CN106910719A - The method of packaging part and manufacture packaging part - Google Patents

The method of packaging part and manufacture packaging part Download PDF

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Publication number
CN106910719A
CN106910719A CN201710192289.5A CN201710192289A CN106910719A CN 106910719 A CN106910719 A CN 106910719A CN 201710192289 A CN201710192289 A CN 201710192289A CN 106910719 A CN106910719 A CN 106910719A
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CN
China
Prior art keywords
conjunction
block piece
substrate
packaging part
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710192289.5A
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Chinese (zh)
Inventor
徐健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Semiconductor China R&D Co Ltd
Samsung Electronics Co Ltd
Original Assignee
Samsung Semiconductor China R&D Co Ltd
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Semiconductor China R&D Co Ltd, Samsung Electronics Co Ltd filed Critical Samsung Semiconductor China R&D Co Ltd
Priority to CN201710192289.5A priority Critical patent/CN106910719A/en
Publication of CN106910719A publication Critical patent/CN106910719A/en
Pending legal-status Critical Current

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

There is provided a kind of packaging part and the method for manufacture packaging part.The packaging part includes：Substrate, with first surface and the second surface back to first surface, is provided with multiple pads in substrate；First conjunction and the second conjunction, are arranged in substrate, and the second conjunction is located at around the first conjunction；Chip, is arranged on the first conjunction and is electrically connected to the multiple pad by lead；Block piece, is arranged on the second conjunction；Encapsulating component, is arranged on the inner side of block piece to encapsulate the conjunction of chip first and lead.

Description

The method of packaging part and manufacture packaging part
The application is to be submitted to the Application No. 201510295917.3 of State Intellectual Property Office on June 2nd, 2015 The divisional application of application.
Technical field
The present invention relates to encapsulation field, and in particular to a kind of method of packaging part and manufacture packaging part.
Background technology
Existing encapsulation technology generally provides protection using dispensing or molded method to chip, prevents chip from receiving Failed to ambient influnence and external force influence.
Fig. 1 shows a kind of schematic cross sectional views of glue dispensing and packaging part of correlation technique, and its chips 102 is by including knot The tack coat A of mixture is arranged on conjunction 101a, using lead W by chip 102 with the pad being arranged in substrate 100 (not Show) electrical connection, then encapsulated using component 103 is encapsulated using method for dispensing glue.Glue dispensing and packaging is difficult to control packaging part Dimensional accuracy.Additionally, this kind encapsulation also has the shortcomings that mechanical strength is low so that the mechanical test that can not meet high intensity will Ask.
Fig. 2 shows a kind of schematic cross sectional views of molded package element of correlation technique, and its chips 202 is by including knot The tack coat A of mixture is arranged on conjunction 201a, using lead W by chip 202 with pad on a substrate 200 is set (not Show) electrical connection, then encapsulated using component 203 is encapsulated using the method for molding.Although this kind of packaging part be readily able to The dimensional accuracy of packaging part is controlled, but moulding compound is weaker with the solder joint position adhesion of substrate, layering is easily produced, so as to cause Failure.
The content of the invention
Easily the packaging part of precise control package dimension and manufacture can be somebody's turn to do it is an object of the present invention to provide a kind of The method of packaging part.
Another object of the present invention is to providing a kind of packaging part that can improve overall mechanical properties and manufacturing the encapsulation The method of part.
According to an aspect of the present invention, there is provided a kind of packaging part, the packaging part includes：Substrate, with first surface With the second surface back to first surface, multiple pads are provided with substrate；First conjunction and the second conjunction, are arranged on base On the second surface at bottom, the second conjunction is located at around the first conjunction；Chip, is arranged on the first conjunction, and pass through Lead is electrically connected to the multiple pad；Block piece, is arranged on the second conjunction；Encapsulating component, is arranged on the interior of block piece Side is encapsulating chip, the first conjunction and lead.
Exemplary embodiment of the invention, block piece can include that preset dam and/or scolding tin are built a dam.
Exemplary embodiment of the invention, block piece can be annular, and now, chip can be arranged on block piece Annular center.
Exemplary embodiment of the invention, block piece can be including at least in ceramics, plastics, metal and solder Kind.
Exemplary embodiment of the invention, block piece can be provided with metal pattern layer between conjunction.
