CN106952836B - A kind of panel and its test method, display device - Google Patents
A kind of panel and its test method, display device Download PDFInfo
- Publication number
- CN106952836B CN106952836B CN201710342456.XA CN201710342456A CN106952836B CN 106952836 B CN106952836 B CN 106952836B CN 201710342456 A CN201710342456 A CN 201710342456A CN 106952836 B CN106952836 B CN 106952836B
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- panel
- electronic device
- linkage function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
Abstract
The embodiment of the present invention provides a kind of panel and its test method, display device, is related to electronic field, when testing and analyzing to the electronic device in panel, can be avoided and is separated single electronic device using the method for laser cutting.The panel forms box by the first substrate and the second substrate being oppositely arranged；First substrate includes the multiple electronic devices being set on underlay substrate and deviates from the insulating layer of underlay substrate side positioned at electronic device；The panel includes the linkage function layer for being set to insulating layer and deviating from underlay substrate side, electronic device is electrically connected by linkage function layer by the via hole being located on insulating layer, and the adhesion strength in linkage function layer and the second substrate between contact surface in contact is greater than the adhesion strength between linkage function layer and insulating layer.
Description
Technical field
The present invention relates to electronic field more particularly to a kind of panel and its test methods, display device.
Background technique
For existing display panel, generally require to carry out evaluation analysis, example to the performance of display panel in the later period
Such as, to the electric property of the thin film transistor (TFT) (Thin Film Transistor, abbreviation TFT) in display panel (threshold voltage,
The parameters such as ON state circuit, leakage current) carry out evaluation test.
Specifically, in the prior art in order to realize narrow frame design use GOA (Gate Driver on Array,
Array substrate row actuation techniques) circuit display panel for, each GOA unit is made of multiple TFT, once some
TFT failure, can bring entire GOA unit can not work normally, at this time, it may be necessary to carry out evaluation analysis to the GOA circuit.GOA is mono-
All be between multiple TFT in member it is interconnected by connecting line, needed when testing a certain TFT by the TFT and other TFT
Between connecting line disconnect；It is to use the method for laser cutting by a certain TFT and others TFT in the prior art based on this
Between connecting line disconnect, not only spent human and material resources using this method, and the high-energy of laser can impact TFT,
In turn result in the drawback of the subsequent performance evaluation inaccuracy to the TFT.
Summary of the invention
The embodiment of the present invention provides a kind of panel and its test method, display device, to the electronic device in panel into
When row tests and analyzes, it can be avoided and separated single electronic device using the method for laser cutting.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
On the one hand the embodiment of the present invention provides a kind of panel, the panel is by the first substrate and the second substrate that are oppositely arranged
Box is formed；The first substrate include the multiple electronic devices being set on underlay substrate and be located at the electronic device
Insulating layer away from the underlay substrate side；The panel includes being set to the insulating layer away from the underlay substrate side
Linkage function layer, the linkage function layer by be located at the insulating layer on via hole the electronic device is electrically connected, and
Adhesion strength in the linkage function layer and the second substrate between contact surface in contact is greater than the linkage function
Adhesion strength between layer and the insulating layer.
Further, the electronic device includes connecting line, and the connecting line is electrically connected by the linkage function layer.
Further, the linkage function layer includes conductive pattern layer and adhesive layer, wherein the adhesive layer is located at described
Conductive pattern layer deviates from the side of the underlay substrate, and the adhesive layer and the conductive pattern layer are on the underlay substrate
Projection have overlapping region；Adhesion strength in the adhesive layer and the second substrate between contact surface in contact is big
Adhesion strength between the adhesive layer and the conductive pattern layer, and the adherency between the adhesive layer and the conductive pattern layer
Power is greater than the adhesion strength between the conductive pattern layer and the insulating layer.
Further, projection of the adhesive layer on the underlay substrate covers the conductive pattern layer in the substrate
Projection on substrate.
Further, the conductive pattern layer is located in the first substrate, and the adhesive layer is located at the first substrate
Or in the second substrate.
Further, the linkage function layer is mainly made of conducting resinl.
Further, the linkage function layer is located in the first substrate.
Further, the panel is display panel, and the electronic device is the non-display area positioned at the display panel
The thin film transistor (TFT) in domain.
On the other hand the embodiment of the present invention also provides a kind of display device, including panel according to any one of claims 8.
The another aspect of the embodiment of the present invention also provides a kind of method of electronic device for testing above-mentioned panel, comprising: splits
First substrate and the second substrate in panel so that the contact surface being in contact in linkage function layer and the second substrate together with it is described
Insulating layer separation in first substrate, is formed between the electronic device in the first substrate by the linkage function layer with disconnecting
Electrical connection；The electronic device that electrical connection is disconnected in the first substrate is tested for the property.
The embodiment of the present invention provides a kind of panel and its test method, display device, the panel by be oppositely arranged first
Substrate and the second substrate form box, and first substrate includes the multiple electronic devices being set on underlay substrate and is located at
Electronic device deviates from the insulating layer of underlay substrate side；The panel further includes the company for being set to insulating layer and deviating from underlay substrate side
Connection function layer, electronic device is electrically connected by linkage function layer by the via hole being located on insulating layer, and linkage function layer and second
Adhesion strength in substrate between contact surface in contact is greater than the adhesion strength between linkage function layer and the insulating layer, this
Sample one tears first substrate and the second substrate open when carrying out performance evaluation to the electronic device in above-mentioned first substrate
Point, linkage function layer is separated with the insulating layer in first substrate as a whole with contact surface in contact in the second substrate,
It is electrically connected due to the electronic device being located in first substrate by linkage function layer, after fractionation, in first substrate
It is disconnected between electronic device by the electrical connection that linkage function layer is formed, the electronic device so as to be electrically connected to the disconnection carries out
Performance test is avoided and is disconnected the electrical connection between electronic device using the method for laser cutting in the prior art, in this way
One, on the one hand, achieve the purpose that save cost；On the other hand, it avoids because the method using laser cutting is to electronic device
Performance impact so that the problem of evaluation test result is affected.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of panel provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another panel provided in an embodiment of the present invention；
Fig. 3 is a kind of attachment structure schematic diagram of electronic device provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another panel provided in an embodiment of the present invention；
Fig. 5 is the flow diagram that a kind of panel provided in an embodiment of the present invention splits detection method.
Appended drawing reference:
01- panel；10- first substrate；101- underlay substrate；102- electronic device；1021- connecting line；103- insulating layer；
1031- via hole；20- the second substrate；A- linkage function layer；A1- conductive pattern layer；A2- adhesive layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of panel, as shown in Figure 1, the panel 01 is by the first substrate 10 being oppositely arranged and
Two substrates 20 form box.
Herein it should be noted that above-mentioned panel 01 can be display panel, it is also possible to others to box panel, this hair
It is bright that this is not construed as limiting.
In the case where panel 01 is display panel, which can be liquid crystal display panel (Liquid
Crystal Display, LCD), it is also possible to organic light emission (Organic Light Emitting Diode, OLED) display
Panel, this is not limited by the present invention.Certainly, in the case where the display panel is liquid crystal display panel, above-mentioned first substrate
10 can be array substrate, and the second substrate 20 is to box substrate, wherein may include the color membrane substrates of color film layer to box substrate；
It is also possible to not include color film layer to box substrate, at this point, first substrate is to make array substrate using color blocking integrated technology,
That is COA array substrate (Color Filter On Array).Following embodiment is display panel with above-mentioned panel 01, and the
One substrate 10 is array substrate, and the second substrate 20 is for color membrane substrates, the present invention is described further.
As shown in Figure 1, first substrate 10 includes the multiple electronic devices 102 being set on underlay substrate 101 and is located at
Electronic device 102 deviates from the insulating layer 103 of 101 side of underlay substrate, and wherein Fig. 1 is shown by taking two electronic devices as an example
Meaning explanation.
Herein it should be noted that first, above-mentioned electronic device 102 can be thin film transistor (TFT) (Thin Film
Transistor, TFT), can also be with photosensitive element etc., this is not limited by the present invention.It is film crystal in the electronic device 102
In the case where pipe, which can be the thin film transistor (TFT) in the non-display area of display panel, such as GOA electricity
Thin film transistor (TFT) in road, it is in the non-display area of display panel that following embodiment, which is with the electronic device 102,
In GOA circuit for thin film transistor (TFT), the present invention is described further.
Second, above-mentioned multiple electronic devices 102 can be as shown in Figure 1, be located at same layer；It can also be located at as shown in Figure 2 different
Layer, this is not limited by the present invention.Certainly, in the case where multiple electronic devices 102 are located at different layer, the electronics device of different layer setting
Other film layers, such as insulating thin layer are generally also set up between part 102.
In addition, as shown in Figure 1, above-mentioned panel 01 includes the connection for being set to insulating layer 103 and deviating from 101 side of underlay substrate
Electronic device 102 is electrically connected by functional layer A, the linkage function layer A by the via hole 1031 being located on insulating layer 103, and is connected
Adhesion strength in functional layer A and the second substrate 20 between contact surface in contact is greater than linkage function layer A and insulating layer 103
Between adhesion strength, wherein Fig. 1 is illustrated so that linkage function layer A is located at first substrate 10 as an example, the present invention in it is right
It is not construed as limiting in the specific location of linkage function layer A.
Herein it should be noted that in the case where being located at same layer for multiple electronic devices 102 shown in FIG. 1, above-mentioned company
Electronic device 102 is directly electrically connected by the via hole 1031 being located on insulating layer 103 by connection function layer A；For shown in Fig. 2 more
In the case that a electronic device 102 is located at different layer, above-mentioned linkage function layer A needs the via hole by being located on insulating layer 103
1031 and the setting of different layer electronic device 102 between via hole in film layer electronic device 102 is electrically connected.
In conclusion when carrying out performance evaluation to the electronic device in above-mentioned first substrate, by first substrate and second
Substrate is split, linkage function layer and contact surface in contact in the second substrate as a whole with it is exhausted in first substrate
Edge layer separation is electrically connected due to the electronic device being located in first substrate by linkage function layer, after fractionation, the
It is disconnected between electronic device in one substrate by the electrical connection that linkage function layer is formed, so as to the electricity being electrically connected to the disconnection
Sub- device is tested for the property, and is avoided and is used the method for laser cutting in the prior art by the electrical connection between electronic device
It disconnects, so, on the one hand, achieve the purpose that save cost；On the other hand, it avoids because of the method pair using laser cutting
The performance of electronic device impacts, so that the problem of evaluation test result is affected.
On this basis, in general, in order to guarantee be electrically connected effect of the linkage function layer A with electronic device 102, such as Fig. 3
Shown (partial top view of above-mentioned panel), the electronic device 102 include connecting line 1021, and connecting line 1021 passes through linkage function
Layer A electrical connection.
Explanation is further explained below by way of specific facilities of the specific embodiment to above-mentioned linkage function layer A.
Embodiment one
As shown in figure 4, linkage function layer A may include conductive pattern layer A1 and adhesive layer A2, wherein adhesive layer A2
Deviate from the side of underlay substrate 101 in conductive pattern layer A1, and adhesive layer A2 and conductive pattern layer A1 are on underlay substrate 101
Projection has overlapping region.Meanwhile the adhesion strength in adhesive layer A2 and the second substrate 20 between contact surface in contact is big
Adhesion strength between adhesive layer A2 and conductive pattern layer A1, and the adhesion strength between adhesive layer A2 and conductive pattern layer A1 is big
Adhesion strength between conductive pattern layer A1 and insulating layer 103.
So, when carrying out performance evaluation to the electronic device in above-mentioned first substrate, due to adhesive layer and conduction
Projection of the pattern layer on underlay substrate has overlapping region, i.e. adhesive layer has the position directly contacted with conductive pattern layer,
And the adhesion strength in adhesive layer and the second substrate between contact surface in contact be greater than the adhesive layer and conductive pattern layer it
Between adhesion strength, adhesion strength between adhesive layer and conductive pattern layer is greater than the adhesion strength between conductive pattern layer and insulating layer,
In the case, when first substrate and the second substrate being split, at least exist in adhesive layer with conductive pattern layer and directly connect
The position of touching, the contact surface being in contact in the second substrate with adhesive layer drive adhesive layer and conductive pattern layer and first substrate simultaneously
Middle insulating layer separates, so that disconnected between the electronic device in first substrate by the electrical connection that linkage function layer is formed, into
And the electronic device that can be electrically connected to the disconnection is tested for the property.
