CN106960882B - A kind of surface metallised ceramic cube and production method - Google Patents
A kind of surface metallised ceramic cube and production method Download PDFInfo
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- CN106960882B CN106960882B CN201710165084.8A CN201710165084A CN106960882B CN 106960882 B CN106960882 B CN 106960882B CN 201710165084 A CN201710165084 A CN 201710165084A CN 106960882 B CN106960882 B CN 106960882B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 223
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000012545 processing Methods 0.000 claims abstract description 137
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000007639 printing Methods 0.000 claims abstract description 32
- 238000003854 Surface Print Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims description 45
- 239000007787 solid Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 23
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 6
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 27
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002271 resection Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
This application discloses a kind of surface metallised ceramic cube and production methods, solve the problems, such as that miniature ceramic three-dimensional structure carrier metalization is difficult, the cube top surface covering metal layer, front include metallic pattern two comprising metallic pattern one, bottom surface, comprise the steps of, in ceramic substrate front printing figures one and positive processing line；Curing, sintering；The ceramic substrate is cut into item along the horizontal cut line；Metal layer is printed in the top surface of ceramic item；In the bottom surface printing figures two of ceramic item and bottom surface processing line；Curing, sintering；In two electroplating surface metal of the metal layer, figure one and figure；Ceramic item is cut along the perpendicular cuts.The surface metallised ceramic cube preparation that the application provides, simple production process is at low cost, and production efficiency is high.
Description
Technical field
The present invention relates to field of photoelectric technology more particularly to a kind of cubical preparation methods of metallized ceramic.
Background technology
With the development of opto-electronic communications technology, the frequency used is higher and higher, and device and module size are less and less, simultaneously
Structure also becomes increasingly complex so that ceramet carrier is gradually converted from two-dimensional structure to three-dimensional structure.However, current phototube
Three-dimensional ceramic metallic carrier used in part, optical-electric module, often due to small and so that metallization process is difficult.
Existing ceramics three-dimensional structure carrier metalization processing, need to be by repeatedly splashing mainly using film metallizing art
Penetrate, multiple gluing, multiple photoetching could be completed, not only program is cumbersome, and there are top and bottom metallic pattern gluing it is difficult,
The problems such as being difficult to ensure that the accurate contraposition of top surface, bottom-side metal figure and front metal pattern, while equipment investment is big, it is difficult to make
Degree is high, it is difficult to realize the batch production of scale, can not meet the ceramic metallization three-dimensional structure that thickness is less than or equal to 1mm
The production and processing requirement of carrier.
Invention content
In view of this, to solve the problems, such as miniature ceramic surface metallization processing difficulties, the present invention proposes a kind of surface
Metallized ceramic cube and production method.
The embodiment of the present application provides a kind of surface metallised ceramic cube production method, the cube top surface covering
Metal layer, front include metallic pattern two comprising metallic pattern one, bottom surface, and the distance of positive two horizontal sides is height, two
The distance of vertical edges is length, and the figure one is connected with figure two, and the figure two connects at least one side, making side
Method comprises the steps of：Printing figures one and positive processing line in ceramic substrate front, the range of the solid front faces is by two
Horizontal cut line and two perpendicular cuts surround, the front processing line outside the range, the front processing line
Intersect respectively with two horizontal cut lines；Cure, be sintered the figure one and positive processing line；By the ceramic substrate edge
The horizontal cut line cuts into item, and the ceramic substrate front and the front of ceramic item are coplanar；It is printed in the top surface of ceramic item
Metal layer, the top surface and cube top surface of ceramic item are coplanar；In the bottom surface printing figures two of ceramic item and bottom surface processing line, ceramics
The bottom surface of item and the cube bottom surface are coplanar, the aligned in position of the cube bottom surface, front on ceramic item, the bottom surface
Processing line is connected with the positive processing line, and the bottom surface processing line is connected with the figure two；Cure, be sintered the metal
Layer, figure two and bottom surface processing line；In two electroplating surface metal of the metal layer, figure one and figure；By ceramic item described in
Perpendicular cuts cutting disconnects.
Further, the figure one and positive processing line be in ceramic substrate front repeated arrangement in the horizontal direction,
The figure two and bottom surface processing line are in the bottom surface of ceramic item repeated arrangement in the horizontal direction.
Selectively, the figure one is in the ceramic substrate front vertically repeated arrangement, the figure one
Repetition interval is greater than or equal to the height.
