CN106956216A - A kind of grinding and polishing machining state on-Line Monitor Device - Google Patents
A kind of grinding and polishing machining state on-Line Monitor Device Download PDFInfo
- Publication number
- CN106956216A CN106956216A CN201710141347.1A CN201710141347A CN106956216A CN 106956216 A CN106956216 A CN 106956216A CN 201710141347 A CN201710141347 A CN 201710141347A CN 106956216 A CN106956216 A CN 106956216A
- Authority
- CN
- China
- Prior art keywords
- polishing
- grinding
- sensor
- signal
- monitor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Abstract
A kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it is included on glass polishing machine by a motor-driven grinding and polishing disk（1）Retaining ring is driven with by another motor（4）Rotate, in grinding and polishing disk（1）On grinding and polishing pad is installed（3）, retaining ring（4）In wafer carrier is installed（2）, workpiece（5）Installed in wafer carrier（2）Bottom and under the drive of retaining ring with pad light pad（3）Make relative grinding and polishing processing, in wafer carrier（2）On sensor is installed（6）, sensor（6）With being fixedly mounted on platform（10）On signal conditioning circuit（7）It is electrically connected, signal conditioning circuit（7）With being fixedly mounted on platform（10）On data acquisition unit（8）Electrical connection, data acquisition unit（8）Pass through conducting slip ring（9）It is connected with computer；Described stage+module is in retaining ring（4）Upper and synchronous axial system.Low for equipment requirements, low cost of the invention, convenient operation.
Description
Technical field
It is especially a kind of to finish monitoring technology the present invention relates to a kind of accurate, ultraprecise field of machining, specifically
Say it is a kind of grinding and polishing machining state on-Line Monitor Device based on sensor technology, high-speed data acquisition and processing.
Background technology
With developing rapidly for the fields such as optics, photoelectronics, integrated circuit and material technology, material machined surface quality
It is required that also becoming more and more higher.In addition, some functional materials are because of its unique performance, optics, electronics, instrument and meter,
The fields such as Aero-Space have wide practical use and demand.Above-mentioned material is mostly added using ultraprecision grinding, polishing as it
Work means, such as conventional chemically mechanical polishing（CMP）.But many essential phenomenon such as materials in being processed at present for grinding and polishing
Material cutting mechanisms, grain motion form, affecting laws of different technology conditions etc. can't be explained well, cause chip
Surface quality is difficult to improve, low production efficiency, the problems such as grinding and polishing process is difficult to realize Automated condtrol.For example, when polishing
During workpiece produce the defect such as cut and not yet remove, terminated after the scheduled time of polishing is reached, be then not up to polishing
Effect.In addition, needing brought offline to measure for workpiece quality after polishing efficiency, polishing at present, this results in time and cost
Waste.
Chinese patent CN1726116A discloses polishing state monitoring apparatus and burnishing device and method, and the invention is utilized
The light that light source is sent is applied on workpiece, reuses the light that spectroscope is divided into respective wavelength to the reflected light of collection workpiece reflection
The light of detection is converted to power information by line, light receiving element, by gathering power information, obtains the spectroscopic data of reflected light, base
The characteristic value of workpiece surface is calculated in resulting spectroscopic data, polishing condition is judged by characteristic value.Chinese patent
CN102192928A discloses the apparatus and method for monitoring glass plate polishing state, and the invention location measurement unit obtains glass
Glass plate utilizes the position of polishing machine, and current measuring unit obtains flowing into the electric current of polishing machine, by by the corresponding electricity of diverse location
Flow valuve and reference value contrast determine polishing condition whether failure.
There is complex structure in above-mentioned all kinds of on-line measuring devices, complex disposal process is influenceed greatly, precision by external interference
Not high the problem of, is, it is necessary to solve.
The content of the invention
The present invention seeks to there is complex structure for existing on-line measuring device, influenceed greatly by external interference, essence
The problem of degree is not high, design is a kind of simple in construction, easy to use, can online, fast and accurately monitor the processing of grinding and polishing
The grinding and polishing machining state on-Line Monitor Device of state.
The technical solution adopted in the present invention is：
A kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it includes motor-driven being ground by one on glass polishing machine
Polishing disc 1 and drive retaining ring 4 to rotate by another motor, grinding and polishing pad 3 is installed on grinding and polishing disk 1, kept
Wafer carrier 2 is installed, workpiece 5 is arranged on the bottom of wafer carrier 2 and under the drive of retaining ring with padding light pad in ring 4
3 make relative grinding and polishing processing, sensor 6 are provided with wafer carrier 2, sensor 6 is with being fixedly mounted on platform 10
On signal conditioning circuit 7 be electrically connected, signal conditioning circuit 7 is electric with data acquisition unit 8 on platform 10 is fixedly mounted
Connection, data acquisition unit 8 is connected by conducting slip ring 9 with computer；Described stage+module is in retaining ring 4 and synchronously turns
It is dynamic.
Described sensor 6 is used for the physical quantity monitored during grinding and polishing and is converted into electric signal；Passed by sound emission
One or more compositions in sensor, load cell, temperature sensor and acceleration transducer.
Signal that described signal conditioning circuit is gathered to sensor carries out necessary amplification, filtering, decay, excitation, many
Road multiplexing etc..
Described data acquisition unit, the electric signal after collection conditioning, converts analog signals into data signal, and to data
Pre-processed.
Described computer is ground process monitoring and the knot of polishing according to the signal of collection using signal processing method
Fruit is predicted.
Described sensor is fixed on wafer carrier by clamp of sensor.
The temperature of inner ring during rotation of described conducting slip ring 9 is fixed on the axis of platform 10, is connected with data acquisition unit 8；It is quiet
Only outer ring is connected with computer.
The beneficial effects of the invention are as follows:
The present invention is monitored on-line by multiple sensors to grinding and polishing state, can measure sound emission, power, vibration etc. many
Plant physical quantity and show in real time.Therefore so that operator can take suitable operation according to grinding and polishing state is measured, improve
Processing efficiency and quality.
The present invention gathers a variety of physical quantitys simultaneously and considered, and can obtain more comprehensive machining state information, has
Beneficial to the control realized to grinding and polishing process.
In addition on-Line Monitor Device proposed by the present invention is reequiped for traditional glass polishing machine, low for equipment requirements, low cost,
Convenient operation.
Brief description of the drawings
Fig. 1 is the theory diagram of the grinding and polishing on-Line Monitor Device of the present invention.
Fig. 2 is the structure chart of the grinding and polishing on-Line Monitor Device of the present invention.
Embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
As shown in Figure 2.
A kind of grinding and polishing machining state on-Line Monitor Device, it includes grinding and polishing disk 1, wafer carrier 2, retaining ring
4th, sensor 6, signal conditioning circuit 7, data acquisition unit 8 and computer, grinding and polishing disk 1 are driven by a motor, retaining ring 4
By another motor-driven rotation, it is provided with grinding and polishing disk 1 in grinding and polishing pad 3, retaining ring 4 and wafer carrying is installed
Device 2, workpiece 5, which is arranged on the bottom of wafer carrier 2 and makees relative grinding and polishing with pad light pad 3 under the drive of retaining ring, to be added
Work, is provided with sensor 6, sensor 6 is with being fixedly mounted the electricity of signal conditioning circuit 7 on platform 10 on wafer carrier 2
Gas phase connects, and signal conditioning circuit 7 is electrically connected with the data acquisition unit 8 being fixedly mounted on platform 10, and data acquisition unit 8 passes through
Conducting slip ring 9 is connected with computer；Described stage+module is in retaining ring 4 and synchronous axial system.Described sensor 6 is used for supervising
Survey grinding and polishing during physical quantity and be converted into electric signal；By acoustic emission sensor, load cell, temperature sensor and
One or more compositions in acceleration transducer.The signal that described signal conditioning circuit is gathered to sensor carries out necessary
Amplification, filtering, decay, excitation, multiplexing etc..Described data acquisition unit, the electric signal after collection conditioning, by analog signal
Data signal is converted into, and data are pre-processed.Described computer uses signal processing method according to the signal of collection
It is ground process monitoring and the prediction of result of polishing.Described sensor is fixed on wafer carrier by clamp of sensor.
The temperature of inner ring during rotation of described conducting slip ring 9 is fixed on the axis of platform 10, is connected with data acquisition unit 8；Stationary outer race with
Computer is connected.
Embodiment 1：
For example during grinding and polishing, the acoustic emission sensor on wafer carrier is collected by abrasive particle and workpiece production
Raw acoustic emission signal, the weak electric signal obtained by signal conditioning circuit to sensor carries out necessary amplification, filtering, data
Collector is with 2M sample rate, and 16 bit resolutions are acquired to the analog voltage signal after processing, and are converted into data signal
Computer is transferred to, display and store function is realized.By being analyzed in computer terminal signal, signal is such as subjected to small echo
Conversion, when there is the signal characteristic of correspondence workpiece scratch defects, operating personnel can carry out appropriate to grinding and polishing process
Operation, to improve the machining state of grinding and polishing；The mathematics for setting up acoustic emission signal intensity and abrasive polishing materials clearance is closed
System, by the calculating to the intensity of acoustic emission signal in process, estimates the material removing rate of grinding and polishing.
Embodiment 2：
For example in CMP process, the load cell on wafer carrier collects workpiece and grinding is thrown
Resistance between light pad in horizontal direction, the necessary amplification of electric signal progress gathered by signal conditioning circuit to sensor,
Filtering, the bit resolution of data acquisition unit 16 is acquired to the analog voltage signal after processing, and is converted into data signal transmission
To computer, display and store function are realized.By being analyzed in computer terminal signal, such as using workpiece level direction by
To frictional resistance and Vertical Square upward pressure, the coefficient of friction of workpiece and polishing pad is calculated, by contrasting different calculating
Obtained coefficient of friction can obtain effect of the polishing fluid in polishing process, qualitatively determine the chemical action of polishing fluid workpiece
The species of the softening layer of generation；The mathematical relationship of frictional resistance and abrasive polishing materials clearance is set up, by process
The calculating of middle frictional resistance, estimates out the material removing rate of grinding and polishing.
Embodiment 3：
For example during grinding and polishing, the acceleration transducer on wafer carrier collect wafer carrier and
The vibration signal of workpiece, the electric signal collected by signal conditioning circuit to sensor carries out necessary amplification, filtering, data
Collector is acquired with 16 bit resolutions to the analog voltage signal after processing, and is converted into data signal and is transferred to calculating
Machine, realizes display and store function.By being analyzed in computer terminal signal, such as vibration signal intensive analysis, foundation is shaken
The relational model of dynamic signal intensity and surface roughness, by the calculating to vibration signal intensity, estimates out workpiece after processing
Surface roughness.
The present invention operation principle be：
As shown in Figure 1.
1. when grinding and polishing is processed, grinding and polishing pad is under the driving of motor on described glass polishing machine, with another electricity
Machine drives the workpiece under wafer carrier to produce relative rotation by retaining ring, so as to realize the grinding and polishing processing to workpiece.
2. described in sensor collect the physical quantity during grinding and polishing and be converted into electric signal, electric signal is by letter
The amplification of number modulate circuit, filtering, are sent to data acquisition unit, analog voltage signal is converted into data signal by data acquisition unit
And wear and deliver to computer, pass through computer and realize the displays of all signals, storage and handle.The signal of synthetical collection, in computer
End Treatment Analysis signal can obtain the machining state of grinding and polishing, so as to take appropriate operation.
Highly preferred embodiment of the present invention has been illustrated, and the various change or remodeling made by those of ordinary skill in the art are not
It can depart from the scope of the present invention.
Part that the present invention does not relate to is same as the prior art or can be realized using prior art.
Claims (7)
1. a kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it is including motor-driven by one on glass polishing machine
Grinding and polishing disk（1）Retaining ring is driven with by another motor（4）Rotate, in grinding and polishing disk（1）On grinding and polishing is installed
Pad（3）, retaining ring（4）In wafer carrier is installed（2）, workpiece（5）Installed in wafer carrier（2）Bottom and keep
With pad light pad under the drive of ring（3）Make relative grinding and polishing processing, in wafer carrier（2）On sensor is installed（6）, pass
Sensor（6）With being fixedly mounted on platform（10）On signal conditioning circuit（7）It is electrically connected, signal conditioning circuit（7）With fixation
Installed in platform（10）On data acquisition unit（8）Electrical connection, data acquisition unit（8）Pass through conducting slip ring（9）With computer
It is connected；Described stage+module is in retaining ring（4）Upper and synchronous axial system.
2. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described sensor（6）
For monitoring the physical quantity during grinding and polishing and being converted into electric signal；Passed by acoustic emission sensor, load cell, temperature
One or more compositions in sensor and acceleration transducer.
3. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described signal condition
The signal that circuit is gathered to sensor carries out necessary amplification, filtering, decay, excitation, multiplexing etc..
4. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described data acquisition
Device, the electric signal after collection conditioning, converts analog signals into data signal, and data are pre-processed.
5. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described computer root
Process monitoring and the prediction of result of polishing are ground using signal processing method according to the signal of collection.
6. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described sensor quilt
Clamp of sensor is fixed on wafer carrier.
7. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that described conducting slip ring（9）
Temperature of inner ring during rotation be fixed on platform（10）Axis on, with data acquisition unit（8）It is connected；Stationary outer race is connected with computer
Connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141347.1A CN106956216B (en) | 2017-03-10 | 2017-03-10 | A kind of grinding and polishing machining state on-Line Monitor Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141347.1A CN106956216B (en) | 2017-03-10 | 2017-03-10 | A kind of grinding and polishing machining state on-Line Monitor Device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106956216A true CN106956216A (en) | 2017-07-18 |
| CN106956216B CN106956216B (en) | 2019-08-09 |
Family
ID=59470710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710141347.1A Active CN106956216B (en) | 2017-03-10 | 2017-03-10 | A kind of grinding and polishing machining state on-Line Monitor Device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106956216B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108500825A (en) * | 2018-05-16 | 2018-09-07 | 福建北电新材料科技有限公司 | A kind of method and apparatus of silicon carbide wafer polishing temperature control |
| CN108972376A (en) * | 2018-07-04 | 2018-12-11 | 郑州磨料磨具磨削研究所有限公司 | A kind of Internet of Things grinding wheel |
| CN109333360A (en) * | 2018-10-15 | 2019-02-15 | 北京工业大学 | A kind of thinned grinding force on-line measurement device and method of wafer |
| CN109605133A (en) * | 2018-11-22 | 2019-04-12 | 国网天津市电力公司电力科学研究院 | A kind of site intelligent polishing process suitable for tower material tissue |
| CN111002214A (en) * | 2019-12-25 | 2020-04-14 | 唐山万士和电子有限公司 | Piezoelectric quartz wafer convex surface grinding frequency real-time monitoring device |
| CN111775051A (en) * | 2020-06-15 | 2020-10-16 | 德尔福柴油系统（烟台）有限公司 | Method for detecting whether ground product is qualified or not |
| CN112207714A (en) * | 2019-07-10 | 2021-01-12 | 鼎朋企业股份有限公司 | Grinding machine tool with random eccentric orbit motion speed detection |
| CN114800248A (en) * | 2022-01-20 | 2022-07-29 | 上海工程技术大学 | Monitoring device for dynamic sensing of single-side chemical mechanical planarization processing |
| CN116394153A (en) * | 2023-02-28 | 2023-07-07 | 名正(浙江)电子装备有限公司 | Wafer grinding and polishing system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825119B1 (en) * | 2003-08-28 | 2004-11-30 | Powerchip Semiconductor Corp. | Method of piping defect detection |
| CN1915595A (en) * | 2006-08-30 | 2007-02-21 | 中国科学院上海微系统与信息技术研究所 | Method for batch processing polishing fluid in situ for chemico-mechanical polishing metal, and equipment utilized |
| CN101303382A (en) * | 2007-05-09 | 2008-11-12 | 台湾积体电路制造股份有限公司 | Semiconductor CP (circuit probe) test management system and method |
| CN101459095A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer on-line detection method and on-line detection device |
| CN102157413A (en) * | 2011-01-20 | 2011-08-17 | 大连理工大学 | On-line measuring device for frictional force generated during polishing of small-sized wafer |
-
2017
- 2017-03-10 CN CN201710141347.1A patent/CN106956216B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825119B1 (en) * | 2003-08-28 | 2004-11-30 | Powerchip Semiconductor Corp. | Method of piping defect detection |
| CN1915595A (en) * | 2006-08-30 | 2007-02-21 | 中国科学院上海微系统与信息技术研究所 | Method for batch processing polishing fluid in situ for chemico-mechanical polishing metal, and equipment utilized |
| CN101303382A (en) * | 2007-05-09 | 2008-11-12 | 台湾积体电路制造股份有限公司 | Semiconductor CP (circuit probe) test management system and method |
| CN101459095A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer on-line detection method and on-line detection device |
| CN102157413A (en) * | 2011-01-20 | 2011-08-17 | 大连理工大学 | On-line measuring device for frictional force generated during polishing of small-sized wafer |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108500825A (en) * | 2018-05-16 | 2018-09-07 | 福建北电新材料科技有限公司 | A kind of method and apparatus of silicon carbide wafer polishing temperature control |
| CN108972376A (en) * | 2018-07-04 | 2018-12-11 | 郑州磨料磨具磨削研究所有限公司 | A kind of Internet of Things grinding wheel |
| CN108972376B (en) * | 2018-07-04 | 2020-12-01 | 郑州磨料磨具磨削研究所有限公司 | Thing networking emery wheel |
| CN109333360A (en) * | 2018-10-15 | 2019-02-15 | 北京工业大学 | A kind of thinned grinding force on-line measurement device and method of wafer |
| CN109333360B (en) * | 2018-10-15 | 2020-07-03 | 北京工业大学 | Online measuring device and method for wafer thinning grinding force |
| CN109605133A (en) * | 2018-11-22 | 2019-04-12 | 国网天津市电力公司电力科学研究院 | A kind of site intelligent polishing process suitable for tower material tissue |
| CN112207714A (en) * | 2019-07-10 | 2021-01-12 | 鼎朋企业股份有限公司 | Grinding machine tool with random eccentric orbit motion speed detection |
| CN111002214A (en) * | 2019-12-25 | 2020-04-14 | 唐山万士和电子有限公司 | Piezoelectric quartz wafer convex surface grinding frequency real-time monitoring device |
| CN111775051A (en) * | 2020-06-15 | 2020-10-16 | 德尔福柴油系统（烟台）有限公司 | Method for detecting whether ground product is qualified or not |
| CN111775051B (en) * | 2020-06-15 | 2021-08-10 | 德尔福柴油系统（烟台）有限公司 | Method for detecting whether ground product is qualified or not |
| CN114800248A (en) * | 2022-01-20 | 2022-07-29 | 上海工程技术大学 | Monitoring device for dynamic sensing of single-side chemical mechanical planarization processing |
| CN116394153A (en) * | 2023-02-28 | 2023-07-07 | 名正(浙江)电子装备有限公司 | Wafer grinding and polishing system |
| CN116394153B (en) * | 2023-02-28 | 2023-10-24 | 名正(浙江)电子装备有限公司 | Wafer grinding and polishing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106956216B (en) | 2019-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106956216A (en) | A kind of grinding and polishing machining state on-Line Monitor Device | |
| US5860847A (en) | Polishing apparatus | |
| CN105738807B (en) | A kind of high speed dynamic pressure gyro machine contacts to earth rotary speed test system | |
| CN102175412A (en) | Rotor torsion oscillation testing device and testing method thereof | |
| CN105758728A (en) | Variable-temperature composite load in-situ testing platform | |
| CN110456733B (en) | Portable numerical control equipment comprehensive performance detection and analysis platform and analysis method | |
| CN103674749B (en) | Concrete curing rear surface strength testing device and test method thereof | |
| CN105372537B (en) | Frequency converter intelligence test platform based on Labview/PDA | |
| CN108982272B (en) | Peanut picking collision friction wear testing machine | |
| CN2826406Y (en) | Normal surface measuring friction wear testing machine | |
| CN109974609A (en) | A kind of brill ream quality on-line detecting device and method | |
| CN110987293B (en) | Device and method for dynamically calibrating torque sensor by using braking natural frequency method | |
| CN102789228A (en) | Detection device for mechanical cam controller | |
| CN107504998A (en) | A kind of pumping plant failure detector | |
| CN115122096B (en) | Marking and descaling device for pipes | |
| CN111076935A (en) | Method and device for measuring dynamic impact load of wheel edge motor bearing | |
| US6067857A (en) | Braking element processing system | |
| CN201063050Y (en) | Apparatus for measuring wiping of charged friction pair | |
| CN213364718U (en) | Indoor formaldehyde rapid determination device | |
| CN205581282U (en) | Automatic detection apparatus for permanent magnet work piece | |
| CN206038518U (en) | Efficient pesticide remains measuring device | |
| CN110421731B (en) | Diamond wire breakage online detection system | |
| CN108106559A (en) | A kind of precision bearing system radial direction rotating accuracy laser measurement system and method | |
| CN214309249U (en) | High-precision sensor convenient to maintain | |
| CN112846937A (en) | Main shaft state online monitoring system and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |