CN106949580A - Air-conditioning - Google Patents
Air-conditioning Download PDFInfo
- Publication number
- CN106949580A CN106949580A CN201611109219.0A CN201611109219A CN106949580A CN 106949580 A CN106949580 A CN 106949580A CN 201611109219 A CN201611109219 A CN 201611109219A CN 106949580 A CN106949580 A CN 106949580A
- Authority
- CN
- China
- Prior art keywords
- air
- conditioning
- refrigerating chamber
- semiconductor chilling
- chilling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
Abstract
The embodiment of the invention discloses a kind of air-conditioning, it includes refrigerating chamber and semiconductor chilling plate, refrigerating chamber has air inlet and gas outlet, installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the refrigeration side of semiconductor chilling plate is towards inside refrigerating chamber, and semiconductor chilling plate heats side towards outside refrigerating chamber.Air-conditioning provided in an embodiment of the present invention on the installation portion of refrigerating chamber by setting semiconductor chilling plate, the reduction of temperature can be achieved, relative to traditional air-conditioning, refrigerant is not needed to be circulated in pipeline, refrigerating efficiency can be improved, environmental pollution is not resulted in, and it is simple in construction, and production and use cost are all relatively low.
Description
Technical field
The present embodiments relate to air cooling technical field, and in particular to a kind of air-conditioning.
Background technology
At present, the refrigerant that traditional air-conditioning is typically used is freon.The characteristic of freon is：Liquid is changed into from gaseous state
When, discharge substantial amounts of heat.And when being changed into gaseous state by liquid, substantial amounts of heat can be absorbed.Traditional air-conditioning include compressor,
Condenser (outdoor unit) and evaporator (indoor set).The operation principle of traditional air conditioner：Refrigerant is reached after evaporator from capillary,
Space increases suddenly, and pressure reduces, and the refrigerant of liquid will be vaporized, and become the refrigerant of gaseous state low temperature, so as to absorb a large amount of
Heat, evaporator will turn cold, and the fan of evaporator blows over indoor air from evaporator, carries out room temperature lowering.Make
Refrigerant is opposite when the flow direction of condenser and evaporator is with refrigeration, you can improve room temperature.
Because traditional air conditioner refrigeration needs refrigerant reciprocation cycle in pipeline, cause refrigerating efficiency low, and using system
Cryogen can cause environmental pollution, while, it is necessary to compressor, condenser and evaporator work simultaneously during traditional air conditioner work, power consumption
Amount is high.
The content of the invention
In view of this, the embodiment of the present invention proposes a kind of air-conditioning, to solve above-mentioned technical problem.
The embodiment of the present invention provides a kind of air-conditioning, and it includes refrigerating chamber and semiconductor chilling plate, and refrigerating chamber has air inlet
And gas outlet, installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the system of semiconductor chilling plate
Cold side is towards inside refrigerating chamber, and semiconductor chilling plate heats side towards outside refrigerating chamber.
Alternatively, the installation portion is mounting hole, and the mounting hole is arranged in the cavity wall of the refrigerating chamber, and freeze side seal
Block up the mounting hole.
Alternatively, refrigerating chamber is the hexahedron of an opening and five cavity wall compositions, and the opening is installation portion, semiconductor
Cooling piece is blocked over said opening.
Alternatively, also including conducting part, conducting part is in close contact with refrigeration side, has through hole in the middle part of conducting part, through hole
Internal diameter is less than the internal diameter of refrigeration side, and the through hole of conducting part is arranged on refrigeration side.
Alternatively, conducting part be metal wire knitted into cylinder, there is space, the via bottoms are set between wire
The contact site for increasing through hole and refrigeration side contacts area is equipped with, contact site is fitted with refrigeration side.
Alternatively, fan is installed, the air inlet of fan is towards the refrigeration side of semiconductor chilling plate in the through hole.
Alternatively, the air inlet of fan on fan, conducting part is also equipped with towards the side of conducting part on the side wall of conducting part
Wall.
Alternatively, also including heating chamber, heating chamber also has gas outlet and air inlet, heats chamber and is abutted with refrigerating chamber and sets
Put, the side direction that heats of semiconductor chilling plate is heated inside chamber.
Alternatively, heat and electric hot plate is provided with chamber, heating has thermal hole, the system of semiconductor chilling plate in the cavity wall of chamber
Hot side is fitted through thermal hole with electric hot plate.
Alternatively, refrigerating chamber is cuboid with chamber is heated, and gas outlet and air inlet are located at two relative cavity walls respectively
On, also it is respectively arranged with fan on the air inlet and gas outlet.
