CN106893539A - A kind of novel heat-conducting insulation adhesive - Google Patents
A kind of novel heat-conducting insulation adhesive Download PDFInfo
- Publication number
- CN106893539A CN106893539A CN201510981368.5A CN201510981368A CN106893539A CN 106893539 A CN106893539 A CN 106893539A CN 201510981368 A CN201510981368 A CN 201510981368A CN 106893539 A CN106893539 A CN 106893539A
- Authority
- CN
- China
- Prior art keywords
- parts
- adhesive
- novel heat
- insulation adhesive
- diluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of novel heat-conducting insulation adhesive, and the parts by weight of composition are as follows contained by the adhesive：Contain high-temperature-resistant epoxy resin 45-65 parts, anhydride curing agent 8-13 parts, diluent 2-6 parts, coupling agent 3-5 parts, plasticizer 5-8 parts, fire retardant 2-3 parts, high-temperature stabilizer 2-4 parts, filler surplus in every 100 parts.The beneficial effects of the invention are as follows reasonable mixture ratio, with good heat conductivility and adhesion strength, the diluent for wherein adding reduces the too strong caking property of adhesive, it is to avoid causes the electronic component of inside loudspeakers to damage due to too high temperature and caking ability, extends the service life of loudspeaker.
Description
Technical field
The invention belongs to adhesive field, more particularly, to a kind of novel heat-conducting insulation adhesive.
Background technology
In adhesives industry, with electronic component and electronic equipment to it is thin it is light it is small in terms of develop, for
As envelope Zhuanghe's thermal interfacial material heat conduction adhesive especially the agent of heat conductive insulating gluing demand increasingly
It is high.During loudspeaker makes, can also use to heat conductive insulating gluing agent.Epoxy adhesive master
If being made up of epoxy resin and the major part of curing agent two.In order to improve some performances, different purposes are met
The auxiliary materials such as toughener, diluent, the urgent, coupling agent in village can also be added.
The content of the invention
It is an object of the invention to provide a kind of simple structure, simple to operate, heat conductivility is good, extend electricity
The novel heat-conducting insulation adhesive of sub- component service life.
A kind of novel heat-conducting insulation adhesive of the present invention, the parts by weight of composition contained by the adhesive are such as
Under, wherein containing in every 100 parts：
The plasticizer is neck dibatyl phithalate, tbp, trichloroethyl phosphate and polyester,
The mixture of polyethers.
The diluent is ethanol.
The high-temperature stabilizer is antioxidant 264, hydroquinones, p-tert-Butylcatechol, quinhydrones list
The mixture of one or more in methyl ether, 1,4-benzoquinone.
The present invention has the advantages and positive effects that：Due to using above-mentioned technical proposal, reasonable mixture ratio,
With good heat conductivility and adhesion strength, wherein the diluent for adding is reduced, adhesive is too strong to be glued
Knot property, it is to avoid cause the electronic component of inside loudspeakers to damage due to too high temperature and caking ability,
Extend the service life of loudspeaker.
Specific embodiment
The present invention is elaborated with reference to embodiment.
A kind of novel heat-conducting insulation adhesive of the present invention, the parts by weight of composition contained by the adhesive are such as
Under, wherein containing in every 100 parts：
The plasticizer is neck dibatyl phithalate, tbp, trichloroethyl phosphate and polyester,
The mixture of polyethers.
The diluent is ethanol.
The high-temperature stabilizer is antioxidant 264, hydroquinones, p-tert-Butylcatechol, quinhydrones list
The mixture of one or more in methyl ether, 1,4-benzoquinone.
Embodiment 1
The course of work of this example：The present invention a kind of novel heat-conducting insulation adhesive, contained by the adhesive
The parts by weight of composition are as follows, wherein containing in every 100 parts：
Embodiment 2
The course of work of this example：The present invention a kind of novel heat-conducting insulation adhesive, contained by the adhesive
The parts by weight of composition are as follows, wherein containing in every 100 parts：
Embodiment 3
The course of work of this example：A kind of novel heat-conducting insulation adhesive of the present invention, composition contained by the adhesive
Parts by weight it is as follows, wherein containing in every 100 parts：
The plasticizer is neck dibatyl phithalate, tbp, trichloroethyl phosphate and polyester,
The mixture of polyethers.
The diluent is ethanol.
The high-temperature stabilizer is antioxidant 264, hydroquinones, p-tert-Butylcatechol, quinhydrones list
The mixture of one or more in methyl ether, 1,4-benzoquinone.
Diluent is added in epoxy resin, is stirred and is heated to 150-170 DEG C, enter back into room temperature cooling,
The curing agent for adding coupling agent treatment to cross afterwards, stirs and solidifies 5-7 hours at 70-80 DEG C.
One embodiment of the present of invention has been described in detail above, but the content is only of the invention
Preferred embodiment, it is impossible to be considered as limiting practical range of the invention.It is all according to the present patent application scope
The impartial change made and improvement etc., all should still belong within patent covering scope of the invention.
Claims (3)
1. a kind of novel heat-conducting insulation adhesive of the invention, the parts by weight of composition contained by the adhesive
It is as follows, wherein containing in every 100 parts：
2. novel heat-conducting according to claim 1 insulation adhesive, it is characterised in that：The increasing
Modeling agent be lead dibatyl phithalate, tbp, trichloroethyl phosphate and polyester, polyethers it is mixed
Compound.
3. novel heat-conducting according to claim 1 insulation adhesive, it is characterised in that：It is described dilute
Agent is released for ethanol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510981368.5A CN106893539A (en) | 2015-12-17 | 2015-12-17 | A kind of novel heat-conducting insulation adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510981368.5A CN106893539A (en) | 2015-12-17 | 2015-12-17 | A kind of novel heat-conducting insulation adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106893539A true CN106893539A (en) | 2017-06-27 |
Family
ID=59190845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510981368.5A Pending CN106893539A (en) | 2015-12-17 | 2015-12-17 | A kind of novel heat-conducting insulation adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106893539A (en) |
-
2015
- 2015-12-17 CN CN201510981368.5A patent/CN106893539A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Xin Fenglian Document name: Notification of Acceptance of Patent Application |
|
| PB01 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: TIANJIN GENYUAN TECHNOLOGY DEVELOPMENT CO., LTD. Document name: Notification of before Expiration of Request of Examination as to Substance |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170627 |