According to another aspect of the present invention, there is provided a kind of method for manufacturing packaging part, methods described includes：Base is set Bottom, substrate has first surface and the second surface back to first surface, and multiple pads are provided with substrate；The second of substrate First conjunction and the second conjunction are set on surface, wherein, the second conjunction is located at around the first conjunction；In the first knot Chip is set on component, and block piece is set on the second conjunction；Chip is electrically connected with pad by lead；Structure will be encapsulated Part is arranged on the inner side of block piece, to encapsulate chip, the first conjunction and lead.
Exemplary embodiment of the invention, block piece can include preset dam.
Exemplary embodiment of the invention, by the quantity of block piece can be set to one and could be arranged to have Loop configuration, chip can be arranged on the center of the loop configuration of block piece.
Exemplary embodiment of the invention, can be set to multiple by the quantity of block piece, wherein, the multiple resistance Block piece is combined can have loop configuration.
Exemplary embodiment of the invention, block piece can be including at least in ceramics, plastics, metal and solder Kind.
Exemplary embodiment of the invention, block piece can build a dam including scolding tin.
The step of exemplary embodiment of the invention, setting barrier layer, can include：Set on the second conjunction Metal pattern layer, then sets block piece to cover metal pattern layer in metal pattern layer.
Exemplary embodiment of the invention, metal pattern layer can include copper.
Packaging part of the invention and its manufacture method, by setting such as preset dam or weldering on the second conjunction The annular barrier part that tin is built a dam, can easily control the size of packaging part.Additionally, packaging part of the invention still uses point Glue is encapsulated, therefore avoids the weakness that molded packages are easily layered.
Brief description of the drawings
By the following description of the exemplary embodiment with reference to accompanying drawing, each aspect of the present invention will become to be more prone to reason Solution, in the accompanying drawings：
Fig. 1 is a kind of schematic cross sectional views of the packaging part of plastic structure for showing correlation technique；
Fig. 2 is a kind of schematic cross sectional views of the packaging part of the molded structure for showing correlation technique；
Fig. 3 A are the schematic cross sectional views of the packaging part for showing an exemplary embodiment of the invention；
Fig. 3 B are the schematic plans of the packaging part for showing Fig. 3 A；
Fig. 3 C are the schematic cross sectional views for showing packaging part in accordance with an alternative illustrative embodiment of the present invention；
Fig. 4 is the schematic cross sectional views for showing packaging part in accordance with an alternative illustrative embodiment of the present invention；
Fig. 5 A to Fig. 5 C are the signals of the method for the manufacture packaging part for showing an exemplary embodiment of the invention Property sectional view；
Fig. 6 A to Fig. 6 C are the schematic sectionals for showing manufacture packaging part in accordance with an alternative illustrative embodiment of the present invention Figure.
Specific embodiment
Hereinafter, exemplary embodiment will be explained by reference to accompanying drawing describe present inventive concept in detail.So And, present inventive concept can be embodied in many different forms, and should not be interpreted as being limited to described in this paper each Embodiment；Conversely, these embodiments are provided so that the disclosure is clear and complete, and will be to the common skill in this area Art personnel fully pass on present inventive concept.In the accompanying drawings, identical reference represents identical element.Additionally, each yuan Part and region schematically show.Thus, present inventive concept is not limited to relative size or distance shown in figure.Will manage Solution, although each element, part, region, layer and/or portion can be described using term first, second, third, etc. herein Divide, but these elements, part, region, layer and/or part should not be limited by these terms.These terms are used only for one Individual element, part, region, layer or part distinguish with another element, part, region, layer or part.Therefore, it is discussed below The first element, first component, first area, ground floor or Part I can be referred to as the second element, second component, second Region, the second layer or Part II, without departing from the teaching of present inventive concept.
Term used herein is in order at the purpose of description specific embodiment, and is not intended to limit present inventive concept.Such as this In used, the " one " of singulative, " one kind ", " being somebody's turn to do ", " described " are also intended to include plural form, unless in context In clearly dictate otherwise.It will be understood that, term " including " and/or " including ... " when used in this specification When, illustrate in the presence of stated feature, entirety, step, operation, element and/or component, but do not preclude the presence or addition of one Or more further feature, entirety, step, operation, element, component and/or their group.