Air-conditioning provided in an embodiment of the present invention on the installation portion of refrigerating chamber by setting semiconductor chilling plate, you can realizes
The reduction of temperature, relative to traditional air-conditioning, it is not necessary to which refrigerant circulates in pipeline, can improve refrigerating efficiency, not result in
Environmental pollution, air-conditioning of the invention is compared to traditional air-conditioning, without installing compressor, condenser and evaporator, effect reduction
About 50%, while installing space can be reduced；Compared with traditional air-conditioning, without installing compressor, condenser and evaporator,
Effect reduces about 50%, while can reduce installing space, simple in construction, production and use cost are all relatively low, but also
Conducting part is set on cooling piece, increases contact area, cooling efficiency is further improved.
Brief description of the drawings
Fig. 1 is the structural representation of the air-conditioning of the embodiment of the present invention.
Fig. 2 is the top view of the air-conditioning of the embodiment of the present invention.
Fig. 3 is the internal structure schematic diagram of the refrigerating chamber of the air-conditioning of the embodiment of the present invention.
Fig. 4 is the sectional drawing of the conducting part of the air-conditioning of the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, technical scheme is described in detail.
Embodiment one
Fig. 1 shows the structural representation of the air-conditioning of the embodiment of the present invention, and it includes refrigerating chamber 1 and semiconductor chilling plate 2,
Refrigerating chamber 1, which has, is provided with installation portion in air inlet and gas outlet, the cavity wall of refrigerating chamber 1, semiconductor chilling plate 2 is arranged on described
On installation portion, the refrigeration side of semiconductor chilling plate 2 is towards inside refrigerating chamber 1, and semiconductor chilling plate 2 heats side towards refrigerating chamber
Outside 1.
During work, air is entered inside refrigerating chamber by air inlet, the refrigeration surveyed of freezing by semiconductor chilling plate, temperature drop
It is low, refrigerating chamber is discharged by gas outlet, the reduction of indoor temperature is realized.Air-conditioning provided in an embodiment of the present invention passes through in refrigerating chamber
Semiconductor chilling plate is set, you can realize the reduction of temperature, relative to traditional air-conditioning, it is not necessary to which refrigerant is in pipe on installation portion
Circulated in road, refrigerating efficiency can be improved, environmental pollution is not resulted in.The air-conditioning of the present invention is compared with traditional air-conditioning, without peace
Compressor, condenser and evaporator are filled, effect reduces about 50%, while installing space can be reduced, it is simple in construction, it is manufactured into
This is low.
Embodiment two
Alternatively, installation portion is mounting hole, and the mounting hole is arranged in the cavity wall of the refrigerating chamber 1, semiconductor refrigerating
Piece 2 is arranged on the mounting hole.The size of mounting hole is adapted to the size for side of freezing, and the refrigeration side seal of refrigerating chamber 1 is stifled described
Mounting hole, so as to only have air inlet and gas outlet to be in communication with the outside inside refrigerating chamber, reduces outside air and enters system from mounting hole
Inside cold chamber, to improve cooling efficiency.
In other embodiments of the invention, the hexahedron that refrigerating chamber 1 can also constitute for an opening and five cavity walls is (such as
Cuboid, square), installation portion is the opening, and semiconductor chilling plate 2 is blocked in opening, also only has the inside of refrigerating chamber 1
Air inlet and gas outlet are in communication with the outside, and reduce outside air and enter from opening inside refrigerating chamber, improve cooling efficiency.Refrigerating chamber
1 can also use other shapes, such as cylinder.
Alternatively, as shown in Figures 2 and 3, the air-conditioning also includes conducting part 4, and conducting part 4 is in close contact with refrigeration side.
The middle part of conducting part 4 has through hole 41, and the internal diameter of through hole 41 is less than the internal diameter of refrigeration side, and the through hole 41 of conducting part 4 is covered in refrigeration
On side.During work, refrigeration side temperature be delivered on conducting part, making the temperature of conducting part reduce, increase indirectly air and
The contact area of refrigeration side, preferably improves cooling efficiency.
In other embodiments of the invention, the bottom of through hole 41 is provided with for increasing through hole 41 and refrigeration side contacts
The contact site of area, contact site is fitted with refrigeration side, to increase conducting part and the contact area of refrigeration side, increases cold-side temperature processed
Conduction efficiency, preferably improves cooling-down effect.For example, setting conductive performance contact chip well, contact in the bottom of through hole 41
Piece is equal with the bottom area of through hole 41.When contact site is integrally formed with conducting part, through hole 41 can be fabricated directly into groove profile, example
Such as, the depth of through hole 41 is the half of conducting part thickness.
Further, as shown in figure 4, conducting part 4 for metal wire knitted cylinder, in order to increase air with conduction
There is densely covered space between the contact area in portion, wire, cooling efficiency is further increasing.Conducting part 4 may also set up
For other shapes, such as round estrade, cuboid.In the present embodiment, the height of cylinder inwall is slightly below the height of outer wall, passes
The material for leading portion 4 is copper wire, improves refrigeration side to the heat conductivility of conducting part 4.Contact site also can be together with conducting part 4 by metal
Silk braiding is formed, and also has space between the wire of contact site, to increase air passage rates.
Alternatively, fan 3 is installed, the refrigeration of the air inlet of fan 3 towards semiconductor chilling plate 2 in the through hole 41
Side, can avoid cold air proportion heavier, the problem of the side residence time of freezing is longer, accelerates the inner air flow of refrigerating chamber 1, improve
Cool efficiency.For example, as shown in figure 4, in the through hole 41 of the cylinder of metal wire knitted, by metal wire knitted into one
Mounting platform 42, fan 3 is arranged on mounting platform 42, also has space between the wire on mounting platform, to increase sky
Gas velocity of liquid assets.
Further, the air inlet direction conduction of fan 3 on fan 3, conducting part 4 is also equipped with the side wall of conducting part 4
The side wall in portion 4, so as to further improve the velocity of liquid assets of the inner air of refrigerating chamber 1, accelerates cooling.Preferably, conducting part 4
Four fans are provided with the wall of side, cool efficiency highest, and air passage rates, the electricity with four fans 3 are improved with four fans 3
The heat that machine is produced is compared, and the cooling-down effect that fan 3 is lifted is much larger than the heat that the motor of fan 3 is sent, therefore cooling-down effect
It is best.
Embodiment three
On the basis of above-described embodiment, as shown in figures 1 and 3, air-conditioning also includes heating chamber 5, and heating chamber 5 also has
Gas port and air inlet.Chamber 5 is heated with refrigerating chamber 1 against setting, the side direction that heats of semiconductor chilling plate 2 is heated inside chamber 5.It is logical
Cross setting and heat chamber 5, may be such that air-conditioning can be while provide heat-production functions, the utilization rate of raising semiconductor chilling plate 2, reduction is given birth to
Produce cost.
Alternatively, heat and electric hot plate 6 is provided with chamber 5, heating has thermal hole, semiconductor chilling plate 2 in the cavity wall of chamber 5
The side that heats fitted through thermal hole with electric hot plate 6.It can increase the contact area with air by setting electric hot plate 6, improve and rise
Warm efficiency.
Alternatively, refrigerating chamber 1 is cuboid with chamber 5 is heated, and gas outlet and air inlet are located at two relative chambers respectively
On wall, fan 3 is also respectively arranged with the air inlet and gas outlet.By the way that air inlet and gas outlet are oppositely arranged, and
Fan 3 is provided with air inlet and gas outlet, can accelerate to heat the air turnover speed in chamber 1 and refrigerating chamber 5, improve air and adjust
Save efficiency.
More than, technical scheme is described in detail in conjunction with specific embodiments, described specific implementation
Example is used to help understand the thought of the present invention.The derivation that those skilled in the art make on the basis of the specific embodiment of the invention
Fallen within modification within the scope of the present invention.
Claims (10)
1. a kind of air-conditioning, it is characterised in that including refrigerating chamber and semiconductor chilling plate, refrigerating chamber has air inlet and gas outlet,
Installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the refrigeration side direction of semiconductor chilling plate
Inside refrigerating chamber, semiconductor chilling plate heats side towards outside refrigerating chamber.
2. air-conditioning as claimed in claim 1, it is characterised in that the installation portion is mounting hole, the mounting hole is arranged on institute
State in the cavity wall of refrigerating chamber, refrigeration side seal blocks up the mounting hole.
3. air-conditioning as claimed in claim 1, it is characterised in that refrigerating chamber is six faces of an opening and five cavity wall compositions
Body, the opening is installation portion, and semiconductor chilling plate is blocked over said opening.
4. air-conditioning as claimed in claim 1, it is characterised in that also including conducting part, conducting part is in close contact with refrigeration side, pass
Leading has through hole in the middle part of portion, the internal diameter of through hole is less than the internal diameter of refrigeration side, and the through hole of conducting part is arranged on refrigeration side.
5. air-conditioning as claimed in claim 4, it is characterised in that conducting part be metal wire knitted into cylinder, wire it
Between have space, the via bottoms be provided with for increase through hole with refrigeration side contacts area contact site, contact site with system
Cold side is fitted.
6. air-conditioning as claimed in claim 4, it is characterised in that fan, the air inlet direction of fan are provided with the through hole
The refrigeration side of semiconductor chilling plate.
7. air-conditioning as claimed in claim 6, it is characterised in that fan, conducting part windward are also equipped with the side wall of conducting part
Side wall of the air inlet of fan towards conducting part.
8. the air-conditioning as described in claim 1-7 is any, its speciality is that, also including heating chamber, heating chamber also has gas outlet
And air inlet, chamber is heated with refrigerating chamber against setting, and the side direction that heats of semiconductor chilling plate is heated inside chamber.
9. air-conditioning as claimed in claim 8, it is characterised in that heat and electric hot plate is provided with chamber, heats in the cavity wall of chamber and has
There is thermal hole, the side that heats of semiconductor chilling plate is fitted through thermal hole with electric hot plate.
10. air-conditioning as claimed in claim 8, it is characterised in that refrigerating chamber and heat chamber and be cuboid, gas outlet and air inlet
Mouth is located in two relative cavity walls respectively, and fan is also respectively arranged with the air inlet and gas outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611109219.0A CN106949580A (en) | 2016-12-02 | 2016-12-02 | Air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611109219.0A CN106949580A (en) | 2016-12-02 | 2016-12-02 | Air-conditioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106949580A true CN106949580A (en) | 2017-07-14 |
Family
ID=59465318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611109219.0A Pending CN106949580A (en) | 2016-12-02 | 2016-12-02 | Air-conditioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106949580A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN201764602U (en) * | 2010-09-01 | 2011-03-16 | 谢建祥 | Semiconductor air conditioner |
| CN201844486U (en) * | 2010-09-26 | 2011-05-25 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air-conditioning device |
| CN203147957U (en) * | 2013-03-07 | 2013-08-21 | 王方军 | Air conditioner without noises |
| CN205317043U (en) * | 2015-12-23 | 2016-06-15 | 陈端端 | Woven wire heat accumulator |
| CN105757816A (en) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | Window type semiconductor air conditioner |
| CN206338891U (en) * | 2016-12-02 | 2017-07-18 | 王彦宸 | Air-conditioning |
-
2016
- 2016-12-02 CN CN201611109219.0A patent/CN106949580A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN201764602U (en) * | 2010-09-01 | 2011-03-16 | 谢建祥 | Semiconductor air conditioner |
| CN201844486U (en) * | 2010-09-26 | 2011-05-25 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air-conditioning device |
| CN203147957U (en) * | 2013-03-07 | 2013-08-21 | 王方军 | Air conditioner without noises |
| CN205317043U (en) * | 2015-12-23 | 2016-06-15 | 陈端端 | Woven wire heat accumulator |
| CN105757816A (en) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | Window type semiconductor air conditioner |
| CN206338891U (en) * | 2016-12-02 | 2017-07-18 | 王彦宸 | Air-conditioning |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101038121A (en) | Refrigerator | |
| WO2020147168A1 (en) | Mobile air conditioner and cooling method thereof | |
| CN203478454U (en) | Air conditioner outdoor unit and variable frequency air conditioner with same | |
| CN105716348A (en) | Refrigerator | |
| EP3214380B1 (en) | Air conditioner | |
| CN206338891U (en) | Air-conditioning | |
| CN204594038U (en) | A kind of central refrigerating module of wind cooling refrigerator | |
| CN204733506U (en) | A kind of controller cooling mechanism of Vehicular air-conditioner compressor | |
| CN204128233U (en) | Environment-friendly and energy-efficient freezer unit | |
| CN106949580A (en) | Air-conditioning | |
| CN206310788U (en) | Air-conditioning | |
| CN206310650U (en) | Air-conditioning | |
| CN106016508B (en) | Air condensing units and air conditioner | |
| CN2505785Y (en) | Multi-functional semiconductor refrigerator | |
| CN202182587U (en) | High-efficiency novel-structure semiconductor refrigeration and warm-storage box | |
| CN202016654U (en) | A new structure and multifunction semiconductor box serving dual purposes of cold storage and warm storage | |
| CN202869114U (en) | Novel simple and efficient dual-purpose semiconductor refrigerating and heating storage box | |
| CN201973955U (en) | Novel structure semiconductor refrigerating and heating box | |
| CN201873148U (en) | Novel cold storage and heat storage tank of compressor | |
| CN202757222U (en) | Electronic air conditioner for base station | |
| CN107062460A (en) | Air-conditioning | |
| CN202350374U (en) | Simple efficient semiconductor cold/warm storage container | |
| CN106989538A (en) | Air-conditioning | |
| CN104296417A (en) | Refrigerator for heat pipe | |
| KR20130122490A (en) | Method of vaporization cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170714 |
|
| RJ01 | Rejection of invention patent application after publication |