CN106989538A - Air-conditioning - Google Patents
Air-conditioning Download PDFInfo
- Publication number
- CN106989538A CN106989538A CN201611170407.4A CN201611170407A CN106989538A CN 106989538 A CN106989538 A CN 106989538A CN 201611170407 A CN201611170407 A CN 201611170407A CN 106989538 A CN106989538 A CN 106989538A
- Authority
- CN
- China
- Prior art keywords
- air
- refrigerating chamber
- semiconductor chilling
- chilling plate
- conditioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
Abstract
The embodiment of the invention discloses a kind of air-conditioning, it includes refrigerating chamber and semiconductor chilling plate, refrigerating chamber has air inlet and gas outlet, installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the refrigeration side of semiconductor chilling plate is towards inside refrigerating chamber, and semiconductor chilling plate heats side towards outside refrigerating chamber, and the material of refrigeration side is graphene.Air-conditioning provided in an embodiment of the present invention by the material of the refrigeration side of semiconductor chilling plate by being set to graphene, under the same conditions, the thermal conductivity of graphene is 36 times of ceramic wafer, the side temperature decrease rate that freezes can be accelerated, so as to accelerate the rate of temperature fall of refrigeration side surrounding air, so that the air themperature of refrigerating chamber discharge is lower, cooling-down effect is improved.
Description
Technical field
The present embodiments relate to air cooling technical field, and in particular to a kind of air-conditioning.
Background technology
At present, traditional air-conditioning can be freezed using semiconductor chilling plate.The semiconductor chilling plate of traditional air conditioner is set
Put in the cavity wall of refrigerating chamber, the refrigeration side of semiconductor chilling plate is towards refrigerating chamber, and refrigerating chamber has air inlet and gas outlet.Work
When making, air enters in refrigerating chamber from air inlet, by side refrigeration of freezing, is then arranged by gas outlet to the outside of refrigerating chamber.
Inventor has found that the material of the refrigeration side of semiconductor chilling plate is ceramic wafer, pottery during the present invention is realized
The thermal conductivity of porcelain plate is not high, and the cooling rate of ceramic wafer itself is slower so that the temperature drop of refrigeration side surrounding air is slow, leads
The air themperature for causing refrigerating chamber gas outlet to discharge is higher, and cooling-down effect is not obvious.
The content of the invention
In view of this, the embodiment of the present invention proposes a kind of air-conditioning, to solve above-mentioned technical problem.
The embodiment of the present invention provides a kind of air-conditioning, and it includes refrigerating chamber and semiconductor chilling plate, and refrigerating chamber has air inlet
And gas outlet, installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the system of semiconductor chilling plate
Cold side is towards inside refrigerating chamber, and semiconductor chilling plate heats side towards outside refrigerating chamber, and the material of the refrigeration side is graphite
Alkene.
Alternatively, the installation portion is mounting hole, and the mounting hole is arranged in the cavity wall of the refrigerating chamber, and freeze side seal
Block up the mounting hole.
Alternatively, refrigerating chamber is the hexahedron of an opening and five cavity wall compositions, and the opening is installation portion, semiconductor
Cooling piece is blocked over said opening.
Alternatively, in addition to conducting part, conducting part is in close contact with refrigeration side, has through hole in the middle part of conducting part, through hole
Internal diameter is less than the internal diameter of refrigeration side, and the through hole of conducting part is arranged on refrigeration side.
Alternatively, conducting part be metal wire knitted into cylinder, there is space, the via bottoms are set between wire
The contact site for increasing through hole and refrigeration side contacts area is equipped with, contact site is fitted with refrigeration side.
Alternatively, fan is installed, the air inlet of fan is towards the refrigeration side of semiconductor chilling plate in the through hole.
Alternatively, the air inlet of fan on fan, conducting part is also equipped with towards the side of conducting part on the side wall of conducting part
Wall.
