stacks is applied with the passivation on n-type battery.
Embodiment
With reference to Figure of description and specific embodiment, the present invention is described in detail.
Embodiment 1
Different process conditions (technique vacuum, technological temperature), different proportioning (n1, n2, n3 numbers are used in this patent
Value, the doping level of aluminum oxide (n2/ (n1+n2) at%), the film for preparing heterogeneity (thickness, resistivity), specific each ginseng
Several relations is as follows:
The table of comparisons between the preparation condition of table 1, composition and property
Embodiment 2
In order to realize the purpose of the present invention, it is more convenient for collected current using the relatively low material of resistivity, considers preparation
The factors such as condition, proportioning, under conditions of the handkerchief of technique vacuum 100,200 degrees Celsius of technological temperature, fixed n2=1, control oxidation
When the doping level of aluminium in the film is between 1at% to 7at%, the resistivity of film is smaller, 1.5 × 10-3Ohmcm is arrived
3.0×10-3Change between ohmcm, and with 1.5 × 10 in experiment-3Ohmcm is a minimum measured value.
The table of comparisons between preparation condition, composition and the property of the preferred embodiment of table 2
Embodiment 3
The transparent conductive film of the nano-stack prepared using this patent method is used for the solar cell of PERC structures
In emitter stage passivation.Shown in reference picture 2, the zinc-oxide film adulterated with aluminium replaces the alumina layer in PERC batteries, its institute
It is negatively charged to play a part of passivation to the p emitter stages at the back side.Meanwhile, this conductive film can play a part of collected current,
Reduction is because of the small and elevated contact resistance of perforated area.The upper surface of this battery can also make of the transparent conductive film of p-doping
Passivation.
Embodiment 4
The transparent conductive film of the transparent nano-stack prepared using this patent method is used for n-type crystal silicon solar
Emitter stage passivation in battery.Shown in reference picture 3, the zinc-oxide film adulterated with aluminium is passivated to battery upper surface p emitter stages.Together
When, this conductive film can play a part of collected current, and this film is less in the absorption of visible frequency, does not interfere with light
Transmission.The back side of this battery can be also passivated with the transparent conductive film of p-doping.
The creation and embodiments thereof schematically to the present invention are described above, and protection scope of the present invention includes
But it is not limited to the description above.Shown in accompanying drawing is also one of embodiment of the invention, and actual structure is not
It is confined to this.So, if one of ordinary skill in the art is enlightened by the present invention, do not departing from the creation ancestor of the present invention
In the case of purport, the frame mode similar to technical scheme and embodiment are designed without creative, all should be belonged to
In the protection domain of this patent.
Claims (12)
1. a kind of preparation method of the transparent conductive film of nano-stack, it is characterised in that:Carried out using technique for atomic layer deposition
Prepare, specifically include following main step:
(1) it will remove to carry on the back close after washing silicon cell and be loaded into the cavity of plated film, need the face of plated film in cavity in exposure
State, it is not necessary to blocked in the face of plated film;
(2) the technique vacuum that cavity is vacuumized in simultaneously holding chamber body is constant, and heating makes the temperature in cavity reach required work
Skill temperature;
(3) circulate 1~200 Al2O3 is deposited as transition zone;
(4) n1 ZnO deposition is circulated, n2 Al2O3 deposition is circulated, wherein n1, n2 is non-zero positive integer;
(5) repeat step (4), the nano-stack conductive film of thickness needed for preparing;
(6) cavity directly cools or increased and cools after annealing steps, and vacuum breaker takes out silicon cell.
2. a kind of preparation method of the transparent conductive film of nano-stack according to claim 1, it is characterised in that:Step
(3) 5~20 Al of circulation in2O3Sedimentary be used as transition zone.
3. a kind of preparation method of the transparent conductive film of nano-stack according to claim 1, it is characterised in that:In step
When being processed suddenly in (1) to multi-disc silicon cell:In cell backside plated film, multi-disc battery is put and compressed face-to-face,
In battery front side plated film, put two panels battery is back-to-back and compresses, to save the space of process chamber, increase production capacity.
4. a kind of preparation method of the transparent conductive film of nano-stack according to claim 1 or 2 or 3, its feature exists
In:The range of choice of technique vacuum in step (2) is 100 handkerchiefs to 1000 handkerchiefs, and the range of choice of technological temperature is taken the photograph for 100-300
Family name's degree.
5. a kind of preparation method of the transparent conductive film of nano-stack according to claim 4, it is characterised in that:Step
(3) trimethyl aluminium and the steam of deionized water are conveyed into cavity by completely self-contained pipeline in a pulsed fashion, carrier gas is adopted
Use nitrogen;The pulse train of deposition cycle is every time:Trimethyl aluminium pulse, nitrogen purging, the pulse of deionized water steam, nitrogen
Purging, the time is respectively 0.1 second, 2 seconds, 0.1 second, 2 seconds.
6. a kind of preparation method of the transparent conductive film of nano-stack according to claim 4, it is characterised in that:Step
(4) diethyl zinc, the steaming of trimethyl aluminium and deionized water are conveyed into cavity by completely self-contained pipeline in a pulsed fashion
Vapour, carrier gas uses nitrogen;The pulse train of each deposition cycles of ZnO is:Diethyl zinc pulse, nitrogen purging, deionized water are steamed
The pulse of vapour, nitrogen purging, the time is respectively 0.1 second, 2 seconds, 0.1 second, 2 seconds;Al2O3The pulse train of deposition cycle is every time:
Trimethyl aluminium pulse, nitrogen purging, the pulse of deionized water steam, nitrogen purging, the time is respectively 0.1 second, 2 seconds, 0.1 second, 2
Second.
7. a kind of preparation method of the transparent conductive film of nano-stack according to claim 4, it is characterised in that:N1's
Scope is 1-100, and n2 scope is 1-10.
8. a kind of preparation method of the transparent conductive film of nano-stack according to claim 4, it is characterised in that:In step
Suddenly in (6), after being circulated throughout of deposition plating, the step of can also increasing annealing before cavity cooling, required annealing time with
The annealing temperature that practical application needs is defined.
9. a kind of application for the passivation layer that conductive film that nano-stack is transparent is used in solar cell, it is characterised in that:
The transparent conductive film of the nano-stack uses the method for any one claim in the claims to prepare, in n-type
The field that the transparent conductive film of nano-stack described in during doping is used for cell p emitter stage is passivated, described in p-doping
The field that the transparent conductive film of nano-stack is used for battery n emitter stages is passivated.
10. the passivation that a kind of conductive film that nano-stack is transparent according to claim 9 is used in solar cell
The application of layer, it is characterised in that:The transparent conductive film of described nano-stack mainly includes by ZnO layer and Al2O3Layer composition
Elementary cell;The cycle-index n3 × (thickness of ZnO individual layers × ZnO individual layers of gross thickness=elementary cell of conductive film in itself
Cycle-index n1+Al2O3Thickness × Al of individual layer2O3Individual layer cycle-index n2);Aluminum oxide is transparent in described nano-stack
Doping level in conductive film is n2/ (n1+n2) at%.
11. the passivation that a kind of conductive film that nano-stack is transparent according to claim 9 is used in solar cell
The application of layer, it is characterised in that:The scope of the gross thickness of the transparent conductive film of described nano-stack is received at 5 nanometers to 200
Between rice.
12. a kind of conductive film that nano-stack is transparent according to claim 9 to 11 is used in solar cell
The application of passivation layer, it is characterised in that:Technique vacuum when preparing film in step (2) is that 100 handkerchiefs, technological temperature are 200
Degree Celsius when, the thickness of ZnO individual layers is 0.12nm, Al2O3The thickness of individual layer is 0.1nm;Led when described nano-stack is transparent
When the aluminium doping level of conductive film is between 1.0at% to 7.1at%, the resistivity of film is 1.5 × 10-3Ohmcm to 3.0 ×
10-3Between ohmcm.
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