CN106965042A - The method for grinding of ceramic workpiece - Google Patents

The method for grinding of ceramic workpiece Download PDF

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Publication number
CN106965042A
CN106965042A CN201710194709.3A CN201710194709A CN106965042A CN 106965042 A CN106965042 A CN 106965042A CN 201710194709 A CN201710194709 A CN 201710194709A CN 106965042 A CN106965042 A CN 106965042A
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CN
China
Prior art keywords
grinding
ceramic workpiece
ceramic
emery wheel
workpiece
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Granted
Application number
CN201710194709.3A
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Chinese (zh)
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CN106965042B (en
Inventor
何智安
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Shenzhen Everwin Precision Technology Co Ltd
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Shenzhen Everwin Precision Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

A kind of method for grinding of ceramic workpiece, comprises the following steps：S1, initial networked control systems, make the grinding wheel component of grinding machine be located at one end of some ceramic workpieces being arranged in a linear in X-direction, and now the position of the emery wheel is defined as initial position；S2, startup control system, control the emery wheel to rotate, and control the workbench of the emery wheel or some ceramic workpieces of carrying to be moved from initial position along X-direction with to the progress first time grinding of the machined surface of several ceramic workpieces；S3, the change grinding wheel component increase cutting output in Z-direction position, and repeat step S2 is ground again to the machined surface of the ceramic workpiece, until multiple cutting output sum is equal to predetermined grinding thichness.The application method for grinding makes the ceramic workpiece after processing possess more excellent flatness.

