CN106956216B - A kind of grinding and polishing machining state on-Line Monitor Device - Google Patents
A kind of grinding and polishing machining state on-Line Monitor Device Download PDFInfo
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- CN106956216B CN106956216B CN201710141347.1A CN201710141347A CN106956216B CN 106956216 B CN106956216 B CN 106956216B CN 201710141347 A CN201710141347 A CN 201710141347A CN 106956216 B CN106956216 B CN 106956216B
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- polishing
- grinding
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- signal
- wafer carrier
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Abstract
A kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it includes rotating by a motor-driven grinding and polishing disk (1) on glass polishing machine and by another motor driven retaining ring (4), grinding and polishing pad (3) are installed on grinding and polishing disk (1), wafer carrier (2) are installed in retaining ring (4), workpiece (5) is mounted on the lower part of wafer carrier (2) and makees opposite grinding and polishing with pad light pad (3) under the drive of retaining ring and processes, sensor (6) are installed on wafer carrier (2), sensor (6) is electrically connected with the signal conditioning circuit (7) being fixedly mounted on platform (10), signal conditioning circuit (7) is electrically connected with the data collector (8) being fixedly mounted on platform (10), data collector (8) passes through conducting slip ring (9) It is connected with computer；The stage+module is on retaining ring (4) and rotates synchronously.The present invention is low for equipment requirements, at low cost, facilitates operation.
Description
Technical field
The present invention relates to a kind of accurate, ultraprecise field of machining, especially a kind of finishing monitoring technology, specifically
Say to be a kind of based on sensor technology, high-speed data acquisition and the grinding and polishing of processing machining state on-Line Monitor Device.
Background technique
With the rapid development in the fields such as optics, photoelectronics, integrated circuit and material technology, material machined surface quality
It is required that also becoming higher and higher.In addition to this, some functional materials are because of its unique performance, optics, electronics, instrument and meter,
The fields such as aerospace have wide practical use and demand.Above-mentioned material mostly uses ultraprecision grinding, polishing to add as it
Work means, such as common chemically mechanical polishing (CMP).However at present for many essential phenomenon such as materials in grinding and polishing processing
Material cutting mechanisms, affecting laws of grain motion form, different technology conditions etc. can't be explained well, cause chip
Surface quality is difficult to improve, and production efficiency is low, and grinding and polishing process is not easy the problems such as realizing automation control.For example, when polishing
Workpiece generates the defects of scratch and not yet removes in the process, terminates after the predetermined time for reaching polishing, is then not up to polishing
Effect.In addition, needing brought offline to measure workpiece quality after polishing efficiency, polishing at present, this results in time and cost
Waste.
Chinese patent CN1726116A discloses polishing state monitoring apparatus and burnishing device and method, which utilizes
The light that light source issues is applied on workpiece, reuses the light that spectroscope is divided into respective wavelength to the reflected light of acquisition workpiece reflection
Line, the light that light receiving element will test are converted to power information, by acquiring power information, obtain the spectroscopic data of reflected light, base
The characteristic value of workpiece surface is calculated in acquired spectroscopic data, polishing condition is judged by characteristic value.Chinese patent
CN102192928A discloses the device and method for monitoring glass plate polishing state, which obtains glass
Glass plate utilizes the position of polishing machine, and current measuring unit obtains flowing into the electric current of polishing machine, by by the corresponding electricity of different location
Flow valuve and reference value compare determine polishing condition whether failure.
Above-mentioned all kinds of on-line measuring devices have that structure is complicated, and complex disposal process is influenced by external interference, precision
Not high problem needs to solve.
Summary of the invention
Object of the present invention is to have that structure is complicated for existing on-line measuring device, influenced by external interference, it is smart
Not high problem is spent, it is simple to design a kind of structure, and it is easy to use, it can online, fast and accurately monitor the processing of grinding and polishing
The grinding and polishing machining state on-Line Monitor Device of state.