On this basis, in order to guarantee as far as possible when first substrate and the second substrate are split, so that being located at the
The electrical connection between multiple electronic devices in one substrate can disconnect, to be tested for the property to all electronic devices,
Currently preferred, above-mentioned adhesive layer A2 is in the projection covering conductive pattern layer A1 on underlay substrate 101 on underlay substrate 101
Projection, i.e. conductive pattern layer A1 is all contacted with adhesive layer A2 away from the surface of 101 side of underlay substrate, so that tearing open
Timesharing, by driving conductive pattern layer to separate with insulating layer in first substrate in adhesive layer A2 maximum magnitude.
In addition, due to being provided with insulating layer 103, and conductive pattern layer A1 among conductive pattern layer A1 and electronic device 102
The via hole 1031 by being located on insulating layer 103 is needed to connect with electronic device 102, therefore, in order to guarantee conductive pattern layer A1
It is electrically connected effect with the electronic device 102 in first substrate 10, as shown in figure 4, it is currently preferred, conductive pattern layer A1
In first substrate 10, i.e., conductive pattern layer A1 is carried by underlay substrate 101, namely the insulation in production first substrate 1
After layer 103, conductive pattern layer A1 is made, it will be understood by those skilled in the art that the film layer in panel 01 generally uses
The techniques such as deposition, exposure, development, etching, removing are formed, and therefore, are directly deposited on the substrate that production has insulating layer 103 conductive
Layer can guarantee in the conductive pattern layer A1 of formation by having between the via hole 1031 and electronic device 102 on insulating layer 103
Preferable electrical connection effect.
On this basis, above-mentioned adhesive layer A2, can with as shown in figure 4, be located at first substrate 10 in, i.e. adhesive layer A2 by
Underlay substrate 101 carries, namely makes adhesive layer A2 after the conductive pattern layer A1 in production first substrate 10, then will
The second substrate 20 and the first substrate 10 form panel 01 to box.Certainly, above-mentioned adhesive layer A2 can also be located at the second substrate 20,
I.e. adhesive layer A2 is carried by the underlay substrate in the second substrate 20, in the case, production is had adhesive layer A2's
The second substrate 20 and production have the first substrate 10 of conductive pattern layer A1 to form panel 01 to box；For adhesive layer A2 in the present invention
Facilities be not construed as limiting, as long as guaranteeing the adherency in adhesive layer A2 and the second substrate 20 between contact surface in contact
Power is greater than the adhesion strength between adhesive layer A2 and conductive pattern layer A1, and the adherency between adhesive layer A2 and conductive pattern layer A1
Power is greater than the adhesion strength between conductive pattern layer A1 and insulating layer.
Embodiment two
As shown in Figure 1 or 2, which is single layer structure, is mainly made of conducting resinl, i.e., this is mainly by leading
The linkage function layer A of electric glue composition realizes the electrical connection of the electronic device in first substrate simultaneously, and meets the linkage function
Adhesion strength in layer A and the second substrate 20 between contact surface in contact is greater than between linkage function layer A and insulating layer 103
Adhesion strength condition, so, in above-mentioned first substrate electronic device carry out performance evaluation when, by first substrate
Split with the second substrate, in the linkage function layer and the second substrate contact surface in contact as a whole with the first base
Insulating layer in plate separates, so that being broken between the electronic device in first substrate by the electrical connection that the linkage function layer is formed
It opens, and then the electronic device that can be electrically connected to the disconnection is tested for the property.
Further, in order to which guarantee the linkage function layer A and the electronic device 102 in first substrate 10 is electrically connected effect
Fruit, as shown in Figure 1 or 2, currently preferred, which is located in first substrate 10, the same embodiment of specific reason
Conductive pattern layer A1 is preferably provided in one, and details are not described herein again.
The embodiment of the present invention also provides a kind of display device, including above-mentioned panel, has the face provided with previous embodiment
The identical structure of plate and beneficial effect.Since previous embodiment has carried out detailed retouch to the structure of panel and beneficial effect
It states, details are not described herein again.