Alternatively, in addition to chamber is heated, heating chamber also has gas outlet and air inlet, heats chamber and abutted with refrigerating chamber and set
Put, the side that heats of semiconductor chilling plate is also graphene towards intracavitary portion, the material for heating side is heated.
Alternatively, heat intracavitary and be provided with electric hot plate, heating has thermal hole, the system of semiconductor chilling plate in the cavity wall of chamber
Hot side is fitted through thermal hole with electric hot plate.
Alternatively, refrigerating chamber is cuboid with chamber is heated, and gas outlet and air inlet are located at two relative cavity walls respectively
On, also it is respectively arranged with fan on the air inlet and gas outlet.
Air-conditioning provided in an embodiment of the present invention by the way that the material of the refrigeration side of semiconductor chilling plate is set into graphene,
Under the same terms, the thermal conductivity of graphene is 36 times of ceramic wafer, can accelerate the side temperature decrease rate that freezes, so as to accelerate refrigeration
The rate of temperature fall of side surrounding air so that the air themperature of refrigerating chamber discharge is lower, improves cooling-down effect；Simultaneously by semiconductor system
The material for heating side of cold is also configured as graphene, can accelerate to heat the programming rate of side surrounding air, improve temperature rise effect.
Brief description of the drawings
Fig. 1 is the structural representation of the air-conditioning of the embodiment of the present invention.
Fig. 2 is the top view of the air-conditioning of the embodiment of the present invention.
Fig. 3 is the internal structure schematic diagram of the refrigerating chamber of the air-conditioning of the embodiment of the present invention.
Fig. 4 is the schematic partial sectional view of the conducting part of the air-conditioning of the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, technical scheme is described in detail.
Embodiment one
Fig. 1 shows the structural representation of the air-conditioning of the embodiment of the present invention, and it includes refrigerating chamber 1 and semiconductor chilling plate 2,
Refrigerating chamber 1, which has, is provided with installation portion in air inlet and gas outlet, the cavity wall of refrigerating chamber 1, semiconductor chilling plate 2 is arranged on described
On installation portion, the refrigeration side of semiconductor chilling plate 2 is towards inside refrigerating chamber 1, and semiconductor chilling plate 2 heats side towards refrigerating chamber
Outside 1, the material of refrigeration side is graphene.Graphene (Graphene) is stripped out from graphite material, by carbon atom group
Into only one layer of atomic thickness two dimensional crystal.
During work, air is entered inside refrigerating chamber by air inlet, the refrigeration surveyed of freezing by semiconductor chilling plate, temperature drop
It is low, refrigerating chamber is discharged by gas outlet, the reduction of indoor temperature is realized.Under the conditions of room temperature (25 DEG C), the thermal conductivity of graphene is
5000w/hk, the thermal conductivity of graphene is 36 times of silicon (composition of ceramic wafer), 20 times of GaAs；The thermal conductivity of metallic copper
Rate is 401w/hk, and the thermal conductivity of graphene is about 12.5 times of copper.
Air-conditioning provided in an embodiment of the present invention by the way that the material of the refrigeration side of semiconductor chilling plate is set into graphene,
Under the same terms, the thermal conductivity of graphene is 36 times of ceramic wafer, can accelerate the side temperature decrease rate that freezes, so as to accelerate refrigeration
The rate of temperature fall of side surrounding air so that the air themperature of refrigerating chamber discharge is lower, improves cooling-down effect.
Embodiment two
On the basis of embodiment one, two semiconductor chilling plates, respectively the first semiconductor chilling plate and second are chosen
Semiconductor chilling plate.
Wherein, the material of the refrigeration side of the first semiconductor chilling plate is ceramic wafer, and the size of refrigeration side is：Length * width *
Thickness=40*40*0.8mm.
The material of the refrigeration side of second semiconductor chilling plate is graphene, and its size is also：Length * width * thickness=40*
40*0.8mm。
The refrigerating chamber of one predetermined, such as length * width * thickness=300*300*150mm, the size of installation portion are set
It is identical with the size for side of freezing.
The refrigeration side of first semiconductor chilling plate is installed on installation portion, refrigeration side heats side towards inside refrigerating chamber
Towards outside refrigerating chamber.Air themperature in refrigerating chamber is down to 18 DEG C, use by 25 DEG C by the refrigeration side of the first semiconductor chilling plate
When 30 seconds.
Under the same conditions, the refrigeration side of the second semiconductor chilling plate is installed on installation portion, the same direction in side of freezing
Inside refrigerating chamber, side is heated towards outside refrigerating chamber.The refrigeration side of second semiconductor chilling plate is by the air themperature in refrigerating chamber
18 DEG C, 10 seconds used times are down to by 25 DEG C.
As can be seen here, the material of semiconductor chilling plate refrigeration side is replaced with into graphene by ceramic wafer, refrigerating chamber can be accelerated
Interior air cooling-down speed, improves cooling-down effect.
Embodiment three
On the basis of embodiment one, two semiconductor chilling plates, respectively the 3rd semiconductor chilling plate and the 4th are chosen
Semiconductor chilling plate.
Wherein, the material of the refrigeration side of the 3rd semiconductor chilling plate is ceramic wafer, and the size of refrigeration side is：Length * width *
Thickness=80*80*1.0mm.
The material of the refrigeration side of 4th semiconductor chilling plate is graphene, and its size is also：Length * width * thickness=80*
80*1.0mm。
The refrigerating chamber of one predetermined, such as length * width * thickness=300*300*150mm, the size of installation portion are set
It is identical with the size for side of freezing.
The refrigeration side of 3rd semiconductor chilling plate is installed on installation portion, refrigeration side heats side towards inside refrigerating chamber
Towards outside refrigerating chamber.Air themperature in refrigerating chamber is down to 18 DEG C, use by 25 DEG C by the refrigeration side of the 3rd semiconductor chilling plate
When 10 seconds.
Under the same conditions, the refrigeration side of the 4th semiconductor chilling plate is installed on installation portion, the same direction in side of freezing
Inside refrigerating chamber, side is heated towards outside refrigerating chamber.The refrigeration side of 4th semiconductor chilling plate is by the air themperature in refrigerating chamber
18 DEG C, 2 seconds used times are down to by 25 DEG C.
As can be seen here, the material of semiconductor chilling plate refrigeration side is replaced with into graphene by ceramic wafer, refrigerating chamber can be accelerated
Interior air cooling-down speed, improves cooling-down effect.Moreover, with the increase of refrigeration Side Volume, the refrigeration side of ceramic wafer material and stone
Cooling-down effect difference between the refrigeration side of black alkene material is increasing, and the cooling-down effect of the refrigeration side of graphene material more shows
Write.
Example IV
On the basis of embodiment one, alternatively, installation portion is mounting hole, and the mounting hole is arranged on the refrigerating chamber 1
Cavity wall on, semiconductor chilling plate 2 be arranged on the mounting hole on.The size of mounting hole is adapted to the size for side of freezing, and is freezed
The refrigeration side seal of chamber 1 blocks up the mounting hole, so as to only have air inlet and gas outlet to be in communication with the outside inside refrigerating chamber, reduces extraneous
Air enters inside refrigerating chamber from mounting hole, to improve cooling efficiency.
In other embodiments of the invention, the hexahedron that refrigerating chamber 1 can also constitute for an opening and five cavity walls is (such as
Cuboid, square), installation portion is the opening, and semiconductor chilling plate 2 is blocked in opening, also only has the inside of refrigerating chamber 1
Air inlet and gas outlet are in communication with the outside, and reduce outside air and enter from opening inside refrigerating chamber, improve cooling efficiency.Refrigerating chamber
1 can also use other shapes, such as cylinder.
Alternatively, as shown in Figures 2 and 3, the air-conditioning also includes conducting part 4, and conducting part 4 is in close contact with refrigeration side.
The middle part of conducting part 4 has through hole 41, and the internal diameter of through hole 41 is less than the internal diameter of refrigeration side, and the through hole 41 of conducting part 4 is covered in refrigeration
On side.During work, refrigeration side temperature be delivered on conducting part, making the temperature of conducting part reduce, increase indirectly air and
The contact area of refrigeration side, preferably improves cooling efficiency.
In other embodiments of the invention, the bottom of through hole 41 is provided with for increasing through hole 41 and refrigeration side contacts
The contact site of area, contact site is fitted with refrigeration side, to increase conducting part and the contact area of refrigeration side, increases cold-side temperature processed
Conduction efficiency, preferably improves cooling-down effect.For example, setting conductive performance contact chip well, contact in the bottom of through hole 41
Piece is equal with the bottom area of through hole 41.When contact site is integrally formed with conducting part, through hole 41 can be fabricated directly into groove profile, example
Such as, the depth of through hole 41 is the half of conducting part thickness.
Further, as shown in figure 4, conducting part 4 is the cylinder of metal wire knitted, in order to increase air and conduction
There is densely covered space between the contact area in portion, wire, cooling efficiency is further increasing.Conducting part 4 may also set up
For other shapes, such as round estrade, cuboid.In the present embodiment, the height of cylinder inwall is slightly below the height of outer wall, passes
The material for leading portion 4 is copper wire, improves refrigeration side to the heat conductivility of conducting part 4.Contact site also can be together with conducting part 4 by metal
Silk braiding is formed, and also has space between the wire of contact site, to increase air passage rates.
Alternatively, fan 3 is installed, the refrigeration of the air inlet of fan 3 towards semiconductor chilling plate 2 in the through hole 41
Side, can avoid cold air proportion heavier, the problem of the side residence time of freezing is longer, accelerates the inner air flow of refrigerating chamber 1, improve
Cool efficiency.For example, as shown in figure 4, in the through hole 41 of the cylinder of metal wire knitted, by metal wire knitted into one
Mounting platform 42, fan 3 is arranged on mounting platform 42, also has space between the wire on mounting platform, to increase sky
Gas velocity of liquid assets.
Further, the air inlet direction conduction of fan 3 on fan 3, conducting part 4 is also equipped with the side wall of conducting part 4
The side wall in portion 4, so as to further improve the velocity of liquid assets of the inner air of refrigerating chamber 1, accelerates cooling.Preferably, conducting part 4
Four fans are provided with the wall of side, cool efficiency highest, and air passage rates, the electricity with four fans 3 are improved with four fans 3
The heat that machine is produced is compared, and the cooling-down effect that fan 3 is lifted is much larger than the heat that the motor of fan 3 is sent, therefore cooling-down effect
It is best.
Embodiment five
On the basis of embodiment one, as shown in figures 1 and 3, air-conditioning also includes heating chamber 5, and heating chamber 5 also has outlet
Mouth and air inlet.Chamber 5 is heated with refrigerating chamber 1 against setting, the side direction that heats of semiconductor chilling plate 2 is heated inside chamber 5, is heated
The material of side is also graphene.Chamber 5 is heated by setting, may be such that air-conditioning can improve semiconductor while provide heat-production functions
The utilization rate of cooling piece 2, reduces production cost, and by the way that the material for heating side is replaced with by ceramic wafer of the prior art
Graphene, can accelerate to heat the programming rate of side surrounding air, greatly improve the heating efficiency for heating side.
Embodiment six
On the basis of embodiment five, two semiconductor chilling plates, respectively the 5th semiconductor chilling plate and the 6th are chosen
Semiconductor chilling plate.
Wherein, the material for heating side of the 5th semiconductor chilling plate is ceramic wafer, and the size for heating side is：Length * width *
Thickness=30*30*0.6mm.
The material for heating side of 6th semiconductor chilling plate is graphene, and its size is also：Length * width * thickness=30*
30*0.6mm。
Set predetermined heats chamber, such as length * width * thickness=400*400*150mm.