The technical scheme adopted by the invention is that:
A kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it includes on glass polishing machine by a motor driven
Grinding and polishing disk 1 and rotated by another motor driven retaining ring 4, grinding and polishing pad 3 is installed on grinding and polishing disk 1,
Wafer carrier 2 is installed in retaining ring 4, workpiece 5 be mounted on the lower part of wafer carrier 2 and under the drive of retaining ring with pad
Light pad 3 makees opposite grinding and polishing processing, is equipped with sensor 6 on wafer carrier 2, sensor 6 be fixedly mounted on it is flat
Signal conditioning circuit 7 on platform 10 is electrically connected, the data collector 8 of signal conditioning circuit 7 and fixed installation on platform 10
Electrical connection, data collector 8 are connected by conducting slip ring 9 with computer；The stage+module is in retaining ring 4 and synchronous
Rotation.
Physical quantity that the sensor 6 is used to monitor during grinding and polishing is simultaneously converted into electric signal；It is passed by sound emission
One of sensor, load cell, temperature sensor and acceleration transducer or a variety of compositions.
The signal conditioning circuit carries out necessary amplification to the signal that sensor acquires, filtering, decaying, motivates, more
Road multiplexing etc..
The data collector, the electric signal after acquisition conditioning, converts analog signals into digital signal, and to data
It is pre-processed.
The process monitoring and knot that the computer is polished directly according to the signal of acquisition using signal processing method
Fruit prediction.
The sensor is fixed on wafer carrier by clamp of sensor.
The temperature of inner ring during rotation of the conducting slip ring 9 is fixed on the axis of platform 10, is connected with data collector 8；It is quiet
Only outer ring is connected to a computer.
The beneficial effects of the present invention are:
The present invention monitors grinding and polishing state on-line by multiple sensors, can measure sound emission, power, vibration
Etc. a variety of physical quantitys and real-time display.Therefore, operator is allowed to take suitable operation according to grinding and polishing state is measured,
Improve processing efficiency and quality.
The present invention acquires a variety of physical quantitys simultaneously and comprehensively considers, and can obtain more comprehensive machining state information, shares
Conducive to the control realized to grinding and polishing process.
Furthermore on-Line Monitor Device proposed by the present invention is reequiped for traditional glass polishing machine, low for equipment requirements, at low cost,
Facilitate operation.
Detailed description of the invention
Fig. 1 is the functional block diagram of grinding and polishing on-Line Monitor Device of the invention.
Fig. 2 is the structure chart of grinding and polishing on-Line Monitor Device of the invention.
Specific embodiment
Below in conjunction with drawings and examples, present invention is further described in detail.
As shown in Figure 2.
A kind of grinding and polishing machining state on-Line Monitor Device, it includes grinding and polishing disk 1, wafer carrier 2, retaining ring
4, sensor 6, signal conditioning circuit 7, data collector 8 and computer, grinding and polishing disk 1 is by a motor driven, retaining ring 4
It is rotated by another motor driven, grinding and polishing pad 3 is installed on grinding and polishing disk 1, wafer carrying is installed in retaining ring 4
Device 2, workpiece 5, which is mounted on the lower part of wafer carrier 2 and makees opposite grinding and polishing with pad light pad 3 under the drive of retaining ring, to be added
Work, is equipped with sensor 6 on wafer carrier 2, and sensor 6 and the signal conditioning circuit 7 being fixedly mounted on platform 10 are electric
Gas phase connects, and signal conditioning circuit 7 and the data collector 8 being fixedly mounted on platform 10 are electrically connected, and data collector 8 passes through
Conducting slip ring 9 is connected with computer；The stage+module is in retaining ring 4 and rotates synchronously.The sensor 6 is used to supervise
Survey grinding and polishing during physical quantity and be converted into electric signal；By acoustic emission sensor, load cell, temperature sensor and
One of acceleration transducer or a variety of compositions.The signal conditioning circuit carries out the signal that sensor acquires necessary
Amplification, filtering, decaying, excitation, multiplexing etc..The data collector, the electric signal after acquisition conditioning, by analog signal
It is converted into digital signal, and data are pre-processed.The computer uses signal processing method according to the signal of acquisition
The process monitoring being polished directly and prediction of result.The sensor is fixed on wafer carrier by clamp of sensor.