It should be noted that the display device specifically at least may include that liquid crystal display device and Organic Light Emitting Diode are aobvious
Showing device, such as the display device can be any for liquid crystal display, LCD TV, Digital Frame, mobile phone or tablet computer etc.
Product or component having a display function.
The embodiment of the present invention also provides a kind of method of electronic device for testing above-mentioned panel, as shown in figure 5, this method packet
It includes:
Step S101, the first substrate 10 and the second substrate 20 in panel are split, so that linkage function layer A and the second substrate
The contact surface being in contact in 20 is separated with the insulating layer 103 in first substrate 10 together, to disconnect the electronics in first substrate 10
The electrical connection formed between device 102 by linkage function layer A can specifically refer to Fig. 1.
Herein it should be noted that the contact surface being in contact in above-mentioned linkage function layer A and the second substrate 20 is together with
In one substrate 10 insulating layer separation, can be linkage function layer A separated with insulating layer 103 between be kept completely separate；It is also possible to
There is gap, slight crack etc. between separating with insulating layer 103 in linkage function layer A；This is not limited by the present invention, as long as guaranteeing connection
By being electrically connected disconnection between the via hole on insulating layer 103 between functional layer A and electronic device 102.
Step S102, the electronic device 102 that electrical connection is disconnected in first substrate 10 is tested for the property.
Based on this, is avoided in the present invention and use the method for laser cutting in the prior art by the electricity between electronic device
Connection disconnects, and the electronic device to be electrically connected to the disconnection is tested for the property, so, on the one hand, reach saving cost
Purpose；On the other hand, it avoids because being impacted using the method for laser cutting to the performance of electronic device, so that evaluation is surveyed
The problem of test result is affected.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of panel, which is characterized in that the panel forms box by the first substrate and the second substrate being oppositely arranged；
The first substrate includes the multiple electronic devices being set on underlay substrate and is located at the electronic device away from institute
State the insulating layer of underlay substrate side；
The panel includes the linkage function layer for being set to the insulating layer and deviating from the underlay substrate side, the linkage function
The electronic device is electrically connected by layer by the via hole being located on the insulating layer, and the linkage function layer and second base
Adhesion strength in plate between contact surface in contact is greater than the adhesion strength between the linkage function layer and the insulating layer.
2. panel according to claim 1, which is characterized in that the electronic device includes connecting line, and the connecting line
It is electrically connected by the linkage function layer.
3. panel according to claim 1, which is characterized in that the linkage function layer includes conductive pattern layer and bonding
Layer, wherein the adhesive layer be located at the conductive pattern layer away from the underlay substrate side, and the adhesive layer with it is described
Projection of the conductive pattern layer on the underlay substrate has overlapping region；
Adhesion strength in the adhesive layer and the second substrate between contact surface in contact is greater than the adhesive layer and institute
The adhesion strength between conductive pattern layer is stated, and the adhesion strength between the adhesive layer and the conductive pattern layer is greater than the conduction
Adhesion strength between pattern layer and the insulating layer.
4. panel according to claim 3, which is characterized in that projection covering of the adhesive layer on the underlay substrate
Projection of the conductive pattern layer on the underlay substrate.
5. panel according to claim 3, which is characterized in that the conductive pattern layer is located in the first substrate, institute
Adhesive layer is stated to be located in the first substrate or the second substrate.
6. panel according to claim 1, which is characterized in that the linkage function layer is mainly made of conducting resinl.
7. panel according to claim 6, which is characterized in that the linkage function layer is located in the first substrate.
8. panel according to claim 1-7, which is characterized in that the panel is display panel, the electronics
Device is the thin film transistor (TFT) of the non-display area positioned at the display panel.
9. a kind of display device, which is characterized in that including panel according to any one of claims 8.
10. a kind of method for the electronic device for testing the described in any item panels of claim 1-8 characterized by comprising
The first substrate and the second substrate in panel are split, so that the contact surface one being in contact in linkage function layer and the second substrate
It is separated with the insulating layer in the first substrate, to disconnect between the electronic device in the first substrate by the connection function
The electrical connection that ergosphere is formed；
The electronic device that electrical connection is disconnected in the first substrate is tested for the property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710342456.XA CN106952836B (en) | 2017-05-12 | 2017-05-12 | A kind of panel and its test method, display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710342456.XA CN106952836B (en) | 2017-05-12 | 2017-05-12 | A kind of panel and its test method, display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106952836A CN106952836A (en) | 2017-07-14 |
| CN106952836B true CN106952836B (en) | 2019-06-07 |
Family
ID=59479574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710342456.XA Expired - Fee Related CN106952836B (en) | 2017-05-12 | 2017-05-12 | A kind of panel and its test method, display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106952836B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111051971B (en) * | 2018-06-29 | 2021-05-18 | 华为技术有限公司 | Electric connection assembly and mobile terminal |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105892161A (en) * | 2016-06-12 | 2016-08-24 | 京东方科技集团股份有限公司 | Display panel, display device, manufacturing method of display panel and manufacturing method of display device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080008704A (en) * | 2006-07-21 | 2008-01-24 | 삼성전자주식회사 | Display substrate, method of manufacturing the same and display device having the same |
| CN101211073A (en) * | 2006-12-28 | 2008-07-02 | 中华映管股份有限公司 | Substrate circuit connected structure and its detection method |
| CN102667678A (en) * | 2009-11-20 | 2012-09-12 | 夏普株式会社 | Flexible display panel with touch sensor function |
| CN105225729B (en) * | 2015-08-26 | 2017-02-22 | 京东方科技集团股份有限公司 | Anisotropic conductive film and method for bonding chip on film and flexible circuit board |
| CN105511130B (en) * | 2016-02-01 | 2019-09-06 | 京东方科技集团股份有限公司 | The stripping off device and stripping means of display base plate |
| CN206020888U (en) * | 2016-09-22 | 2017-03-15 | 合肥鑫晟光电科技有限公司 | A kind of display base plate and display device |
-
2017
- 2017-05-12 CN CN201710342456.XA patent/CN106952836B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105892161A (en) * | 2016-06-12 | 2016-08-24 | 京东方科技集团股份有限公司 | Display panel, display device, manufacturing method of display panel and manufacturing method of display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106952836A (en) | 2017-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021192307A (en) | Information processing device | |
| CN103294237B (en) | Touch panel, touch liquid crystal display panel and forming method thereof | |
| CN105068295B (en) | A kind of touch-control display panel and preparation method thereof, touch control display apparatus | |
| KR101870798B1 (en) | Flexible display device and method for manufacturing the same | |
| CN102237027A (en) | Display panel and test method thereof | |
| CN105607321B (en) | Touch display device and manufacturing method thereof | |
| KR20130006993A (en) | Manufacturing method of flexible display | |
| CN104375347B (en) | Array base palte, patch, display panel and the method for repairing array base palte | |
| KR101797244B1 (en) | In-plane switching mode liquid crystal display | |
| KR101842134B1 (en) | Electrophoretic Display Device and Method for Manufacturing The Same | |
| CN104503174B (en) | GOA circuit modules and its method of testing, display panel and display device | |
| CN104932166B (en) | A kind of array base palte and preparation method thereof, display panel, display device | |
| CN102931189B (en) | Array base palte and make and method for maintaining, display device | |
| CN109164937A (en) | Touch module and preparation method thereof, touch device | |
| CN106952836B (en) | A kind of panel and its test method, display device | |
| EP1079258B1 (en) | Electro-optical material-based display device | |
| CN104460071A (en) | Thin film transistor array substrate and liquid crystal display panel | |
| KR101845440B1 (en) | Method for Manufacturing Flexible Display Device | |
| CN107577101B (en) | Electrophoretic display panel and manufacturing method thereof | |
| JP5334205B2 (en) | Method for manufacturing electrical solid state device | |
| CN106773208A (en) | Liquid crystal display and its display panel | |
| CN207165216U (en) | Drive circuit board and display device | |
| JPH0519294A (en) | Line defect correcting method for active matrix display device | |
| KR20130024385A (en) | Manufacturing method for flexible display device | |
| CN109491166A (en) | Array substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190607 Termination date: 20210512 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |