CN106973524A - A kind of uncovering method of Rigid Flex - Google Patents
A kind of uncovering method of Rigid Flex Download PDFInfo
- Publication number
- CN106973524A CN106973524A CN201710261837.5A CN201710261837A CN106973524A CN 106973524 A CN106973524 A CN 106973524A CN 201710261837 A CN201710261837 A CN 201710261837A CN 106973524 A CN106973524 A CN 106973524A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- additional
- hardboard
- prepreg
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of uncovering method of Rigid Flex, it comprises the following steps：Etching removes the first additional hardboard copper foil in the range of correspondence first window successively from top to bottom, and etching removes the second additional hardboard copper foil in the second window ranges of correspondence successively from the bottom up；Pass through CO2Laser machine from top to bottom successively burns up the first additional prepreg in the range of correspondence first window, passes through CO2Laser machine from the bottom up successively burns up the second additional prepreg in the second window ranges of correspondence；First foundation hardboard copper foil in the range of correspondence first window is removed by etching, the second basic hardboard copper foil in the second window ranges of correspondence is removed by etching.Present invention, avoiding taking off easily broken, the soft board layer surface of lid in the case of Panel area is smaller there are the unusual conditions such as cover plate residual, the production quality and production efficiency of product are improved.
Description
Technical field
The present invention relates to a kind of uncovering method of Rigid Flex, the invention belongs to the production method technology of printed substrate
Field.
Background technology
In line with current product is lightening, the principle of lightweight and miniaturization, present client gets over for printed substrate requirement
Come higher, further optimize Rigid Flex to reduce the connector between soft board and hardboard, present Rigid Flex soft board is long
Degree is less and less, at this stage industry FPCB（I.e. soft or hard combination printed substrate）Soft board is uncapped after production typically using UV after shaping
（Laser cutting machine）After the soft or hard handing-over line of cutting, made in the mode for peeling off its soft board upper cover plate manually.Due to market production
Product are lightening and densification, and such a mode has the problem of less soft board width can not divest cover plate manually.
Uncapped after the radium-shine cuttings of UV production method, be to need the protective layer that will remain in soft board surface manually to peel off, so that
Expose the required soft board region of client, reach the effect of finished product, if the less FPCB of soft board width（I.e. soft or hard combination print
Brush wiring board）, because being accumulated small by soft board leptoprosopy, cover plate is very easy to fracture in manual peel off and remained on soft board, then this
The mode of kind will influence production time and product quality.
The content of the invention
The purpose of the present invention be overcome the deficiencies in the prior art there is provided one kind it is easy to operate, product can be lifted
Convenience in process of production and a kind of uncovering method of Rigid Flex of production quality.
A kind of technical scheme provided according to the present invention, uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate, the first flexible plate copper foil, second soft
Plate copper foil, the first cover layer, the second cover layer, first foundation prepreg, the second basic prepreg, first foundation hardboard copper
Paper tinsel, the second basic hardboard copper foil, the first additional prepreg, the second additional prepreg, the first additional hardboard copper foil and second
Additional hardboard copper foil, the first additional hardboard copper foil is identical with the quantity of the second additional hardboard copper foil, in first foundation prepreg
On offer first window, the position of the second window, first window and the second window is offered on the second basic prepreg
It is corresponding；The first flexible plate copper foil is connected with the upper surface of soft board substrate, the second soft board is connected with the lower surface of soft board substrate
Copper foil, the first cover layer is connected with the upper surface of the first flexible plate copper foil, and second is connected with the lower surface of the second flexible plate copper foil
Cover layer, first foundation prepreg is connected with the upper surface of the first cover layer, is connected with the lower surface of the second cover layer
Second basic prepreg, first foundation hardboard copper foil is connected with the upper surface of first foundation prepreg, on the second basis
The lower surface of prepreg is connected with the second basic hardboard copper foil, be connected with the upper surface of first foundation hardboard copper foil one layer or
Between the first additional hardboard copper foil that more than one layer of person, the additional hardboard copper foil of adjacent two layers first and positioned at the first of bottom
It is connected between additional hardboard copper foil and first foundation hardboard copper foil by the first additional prepreg, in the second basic hardboard copper foil
Lower surface be connected between one layer or more than one layer of the second additional hardboard copper foil, the additional hardboard copper foil of adjacent two layers second
And pass through the second additional prepreg phase between the second additional hardboard copper foil positioned at bottom and the second basic hardboard copper foil
Even；
B, the first additional hardboard copper foil positioned at the top in the range of correspondence first window removed by etching, will correspondingly the
The second additional hardboard copper foil positioned at bottom in two window ranges is removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg in the range of correspondence first window, pass through CO2Laser machine
The second additional prepreg in the second window ranges of correspondence will be burnt up；
D, repeat step b and step c, step b and step c number of repetition are additional by the first additional hardboard copper foil or second
The quantity of hardboard copper foil few 1；
E, by correspondence first window in the range of first foundation hardboard copper foil by etch remove, will correspondence the second window ranges in
The second basic hardboard copper foil pass through to etch and remove.
Preferably, the quantity of the first additional hardboard copper foil is one layer, two layers or three layers.
Advantages of the present invention is as follows：
1st, the production efficiency of product is improved, factory's process capability is improved, factory is made the higher product of precision；
When the 2nd, improving the smaller personnel of soft board area and taking off lid, the abnormal problem of cover plate easy fracture or residual.
Brief description of the drawings
Fig. 1 is the structural representation of the Rigid Flex in the step a of the embodiment of the present invention 1.
Fig. 2 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step b.
Fig. 3 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step c.
Fig. 4 is structural representation of the embodiment of the present invention 1 by the obtained Rigid Flexs of step e.
Embodiment
With reference to specific embodiment, the invention will be further described.
Embodiment 1
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, the
The basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, second
The basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional half
Cured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and second
The quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis half
The second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1
The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil
2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,
First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2
There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,
The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1
Upper surface be connected with one layer of first additional hardboard copper foil 7.1, the first additional hardboard copper foil 7.1 and first foundation hardboard copper foil
It is connected between 5.1 by the first additional prepreg 6.1, one layer the is connected with the lower surface of the second basic hardboard copper foil 5.2
Pass through second additional half between two additional hardboard copper foils 2.2, the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and second
Cured sheets 6.2 are connected；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be right
The second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2Radium
The second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window model
The second basic hardboard copper foil 5.2 in enclosing is removed by etching.
Embodiment 2
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, the
The basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, second
The basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional half
Cured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and second
The quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis half
The second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1
The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil
2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,
First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2
There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,
The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1
Upper surface be connected between two layer of first additional hardboard copper foil 7.1, the additional hardboard copper foil 7.1 of adjacent two layers first and be located at
Pass through the phase of the first additional prepreg 6.1 between the first additional hardboard copper foil 7.1 and first foundation hardboard copper foil 5.1 of bottom
Even, two layer of second additional hardboard copper foil 2.2 is connected with the lower surface of the second basic hardboard copper foil 5.2, adjacent two layers second are attached
Between stiffened plate copper foil 7.2 and between the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and second of bottom
It is connected by the second additional prepreg 6.2；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be right
The second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2Radium
The second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
D, repeat step b and step c are once；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window model
The second basic hardboard copper foil 5.2 in enclosing is removed by etching.
Embodiment 3
A kind of uncovering method of Rigid Flex comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate 1, the first flexible plate copper foil 2.1, the
The basic semi-solid preparation of two flexible plate copper foils 2.2, the first cover layer 3.1, the second cover layer 3.2, first foundation prepreg 4.1, second
The basic hardboard copper foil 5.2 of piece 4.2, first foundation hardboard copper foil 5.1, second, the first additional prepreg 6.1, second additional half
Cured sheets 6.2, the first additional hardboard copper foil 7.2 of additional hardboard copper foil 7.1 and second, the first additional hardboard copper foil 7.1 and second
The quantity of additional hardboard copper foil 7.2 is identical, and first window is offered on first foundation prepreg 4.1, on the second basis half
The second window is offered in cured sheets 4.2, first window is corresponding with the position of the second window；In the upper surface of soft board substrate 1
The first flexible plate copper foil 2.1 is connected with, the second flexible plate copper foil 2.2 is connected with the lower surface of soft board substrate 1, in the first flexible plate copper foil
2.1 upper surface is connected with the first cover layer 3.1, and the second cover layer 3.2 is connected with the lower surface of the second flexible plate copper foil 2.2,
First foundation prepreg 4.1 is connected with the upper surface of the first cover layer 3.1, is connected in the lower surface of the second cover layer 3.2
There is the second basic prepreg 4.2, first foundation hardboard copper foil 5.1 be connected with the upper surface of first foundation prepreg 4.1,
The second basic hardboard copper foil 5.2 is connected with the lower surface of the second basic prepreg 4.2, in first foundation hardboard copper foil 5.1
Upper surface be connected between three layer of first additional hardboard copper foil 7.1, the additional hardboard copper foil 7.1 of adjacent two layers first and be located at
Pass through the phase of the first additional prepreg 6.1 between the first additional hardboard copper foil 7.1 and first foundation hardboard copper foil 5.1 of bottom
Even, three layer of second additional hardboard copper foil 2.2 is connected with the lower surface of the second basic hardboard copper foil 5.2, adjacent two layers second are attached
Between stiffened plate copper foil 7.2 and between the second additional basic hardboard copper foil 5.2 of hardboard copper foil 7.2 and second of bottom
It is connected by the second additional prepreg 6.2；
B, by correspondence first window in the range of the first additional hardboard copper foil 7.1 positioned at the top by etching removal, will be right
The second additional hardboard copper foil 7.2 positioned at bottom in the second window ranges is answered to be removed by etching；
C, pass through CO2Laser machine will burn up the first additional prepreg 6.1 in the range of correspondence first window, pass through CO2Radium
The second additional prepreg 6.2 in the second window ranges of correspondence will be burnt up by penetrating machine；
D, repeat step b and step c are once；
E, by correspondence first window in the range of first foundation hardboard copper foil 5.1 by etch remove, will correspondence the second window model
The second basic hardboard copper foil 5.2 in enclosing is removed by etching.
The present invention is removed the first additional hardboard copper foil 7.1 in Panel area and used successively from top to bottom using engraving method
Engraving method removes the second additional hardboard copper foil 7.2 successively from the bottom up, then using CO2Laser machine is removed successively from top to bottom
First additional prepreg 6.1 and remove the second additional prepreg 6.2 successively from the bottom up, finally, use engraving method
Remove the basic hardboard copper foil 5.2 of first foundation hardboard copper foil 5.1 and second so that by soft board substrate 1, the first flexible plate copper foil 2.1,
The soft board layer that second flexible plate copper foil 2.2, the first cover layer 3.1 are constituted with the second cover layer 3.2 exposes, and will not thus occur
Easily broken, the soft board layer surface of lid is taken off in the case of Panel area is smaller the unusual conditions such as cover plate residual, improves the product of product
Matter and production efficiency.
Claims (2)
1. a kind of uncovering method of Rigid Flex, it is characterized in that this method comprises the following steps：
A, take ready-made Rigid Flex, the Rigid Flex includes soft board substrate（1）, the first flexible plate copper foil
（2.1）, the second flexible plate copper foil（2.2）, the first cover layer（3.1）, the second cover layer（3.2）, first foundation prepreg
（4.1）, the second basic prepreg（4.2）, first foundation hardboard copper foil（5.1）, the second basic hardboard copper foil（5.2）, first
Additional prepreg（6.1）, the second additional prepreg（6.2）, the first additional hardboard copper foil（7.1）With the second additional hardboard copper
Paper tinsel（7.2）, the first additional hardboard copper foil（7.1）With the second additional hardboard copper foil（7.2）Quantity it is identical, it is solid in first foundation half
Change piece（4.1）On offer first window, in the second basic prepreg（4.2）On offer the second window, first window with
The position of second window is corresponding；In soft board substrate（1）Upper surface be connected with the first flexible plate copper foil（2.1）, in soft board substrate
（1）Lower surface be connected with the second flexible plate copper foil（2.2）, in the first flexible plate copper foil（2.1）Upper surface be connected with the first covering
Film（3.1）, in the second flexible plate copper foil（2.2）Lower surface be connected with the second cover layer（3.2）, in the first cover layer（3.1）'s
Upper surface is connected with first foundation prepreg（4.1）, in the second cover layer（3.2）Lower surface to be connected with the second basis half solid
Change piece（4.2）, in first foundation prepreg（4.1）Upper surface be connected with first foundation hardboard copper foil（5.1）, in the second base
Plinth prepreg（4.2）Lower surface be connected with the second basic hardboard copper foil（5.2）, in first foundation hardboard copper foil（5.1）'s
Upper surface is connected with one layer or more than one layer of the first additional hardboard copper foil（7.1）, the additional hardboard copper foil of adjacent two layers first
（7.1）Between and positioned at the first additional hardboard copper foil of bottom（7.1）With first foundation hardboard copper foil（5.1）Between pass through
First additional prepreg（6.1）It is connected, in the second basic hardboard copper foil（5.2）Lower surface be connected with one layer or one layer with
On the second additional hardboard copper foil（2.2）, the additional hardboard copper foil of adjacent two layers second（7.2）Between and positioned at the of bottom
Two additional hardboard copper foils（7.2）With the second basic hardboard copper foil（5.2）Between pass through the second additional prepreg（6.2）It is connected；
B, by correspondence first window in the range of the first additional hardboard copper foil positioned at the top（7.1）Removed by etching, will
The second additional hardboard copper foil positioned at bottom in the second window ranges of correspondence（7.2）Removed by etching；
C, pass through CO2Laser machine by by correspondence first window in the range of the first additional prepreg（6.1）Burn-up, passes through CO2Radium
Penetrate the second additional prepreg that machine will will be corresponded in the second window ranges（6.2）Burn-up；
D, repeat step b and step c, step b and step c number of repetition pass through the first additional hardboard copper foil（7.1）Or the
Two additional hardboard copper foils（7.2）Quantity few 1；
E, by correspondence first window in the range of first foundation hardboard copper foil（5.1）Removed by etching, by the second window of correspondence
In the range of the second basic hardboard copper foil（5.2）Removed by etching.
