CN106933035A - The photosensitive glue composition of the ink of resistance to UV and its application in baking CTP editions is exempted from - Google Patents
The photosensitive glue composition of the ink of resistance to UV and its application in baking CTP editions is exempted from Download PDFInfo
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- CN106933035A CN106933035A CN201710192344.0A CN201710192344A CN106933035A CN 106933035 A CN106933035 A CN 106933035A CN 201710192344 A CN201710192344 A CN 201710192344A CN 106933035 A CN106933035 A CN 106933035A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/055—Thermographic processes for producing printing formes, e.g. with a thermal print head
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Abstract
The invention discloses the photosensitive glue composition of the ink of resistance to UV and its application in baking CTP editions is exempted from, the photosensitive glue composition of the ink of resistance to UV includes 10 20 parts of phenolic resin；5 30 parts of epoxy modified phenolic resin；5 20 parts of acrylic amide modified phenolic resin；35 parts of urethane acrylate；10 20 parts of the carboxylate of alkylphenol-formaldehyde resin and the sulfonic acid chloride of 2 diazonium, 1 naphthoquinones 4；2 20 parts of pyrogallol acetone resin and 2 diazonium, 1 naphthoquinones, 5 sulfonic acid chloride carboxylate；0.5 3 parts of dyestuff；38 parts of chaotropic agent；0.5 1.5 parts of nucleophilic catalyst；Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 5 20.Prepared using the photosensitive glue composition of the ink of resistance to UV CTP editions of the present invention can not carry out next step UV ink printing process by toasted treatment, save time and manpower, reduce cost, and pressrun is high, high resolution and definition is good.
Description
Technical field
The present invention relates to CTP editions plate-making technology field, in particular it relates to the photosensitive glue composition of the ink of resistance to UV and its
Application in baking CTP editions is exempted from.
Background technology
CTP (Computer to Plate) technology is a kind of digitlization directly plate-making for occurring nineteen nineties
Technology, is that graph text information is copied to the technology on plate by computer by laser platemaker.CTP editions is broadly divided into temperature-sensitive
Type, silver salt type, photo-polymerization type, exempt from processing-type, Thermal sensitive plate general at present mainly include negative image heat cross-linked type heat-sensitive CTP plate,
Positive thermosensitive CTP version and thermal ablation type heat-sensitive CTP plate.Wherein, positive thermosensitive CTP version is one layer of heat of coating on one piece of aluminium base
What quick image forming composition was formed, its image-forming principle is that the physics based on thermographic composition before and after infrared laser exposure becomes
Change, before exposure, carbonyl or ether and the phenolic hydroxyl group in film forming phenol resin of the molten dissolution compound of resistance in composition form molecule
Between hydrogen bond, thermographic composition is had the molten effect of resistance before exposure；During exposure, due to IR dyes by laser light energy in moment
Heat is efficiently converted into, the hydrogen bond in thermographic composition is destroyed rapidly, and heat energy scatters and disappears rapidly after exposure, hydrogen bond quilt
The state of destruction continues so that the phenolic hydroxyl group of phenol resin is released, thus the enhancing of exposed portion alkali solubility, by alkaline-based developer
Exposed portion can be removed, obtain positive printing plates.Thermographic composition the printing quality of positive thermosensitive CTP version is played to
Close important effect.
Boutique packaging box in the market all needs to carry out printing using UV ink to can be only achieved substantially when printing
Required precision U.S. effect, but due to the solvent used in UV ink to the destruction of existing common printed plate than larger,
Often there is pressrun not high, resolution ratio and definition do not reach requirement, the life-span is to come to an end after the print of printing hundreds of.To solve to be somebody's turn to do
Common printed plate must be carried out baking treatment to strengthen its printing adaptability by problem, user, but baking process is wasted again
Time and manpower, increased use cost（The heating power consumption of oven is huge）, and be still difficult to reach through the printing effect after baking sheet
To the requirement of high-quality packing box.
The content of the invention
It is described based on this, the invention reside in the defect for overcoming prior art, there is provided a kind of photosensitive glue composition of the ink of resistance to UV
The photosensitive glue composition ink of resistance to UV of the ink of resistance to UV is strong, and solvent resistant effect is good, and, pressrun good with UV ink fitness is high, printing
Quality is good, and solidification rate is fast.
Another object of the present invention is to provide the photosensitive glue composition of the ink of resistance to UV answering in baking CTP editions is exempted from
With.
Exempt from baking CTP editions another object of the present invention is to provide one kind.
Another object of the present invention is to provide a kind of preparation method for exempting from baking CTP editions.
It is as follows with its technical scheme：
A kind of photosensitive glue composition, including the component calculated in parts by mass as follows：
Phenolic resin 10-20 parts；
Epoxy modified phenolic resin 5-30 parts；
Acrylic amide modified phenolic resin 5-20 parts；
Urethane acrylate 3-5 parts；
Carboxylate 10-20 parts of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides；
2-20 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chloride carboxylates；
Dyestuff 0.5-3 parts；
Chaotropic agent 3-8 parts；
Nucleophilic catalyst 0.5-1.5 parts；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 5-20.
Inventor is found through experiments that, including the photosensitive glue composition of said components has the ink of resistance to UV strong, solvent resistant
Effect is good, the features such as good with UV ink cooperation printing quality.Wherein, epoxy modified phenolic resin, acrylic amide modified phenolic aldehyde tree
Fat, urethane acrylate can resist the dissolving of UV ink；It is phenolic resin, epoxy modified phenolic resin, acrylic amide modified
Phenolic resin is as film-forming resin, and its compatibility is good, and homogeneous film can be formed during coating；Phenolic resin is conducive to increasing coating
Development dissolubility；Acrylic amide modified phenolic aldehyde can also protect figure in resin development, increase resolving power；Urethane acrylate
Itself is also UV resins, and it is good with the matching of UV ink, and wearability is good；Alkyl resinox and 2- diazonium -1- naphthalenes
The carboxylate of quinone -4- sulfonic acid chlorides, pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chlorides carboxylates can be in laser
Under resolve into acidic materials, film is easily dissolved in developer solution；Urethane acrylate, phenolic resinoid and 2- diazonium -1-
The carboxylate of naphthoquinones -4- sulfonic acid chlorides, may be used also between pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chloride carboxylates
Associated with Van der Waals force with forming hydrogen bond, make coating that there is the performance of the ink of resistance to UV；Figure is easier to see after dyestuff makes development
Examine；Nucleophilic catalyst promotes epoxy modified phenolic resin solidification；When the epoxide equivalent of epoxy modified phenolic resin is 5-20,
The coating prepared by the photosensitive glue composition without through high-temperature baking printing UV ink can be carried out, and coating print
Brush adaptability is good, and print distinctness is high.
Wherein in one embodiment, the epoxide equivalent of the epoxy modified phenolic resin is 5-10.When epoxide modified phenol
The epoxide equivalent of urea formaldehyde is 5-10, can further increase the printing adaptability of coating.
Wherein in one embodiment, the acrylic amide modified phenolic resin molecular weight is 5000-15000.
Wherein in one embodiment, the dyestuff is triaryl methane type basic-dyeable fibre.
Wherein in one embodiment, the chaotropic agent is organic acid.
Exempting to toast the application during positive thermosensitive CTP version makes the invention also discloses the photosensitive glue composition.
A kind of preparation method of positive thermosensitive CTP version, it uses the photosensitive glue composition, the positive heat-sensitive CTP
The preparation method of version comprises the following steps：
S1, sheet material treatment：Aluminium base is surface-treated, electrolyzing and coarsening, oxidation is then carried out；
The preparation of the photosensitive coating fluid of S2, positive heat-sensitive CTP：The photosensitive glue composition is well mixed, solvent is added, will be photosensitive
With being the photosensitive coating fluid of 50-70cp as viscosity, the solvent is glycol monoethyl ether or ethylene glycol monoethyl ether to glue composition；
S3, coating：Photosensitive coating fluid is coated on sheet material after treatment by double-coated mode；
S4, drying：Drying scribbles the sheet material of photosensitive coating fluid, its surface is formed photosensitive layer, obtains positive thermosensitive CTP version.
The positive thermosensitive CTP version prepared by the preparation method.
The beneficial effects of the present invention are：
（1）The present invention is using phenolic resin, epoxy modified phenolic resin, acrylic amide modified phenolic resin, polyurethane acroleic acid
Ester makes it have the ink of resistance to UV by force as the main component of photosensitive glue composition, and solvent resistant effect is good, coordinates with UV ink and prints
The features such as brush quality is good, wherein epoxy modified phenolic resin, acrylic amide modified phenolic resin, urethane acrylate can be supported
The dissolving of anti-UV ink；Phenolic resin, epoxy modified phenolic resin, acrylic amide modified phenolic resin as film-forming resin,
Its compatibility is good, and homogeneous film can be formed during coating；Phenolic resin is conducive to increasing coating development dissolubility when coordinating；Acryloyl
Amine modified phenolic also protects figure in resin development, increases resolving power；Urethane acrylate in itself also be UV resins, its with
The matching of UV ink is good, and wearability is good；Epoxide equivalent can as one of which component for the epoxide modified phenolic aldehyde tree of 5-20
Make coating without printing UV ink can be carried out through high-temperature baking, and the printing adaptability of coating is good, print distinctness is high.
（2）The present invention coats on sheet material after treatment photosensitive coating fluid by double-coated mode, enters one
Step increased the proof stress of photosensitive layer.
（3）CTP editions that utilizes the photosensitive glue composition of the ink of resistance to UV to prepare of the invention can not toasted treatment
Next step UV ink printing process is carried out, time and manpower has been saved, cost is reduced, and pressrun is high, high resolution and clear
Degree is good.
Specific embodiment
To make the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with specific embodiment, to this
Invention is described in further detail.It should be appreciated that specific embodiment described herein is only used to explain this hair
It is bright, do not limit protection scope of the present invention.
Embodiment 1
Photosensitive glue composition is prepared, its each component and its mass fraction are as follows：
15 parts of phenolic resin；
20 parts of epoxy modified phenolic resin；
10 parts of acrylic amide modified phenolic resin；
5 parts of urethane acrylate；
15 parts of the carboxylate of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides；
10 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chlorides carboxylate；
1 part of dyestuff；
5 parts of chaotropic agent；
1 part of nucleophilic catalyst；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 10.
In this implementation, prepare the positive thermosensitive CTP version and used above-mentioned photosensitive glue composition, positive thermosensitive CTP version
Preparation method comprises the following steps：
S1, sheet material treatment：Aluminium base is surface-treated, electrolyzing and coarsening, oxidation, in the present embodiment, the plate is then carried out
Material treatment uses the routine operation of those skilled in the art, and specific mode of operation is as follows：
Aluminium base is surface-treated：Use 10% sodium hydroxide solution, cleaned under the conditions of 50-70 DEG C, then through hydrochloric acid or
Sulfuric acid is neutralized to be made pH=5-6, washes again, then electrochemical treatments are carried out to the space of a whole page, obtains shaggy porous version, then electricity consumption
Stream, aqueous sulfuric acid carry out oxidation processes at 20 DEG C of temperature.
The preparation of the photosensitive coating fluid of S2, positive heat-sensitive CTP：The photosensitive glue composition is well mixed, solvent is added, will
Photosensitive glue composition is made into the photosensitive coating fluid for 60cp for viscosity, and the solvent is glycol monoethyl ether.
S3, coating：Photosensitive coating fluid is coated on sheet material after treatment by double-coated mode, this implementation
In example, using the apparatus for coating of the double-deck coating heat-sensitive CTP plate of positive-type, it has set gradually bottom painting on plate conveying direction
Cloth mechanism and top layer coating mechanism.
S4, drying：Drying scribbles the sheet material of photosensitive coating fluid, its surface is formed photosensitive layer, obtains positive heat-sensitive CTP
Version.
Embodiment 2
Photosensitive glue composition is prepared, its each component and its mass fraction are as follows：
10 parts of phenolic resin；
30 parts of epoxy modified phenolic resin；
5 parts of acrylic amide modified phenolic resin；
3 parts of urethane acrylate；
20 parts of the carboxylate of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides；
2 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chlorides carboxylate；
3 parts of dyestuff；
8 parts of chaotropic agent；
1 part of nucleophilic catalyst；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 5.
In this implementation, prepare the positive thermosensitive CTP version and used above-mentioned photosensitive glue composition, positive thermosensitive CTP version
Preparation method comprises the following steps：
S1, sheet material treatment：Aluminium base is surface-treated, electrolyzing and coarsening, oxidation, in the present embodiment, the plate is then carried out
Material treatment uses the routine operation of those skilled in the art, and specific mode of operation is as follows：
Aluminium base is surface-treated：Use 5% sodium hydroxide solution, cleaned under the conditions of 50-70 DEG C, then through hydrochloric acid or
Sulfuric acid is neutralized to be made pH=5-6, washes again, then electrochemical treatments are carried out to the space of a whole page, obtains shaggy porous version, then electricity consumption
Stream, aqueous sulfuric acid carry out oxidation processes at 25 DEG C of temperature.
The preparation of the photosensitive coating fluid of S2, positive heat-sensitive CTP：The photosensitive glue composition is well mixed, solvent is added, will
Photosensitive glue composition is made into the photosensitive coating fluid for 50cp for viscosity, and the solvent is glycol dimethyl ether.
S3, coating：Photosensitive coating fluid is coated on sheet material after treatment by double-coated mode, this implementation
In example, using the apparatus for coating of the double-deck coating heat-sensitive CTP plate of positive-type, it has set gradually bottom painting on plate conveying direction
Cloth mechanism and top layer coating mechanism.
S4, drying：Drying scribbles the sheet material of photosensitive coating fluid, its surface is formed photosensitive layer, obtains positive heat-sensitive CTP
Version.
Embodiment 3
Photosensitive glue composition is prepared, including the component calculated in parts by mass as follows：
20 parts of phenolic resin；
5 parts of epoxy modified phenolic resin；
20 parts of acrylic amide modified phenolic resin；
3 parts of urethane acrylate；
10 parts of the carboxylate of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides；
20 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chlorides carboxylate；
0.5 part of dyestuff；
3 parts of chaotropic agent；
0.5 part of nucleophilic catalyst；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 20.
In this implementation, prepare the positive thermosensitive CTP version and used above-mentioned photosensitive glue composition, positive thermosensitive CTP version
Preparation method comprises the following steps：
S1, sheet material treatment：Aluminium base is surface-treated, electrolyzing and coarsening, oxidation, in the present embodiment, the plate is then carried out
Material treatment uses the routine operation of those skilled in the art, and specific mode of operation is as follows：
Aluminium base is surface-treated：Use 5% sodium hydroxide solution, cleaned under the conditions of 50-70 DEG C, then through hydrochloric acid or
Sulfuric acid is neutralized to be made pH=5-6, washes again, then electrochemical treatments are carried out to the space of a whole page, obtains shaggy porous version, then electricity consumption
Stream, aqueous sulfuric acid carry out oxidation processes at 25 DEG C of temperature.
The preparation of the photosensitive coating fluid of S2, positive heat-sensitive CTP：The photosensitive glue composition is well mixed, solvent is added, will
Photosensitive glue composition is made into the photosensitive coating fluid for 50cp for viscosity, and the solvent is glycol dimethyl ether.
S3, coating：Photosensitive coating fluid is coated on sheet material after treatment by double-coated mode, this implementation
In example, using the apparatus for coating of the double-deck coating heat-sensitive CTP plate of positive-type, it has set gradually bottom painting on plate conveying direction
Cloth mechanism and top layer coating mechanism.
S4, drying：Drying scribbles the sheet material of photosensitive coating fluid, its surface is formed photosensitive layer, obtains positive heat-sensitive CTP
Version.
Embodiment 4
The component of photosensitive glue composition described in the present embodiment and the preparation method of positive thermosensitive CTP version are substantially the same manner as Example 1,
Difference is that the epoxide equivalent of epoxy epoxy modified phenolic resin used by the present embodiment is 20.
Comparative example 1
The positive board positive-type ink of the resistance to UV photosensitive liquid TY-1 of Thailand of sun chemistry Science and Technology Ltd. of purchase Jiangsu Thailand production, it is photosensitive with this
Photosensitive glue composition in glue alternate embodiment 1, the preparation method as described in embodiment 1 prepares positive thermosensitive CTP version.
Comparative example 2
The component of photosensitive glue composition described in the present embodiment and the preparation method of positive thermosensitive CTP version are substantially the same manner as Example 1,
Difference is that the epoxide equivalent of epoxy epoxy modified phenolic resin used by this comparative example is 25.
Comparative example 3
The component of photosensitive glue composition described in the present embodiment and the preparation method of positive thermosensitive CTP version are substantially the same manner as Example 1,
Difference is that this comparative example is not used urethane acrylate.
Positive thermosensitive CTP version prepared by the positive thermosensitive CTP version and comparative example 1-3 prepared to embodiment 1-4 is not toasted
Pressrun, site, solvent resistance, the ink of resistance to UV test are directly carried out afterwards.
Solvent resistance is tested：Measurement solvent loss in 60 seconds：Positive thermosensitive CTP version is cut into the square of 10 × 10cm, first
The weight W1 of band coating square is weighed on the electronic balance for be accurate to 0.0001, then in ready solvent (60% weight portion
Ethyl acetate, the isopropanol of 40% weight portion) it is inner, temperature be generally 25 DEG C soak 60 seconds, take out drying after weigh weight
W2, W1-W2/W1 are solvent loss in 60 seconds.To reduce error, repeat aforesaid operations and detect three times, take its average value.
The ink of resistance to UV is tested：UV ink is dripped in CTP versions, blotted with paper handkerchief after one minute, used Ai Seli Density Measuring Instruments
The optical density (OD) D1 of 504 parts that test liquid was contacted respectively and week there are not the optical density (OD) D2 of contact liq part, calculate
The value of D1/D2.
Surveying version instrument with Ai Seli printing plates carries out site test.
The testing result of the positive thermosensitive CTP version of embodiment and comparative example is shown in Table 1.
Table 1
| Detection project | Pressrun | Site/% | Solvent resistance/% | The ink of resistance to UV is tested（D1/D2） |
| Embodiment 1 | >170000 | 0.5~99.5 | 30% | 0.52 |
| Embodiment 2 | >170000 | 0.5~99.5 | 33% | 0.51 |
| Embodiment 3 | >170000 | 0.5~99.5 | 32% | 0.50 |
| Embodiment 4 | 160000 | 1~99 | 36% | 0.48 |
| Comparative example 1 | 70000 | 5~95 | Fall light | 0.08 |
| Comparative example 2 | 110000 | 2~99 | 65% | 0.12 |
| Comparative example 3 | 100000 | 3~95 | 60% | 0.14 |
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics do not exist lance
Shield, is all considered to be the scope of this specification record.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
The invention discloses the photosensitive glue composition of the ink of resistance to UV and its application in baking CTP editions is exempted from, the resistance to UV oil
The photosensitive glue composition of ink includes phenolic resin 10-20 parts；Epoxy modified phenolic resin 5-30 parts；Acrylic amide modified phenolic resin
5-20 parts；Urethane acrylate 3-5 parts；The carboxylate 10- of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides
20 parts；2-20 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chloride carboxylates；Dyestuff 0.5-3 parts；Dissolution
Agent 3-8 parts；Nucleophilic catalyst 0.5-1.5 parts；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 5-20.The present invention utilizes the ink of the resistance to UV photoresists group
CTP editions that compound is prepared can not carry out next step UV ink printing process by toasted treatment, save time and manpower, subtract
Lack cost, and pressrun is high, high resolution and definition is good.
Claims (9)
1. a kind of photosensitive glue composition, it is characterised in that including the component calculated in parts by mass as follows：
Phenolic resin 10-20 parts；
Epoxy modified phenolic resin 5-30 parts；
Acrylic amide modified phenolic resin 5-20 parts；
Urethane acrylate 3-5 parts；
Carboxylate 10-20 parts of alkyl resinox and 2- diazonium -1- naphthoquinones -4- sulfonic acid chlorides；
2-20 parts of pyrogallol-acetone resin and 2- diazonium -1- naphthoquinones -5- sulfonic acid chloride carboxylates；
Dyestuff 0.5-3 parts；
Chaotropic agent 3-8 parts；
Nucleophilic catalyst 0.5-1.5 parts；
Wherein, the epoxide equivalent of the epoxy modified phenolic resin is 5-20.
2. photosensitive glue composition according to claim 1, it is characterised in that the epoxide equivalent of the epoxy modified phenolic resin
It is 5-10.
3. photosensitive glue composition according to claim 1, it is characterised in that the acrylic amide modified phenolic resin molecular weight
It is 5000-15000.
4. photosensitive glue composition according to claim 1, it is characterised in that the dyestuff is triaryl methane type basic-dyeable fibre.
5. photosensitive glue composition according to claim 1, it is characterised in that the chaotropic agent is organic acid or acid anhydrides.
6. photosensitive glue composition according to claim 1, it is characterised in that the nucleophilic catalyst be tertiary amine, quaternary amine or
Person's triphenylphosphine.
7. photosensitive glue composition described in claim 1-6 any claims is exempting to toast answering during positive thermosensitive CTP version makes
With.
8. a kind of preparation method of positive thermosensitive CTP version, it is characterised in that prepare the positive thermosensitive CTP version and used right
It is required that photosensitive glue composition described in 1-6 any claims, the preparation method comprises the following steps：
S1, sheet material treatment：Aluminium base is surface-treated, electrolyzing and coarsening, oxidation is then carried out；
The preparation of the photosensitive coating fluid of S2, positive heat-sensitive CTP：By photosensitive glue composition described in claim 1-6 any claims
It is well mixed, solvent is added, photosensitive glue composition is made into the photosensitive coating fluid for viscosity for 50-70cp, the solvent is second
Glycol monomethyl ether or ethylene glycol monoethyl ether；
S3, coating：Photosensitive coating fluid is coated on sheet material after treatment by double-coated mode；
S4, drying：Drying scribbles the sheet material of photosensitive coating fluid, its surface is formed photosensitive layer, obtains positive thermosensitive CTP version.
9. the positive thermosensitive CTP version that preparation method described in claim 8 is prepared.
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| CN201710192344.0A CN106933035B (en) | 2017-03-28 | 2017-03-28 | UV (ultraviolet) -resistant ink photosensitive emulsion composition and application thereof in baking-free CTP (computer to plate) |
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| CN201710192344.0A CN106933035B (en) | 2017-03-28 | 2017-03-28 | UV (ultraviolet) -resistant ink photosensitive emulsion composition and application thereof in baking-free CTP (computer to plate) |
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