The refrigeration side of 5th semiconductor chilling plate is installed on refrigerating chamber, refrigerating chamber is heated with heating chamber against setting
Side direction heats intracavitary portion.The side that heats of 5th semiconductor chilling plate will heat the air themperature of intracavitary and rise to 30 DEG C by 20 DEG C,
45 seconds used times.
Under the same conditions, the refrigeration side of the 6th semiconductor chilling plate is installed on refrigerating chamber, refrigerating chamber is with heating chamber
Against setting, heat side direction and heat intracavitary portion.6th semiconductor chilling plate heat side will heat the air themperature of intracavitary by
20 DEG C rise to 30 DEG C, 15 seconds used times.
As can be seen here, the material for heating side of semiconductor chilling plate is replaced with into graphene by ceramic wafer, can accelerates to heat
Chamber air programming rate, improves temperature rise effect.
Embodiment seven
On the basis of embodiment five, two semiconductor chilling plates, respectively the 7th semiconductor chilling plate and the 8th are chosen
Semiconductor chilling plate.
Wherein, the material for heating side of the 7th semiconductor chilling plate is ceramic wafer, and the size for heating side is：Length * width *
Thickness=60*60*1.2mm.
The material for heating side of 8th semiconductor chilling plate is graphene, and its size is also：Length * width * thickness=60*
60*1.2mm。
Set predetermined heats chamber, such as length * width * thickness=400*400*150mm.
The refrigeration side of 7th semiconductor chilling plate is installed on refrigerating chamber, refrigerating chamber is heated with heating chamber against setting
Side direction heats intracavitary portion.The side that heats of 7th semiconductor chilling plate will heat the air themperature of intracavitary and rise to 30 DEG C by 20 DEG C,
20 seconds used times.
Under the same conditions, the refrigeration side of the 6th semiconductor chilling plate is installed on refrigerating chamber, refrigerating chamber is with heating chamber
Against setting, heat side direction and heat intracavitary portion.6th semiconductor chilling plate heat side will heat the air themperature of intracavitary by
20 DEG C rise to 30 DEG C, 3 seconds used times.
As can be seen here, the material for heating side of semiconductor chilling plate is replaced with into graphene by ceramic wafer, can accelerates to heat
Chamber air programming rate, improves temperature rise effect.Moreover, with the increase for heating Side Volume, graphene material heats side
Temperature rise effect is more notable.
Embodiment eight
On the basis of embodiment five, alternatively, heat and electric hot plate 6 is provided with chamber 5, have in the cavity wall for heating chamber 5
Fitted through thermal hole with electric hot plate 6 thermal hole, the side that heats of semiconductor chilling plate 2.By setting electric hot plate 6 to increase and sky
The contact area of gas, improves heating efficiency.
Alternatively, refrigerating chamber 1 is cuboid with chamber 5 is heated, and gas outlet and air inlet are located at two relative chambers respectively
On wall, fan 3 is also respectively arranged with the air inlet and gas outlet.By the way that air inlet and gas outlet are oppositely arranged, and
Fan 3 is provided with air inlet and gas outlet, can accelerate to heat the air turnover speed in chamber 1 and refrigerating chamber 5, improve air and adjust
Save efficiency.
More than, technical scheme is described in detail in conjunction with specific embodiments, described specific implementation
Example is used to help understand the thought of the present invention.The derivation that those skilled in the art make on the basis of the specific embodiment of the invention
Fallen within modification within the scope of the present invention.
Claims (10)
1. a kind of air-conditioning, it is characterised in that including refrigerating chamber and semiconductor chilling plate, refrigerating chamber has air inlet and gas outlet,
Installation portion is provided with refrigerating chamber, semiconductor chilling plate is arranged on the installation portion, the refrigeration side direction of semiconductor chilling plate
Inside refrigerating chamber, semiconductor chilling plate heats side towards outside refrigerating chamber, and the material of the refrigeration side is graphene.
2. air-conditioning as claimed in claim 1, it is characterised in that the installation portion is mounting hole, the mounting hole is arranged on institute
State in the cavity wall of refrigerating chamber, refrigeration side seal blocks up the mounting hole.
3. air-conditioning as claimed in claim 1, it is characterised in that refrigerating chamber is six faces of an opening and five cavity wall compositions
Body, the opening is installation portion, and semiconductor chilling plate is blocked over said opening.
4. air-conditioning as claimed in claim 1, it is characterised in that also including conducting part, conducting part is in close contact with refrigeration side, pass
Leading has through hole in the middle part of portion, the internal diameter of through hole is less than the internal diameter of refrigeration side, and the through hole of conducting part is arranged on refrigeration side.
5. air-conditioning as claimed in claim 4, it is characterised in that conducting part be metal wire knitted into cylinder, wire it
Between have space, the via bottoms be provided with for increase through hole with refrigeration side contacts area contact site, contact site with system
Cold side is fitted.
6. air-conditioning as claimed in claim 4, it is characterised in that fan, the air inlet direction of fan are provided with the through hole
The refrigeration side of semiconductor chilling plate.
7. air-conditioning as claimed in claim 6, it is characterised in that fan, conducting part windward are also equipped with the side wall of conducting part
Side wall of the air inlet of fan towards conducting part.
8. the air-conditioning as described in claim 1-7 is any, its speciality is, in addition to heats chamber, heating chamber also has gas outlet
And air inlet, chamber is heated with refrigerating chamber against setting, and the side direction that heats of semiconductor chilling plate heats intracavitary portion, described to heat side
Material also be graphene.
9. air-conditioning as claimed in claim 8, it is characterised in that heat intracavitary and be provided with electric hot plate, heats in the cavity wall of chamber and has
There is thermal hole, the side that heats of semiconductor chilling plate is fitted through thermal hole with electric hot plate.
10. air-conditioning as claimed in claim 8, it is characterised in that refrigerating chamber and to heat chamber be cuboid, gas outlet and air inlet
Mouth is located in two relative cavity walls respectively, and fan is also respectively arranged with the air inlet and gas outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611170407.4A CN106989538A (en) | 2016-12-16 | 2016-12-16 | Air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611170407.4A CN106989538A (en) | 2016-12-16 | 2016-12-16 | Air-conditioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106989538A true CN106989538A (en) | 2017-07-28 |
Family
ID=59413736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611170407.4A Pending CN106989538A (en) | 2016-12-16 | 2016-12-16 | Air-conditioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106989538A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN201844486U (en) * | 2010-09-26 | 2011-05-25 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air-conditioning device |
| CN104738945A (en) * | 2015-04-17 | 2015-07-01 | 万新光学集团有限公司 | Spectacle case with built-in cooling interlayer |
| CN205317043U (en) * | 2015-12-23 | 2016-06-15 | 陈端端 | Woven wire heat accumulator |
| CN105757816A (en) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | Window type semiconductor air conditioner |
| CN206310788U (en) * | 2016-12-16 | 2017-07-07 | 王彦宸 | Air-conditioning |
-
2016
- 2016-12-16 CN CN201611170407.4A patent/CN106989538A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN201844486U (en) * | 2010-09-26 | 2011-05-25 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air-conditioning device |
| CN104738945A (en) * | 2015-04-17 | 2015-07-01 | 万新光学集团有限公司 | Spectacle case with built-in cooling interlayer |
| CN205317043U (en) * | 2015-12-23 | 2016-06-15 | 陈端端 | Woven wire heat accumulator |
| CN105757816A (en) * | 2016-03-31 | 2016-07-13 | 青岛海尔空调器有限总公司 | Window type semiconductor air conditioner |
| CN206310788U (en) * | 2016-12-16 | 2017-07-07 | 王彦宸 | Air-conditioning |
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Application publication date: 20170728 |
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