The temperature of inner ring during rotation of the conducting slip ring 9 is fixed on the axis of platform 10, is connected with data collector 8；Stationary outer race with
Computer is connected.
Embodiment 1:
Such as during grinding and polishing, the acoustic emission sensor being mounted on wafer carrier is collected by abrasive grain and work
The acoustic emission signal that part generates carries out necessary amplification, filtering to the weak electric signal that sensor obtains by signal conditioning circuit,
With the sample rate of 2M, to treated, analog voltage signal is acquired 16 bit resolutions data collector, and is converted into number
Signal is transferred to computer, realizes display and store function.By analyzing in computer terminal signal, such as signal is carried out
Wavelet transformation, when there is the signal characteristic of corresponding workpiece scratch defects, operator can be fitted grinding and polishing process
When operation, to improve the machining state of grinding and polishing；Establish the number of acoustic emission signal intensity and abrasive polishing materials removal rate
Relationship estimates the material removing rate of grinding and polishing by the calculating to the intensity of acoustic emission signal in process.
Embodiment 2:
Such as in CMP process, the load cell being mounted on wafer carrier collects workpiece and grinds
The resistance between polishing pad in horizontal direction is ground, necessary put is carried out to the electric signal that sensor acquires by signal conditioning circuit
Greatly, it filters, to treated, analog voltage signal is acquired 16 bit resolution of data collector, and is converted into digital signal biography
It is handed to computer, realizes display and store function.By analyzing in computer terminal signal, workpiece horizontal direction is such as utilized
The frictional resistance and Vertical Square being subject to upward pressure, and calculate the coefficient of friction of workpiece and polishing pad, by comparing different meters
The effect of the available polishing fluid of obtained coefficient of friction during the polishing process, the chemistry for qualitativeling determine polishing fluid workpiece are made
With the type of the softening layer of generation；The mathematical relationship for establishing frictional resistance Yu abrasive polishing materials removal rate, by processed
The calculating of frictional resistance in journey, estimates out the material removing rate of grinding and polishing.
Embodiment 3:
Such as during grinding and polishing, the acceleration transducer being mounted on wafer carrier collects wafer carrier
And the vibration signal of workpiece, necessary amplification, filtering are carried out to the collected electric signal of sensor by signal conditioning circuit,
With 16 bit resolutions, to treated, analog voltage signal is acquired data collector, and is converted into digital signal and is transferred to meter
Calculation machine realizes display and store function.By analyzing in computer terminal signal, such as vibration signal intensive analysis, establish
The relational model of vibration signal intensity and surface roughness estimates out workpiece after processing by the calculating to vibration signal intensity
Surface roughness.
The working principle of the invention is:
As shown in Figure 1.
1. grinding and polishing pad is under the drive of the motor, electric with another on the glass polishing machine when grinding and polishing processing
Machine drives the workpiece under wafer carrier to produce relative rotation by retaining ring, processes to realize to the grinding and polishing of workpiece.
2. sensor described in collects the physical quantity during grinding and polishing and is converted into electric signal, and electric signal is by letter
Amplification, the filtering of number conditioning circuit, are transmitted to data collector, analog voltage signal is converted into digital signal by data collector
And wear and give to computer, display, the storage and processing of all signals are realized by computer.The signal of synthetical collection, in computer
The machining state of the end processing analysis available grinding and polishing of signal, to take operation appropriate.
Highly preferred embodiment of the present invention has illustrated, and the various change or remodeling made by those of ordinary skill in the art are not
It can depart from the scope of the present invention.
Part that the present invention does not relate to is same as the prior art or can be realized by using the prior art.
Claims (4)
1. a kind of grinding and polishing machining state on-Line Monitor Device, it is characterized in that it includes motor-driven by one on glass polishing machine
It grinding and polishing disk (1) and is rotated by another motor driven retaining ring (4), grinding and polishing is installed on grinding and polishing disk (1)
It pads (3), is equipped with wafer carrier (2) in retaining ring (4), workpiece (5) is mounted on the lower part of wafer carrier (2) and is keeping
Make opposite grinding and polishing processing under the drive of ring with grinding and polishing pad (3), sensor is installed on wafer carrier (2)
(6), sensor (6) is electrically connected with the signal conditioning circuit (7) being fixedly mounted on platform (10), signal conditioning circuit (7)
Be electrically connected with the data collector (8) that is fixedly mounted on platform (10), data collector (8) by conducting slip ring (9) with
Computer is connected；The stage+module is on retaining ring (4) and rotates synchronously；The sensor (6) is used to monitor grinding
Physical quantity in polishing process is simultaneously converted into electric signal；By acoustic emission sensor, load cell, temperature sensor and acceleration
One of sensor or a variety of compositions；The sensor is fixed on wafer carrier by clamp of sensor；Described leads
The temperature of inner ring during rotation of electric slip ring (9) is fixed on the axis of platform (10), is connected with data collector (8)；Stationary outer race and meter
Calculation machine is connected；Grinding and polishing state is monitored on-line by multiple sensors, measures sound emission, power, vibration physical quantity
And real-time display, it allows an operator to take suitable operation according to measuring grinding and polishing state, improves processing efficiency and quality.
2. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that the signal condition
Circuit carries out necessary amplification, filtering, decaying, excitation, multiplexing etc. to the signal that sensor acquires.
3. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that the data acquire
Device, the electric signal after acquisition conditioning, converts analog signals into digital signal, and pre-process to data.
4. grinding and polishing machining state on-Line Monitor Device according to claim 1, it is characterized in that the computer root
The process monitoring for using signal processing method to be polished directly according to the signal of acquisition and prediction of result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141347.1A CN106956216B (en) | 2017-03-10 | 2017-03-10 | A kind of grinding and polishing machining state on-Line Monitor Device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141347.1A CN106956216B (en) | 2017-03-10 | 2017-03-10 | A kind of grinding and polishing machining state on-Line Monitor Device |
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| Publication Number | Publication Date |
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| CN106956216A CN106956216A (en) | 2017-07-18 |
| CN106956216B true CN106956216B (en) | 2019-08-09 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108500825A (en) * | 2018-05-16 | 2018-09-07 | 福建北电新材料科技有限公司 | A kind of method and apparatus of silicon carbide wafer polishing temperature control |
| CN108972376B (en) * | 2018-07-04 | 2020-12-01 | 郑州磨料磨具磨削研究所有限公司 | Thing networking emery wheel |
| CN109333360B (en) * | 2018-10-15 | 2020-07-03 | 北京工业大学 | Online measuring device and method for wafer thinning grinding force |
| CN109605133A (en) * | 2018-11-22 | 2019-04-12 | 国网天津市电力公司电力科学研究院 | A kind of site intelligent polishing process suitable for tower material tissue |
| CN112207714B (en) * | 2019-07-10 | 2023-01-31 | 鼎朋企业股份有限公司 | Grinding machine tool with random eccentric orbit motion speed detection |
| CN111002214B (en) * | 2019-12-25 | 2021-08-06 | 唐山万士和电子有限公司 | Piezoelectric quartz wafer convex surface grinding frequency real-time monitoring device |
| CN111775051B (en) * | 2020-06-15 | 2021-08-10 | 德尔福柴油系统（烟台）有限公司 | Method for detecting whether ground product is qualified or not |
| CN114800248A (en) * | 2022-01-20 | 2022-07-29 | 上海工程技术大学 | Monitoring device for dynamic sensing of single-side chemical mechanical planarization processing |
| CN116394153B (en) * | 2023-02-28 | 2023-10-24 | 名正(浙江)电子装备有限公司 | Wafer grinding and polishing system |
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| US6825119B1 (en) * | 2003-08-28 | 2004-11-30 | Powerchip Semiconductor Corp. | Method of piping defect detection |
| CN1915595A (en) * | 2006-08-30 | 2007-02-21 | 中国科学院上海微系统与信息技术研究所 | Method for batch processing polishing fluid in situ for chemico-mechanical polishing metal, and equipment utilized |
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| CN106956216A (en) | 2017-07-18 |
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