Further, the surface metallised ceramic cube production method, is additionally included in the ceramic substrate or ceramics
The front cutting alignment grooves of item, the alignment grooves intersect perpendicular to the horizontal cut line and with the horizontal cut line.
The application also proposes a kind of surface metallised ceramic cube, described vertical using the method for the embodiment of the present invention
It is less than or equal to 1mm at least one of in the length of cube, height and width.
Above-mentioned at least one technical solution that the embodiment of the present application uses can reach following advantageous effect：
The miniature ceramic metal three-dimensional structure carrier used to prepare field of photoelectric technology, method of the present invention,
Compared with prior art, simple production process, at low cost, production efficiency is high.In at least one embodiment of the present invention, by
Reach the accurate contraposition of optimization front description and side figure in measures such as the production technologies and cutting locating slot for taking thick film
Effect, solve the problems, such as that miniature ceramic monolith manufacture difficulty is big, production cost is high, substantially increases production efficiency, make batch
Quantization production is possibly realized.
Description of the drawings
Attached drawing described herein is used for providing further understanding of the present application, forms the part of the application, this Shen
Illustrative embodiments and their description please do not form the improper restriction to the application for explaining the application.
In the accompanying drawings：
Fig. 1 is a kind of surface metallised ceramic cube production method embodiment flow chart；
Fig. 2 is the surface metallised ceramic cube production method embodiment flow chart in ceramic substrate cutting alignment grooves；
Fig. 3 is the surface metallised ceramic cube production method embodiment flow chart in ceramic item cutting alignment grooves；
Fig. 4 is surface metallised ceramic solid front faces schematic diagram；
Fig. 5 is the ceramic substrate schematic diagram for being printed with front metal pattern one and positive processing line；
Fig. 6 is the ceramic schematic diagram after cutting；
Fig. 7 is the ceramic schematic diagram that top surface is printed with metal layer；
Fig. 8 is that bottom surface is printed with figure two and the ceramic schematic diagram of bottom surface processing line；
Fig. 9 is cube schematic diagram after being cut along the perpendicular cuts；
Figure 10 is figure one, positive processing line, figure two and bottom surface processing line repeated arrangement schematic diagram in the horizontal direction；
Figure 11 is figure one in the ceramic substrate front vertically repeated arrangement schematic diagram；
Figure 12 is the ceramic substrate schematic diagram for cutting with alignment grooves；
Figure 13 is the ceramic schematic diagram for cutting with alignment grooves；
Figure 14 be and have alignment grooves, print two-dimensional metallic graphic array ceramic substrate schematic diagram, wherein
Figure 14 a are ceramic substrate front view；
Figure 14 b are ceramic cut surface view；
Figure 14 c are the ceramic bottom surface printing screen pattern comprising position line；
Figure 15 is surface metallised ceramic cube example structure schematic diagram of the present invention, wherein
Figure 15 a are a kind of surface metallised ceramic cube embodiment top schematic diagrams；
Figure 15 b are a kind of surface metallised ceramic cube embodiment front schematic views；
Figure 15 c are a kind of surface metallised ceramic cube embodiment schematic bottom views.
Specific embodiment
Purpose, technical scheme and advantage to make the application are clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out all other embodiments obtained under the premise of creative work, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical solution that each embodiment of the application provides is described in detail.
Fig. 1 is a kind of surface metallised ceramic cube production method schematic diagram, the cube top surface covering metal layer,
Front includes metallic pattern two comprising metallic pattern one, bottom surface, and the distance of positive two horizontal sides is cube height, two hang down
The distance of straight flange be cube body length, a length of cube width of the rib vertical with the solid front faces；The figure one and figure
Shape two is connected, and the figure two connects at least one side, comprises the steps of：
Step 101, in ceramic substrate front printing figures one and positive processing line, the range of the solid front faces is by two
Horizontal cut line and two perpendicular cuts surround, the front processing line outside the range, the front processing line
Intersect respectively with two horizontal cut lines.
In a step 101, such as the ceramic substrate printing figures of selection thickness suitable 50mm × 50mm, the thickness is not
Less than cube width.
Two horizontal cut lines, be respectively along solid front faces range under length of side cutting line, along in solid front faces range
Length of side cutting line.
Two perpendicular cuts, be respectively along the long cutting line in the solid front faces range left side, along solid front faces range the right side
Length of side cutting line.
In a step 101, front-side metallization printing screen is made；Then silk screen is covered on ceramic substrate, uses tungsten
Slurry finely prints tungsten metallic pattern with full-automatic screen printer on ceramic substrate.
In order to improve efficiency, in highly preferred embodiment of the present invention, multigroup figure is once printed on the ceramic substrate
One and positive processing line.
Step 102 cures, is sintered the figure one and positive processing line.
Preferably 80~120 DEG C of solidification temperature, preferably 30~40 minutes time, the preferred baking oven of solidification equipment.
Metal paste is sintered in high temperature furnace, in the metal layer that ceramic surface formation is well combined.Temperature is preferred
1600~1650 DEG C, preferably 2~4 hours time was sintered the preferred hydrogen of gas.
The ceramic substrate is cut into item, the ceramic substrate front and ceramics by step 103 along the horizontal cut line
The front of item is coplanar.
Step 104 prints metal layer in the top surface of ceramic item, and the top surface and cube top surface of ceramic item are coplanar.
Ceramic item after cutting, cutting is face-up, ceramic item is tightly fastened using fixture；When cut surface be used as cube
During body top surface, metal paste, such as tungsten slurry are covered in cut surface.
In order to improve efficiency, multiple ceramic items are tightly fastened using fixture, once the cut surface of multiple ceramic items is covered
Lid metal paste.
Since on ceramic substrate, positive processing line intersects with horizontal cut line, therefore on ceramic item, the front work
Skill line connects with the top surface of ceramic item.After covering metal paste in top surface, metal layer, the front processing line and top surface gold are formed
Belong to layer to be connected.
Step 105, in the bottom surface printing figures two of ceramic item and bottom surface processing line, the bottom surface of ceramic item and the cube
Bottom surface is coplanar, the aligned in position of the cube bottom surface, front on ceramic item, the bottom surface processing line and the positive technique
Line is connected, and the bottom surface processing line is connected with the figure two.
Ceramic item after cutting, cutting is face-up, ceramic item is tightly fastened using fixture；When cut surface be used as cube
During body bottom surface, silk screen is covered, prints out corresponding cube bottom-side metal figure.
Since on ceramic substrate, positive processing line intersects with horizontal cut line, therefore on ceramic item, the front work
Skill line also connects with the bottom surface of ceramic item.When printing bottom surface processing line, the position of bottom surface processing line and the position of positive processing line
Relatively, the bottom surface processing line is made to be connected with the positive processing line.
In order to improve efficiency, in the multigroup figure two of the cut surface one-step print of ceramic item and bottom surface processing line；At this point, need by
The position of multiple cube bottom surfaces and multiple solid front faces on ceramic item is aligned respectively.
In order to further improve efficiency, multiple ceramic items are tightly fastened using fixture, once multiple ceramic items are cut
Face prints multigroup figure two and bottom surface processing line.
Step 106 cures, is sintered the metal layer, figure two and bottom surface processing line.
Curing, the condition of sintering and scheme are the same as step 102.
Step 107, in two electroplating surface metal of the metal layer, figure one and figure.
It is electroplated using ceramic item, since figure one is connected with figure two, figure two is connected with bottom surface processing line, bottom surface
Processing line is connected with positive processing line, positive processing line is connected with topside metal layer, therefore all gold on the ceramic surface
Belong to figure, processing line realizes conducting.
Ceramic item is cut disconnection by step 108 along the perpendicular cuts.
For example, gold-plated ceramic item is cut into unit finished product according to the cutting line of design with sand-wheel slice cutting machine.
The step of using microscopy, cleaning, drying, thus the carrier of a ceramet thick film three-dimensional structure processes
Into.
As the embodiment advanced optimized, behind step 101,105, the figure one, figure two, positive work are further included
The step of skill line, bottom surface processing line levelling, the flow time preferably 10~15 minutes.
In the embodiment of the application method, the figure one, figure two, positive processing line, bottom surface processing line, metal layer
It is preferable to use the printings of metal tungsten slurry.
As the embodiment advanced optimized, in the embodiment of the application method, it is preferable to use gold for the plating metal
Belong to nickel or gold.
Fig. 2 is the surface metallised ceramic cube production method embodiment flow chart in ceramic substrate cutting alignment grooves.
The cube top surface covering metal layer, front include metallic pattern two comprising metallic pattern one, bottom surface, and described positive two is horizontal
The distance on side is height, the distance of two vertical edges is length, a length of cube width of the rib vertical with the solid front faces；Institute
It states figure one with figure two to be connected, the figure two connects at least one side, comprises the steps of：
Step 201, in ceramic substrate front printing figures one and positive processing line, the range of the solid front faces is by two
Horizontal cut line and two perpendicular cuts surround, the front processing line outside the range, the front processing line
Intersect respectively with two horizontal cut lines.The concrete scheme of step 201 is the same as step 101.
Step 202 cures, is sintered the figure one and positive processing line.The concrete scheme of step 202 is the same as step 102.
Step 203, the front cutting alignment grooves in the ceramic substrate, the alignment grooves are perpendicular to the horizontal cut line
And intersect with the horizontal cut line.
For example, with sand-wheel slice cutting machine according to the cut mark of design on the array ceramic substrate sintered along positive work
Skill line cuts out the slot of certain depth, for other face printed patterns position, the alignment grooves with it is described front processing line it is parallel or
Collinearly.Due to alignment grooves, there are certain depth, the cut surfaces formed after ceramic substrate is cut off along horizontal cut line, in alignment grooves
Position present spill mouth.
The ceramic substrate is cut into item, the ceramic substrate front and ceramics by step 204 along the horizontal cut line
The front of item is coplanar.The concrete scheme of step 204 is the same as step 103.
Step 205 prints metal layer in the top surface of ceramic item, and the top surface and cube top surface of ceramic item are coplanar.
The concrete scheme of step 205 is the same as step 104.
Step 206, in the bottom surface printing figures two of ceramic item and bottom surface processing line, the bottom surface of ceramic item and the cube
Bottom surface is coplanar, the aligned in position of the cube bottom surface, front on ceramic item, the bottom surface processing line and the positive technique
Line is connected, and the bottom surface processing line is connected with the figure two.
Ceramic item after cutting, cutting is face-up, ceramic item is tightly fastened using fixture；When cut surface be used as cube
During body bottom surface, bottom-side metal printing screen is covered, prints out corresponding cube bottom-side metal figure.
When by cube bottom surface, front in the aligned in position on ceramic item, bottom-side metal printing screen is used.It is described
Comprising figure two and position line on bottom-side metal printing screen, bottom-side metal printing screen is covered in ceramic bottom surface
On, the position line is aligned with the spill mouth of the alignment grooves.
Since on ceramic substrate, positive processing line intersects with horizontal cut line, therefore on ceramic item, the front work
Skill line connects with the bottom surface of ceramic item.When printing bottom surface processing line, the position of bottom surface processing line and the position phase of positive processing line
It is right, the bottom surface processing line is made to be connected with the positive processing line.
In order to improve efficiency, in the multigroup figure two of the cut surface one-step print of ceramic item and bottom surface processing line；At this time, it may be necessary to
The position of multiple cube bottom surfaces and multiple solid front faces on ceramic item is aligned respectively.
In order to further improve efficiency, multiple ceramic items are tightly fastened using fixture, once multiple ceramic items are cut
Face prints multigroup figure two and bottom surface processing line.
Step 207 cures, is sintered the metal layer, figure two and bottom surface processing line.Concrete scheme is the same as step 106.
Step 208, in two electroplating surface metal of the metal layer, figure one and figure.Concrete scheme is the same as step 107.
Ceramic item is cut disconnection by step 209 along the perpendicular cuts.
Further, behind step 201,206, the figure one, figure two, positive processing line, bottom surface technique are further included
The step of line levelling, the flow time preferably 10~15 minutes.
Fig. 3 is the surface metallised ceramic cube production method embodiment flow chart in ceramic item cutting alignment grooves.Institute
State cube top surface covering metal layer, front includes metallic pattern two, positive two horizontal sides comprising metallic pattern one, bottom surface
Distance be height, two vertical edges distance be length, a length of cube width of the rib vertical with the solid front faces；It is described
Figure one is connected with figure two, and the figure two connects at least one side, comprises the steps of：
Step 301, in ceramic substrate front printing figures one and positive processing line, the range of the solid front faces is by two
Horizontal cut line and two perpendicular cuts surround, the front processing line outside the range, the front processing line
Intersect respectively with two horizontal cut lines.Concrete scheme is the same as step 101.
Step 302 cures, is sintered the figure one and positive processing line.Concrete scheme is the same as step 102.
The ceramic substrate is cut into item, the ceramic substrate front and ceramics by step 303 along the horizontal cut line
The front of item is coplanar.Concrete scheme is the same as step 103.
Step 304, ceramic item front cutting alignment grooves, the alignment grooves perpendicular to the horizontal cut line and with institute
Horizontal cut line is stated to intersect.
For example, it is cut on the ceramic item sintered along positive processing line according to the cut mark of design with sand-wheel slice cutting machine
Go out the slot of certain depth, positioned for other face printed patterns, the alignment grooves and the positive processing line are parallel or conllinear.By
In the depth of alignment grooves, spill mouth is presented in the position of the cut surface alignment grooves of ceramic item.
Step 305 prints metal layer in the top surface of ceramic item, and the top surface and cube top surface of ceramic item are coplanar.Specific side
Case is the same as step 104.
Step 306, in the bottom surface printing figures two of ceramic item and bottom surface processing line, the bottom surface of ceramic item and the cube
Bottom surface is coplanar, the aligned in position of the cube bottom surface, front on ceramic item, the bottom surface processing line and the positive technique
Line is connected, and the bottom surface processing line is connected with the figure two.Concrete scheme is the same as step 206.
Step 307 cures, is sintered the metal layer, figure two and bottom surface processing line.Concrete scheme is the same as step 106.
Step 308, in two electroplating surface metal of the metal layer, figure one and figure.Concrete scheme is the same as step 107.
Ceramic item is cut disconnection by step 309 along the perpendicular cuts.
Further, behind step 301,306, the figure one, figure two, positive processing line, bottom surface technique are further included
The step of line levelling, the flow time preferably 10~15 minutes.
Fig. 4 is surface metallised ceramic solid front faces schematic diagram, the front comprising metallic pattern 1, it is described just
The distance of two horizontal sides 402,403 of face is cube height；The distance of two vertical edges 404,405 is cube body length；Two is horizontal
Side and two vertical edges surround solid front faces range 401.
The a length of cubical width (not represented in Fig. 4) of the rib vertical with the solid front faces.
Fig. 5 is the ceramic substrate schematic diagram for being printed with front metal pattern one and positive processing line.Fig. 5 is further to solve
Release the step 101,201 and 301 of the method for the invention.
501 printing figures 1 and positive processing line 503, the model of the solid front faces in ceramic substrate front
It encloses and is surrounded by two horizontal cut lines, 504,505 and two perpendicular cuts 506,507, the front processing line is in the range
Except, the front processing line intersects respectively with two horizontal cut lines.
Two horizontal cut lines are respectively the upper length of side horizontal cut line 504 of solid front faces range, lower length of side horizontal cutting
Secant 505；Two perpendicular cuts be respectively the long perpendicular cuts 506 in the left side of solid front faces range, the right length vertically cut
Secant 507.
Fig. 6 is the ceramic schematic diagram after cutting.Fig. 6 be for be explained further the step 103 of the method for the invention,
204 and 303.
The ceramic substrate is cut into item along the horizontal cut line, the front 601 of the ceramics item is the ceramics
Substrate front side, cut surface form the bottom surface and top surface of ceramic item, and the bottom surface 603 of the ceramics item is along under solid front faces range
The cut surface that the cutting of length of side horizontal cut line 505 is formed, the top surface 602 of ceramic item is that the length of side is horizontal along in solid front faces range
The cut surface that the cutting of cutting line 504 is formed.The top surface 602 of the ceramics item is opposite with the bottom surface 603 of the ceramic item.Due to pottery
The top surface 602 of porcelain item is in figure 6 in the invisible position in front, therefore the lead-out wire of reference numeral 602 is represented by dashed line.
Fig. 7 is the ceramic schematic diagram that top surface is printed with metal layer.Fig. 7 is for the method for the invention is explained further
Step 104,205 and 305.
Metal layer 701, top surface, that is, cube top surface of ceramic item are printed in the top surface of ceramic item 602.
Fig. 8 is that bottom surface is printed with figure two and the ceramic schematic diagram of bottom surface processing line.Fig. 8 is for this hair is explained further
The step 105 of bright the method, 206 and 306.
603 printing figures 2 801 and bottom surface processing line 802 in the bottom surface of ceramic item, the bottom surface of ceramic item with described cube
Body bottom surface is coplanar, the cube bottom surface, aligned in position of the front on ceramic item, the bottom surface processing line 802 with it is described just
Face processing line 503 is connected, and the bottom surface processing line 802 is connected with the figure 2 801.
On the cube, the figure two connects at least one side.Specially：On the ceramic item, institute
Figure two is stated at least one side cutting line 803,804 to connect；The side cutting line be along ceramic substrate it is positive it is left,
The left and right cut surface formed when the long perpendicular cuts 506,507 in the right are by the ceramic item cut-out and the friendship of ceramic bottom surface 603
Line.
On the cube, when figure two is an entirety, and is connected with the cube right side, then in ceramics
On item, figure two connects with right side cutting line 804.The right printing bottom surface processing line of range in bottom surface；Accordingly, positive work
Skill line also on the right of positive range, makes the bottom surface processing line be connected with the positive processing line；
On the cube, when figure two is an entirety, and is connected with cube left side, then on ceramic item,
Figure two connects with left side cutting line 803.The left side printing bottom surface processing line of range in bottom surface；Accordingly, positive processing line
Also on the left side of positive range, the bottom surface processing line is made to be connected with the positive processing line；
On the cube, when figure two connects for two sides of an entirety and cube, then in ceramic item
On, figure two connects with left side cutting line 803, right side cutting line 804.The left side of range and/or the right print in bottom surface
Bottom surface processing line processed, accordingly, positive processing line are also at the left side and/or the right of positive range, make the bottom surface processing line
It is connected with the positive processing line；
On the cube, when figure two include separation part, and each section respectively with two side phases of cube
When connecing, then on ceramic item, each section of figure two connects respectively with left side cutting line 803, right side cutting line 804.
Bottom surface processing line is printed in the right side and left side of bottom surface range, accordingly, has positive work in the right side and left side of positive range
Skill line makes the bottom surface processing line be connected with the positive processing line.
It being represented in Fig. 8, figure two includes two parts 8011 of separation, and 8012, and first part 8011, second part 8012
Connect respectively with right side, left side.Only represented to describe the problem, in Fig. 8 bottom surface processing line on the right of the range of bottom surface,
Accordingly, there is positive processing line on the right of positive range；And in the bottom surface processing line and figure two on the right of the range of bottom surface
First part 8011 is connected；Bottom surface processing line on the right of the range of bottom surface and the positive processing line phase on the right of positive range
Even.Similarly, in bottom surface range left side printing bottom surface processing line (being not drawn into Fig. 8), accordingly, there is front on the positive range left side
Processing line (is not drawn into) in Fig. 8；And it is located at the bottom surface processing line on the left of the range of bottom surface and 8012 phase of second part in figure two
Even；Bottom surface processing line on the left of the range of bottom surface is connected with the positive processing line on the left of positive range.
Fig. 9 is the cube schematic diagram formed after being cut along the perpendicular cuts.The cube top surface 902 covers gold
Category layer, front 901 include metallic pattern two comprising metallic pattern one, bottom surface 903, and the figure one is connected with figure two.Due to
The cubical top surface 902 is in the invisible position in front, therefore the lead-out wire of reference numeral 902 dotted line table in fig.9
Show.
After cutting into cube, solid front faces range and ceramic bottom surface institute that ceramic item front is included are remained
Comprising cube bottom surface range；It eliminates the front of ceramic item, include positive processing line, bottom surface processing line on bottom surface.
Figure 10 is figure one, positive processing line, figure two and bottom surface processing line repeated arrangement schematic diagram in the horizontal direction.For
Raising producing efficiency, the figure 1 and positive processing line 503 are in the ceramic substrate front row of repeating in the horizontal direction
Row；The figure 2 801 and bottom surface processing line 802 are in the bottom surface of ceramic item repeated arrangement in the horizontal direction.The figure one
Horizontal repetition interval l is more than the length.The horizontal repetition interval, between the long perpendicular cuts in adjacent two left sides away from
From or the distance between adjacent long vertical secant in two the right.
The horizontal repetition interval l is more than the length, and the range exceeded is used to print bottom surface processing line.
Figure 11 is figure one, positive processing line in the ceramic substrate front vertically repeated arrangement schematic diagram.For
Raising producing efficiency, the figure 1 is in the ceramic substrate front 501 vertically repeated arrangement, the figure
One vertical repetition interval h is greater than or equal to the height.The vertical repetition interval is adjacent two lower length of side horizontal resections
The distance between line or the distance between adjacent two upper length of side horizontal cut lines.
Positive processing line in the ceramic substrate front vertically repeated arrangement, and with the upper length of side horizontal resection
Line, lower length of side horizontal cut line intersect respectively.For ease of processing, a positive processing line is printed in the ceramic substrate front,
Intersect respectively with whole horizontal cut lines.
When the figure one, positive processing line are repeatedly arranged in ceramic substrate front along horizontal repeated arrangement, vertically
Row or combination (not only along horizontal repeated arrangement but also vertically repeated arrangement) respectively constitute solid front faces level
Metallic pattern array, solid front faces vertical metal graphic array or solid front faces two-dimensional metallic graphic array.
According to horizontal, vertical direction repetition interval requirement, solid front faces metallic pattern array is printed, it be first, in accordance with
Metallic pattern array makes corresponding printing screen；Then printing screen is covered on ceramic substrate, is printed with Full automatic screen
Brush machine prints tungsten metallic pattern array on ceramic substrate.
When the figure two, bottom surface processing line are when ceramic bottom surface is along horizontal repeated arrangement, cube bottom surface water is formed
Flat metal graphic array；
To further improve efficiency, in printing figures two, the ceramic item after cutting, cut surface is used as cube bottom surface
When, by bottom surface upward, the multiple ceramic items of one-step print.At this point, figure two, bottom surface processing line in ceramic bottom surface vertically
Repeated arrangement forms cube plane perpendicular metallic pattern array；When the figure two, bottom surface processing line had both repeated row along level
Row and vertically repeated arrangement, then form cube bottom surface two-dimensional metallic graphic array.First, in accordance with metallic pattern array
Make corresponding printing screen；Multiple ceramic items are tightly fastened using fixture；Printing screen is covered, prints out corresponding metal
Graphic array.
Figure 12 is the ceramic substrate schematic diagram for cutting with alignment grooves.An alignment grooves are represented in Figure 12.In the ceramic base
Plate front 501 cut alignment grooves 121, the alignment grooves perpendicular to the horizontal cut line 504 and with the horizontal cut line phase
It hands over.
Preferably, the alignment grooves are no less than 2.
Figure 13 is the ceramic schematic diagram for cutting with alignment grooves.An alignment grooves are represented in Figure 13.In ceramic item front 601
Alignment grooves 131 are cut, the alignment grooves intersect perpendicular to the horizontal cut line 504,505 and with the horizontal cut line.
Preferably, the alignment grooves are no less than 2.
Figure 14 is the ceramic substrate schematic diagram for cutting with alignment grooves, printing two-dimensional metallic graphic array, and wherein Figure 14 a are ceramics
Substrate front side view, the ceramic substrate front are used as solid front faces and ceramic item front；Two contrapositions are represented in figure
Slot.Figure 14 b are ceramic cut surface view, and cut surface shown in Figure 14 b is used as cube bottom surface and ceramic bottom surface.It is printing
During bottom-side metal figure (figure two) processed, using alignment grooves, printing screen with alignment grooves is aligned, then makes the cube bottom
The aligned in position of face, front on ceramic item；When printing metallic pattern array, multiple cube bottom surfaces and multiple cubes are just
Position of the face on ceramic item is aligned respectively.Figure 14 c are the ceramics bottom surface printing comprising cube bottom-side metal graphic array
Silk-screen patterns embodiment, to put it more simply, only being represented in figure for the printed patterns of a ceramics bottom surface range, cube bottom
Face horizontal metal graphic array.When by cube bottom surface, front in the aligned in position on ceramic item, printed using bottom-side metal
Brush filament net, comprising periodic two array of figure and position line 122 on the bottom-side metal printing screen, by bottom-side metal
Printing screen is covered on ceramic bottom surface, and the position line 122 is aligned with the spill mouth of the alignment grooves 121.Position line
At least 1, preferred embodiment is 2.
Figure 15 is surface metallised ceramic cube example structure schematic diagram of the present invention, wherein, Figure 15 a are a kind of surfaces
Metallized ceramic cube embodiment top schematic diagram；Figure 15 b are that a kind of surface metallised ceramic cube embodiment front shows
It is intended to；Figure 15 c are a kind of surface metallised ceramic cube embodiment schematic bottom views.The cube top surface covers metal
Layer, front include metallic pattern two comprising metallic pattern one, bottom surface, and the figure one is connected with figure two.The figure two with
At least one side connects, and specifically, in Figure 15 c, figure two includes two parts, and first part connects with right side, the
Two parts connect with left side.It is less than or equal to 1mm at least one of in the cubical length, height and width, it is described vertical
Cube is made using surface metallised ceramic cube production method described in the application any one embodiment.
The figure one, figure two, positive processing line, bottom surface processing line, it is preferable to use the printings of metal tungsten slurry for metal layer.
The preferred metallic nickel of the plating metal or gold.
It should also be noted that, term " comprising ", "comprising" or its any other variant are intended to nonexcludability
Comprising so that process, method or equipment including a series of elements not only include those elements, but also including not having
It the other element that is expressly recited or further includes as this process, method or the intrinsic element of equipment.Not more
In the case of limitation, the element that is limited by sentence "including a ...", it is not excluded that in the process including the element, method
Or also there are other identical elements in equipment.
The foregoing is merely embodiments herein, are not limited to the application.For those skilled in the art
For, the application can have various modifications and variations.All any modifications made within spirit herein and principle are equal
Replace, improve etc., it should be included within the scope of claims hereof.
Claims (9)
1. a kind of surface metallised ceramic cube production method, the cube top surface covering metal layer, front include metal
Figure one, bottom surface include metallic pattern two, and the distance of positive two horizontal sides is height, the distance of two vertical edges is length,
The figure one is connected with figure two, and the figure two connects at least one side, which is characterized in that comprises the steps of：
Printing figures one and positive processing line in ceramic substrate front, the range of the solid front faces is by two horizontal cut lines
Surrounded with two perpendicular cuts, the front processing line outside the range, front processing line and two water
Truncation secant intersects respectively；
Cure, be sintered the figure one and positive processing line；
The ceramic substrate is cut into item along the horizontal cut line, the ceramic substrate front and the front of ceramic item are total to
Face；
In the front cutting alignment grooves of the ceramic substrate or ceramic item, the alignment grooves perpendicular to the horizontal cut line and with
The horizontal cut line intersects；
Metal layer is printed in the top surface of ceramic item, the top surface and cube top surface of ceramic item are coplanar；
In the bottom surface printing figures two of ceramic item and bottom surface processing line, the bottom surface of ceramic item and the cube bottom surface are coplanar, institute
The aligned in position of cube bottom surface, front on ceramic item is stated, the bottom surface processing line is connected with the positive processing line, described
Bottom surface processing line is connected with the figure two；
Cure, be sintered the metal layer, figure two and bottom surface processing line；
In two electroplating surface metal of the metal layer, figure one and figure；
Ceramic item along the perpendicular cuts is cut and is disconnected.
2. surface metallised ceramic cube production method according to claim 1, which is characterized in that the figure one and just
Face processing line is in ceramic substrate front repeated arrangement in the horizontal direction, and the figure two and bottom surface processing line are in ceramic item
Bottom surface repeated arrangement in the horizontal direction.
3. surface metallised ceramic cube production method according to claim 1, which is characterized in that the figure one is in institute
Ceramic substrate front vertically repeated arrangement is stated, the repetition interval of the figure one is greater than or equal to the height.
4. surface metallised ceramic cube production method according to claim 2, which is characterized in that the figure one is in institute
State ceramic substrate front vertically repeated arrangement；The repetition interval of the figure one is greater than or equal to the height.
5. according to surface metallised ceramic cube production method described in Claims 1 to 4 any one, which is characterized in that Gu
It is 80~120 DEG C to change temperature, and the time is 30~40 minutes.
6. according to surface metallised ceramic cube production method described in Claims 1 to 4 any one, which is characterized in that burn
Junction temperature is 1600~1650 DEG C, and the time is 2~4 hours.
7. according to surface metallised ceramic cube production method described in Claims 1 to 4 any one, which is characterized in that institute
Plating metal is stated as nickel or gold.
8. according to surface metallised ceramic cube production method described in Claims 1 to 4 any one, which is characterized in that institute
It states at least one in cubical length, height and width and is less than or equal to 1mm.
9. a kind of surface metallised ceramic cube, which is characterized in that any one method is made using claim 1~8, institute
It states at least one in cubical length, height and width and is less than or equal to 1mm.
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| CN113889542A (en) * | 2021-09-29 | 2022-01-04 | 深圳金航芯半导体有限公司 | Production process for manufacturing three-side metallized ceramic heat sink by using precious metal ceramic film |
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| DE10049844A1 (en) * | 2000-10-09 | 2002-04-11 | Philips Corp Intellectual Pty | Miniaturized microwave antenna |
| GB2400493B (en) * | 2003-04-08 | 2005-11-09 | Avx Corp | Plated terminations |
| US9450556B2 (en) * | 2009-10-16 | 2016-09-20 | Avx Corporation | Thin film surface mount components |
| KR101052059B1 (en) * | 2010-04-14 | 2011-07-27 | 김병준 | Surface processing method of silicon substrate for solar cell, and manufacturing method of solar cell |
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Address after: 050091 4th floor, building 4, No. 368, xinshibei Road, Shijiazhuang City, Hebei Province Patentee after: Hebei Sheng Ping Electronic Technology Co., Ltd. Address before: 050091, East fourth floor, building 368, No. four Xinshi North Road, Hebei, Shijiazhuang Patentee before: Hebei Sheng Ping Electronic Technology Co., Ltd. |