Description

The method for grinding of ceramic workpiece
Technical field
The application is related to field of ceramic processing, espespecially a kind of method for grinding of ceramic workpiece.
Background technology
In the mobile terminal such as 3C fields, particularly smart mobile phone, wearable device, with the upgrading of network, for terminal The receiving ability requirement more and more higher of antenna, existing smart mobile phone typically use metal material manufacture shell, and metal material pair There is obvious shielding problem in aerial signal.After network upgrade to 5G, the antenna for mobile phone of metal material shell is unable to reach Performance requirement is, it is necessary to which a kind of new material solves the above problems.
Ceramic material possesses high rigidity, glossiness more more preferable than metal, and aerial signal is not present screening effect, but pottery The hardness of ceramic material is very high, and diamond is only second to more than stainless steel.It is unable to reach in the sintering process of ceramic material accurate Flatness, it is necessary to carry out retrofit to obtain final product to ceramic workpiece after sintering, and high rigidity becomes plus The problem of work.Manufacturing procedure to mobile phone ceramic package typically roughly grinds plane, including following process using big water mill：Big water mill is thick Plane-sandblasting-CNC processing inner chamber-annealing.At present, the flatness of big water mill grinding is also than larger, about 0.2-0.3mm Left and right, sandblasting process release internal stress can optimize and revise flatness about 0.05mm or so；CNC processing rear interior cavity deformations exist Between 0.15-0.2；8H is made annealing treatment at 1050 DEG C and increases hardness flatness stabilization between 0.1-0.2mm.Above process is answered Miscellaneous, processing cost is very high, and subject matter is in flatness, if can control plane degree in below 0.1mm, sandblasting below with Annealing process can be cancelled, and so can not only improve the flatness of ceramic idiosome and can also save substantial amounts of time and cost, Improve production quality and efficiency.
The content of the invention
In consideration of it, being necessary to provide a kind of method for grinding of ceramic workpiece to complete the mill to the ceramic workpiece machined surface Processing is cut, the flatness on ceramic workpiece surface is reached more preferable effect.
In order to solve the above technical problems, this application provides a kind of method for grinding of ceramic workpiece, comprising the following steps：
S1, initial networked control systems, make the grinding wheel component of grinding machine be located at some potters being arranged in a linear in X-direction One end of part, now the position of the emery wheel be defined as initial position；
S2, startup control system, control the emery wheel to rotate, and control the work of the emery wheel or some ceramic workpieces of carrying Platform moves to carry out first time grinding to the machined surface of several ceramic workpieces from initial position along X-direction；
S3, the change grinding wheel component increase cutting output in Z-direction position, and repeat step S2 is to the ceramic workpiece Machined surface is ground again, until multiple cutting output sum is equal to predetermined grinding thichness.
Preferably, the step S1 includes：
Set machined parameters；
The grinding wheel component is adjusted in the position of Z-direction to determine first time cutting output, the workbench is adjusted in XY With the relative position of the grinding wheel component in plane, initial processing position is determined, makes the grinding wheel component contact X-direction outermost A ceramic workpiece machined surface edge.
Preferably, the ceramic workpiece is more than width of the emery wheel in Y direction of the grinding wheel component in the width of Y direction Degree, step S2 includes：
Along X-axis with carrying the workbench of some ceramic workpieces relative movement occurs for S201, the emery wheel until the emery wheel A grinding of X-direction is completed relative to the other end of the initial position positioned at X-direction, X-direction is once Grinding completes the processing of the part machining area equal with the grinding wheel width to some ceramic workpiece Y directions； Now, the emery wheel is defined as the second place in the position of X-direction；
S202, the amount of feeding is given, the emery wheel is sent out in the contact position of Y direction and the machined surface of the ceramic workpiece It is raw to change；The emery wheel is moved with completion pair along the X-direction direction opposite relative to step S201 and the workbench Grinding of the ceramic workpiece machined surface in the machining area of Y direction one fixed width；
S203, repeat step S201, S202 are until complete the grinding at least one times to all machined surfaces of the ceramic workpiece Processing.
Preferably, the amount of feeding is changed by the mobile workbench in the position of Y direction, the amount of feeding For 5-30mm.
Preferably, the amount of feeding is changed by the mobile grinding wheel component in the position of Y direction, the feeding Measure as 5-30mm.
Preferably, the amount of feeding is 10mm.
Preferably, the cutting output parameter is 0.005-0.05mm.
Preferably, the cutting output parameter is 0.01mm.
Preferably, the grinding wheel speed of the grinding wheel component is 1500-3000rad/min.
Preferably, the grinding wheel speed of the grinding wheel component is 2400rad/min
The application is improved grinding parameter, is realized more preferable flatness, can cancelled follow-up by many experiments Sandblasting, annealing operation, greatly reduce processing cost, improve processing efficiency.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen Schematic description and description please is used to explain the application, does not constitute the improper restriction to the application.
Fig. 1 is the stereogram of the application grinding machine；
Fig. 2 is provided with the stereogram of ceramic workpiece for the fixture of the application grinding machine；
Fig. 3 is the stereogram of the fixture of the application grinding machine；
Fig. 4 is the stereogram of the positioning element of the fixture of the application grinding machine；
Fig. 5 is the stereogram of the locking member of the fixture of the application grinding machine；