2. a kind of uncovering method of Rigid Flex as claimed in claim 1, it is characterized in that：The first additional hardboard copper foil
（7.1）Quantity be one layer, two layers or three layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710261837.5A CN106973524A (en) | 2017-04-20 | 2017-04-20 | A kind of uncovering method of Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710261837.5A CN106973524A (en) | 2017-04-20 | 2017-04-20 | A kind of uncovering method of Rigid Flex |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106973524A true CN106973524A (en) | 2017-07-21 |
Family
ID=59332256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710261837.5A Pending CN106973524A (en) | 2017-04-20 | 2017-04-20 | A kind of uncovering method of Rigid Flex |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106973524A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302577A (en) * | 2021-12-06 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board cover uncovering area |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102811567A (en) * | 2012-08-17 | 2012-12-05 | 惠州中京电子科技股份有限公司 | Flexible and rigid combined plate process and uncapping method |
| CN104202928A (en) * | 2014-09-12 | 2014-12-10 | 高德（江苏）电子科技有限公司 | Production method for rigid-flex board |
| EP2816443A2 (en) * | 2013-06-20 | 2014-12-24 | Samsung Electronics Co., Ltd | Protective apparatus for electronic device |
-
2017
- 2017-04-20 CN CN201710261837.5A patent/CN106973524A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102811567A (en) * | 2012-08-17 | 2012-12-05 | 惠州中京电子科技股份有限公司 | Flexible and rigid combined plate process and uncapping method |
| EP2816443A2 (en) * | 2013-06-20 | 2014-12-24 | Samsung Electronics Co., Ltd | Protective apparatus for electronic device |
| CN104202928A (en) * | 2014-09-12 | 2014-12-10 | 高德（江苏）电子科技有限公司 | Production method for rigid-flex board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302577A (en) * | 2021-12-06 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board cover uncovering area |
| CN114302577B (en) * | 2021-12-06 | 2023-07-14 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of soft and hard combined circuit board uncovering area |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107846791A (en) | Uncapped before a kind of Rigid Flex and protect the production method of soft board | |
| WO2013071795A1 (en) | Method for manufacturing rigid-flexible printed circuit board and the rigid-flexible printed circuit board | |
| CN110324992A (en) | A kind of processing technology that Rigid Flex is uncapped using V-Cut docking cutting | |
| CN107846792A (en) | A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board | |
| CN106535510A (en) | Method for producing rigid-flex PCB lid | |
| CN112040670A (en) | Uncovering method of ultrathin rigid-flex printed circuit board | |
| CN107846793A (en) | The technique that a kind of Rigid Flex is pressed using hardboard mode | |
| CN104202928A (en) | Production method for rigid-flex board | |
| CN105072810A (en) | Method for producing double-surface thick copper flexible working board | |
| CN103635005A (en) | Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing methods | |
| CN105050325A (en) | Rigid-flex printed circuit board milling method | |
| CN106973524A (en) | A kind of uncovering method of Rigid Flex | |
| WO2008111309A1 (en) | Recognition mark, and circuit substrate manufacturing method | |
| CN106341944B (en) | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad | |
| TW200718313A (en) | Two-layer flexible printed board and process for preparing the same | |
| CN102244974B (en) | Hollowed-out FPC and manufacturing method thereof | |
| CN104470250A (en) | Manufacturing method for flexible and rigid combined circuit board | |
| CN110191597A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN101742822B (en) | Method for peeling rigid board from flexible board area of flexible-rigid board | |
| CN106231814A (en) | The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens | |
| CN109104824A (en) | A kind of production method of rigid-flexible combined circuit plate | |
| CN107548244A (en) | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based | |
| CN108207078A (en) | Improve the manufacture craft that rigid-flex combined board takes off lid leak | |
| CN103338599B (en) | A kind of Rigid Flex processing technology | |
| CN106132120B (en) | A kind of processing technology of the soft or hard combination printed wiring board with protective film protection soft board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170721 |