For the ease of description, space relative terms may be used herein to describe an element or the feature shown in figure With other elements or the relation of feature, such as " ... under ", " in ... lower section ", " below ", " in ... top " and " above " etc..It will be appreciated that these spatial terminologies are intended to cover the shown in the figure of the device in use or in operation Different azimuth outside orientation.For example, if the device in accompanying drawing is reversed, be described as other elements or feature " under " Or the element of " lower section " will be positioned in other elements or feature " top ".Therefore, exemplary term " in ... lower section " can To cover " lower section " and " top " two kinds of orientation.Device additionally can be positioned (being rotated by 90 ° or in other orientation), and Correspondingly explain that the space being used herein is relative and describe language.
Described with reference to the sectional view of the schematic diagram of the desirable embodiment (and intermediate structure) of property embodiment as an example Exemplary embodiment.In this way, the change of the diagram shape for example caused by manufacturing technology and/or tolerance is expected.Cause This, exemplary embodiment should not be construed as limited to the given shape in region as shown here, but include example Such as by the deviation of vpg connection caused by manufacture.
Unless otherwise defined, the term (including technical term and scientific terminology) for otherwise using in this manual have with The implication identical implication that those of ordinary skill in the art are generally understood that.Term defined in universaling dictionary should be explained Be with background of related under implication identical implication, and unless be defined in this manual, otherwise not They should be explained with the meaning that is Utopian or excessively formalizing.
As used herein, term "and/or" includes any and whole combination that one or more correlations are listd.
Hereinafter, figure accompanying drawing will be combined to describe the packaging part of exemplary embodiment of the invention in detail.
Fig. 3 A are the schematic cross sectional views of the packaging part for showing an exemplary embodiment of the invention, and Fig. 3 B are to show Go out the schematic plan of the packaging part of Fig. 3, Fig. 3 C are to show packaging part in accordance with an alternative illustrative embodiment of the present invention Schematic cross sectional views.Hereinafter, Fig. 3 A to Fig. 3 C will be combined to describe two kinds of packaging parts of exemplary embodiment of the invention. Through entire disclosure, same reference is designated as same element all the time.
Reference picture 3A, the packaging part of exemplary embodiment of the invention includes：Substrate 300, with first surface and Back to the second surface of first surface, multiple pad (not shown) are provided with substrate 300；First conjunction 301a and the second knot Component 301b, is arranged on the second surface of substrate 300, and the second conjunction 301b is located at around the first conjunction 301a；Core Piece 302, is arranged on the first conjunction 301a, and is electrically connected with the pad being arranged in substrate 300 by lead W；Block piece 304a, is arranged on the second conjunction 301b；Encapsulating component 303, be arranged on the inner side of block piece 304a with encapsulate chip 302, First conjunction 301a and lead W.
Exemplary embodiment of the invention, chip 302 can be fixed on first by the tack coat A including bonding agent On conjunction 301a, so as to be fixed on the second surface of substrate 300, but the invention is not restricted to this.The first combination can be omitted Part 301a.More specifically, it is possible to use be fixed to chip 302 in substrate 300 by the tack coat A of such as bonding agent, i.e. chip 302 are set directly in substrate 300 by bonding agent, wherein, the tack coat A formed by bonding agent can be directly used as first Conjunction 301a.
Exemplary embodiment of the invention, block piece 304a can be fixed on by the tack coat A of such as bonding agent On second conjunction 301b, so as to be fixed in substrate 300, but the invention is not restricted to this.The second conjunction 301b can be omitted. More specifically, it is possible to use be fixed to block piece 304a in substrate 300 by the tack coat A of such as bonding agent, i.e. block piece 304a is set directly in substrate 300 by the tack coat A including bonding agent, wherein, the tack coat A that bonding agent is formed can be straight Connect and be used as the second conjunction 301b.
Exemplary embodiment of the invention, the second conjunction 301b has in face of the first surface of substrate and back to base The second surface at bottom.Second surface can have flat shape, however, according to technique needs, second surface can also be set Be with rough structure, or could be arranged to have can accommodate or part accommodate metal pattern layer 304 structure, This will be specifically described later.
The need for packaging part, block piece 304a can have predetermined shape, and chip 302 is surrounded wherein. Exemplary embodiment of the invention, as shown in Figure 3 B, block piece 304a can have the shape of annular, and work as block piece When 304a is annular shape, chip 302 can be arranged on the center of the annular shape of block piece 304a.Additionally, the second conjunction 301b can have the shape being engaged with block piece 304a.Specifically, block piece 304a can be arranged to annular shape, chip 302 centers that can be arranged on annular shape.Now, the second conjunction 301b can have the ring being engaged with block piece 304a Shape shape, so that block piece 304a can be disposed thereon, but the invention is not restricted to this.In a top view, the second conjunction 301b can have the arbitrary shape that can be disposed thereon block piece 304a.
Exemplary embodiment of the invention, block piece 304a can be set integrally, i.e. block piece 304a can have There is preset integral loop configuration, but the present invention is not limited thereto.Block piece 304a can include multiple barrier structures with group Structure is circularized, for example, block piece 304a can include two or more multiple barrier structures, the multiple stop structure Part can be connected to form such as annular or other shapes of block piece 304a from beginning to end each other, and encapsulating component 303 is accommodated to provide Space.
Exemplary embodiment of the invention, the section of block piece can have arbitrary shape.As shown in Fig. 3 A An exemplary embodiment of the invention packaging part in block piece 304a have be similar to rectangular section, but In the packaging part in accordance with an alternative illustrative embodiment of the present invention for showing in fig. 3 c, block piece 304b has similar bullet shaped The section of shape, but the invention is not restricted to this.
Exemplary embodiment of the invention, block piece 304a can set and circularize prefabricated dam, allow it to Receiving will be filled in the encapsulating component 303 for such as encapsulating glue therein.Therefore, show in order to precise control is of the invention The size of the packaging part of example property embodiment, can as needed control the height of the block piece 304a of such as preset dam, but The invention is not restricted to this.
Exemplary embodiment of the invention, constitute the material of block piece 304a can include ceramics, plastics, metal or Solder.
Exemplary embodiment of the invention, the encapsulating component 303 for such as encapsulating glue can be arranged on block piece In 304a, so as to encapsulate chip 302, the first conjunction 301a and lead W.
Fig. 4 is the schematic cross sectional views for showing packaging part in accordance with an alternative illustrative embodiment of the present invention.Hereinafter, will join Packaging part in accordance with an alternative illustrative embodiment of the present invention is described according to Fig. 4.The packaging part shown in Fig. 4 and Fig. 3 A and Fig. 3 C In the packaging part that shows have in addition to the connector between block piece and block piece and the second conjunction it is same or similar Structure, therefore, carry out the main difference described with the packaging part shown in Fig. 3 A and Fig. 3 C below in conjunction with Fig. 4.Through whole Specification, same reference is designated as same element all the time.
Reference picture 4, the packaging part of exemplary embodiment of the invention includes：Substrate 400, with first surface and the back of the body To the second surface of first surface, multiple pad (not shown) are provided with substrate 400；First conjunction 401a and second is combined Part 401b, is arranged on the second surface of substrate 400, and the second conjunction 401b is located at around the first conjunction 401a；Chip 402, it is arranged on the first conjunction 401a, and electrically connected with the pad (not shown) being arranged in substrate 400 by lead W； Block piece 404, is arranged on the second conjunction 401b；Encapsulating component 403, is arranged on the inner side of block piece 404, to encapsulate chip 402nd, the first conjunction 401a and lead W.
The material of the block piece 404 of exemplary embodiment of the invention, such as dam can include such as scolding tin Solder.In this case, in order that block piece 404 is fixed on the second conjunction 401b, metal pattern layer 405 can be set Between the conjunction 401b of block piece 404 and second, block piece 404 is combined with the second conjunction 402b, but the present invention is not It is limited to this.
Exemplary embodiment of the invention, metal pattern layer 405 can include copper, but not limited to this.That is, Metal pattern layer can include any metal that the second conjunction 401b and block piece 404 can be combined and/or they Alloy.Exemplary embodiment of the invention, when the second conjunction 401b is omitted, metal pattern layer 405 can pass through The tack coat A being made up of such as bonding agent is arranged in substrate 400, in this case, the bonding being made up of such as bonding agent Layer A can be equal to the second conjunction 401b.
Exemplary embodiment of the invention, block piece 404 could be arranged to one, i.e. by solder and backflow work It is such as annular integral shape that the block piece 404 that skill is formed can be continuously formed, but the invention is not restricted to this.Namely Say, the such as weldering as shown in the block piece 304a and 304b and Fig. 4 of the such as preset dam being shown respectively in Fig. 3 A and Fig. 3 C The block piece 404 that tin is built a dam can be combined to form block piece.Specifically, for example, the stop of such as preset dam Part 304a could be arranged to semicircular ring, and the block piece 404 of scolding tin of such as building a dam could be arranged to semicircular ring so that block piece 304a and block piece 404 can be combined, so as to obtain the space for accommodating the encapsulating all round closure of component 403.However, according to The need for technique, girth ratios of the block piece 304a with 404 can determine according to actual conditions.Additionally, according to block piece The specific size of 304a and 404, can do suitable to the specific size of the second conjunction 301b and 401b and metal pattern layer 405 Work as regulation.
Exemplary embodiment of the invention, the second conjunction 401b can have the first surface in face of substrate 400 With the second surface back to first surface.When metal pattern layer 405 is arranged between the second conjunction 401b and block piece 404 When, the second surface of the second conjunction 401b can have flat shape, so that metal pattern layer 405 is arranged on flat the On two surfaces, but the invention is not restricted to this.The second surface of the second conjunction 401b can have irregular shape, more specifically Ground, second surface can have pit, and the pit can be accommodated or part accommodates metal pattern layer 405.Additionally, working as block piece bag Include the block piece 304a and/or 304b of such as preset dam as shown in Figure 3 and such as scolding tin is built a dam as shown in Figure 4 Block piece 404 when, the second conjunction 401b parts corresponding from block piece 304a and/or 304b can have different knots Structure, i.e. the second surface of second conjunction 401b corresponding with the block piece 304a and/or 304b of such as preset dam can have There is flat surface, and the second surface of second conjunction 401b corresponding with the block piece 404 that such as scolding tin is built a dam can have There is the dimpled surface of tool that can accommodate metal pattern layer 405, but the invention is not restricted to this.
More than, the encapsulation of exemplary embodiment of the invention is describe in detail with reference to Fig. 3 A to Fig. 3 C and Fig. 4 The specific example of part, receiving bag is provided by setting block piece 304a, 304b and 404 on the second conjunction 301b and 401b The space of component 303 and 403 is sealed, so as to effectively improve the machine of packaging part on the premise of the dimensional accuracy of packaging part is ensured Tool intensity.Further, since encapsulated using method for dispensing glue, therefore avoid in the encapsulation process using molding methods due to mould The solder joint position adhesion of plastics and substrate is weaker and easily produce the generation of the phenomenon of layering.
Below, Fig. 5 A to Fig. 5 C and Fig. 6 A to Fig. 6 C will be combined to describe the system of exemplary embodiment of the invention The method for making packaging part.Through entire disclosure, same reference is designated as same element all the time.
Fig. 5 A to Fig. 5 C are the signals of the method for the manufacture packaging part for showing an exemplary embodiment of the invention Property sectional view.
First, reference picture 5A, sets substrate 300, and chip 302 is set in substrate 300.
Specifically, it is possible to use chip 302 is fixed on the tack coat of such as bonding agent first be arranged in substrate 300 On conjunction 301a, so that chip 302 is fixed in substrate 300, but the present invention is not limited thereto.The first combination can be omitted Part 301a.More specifically, the first conjunction 301a can be tack coat A, i.e. can be by as the viscous of the first conjunction 301a Directly be fixed on chip 302 in substrate 300 by knot layer A.
Secondly, reference picture 5B, sets block piece 304a.
Specifically, block piece 304a can be fixed on by the first conjunction 301b by the tack coat A of such as bonding agent On, so that it is fixed in substrate 300.In this case, the step of setting block piece 304a can be included in the second knot (for example, coating) bonding agent is set on component 301b to form tack coat A；Block piece 304a is arranged on tack coat A, is gone forward side by side Row curing process, so that the second conjunction 301b is fixed in substrate 300.But the invention is not restricted to this, it is convenient to omit second Conjunction 301b, i.e. bonding agent can directly be set (for example, coating) in substrate 300 to form tack coat A, then will Block piece is arranged on tack coat A, and carries out curing process, so that the second conjunction 301b is directly fixed by tack coat A In substrate 300.
Exemplary embodiment of the invention, the second conjunction 301b has in face of the first surface of substrate and back to base The second surface at bottom 300.Second surface can have flat shape, however, according to technique needs, can set second surface Be set to rough structure, or can by second surface be set to have can accommodate or part accommodate metal pattern The bowl configurations of layer 305.
The need for according to packaging part, block piece 304a can be set to, with predetermined shape, chip 302 be surrounded Wherein.Exemplary embodiment of the invention, block piece 304a can be set to have annular shape.When will stop Part 304a is set to during with annular shape, and chip 302 can be arranged on the center of the annular shape of block piece 304a, and Second conjunction 301b can be set to have the shape being engaged with block piece 304a.Specifically, as shown in Figure 3 B, may be used It is arranged to annular shape with by block piece 304A, at this point it is possible to chip 302 to be arranged on the center of annular shape, and can be with Second conjunction 301b is configured with the annular shape being engaged with block piece 304a, so that block piece 304A can be set Thereon, but the invention is not restricted to this.Second conjunction 301b can be set to set block piece 304a with any Put shape thereon.
Exemplary embodiment of the invention, block piece 304a can be set integrally, i.e. block piece 304a can have There is preset integral loop configuration, but the present invention is not limited thereto.Block piece 304a can include multiple barrier structures with group Structure is circularized, for example, block piece 304a can include two or more multiple barrier structures, the multiple stop structure Part can from beginning to end contact the such as annular or other shapes of block piece that encapsulating component 303 is accommodated to be formed each other.
Exemplary embodiment of the invention, it is possible to use ceramics, plastics, metal and/or solder etc. constitute stop Part 304a.
Then, be electrically connected for chip 302 and the pad (not shown) being arranged in substrate 300 by lead W by reference picture 5C Connect, and encapsulating component 303 is set to encapsulate the conjunction 301a of chip 302 first and lead W.
Exemplary embodiment of the invention, can be using Wire Bonding Technology using lead W is by chip 302 and sets Pad (not shown) electrical connection in substrate 300, but the invention is not restricted to this.
Exemplary embodiment of the invention, it is possible to use encapsulate the packing components such as glue by chip 302, first Conjunction 301a and lead W is encapsulated, but the invention is not restricted to this.
Fig. 6 A to Fig. 6 C are the schematic sectionals for showing manufacture packaging part in accordance with an alternative illustrative embodiment of the present invention Figure.
First, reference picture 6A, sets substrate 400, and chip 402 and metal pattern layer 405 are set in substrate.
Specifically, chip 402 can be fixed on by bonding agent etc. for the first conjunction being arranged in substrate 400 On 401a, so that chip 402 is fixed in substrate 400, but the invention is not restricted to this.The first conjunction 401a can be omitted, I.e., it is possible to the first conjunction 401a is replaced using the tack coat A of such as bonding agent, in such a case, it is possible to by being used as Directly be fixed on chip 402 in substrate 300 by the tack coat A of the first conjunction 401a.Can be in be arranged in substrate 400 Metal pattern layer 405 is set on two conjunction 401b.Exemplary embodiment of the invention, can be made using prior art Metal pattern layer 405 invests the surface of the second conjunction 401b.Can be including copper etc. as the material of metal pattern layer 405 The metal that solder can be fixed on the second conjunction 401b.
Exemplary embodiment of the invention, the second conjunction 401b can have the first surface in face of substrate 400 With the second surface back to first surface.When metal pattern layer 405 is arranged between the second conjunction 401b and block piece 404 When, the second surface of the second conjunction 401b can have flat shape, so that metal pattern layer 405 is arranged on flat the On two surfaces, but the invention is not restricted to this.The second surface of the second conjunction 401b can have irregular shape, more specifically Ground, second surface can have pit, and the pit can be accommodated or part accommodates metal pattern layer 405.
Secondly, reference picture 6B, sets block piece 404.
Specifically, solder etc. can be coated on the second conjunction 401b with metal pattern layer 405, to cover Lid metal pattern layer 405；Then backflow is performed to solder, so that solder forms the stop such as built a dam with predetermined altitude Part 304B.Exemplary embodiment of the invention, the brazing metal or metal that solder can be commonly used by this area is closed Gold solder etc..
Exemplary embodiment of the invention, can set two parts block piece on the second conjunction 401b, that is, have There are the block piece and the such as block piece of scolding tin damming structure of such as preset dam structure, so that two parts block piece can It is combined together, so as to obtain the space that can accommodate encapsulating component 403.
Exemplary embodiment of the invention, when block piece (such as Fig. 6 B and the figure of block piece including such as preset dam Shown in 6C) and such as scolding tin build a dam block piece (as shown in Fig. 6 B and Fig. 6 C) when, different blocking that can be as described above The different characteristic of part is arranged in correspondence with the second conjunction 401b.For example, in the second conjunction 401b, with Fig. 5 B and Fig. 5 C In corresponding the second conjunction of the part 401b of block piece could be arranged to flat shape, with the block piece in Fig. 6 B and Fig. 6 C The second conjunction of corresponding another part 401b could be arranged to have the groove for accommodating metal pattern layer 405.
Exemplary embodiment of the invention, according to technique needs, can control the species of solder and the height of solder Degree so that the block piece 404 of desired height is obtained after backflow is performed such that it is able to the size of precise control packaging part.
Then, reference picture 6C, is electrically connected chip 402 with pad (not shown) by lead W, then performs encapsulating.
Specifically, can using Wire Bonding Technology using lead W by chip 402 and the pad being arranged in substrate 400 (not shown) is electrically connected, but the invention is not restricted to this.Then it is filled into by stopping using the encapsulating component 403 such as encapsulation glue Part 404 constitute space in so that encapsulating component 403 be contained in block piece 404 composition space in, and by chip 402, draw Line W and the first conjunction 401a is encapsulated.
Because the packaging part of exemplary embodiment of the invention is encapsulated using method for dispensing glue, so as to avoid mould The shortcoming that packaged by plastic is easily layered.Additionally, set in substrate by the way of being built a dam using annular preset dam or using scolding tin stopping Part so that the size of packaging part is easy to precise control, and also improve the overall mechanical properties of packaging part.
Although the present invention, those skilled in the art are specifically illustrated and described with reference to exemplary embodiment of the invention It should be understood that without departing from the spirit and scope of the present invention, the various changes in form and in details can be made.

Claims (10)

1. a kind of packaging part, it is characterised in that the packaging part includes：
Substrate, with first surface and the second surface back to first surface, is provided with multiple pads in substrate；
First conjunction and the second conjunction, are arranged on the second surface of substrate, and the second conjunction is located at the first conjunction Around；
Chip, is arranged on the first conjunction, and is electrically connected to the multiple pad by lead；
Block piece, is arranged on the second conjunction；
Encapsulating component, is arranged on the inner side of block piece, to encapsulate chip, the first conjunction and lead.
2. packaging part as claimed in claim 1, it is characterised in that block piece is annular, chip is arranged on the second conjunction Annular center.
3. packing component as claimed in claim 1, it is characterised in that block piece is included in ceramics, plastics and metal at least It is a kind of.
4. packaging part as claimed in claim 1, it is characterised in that block piece includes solder.
5. packaging part as claimed in claim 4, it is characterised in that metal pattern layer is provided between block piece and conjunction.
6. it is a kind of manufacture packaging part method, it is characterised in that the described method comprises the following steps：
Substrate is set, and substrate has first surface and the second surface back to first surface, multiple pads are provided with substrate；
First conjunction and the second conjunction are set on the second surface of substrate, wherein, the second conjunction is located at first and combines Around part；
Chip is set on the first conjunction, and block piece is set on the second conjunction；
Chip is electrically connected with pad by lead；
Encapsulating component is arranged on the inner side of block piece, to encapsulate chip, the first conjunction and lead.
7. method as claimed in claim 6, it is characterised in that the quantity of block piece is set to and is set to ring Shape structure, chip is arranged on the center of the loop configuration of block piece.
8. method as claimed in claim 6, it is characterised in that block piece includes at least one in ceramics, plastics and metal.
9. method as claimed in claim 6, it is characterised in that block piece includes solder.
10. method as claimed in claim 9, it is characterised in that the step of setting barrier layer includes：
Metal pattern layer is set on the second conjunction, then block piece is set in metal pattern layer to cover metal pattern Layer.
CN201710192289.5A 2015-06-02 2015-06-02 The method of packaging part and manufacture packaging part Pending CN106910719A (en)

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