Fig. 6 is the structural representation of the application ceramic workpiece；
Fig. 7 is the schematic side view that the application grinding machine is processed；
Fig. 8 is the schematic top plan view that the application grinding machine is processed.
Embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and Technical scheme is clearly and completely described corresponding accompanying drawing.Obviously, described embodiment is only the application one Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing Go out the every other embodiment obtained under the premise of creative work, belong to the scope of the application protection.
Refer to shown in Fig. 2 to Fig. 6, the fixture 50 of the application includes bottom plate 51, some folders being placed on the bottom plate 51 Seat 53 and the holder 53 is coordinated to fix the locking part 52 of ceramic workpiece 60.
The generally rectangular shaped structure of the holder 53, including main part 531, from the main part 531 it is adjacent first, second Side upwardly extends the block 532 to be formed, the stage portion 535 raised up from the middle of the main part 531, located at the step Adsorption structure 533 in the middle of portion 535 and located at the main part 531 it is adjacent the 3rd, the excision of four side combination edge Portion 534.The generally rectangular shaped structure of the ceramic workpiece 60, including machined surface 61, the opposite side of relative machined surface 61 are recessed to be formed Some inner chambers 63 and the side wall 62 positioned at the periphery of inner chamber 63, the stage portion 535 are the interior of the imitation ceramic workpiece 60 The structure setting of chamber 63, i.e., the inner chamber 63 of described ceramic workpiece 60 is fastened in the stage portion 535.The adsorption structure 533 Including connect valve (not shown) passage 5331, located at the top surface of stage portion 535 and with the UNICOM of passage 5331 Some air drains 5332 and the O-ring seal 5333 located at the periphery of adsorption structure 533.The outward flange of the cutout unit 534 It is less than or equal to the thickness of the side wall 62 of the periphery of 60 inner chamber of ceramic workpiece 63 apart from the vertical range of the stage portion 535. The vertical range of stage portion 535 described in the inner distance of the block 532 is not more than the periphery of 60 inner chamber of ceramic workpiece 63 The thickness of side wall 62.
The locking part 52 includes body 521, the opening portion 524 for being opened in described one end of body 521, described in The bottom side of body 521 protrudes location division 523, clamping screw 528 and the fixing bar through the body 521 that extension is formed Hole 522.The cutout unit 534 of the opening portion 524 correspondence holder 53, the opening portion 524 include the first locating surface 525, Second locating surface 526 and the curved portions 527 between the locating surface 526 of the first locating surface 525 and second, described first Angle between locating surface 525 and second locating surface 526 is according to the knot between the adjacent two side 62 of the ceramic workpiece 60 Structure is adjusted, it is generally the case that first locating surface 525 is mutually perpendicular to second locating surface 526.The curved portions 527 Radian adjustment according to the edge of the ceramic workpiece 60.The bar hole 522 that holds is along first locating surface 525 and second The center line extension of locating surface 526.The center line of the locating surface 526 of first locating surface 525 and second and the ceramic workpiece 60 Diagonal is overlapped.
Locating slot 511, the locating slot 511 are provided with the position of cutout unit 534 of the correspondence of bottom plate 51 holder 53 It is interior to be provided with the screw 512 latched for the clamping screw 528.The location division 523 of the locking part 52 is contained in the positioning In groove 511, length of the locating slot 511 in the center line direction of the locating surface 526 of the first locating surface 525 and second is more than institute The length of location division 523 is stated so that the location division 523 can be in center line direction adjusting position.The locating slot 511 is hanging down The width in the straight center line direction is equal with the width of the location division 523 so that the locating slot 511 is perpendicular to described The position of the location division 523 is fixed in center line direction.The clamping screw 528 by the fixing bar hole 522 adjust with it is described The relative position of locking part 52.
In process, the inner chamber 63 of the ceramic workpiece 60 is first fastened in the stage portion 535 of the holder 53, is started External air exhauster vacuumizes the air drain 5332 by the passage 5331, make the ceramic workpiece 60 inner chamber 63 it is interior Side is adsorbed in the fixation that above-below direction is realized on the adsorption structure 533, and the O-ring seal 5333 ensures the air drain It is air tight in the range of 5332.Two side walls 62 of the ceramic workpiece 60 are held on the first side of the holder 53, the second side Between the block 532 and the stage portion 535 on side；Two other junction of side wall 62 of the ceramic workpiece 60 is exposed to described The position of cutout unit 534 of holder 53, and first, second locating surface 525, the 526 laminating pottery for passing through the locking part 52 Realize positioning in 60 corresponding two outer surfaces of side wall 62 of porcelain workpiece.The locking part 52 passes through pair in the ceramic workpiece 60 Linea angulata direction is adjusted with being fixed after the relative position of the ceramic workpiece 60 by the clamping screw 528.
To ensure that the holder 53 is not damaged to ceramic workpiece, the holder 53 uses bakelite material.
Emphasis is refering to shown in Fig. 1, Fig. 7, Fig. 8, and the fixture application of the application is in the grinding of grinding machine, and the grinding machine includes Base 10, the vertical portion 20 projected upwards from the base 10, the mobile work platform 40 on the base 10, it is installed on institute State the grinding wheel component 30 on vertical portion 20 and positioned at the top of mobile work platform 40, the folder being placed in the mobile work platform 40 Tool 50 and control system (not shown).
The grinding wheel component 30 can realize the shifting of Z-direction on the vertical portion 20 under the control of the control system It is dynamic, it is coated with diamond dust on the emery wheel of the grinding wheel component 30.The mobile work platform 40 structure in the form of slot, including inside groove 41 and positioned at the periphery of the inside groove 41 enclosing portion 42 to prevent coolant from spilling, can be by provided with pore structure in the inside groove 41 Liquid drain enters in other containers.The mobile work platform 40 can realize movement in X, Y plane.The sand of the grinding wheel component 30 The width of wheel is less than the length of the ceramic workpiece 60.
After the ceramic workpiece 60 is fixed on the fixture 50, the lower section of the grinding wheel component 30 is placed in；The application's Grinding machine processing technology is as follows：
S1, initial networked control systems；
This step includes adjusting position in X/Y plane of the mobile work platform 40, the grinding wheel component 30 in Z axis side To position, make the emery wheel of the grinding wheel component 30 and machined surface 61 in the outermost ceramic workpiece 60 of X-direction mutual Contact, the initialization also includes setting various machined parameters；The grinding wheel component 30 is determined to institute in the position of Z-direction The cutting output of machined surface 61 is stated, the mobile work platform 40 is the processing of 30 pairs of grinding wheel component in the change in location of Y direction The processing amount of feeding in face 61, the rotating speed of grinding wheel component 30 represents the rotating speed of board, and the X-direction is 30 pairs of the grinding wheel component The machining path of the machined surface 61.
S2, activation system, the emery wheel are carried out from initial position along X-direction to the machined surface of several ceramic workpieces 60 First time grinding；
After S201, initialization, the grinding wheel component 30 has been set in the initialized location of Z axis according to cutting output, described The relative position of grinding wheel component 30 and the ceramic workpiece 60 similarly determines, i.e., location A as shown in Figure 8, the mobile working Platform 40 is moved in the X-axis direction from the location A, make the emery wheel of the grinding wheel component 30 in X-direction to the machined surface 61 in Y The subregion of direction of principal axis carries out straight line grinding until the wheel grinding completes last ceramic workpiece 60；Now, The emery wheel is located relative to the second place of the initialized location；
S202, then, the control system adjusts the mobile work platform 40 by the amount of feeding of setting in Y direction Position, changes the emery wheel with the ceramic workpiece 60 in the machining area of Y direction, i.e., B location shown in Fig. 8；Complete feeding Afterwards, the mobile work platform 40 is straight to some progress of ceramic workpieces 60 grindings in X direction from the second place To initial position.
S203, repeat step S202 are until complete the region-wide grinding to the machined surface of the ceramic workpiece 60.
S3, the change grinding wheel component 30 are in the cutting output of Z-direction, and repeat step S2 is again to the ceramic workpiece 60 Machined surface be ground again, until the cutting output sum be equal to predetermined grinding thichness.
It should be noted that the control system is by controlling the mobile work platform 40 to realize X/Y plane internal coordinate Change, by controlling the grinding wheel component 30 to realize the change of Z axis coordinate, in specific implementation process, the change of the coordinate Change, can individually be completed by grinding wheel component 30, can also individually be completed by the mobile work platform 40, equally can be two Person is combined to complete.
Drawn by constantly verifying, the grinding machine is processed the ceramic workpiece 60 using following parameter and can effectively controlled The aggregation of stress in process and the deformation produced, but the process time of the big water mill of extension that at the same time can be relative, extension Time can control 0.05mm or so in 10min or so, flatness.Board rotating speed described in grinding machine parameter after improvement is initialized For 2000-2600rad/min, optimal is 2400rad/min；Cutting at one time amount is 0.005-0.05mm, and optimal is 0.01mm；Institute The amount of feeding is stated for 5-30mm, optimal is 10mm.Follow-up sandblasting can be cancelled with annealing process to adjust later by making this adjustment Flatness, so that improving production efficiency, reduces cost, improves processing quality.
Table 1 below is to be processed using traditional handicraft with the application technique to being sampled 10 respectively with a collection of ceramic workpiece 60 The flatness comparison data obtained afterwards：
Table 1
As it can be seen from table 1 after using the method for grinding of the application, can reach with annealing process without carrying out sandblasting More good flatness.Cancel blasting craft, processing cost can be saved, shorten process time.Cancel annealing treating process, Increase idiosome toughness of material, shorten technique processing cost and process time.
The application is improved grinding parameter, is realized more preferable flatness, can cancelled follow-up by many experiments Sandblasting, annealing operation, greatly reduce processing cost, improve processing efficiency.
It should also be noted that, term " comprising ", "comprising" or its any other variant are intended to nonexcludability Comprising so that process, method, commodity or equipment including a series of key elements are not only including those key elements, but also wrap Include other key elements being not expressly set out, or also include for this process, method, commodity or equipment intrinsic want Element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that wanted including described Also there is other identical element in process, method, commodity or the equipment of element.
Embodiments herein is the foregoing is only, the application is not limited to.For those skilled in the art For, the application can have various modifications and variations.It is all any modifications made within spirit herein and principle, equivalent Replace, improve etc., it should be included within the scope of claims hereof.

Claims (10)

1. a kind of method for grinding of ceramic workpiece, it is characterised in that comprise the following steps：
S1, initial networked control systems, make the grinding wheel component of grinding machine be located at some ceramic workpieces being arranged in a linear in X-direction One end, now the position of the emery wheel be defined as initial position；
S2, startup control system, control the emery wheel to rotate, and control the workbench of the emery wheel or some ceramic workpieces of carrying certainly Initial position moves to carry out first time grinding to the machined surface of several ceramic workpieces along X-direction；
S3, the change grinding wheel component increase cutting output, processing of the repeat step S2 to the ceramic workpiece in Z-direction position Face is ground again, until multiple cutting output sum is equal to predetermined grinding thichness.
2. the method for grinding of ceramic workpiece as claimed in claim 1, it is characterised in that the step S1 includes：
Set machined parameters；
The grinding wheel component is adjusted in the position of Z-direction to determine first time cutting output, the workbench is adjusted in X/Y plane The interior relative position with the grinding wheel component, determines initial processing position, makes the grinding wheel component contact X-direction outermost one The machined surface edge of individual ceramic workpiece.
3. the method for grinding of ceramic workpiece as claimed in claim 2, it is characterised in that the ceramic workpiece is in Y direction Width is more than width of the emery wheel in Y direction of the grinding wheel component, and step S2 includes：
Along X-axis with carrying the workbench of some ceramic workpieces relative movement occurs for S201, the emery wheel until the emery wheel is located at X Direction of principal axis completes a grinding of X-direction relative to the other end of the initial position, and the once grinding of X-direction adds Work completes the processing of the part machining area equal with the grinding wheel width to some ceramic workpiece Y directions；Now, institute State emery wheel and be defined as the second place in the position of X-direction；
S202, the amount of feeding is given, the emery wheel is changed in Y direction and the contact position of the machined surface of the ceramic workpiece Become；The emery wheel is moved to complete to ceramics along the X-direction direction opposite relative to step S201 and the workbench Grinding of the work pieces process face in the machining area of Y direction one fixed width；
S203, repeat step S201, S202 are until complete the grinding at least one times to all machined surfaces of the ceramic workpiece.
4. the method for grinding of ceramic workpiece as claimed in claim 3, it is characterised in that the amount of feeding passes through the mobile work Make platform in the position of Y direction to be changed, the amount of feeding is 5-30mm.
5. the method for grinding of ceramic workpiece as claimed in claim 3, it is characterised in that the amount of feeding passes through the mobile sand Wheel assembly is changed in the position of Y direction, and the amount of feeding is 5-30mm.
6. the method for grinding of the ceramic workpiece as described in any one of claim 4 or 5, it is characterised in that the amount of feeding is 10mm。
7. the method for grinding of the ceramic workpiece as described in claim any one of 1-3, it is characterised in that the cutting output parameter is 0.005-0.05mm。
8. the method for grinding of ceramic workpiece as claimed in claim 7, it is characterised in that the cutting output parameter is 0.01mm.
9. the method for grinding of the ceramic workpiece as described in claim any one of 1-3, it is characterised in that the sand of the grinding wheel component Wheel speed is 1500-3000rad/min.
10. the method for grinding of ceramic workpiece as claimed in claim 9, it is characterised in that the grinding wheel speed of the grinding wheel component For 2400rad/min.
CN201710194709.3A 2017-03-28 2017-03-28 The method for grinding of ceramic workpiece Active CN106965042B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109483268A (en) * 2018-12-31 2019-03-19 兴化东华齿轮有限公司 The quick accurate positioning of drive shaft cutting and cutoff device and Cutting Process

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09234653A (en) * 1996-02-28 1997-09-09 Kurashiki Kikai Kk Method and device for grinding
CN1986151A (en) * 2006-12-15 2007-06-27 华南理工大学 Grinding method for superhard silicon carbide ceramic nano mirror
CN102019580A (en) * 2009-09-17 2011-04-20 旭硝子株式会社 Apparatus and method for locally polishing glass plate, and apparatus and method for producing glass product
CN102225533A (en) * 2011-05-03 2011-10-26 桂林市同力自动化系统有限责任公司 Surface grinder numerical control system with bumpy grinding function
CN103707133A (en) * 2013-12-17 2014-04-09 湘潭大学 Efficient and low-damage high-static hydraulic pressure grinding method for engineering ceramics
CN103894888A (en) * 2012-12-25 2014-07-02 住友重机械工业株式会社 Grinding method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09234653A (en) * 1996-02-28 1997-09-09 Kurashiki Kikai Kk Method and device for grinding
CN1986151A (en) * 2006-12-15 2007-06-27 华南理工大学 Grinding method for superhard silicon carbide ceramic nano mirror
CN102019580A (en) * 2009-09-17 2011-04-20 旭硝子株式会社 Apparatus and method for locally polishing glass plate, and apparatus and method for producing glass product
CN102225533A (en) * 2011-05-03 2011-10-26 桂林市同力自动化系统有限责任公司 Surface grinder numerical control system with bumpy grinding function
CN103894888A (en) * 2012-12-25 2014-07-02 住友重机械工业株式会社 Grinding method
CN103707133A (en) * 2013-12-17 2014-04-09 湘潭大学 Efficient and low-damage high-static hydraulic pressure grinding method for engineering ceramics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109483268A (en) * 2018-12-31 2019-03-19 兴化东华齿轮有限公司 The quick accurate positioning of drive shaft cutting and cutoff device and Cutting Process

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